NICHIA NS2W095AT

Nichia STS-DA1-0037
<Cat.No.071122>
SPECIFICATIONS FOR NICHIA CHIP TYPE WHITE LED
MODEL : NS2W095AT
NICHIA CORPORATION
-0-
Nichia STS-DA1-0037
<Cat.No.071122>
1.SPECIFICATIONS
(1) Absolute Maximum Ratings
Item
Forward Current
Pulse Forward Current
Allowable Reverse Current
Power Dissipation
Operating Temperature
Storage Temperature
Dice Temperature
Soldering Temperature
Symbol
IF
IFP
IR
PD
Topr
Tstg
Tj
Tsld
Absolute Maximum Rating
120
200
85
480
-30 ~ + 85
-40 ~ +100
130
Reflow Soldering : 260°C
Hand Soldering : 350°C
(Ts=25°C)
Unit
mA
mA
mA
mW
°C
°C
°C
for 10sec.
for 3sec.
IFP Conditions : Pulse Width <
= 10msec. and Duty <
= 1/10
(2) Initial Electrical/Optical Characteristics
Item
Symbol
Forward Voltage
VF
Luminous Flux
φv
x
Chromaticity Coordinate
y
-
Condition
IF=60[mA]
IF=60[mA]
IF=60[mA]
IF=60[mA]
Typ.
(3.4)
(15.0)
0.344
0.355
(Ts=25°C)
Max.
Unit
4.0
V
lm
-
Min.
15.1
12.7
10.7
9.0
(Ts=25°C)
Max.
Unit
18.0
15.1
lm
12.7
10.7
Please refer to CIE 1931 chromaticity diagram.
(3) Ranking
Item
Luminous Flux
Rank P7
Rank P6
Rank P5
Rank P4
Symbol
Condition
φv
IF=60[mA]
Luminous Flux Measurement allowance is ± 7%.
(IF=60mA,Ts=25°C)
Color Ranks
x
y
x
y
x
y
0.280
0.248
Rank a0
0.264
0.283
0.267
0.305
0.287
0.295
Rank b3
0.283
0.304
0.305
0.330
0.296
0.276
Rank b5
0.287
0.307
0.295
0.315
0.296
0.276
0.307
0.315
x
y
0.311
0.294
x
y
-1-
0.307
0.315
Rank b4
0.304
0.330
0.330
0.360
0.330
0.339
0.311
0.294
Rank b6
0.307
0.330
0.315
0.339
0.330
0.318
Nichia STS-DA1-0037
<Cat.No.071122>
x
y
0.330
0.339
Rank c1
0.330
0.361
0.360
0.385
0.357
0.361
x
y
0.330
0.318
Rank c2
0.330
0.357
0.339
0.361
0.356
0.351
Color Coordinates Measurement allowance is ± 0.01.
Basically, a shipment shall consist of the LEDs of a combination of the above ranks.
The percentage of each rank in the shipment shall be determined by Nichia.
Correspondence table of Color Coordinates – Luminous Flux ranks
Ranking by Luminous Flux
Ranking by Color Coordinates
P4
P5
P6
P7
a0
b3, b4, b5, b6
c1, c2
Shaded ranks are available.
Chromaticity Coordinate – Luminous Flux (Reference)
Ranking by Color Coordinates
Chromaticity Coordinate Luminous Flux
a0
(0.281,0.274)
(14.0)lm
b3, b4, b5, b6
(0.31,0.32)
(14.5)lm
c1, c2
(0.344,0.355)
(15.0)lm
2.INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS
Please refer to figure’s page.
3.OUTLINE DIMENSIONS AND MATERIALS
Please refer to figure’s page.
Material as follows ; Package
Encapsulating Resin
Electrodes
:
:
:
Ceramics
Silicone Resin (with Phosphor)
Ag Plating
4.PACKAGING
· The LEDs are packed in cardboard boxes after taping.
Please refer to figure’s page.
The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity
· In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation.
· The LEDs may be damaged if the boxes are dropped or receive a strong impact against them,
so precautions must be taken to prevent any damage.
· The boxes are not water resistant and therefore must be kept away from water and moisture.
· When the LEDs are transported, we recommend that you use the same packing method as Nichia.
-2-
Nichia STS-DA1-0037
<Cat.No.071122>
5.LOT NUMBER
The first six digits number shows lot number.
The lot number is composed of the following characters;
-U
- Year
( 6 for 2006, 7 for 2007 )
- Month ( 1 for Jan., 9 for Sep., A for Oct.,
- Nichia's Product Number
U - Ranking by Color Coordinates
- Ranking by Luminous Flux
-3-
B for Nov. )
Nichia STS-DA1-0037
<Cat.No.071122>
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item
Standard
Test Method
Note
Number of
Damaged
2 times
0/22
1 time
over 95%
0/22
Test Conditions
Resistance to
Soldering Heat
(Reflow Soldering)
JEITA ED-4701
300 301
Tsld=260°C, 10sec.
(Pre treatment 30°C,70%,168hrs.)
Solderability
(Reflow Soldering)
JEITA ED-4701
300 303
Tsld=215 ± 5°C,
(Lead Solder)
Temperature Cycle
JEITA ED-4701
100 105
-40°C ~ 25°C ~ 100°C ~ 25°C
30min. 5min. 30min. 5min.
100 cycles
0/50
Moisture Resistance Cyclic
JEITA ED-4701
200 203
25°C ~ 65°C ~ -10°C
90%RH 24hrs./1cycle
10 cycles
0/50
High Temperature Storage
JEITA ED-4701
200 201
Ta=100°C
1000 hrs.
0/50
Temperature Humidity
Storage
JEITA ED-4701
100 103
Ta=60°C, RH=90%
1000 hrs.
0/50
Low Temperature Storage
JEITA ED-4701
200 202
Ta=-40°C
1000 hrs.
0/50
Ta=25°C, IF=120mA
1000 hrs.
0/50
1000 hrs.
0/50
500 hrs.
0/50
1000 hrs.
0/50
48min.
0/10
Steady State Operating Life
3sec.
Tested with Nichia standard circuit board.
Steady State Operating Life
of High Temperature
Ta=85°C, IF=110mA
Tested with Nichia standard circuit board.
Steady State Operating Life
of High Humidity Heat
60°C, RH=90%, IF=120mA
Tested with Nichia standard circuit board.
Steady State Operating Life
of Low Temperature
Vibration
Ta=-30°C, IF=60mA
Tested with Nichia standard circuit board.
JEITA ED-4701
400 403
100 ~ 2000 ~ 100Hz Sweep 4min.
200m/s2
3directions, 4cycles
Thermal resistance of LED with Nichia standard circuit board : Rja ≒ 110°C/W
Nichia standard circuit board : FR4, t=1.6mm, Copper foil, t=0.07mm
(2) CRITERIA FOR JUDGING DAMAGE
Criteria for Judgement
Min.
Max.
Item
Symbol Test Conditions
Forward Voltage
VF
IF=60mA
Initial Level
Luminous Flux
φv
IF=60mA
Initial Level 0.7
The test is performed after the board is cooled down to the room temperature.
-4-
1.1
Nichia STS-DA1-0037
<Cat.No.071122>
7.CAUTIONS
The LEDs are devices which are materialized by combining Blue LEDs and special phosphors.
Consequently, the color of the LEDs is changed a little by an operating current.
Care should be taken after due consideration when using LEDs.
(1) Moisture Proof Package
· When moisture is absorbed into the SMT package it may vaporize and expand during soldering.
There is a possibility that this can cause exfoliation of the contacts and damage the optical
characteristics of the LEDs.
For this reason, the moisture proof package is used to keep moisture
to a minimum in the package.
· The moisture proof package is made of an aluminum moisture proof bag. A package of
a moisture absorbent material (silica gel) is inserted into the aluminium moisture proof bag.
The silica gel changes its color from blue to pink as it absorbs moisture.
(2) Storage
· Storage Conditions
Before opening the package :
The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within
a year.
When storing the LEDs, moisture proof packaging with absorbent material (silica gel)
is recommended.
After opening the package :
The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered
within 168 hours (7days) after opening the package.
If unused LEDs remain, they should be
stored in the moisture proof packages, such as sealed containers with packages of moisture
absorbent material (silica gel).
It is also recommended to return the LEDs to the original
moisture proof bag and to reseal the moisture proof bag again.
· If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage
time, baking treatment should be performed using the following condition.
Baking treatment : more than 24 hours at 65 ± 5°C
· This product has silver plated metal parts that are inside and/or outside the package body. The silver
plating becomes tarnished when being exposed to an environment which contains corrosive gases.
Any LED with tarnished leads may lead to poor solderability and deterioration of optical characteristics.
Please do not expose the LEDs to corrosive atmosphere during storage.
· After assembly and during use, silver plating can be affected by the corrosive gases emitted by
components and materials in close proximity of the LEDs within an end product, and the gases entering
into the product from the external atmosphere. The above should be taken into consideration when
designing.
· Please avoid rapid transitions in ambient temperature, especially in high humidity environments where
condensation can occur.
-5-
Nichia STS-DA1-0037
<Cat.No.071122>
(3) Static Electricity
· Static electricity or surge voltage damages the LEDs.
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
· All devices, equipment and machinery must be properly grounded. It is recommended that precautions
be taken against surge voltage to the equipment that mounts the LEDs.
· When inspecting the final products in which LEDs were assembled, it is recommended to check
whether the assembled LEDs are damaged by static electricity or not.
It is easy to find
static-damaged LEDs by a light-on test or a VF test at a lower current (below 2mA is recommended).
· Damaged LEDs will show some unusual characteristics such as the forward voltage becomes lower,
or the LEDs do not light at the low current.
Criteria : (VF > 2.0V at IF=1mA)
-6-
Nichia STS-DA1-0037
<Cat.No.071122>
(4) Application Design Considerations
· In designing a circuit, the current through each LED must not exceed its absolute maximum rating.
It is recommended to use Circuit B which regulates the current flowing through each LED.
In the meanwhile, when driving LEDs with a constant voltage in Circuit A, the current through
the LEDs may vary due to the variation in forward voltage (VF) of the LEDs. In the worst case,
some LED may be subjected to stresses in excess of the absolute maximum rating.
(B)
(A)
...
...
· Thermal design of the end product is of paramount importance.
Please consider the heat generation
of the LED when making the system design. The coefficient of temperature increase per input
electric power is affected by the thermal resistance of the circuit board and density of LED placement
on the board, as well as other components. It is necessary to avoid intense heat generation and operate
within the maximum ratings given in this specification.
· Please determine the operating current with consideration of the ambient temperature local to the LED
and refer to the plot of Ambient temperature vs. Allowable Forward Current on CHARACTERISTICS
in this specifications. Please also take measures to remove heat from the area near the LED to improve
the operational characteristics of the LED.
· The equation 1 indicates correlation between Tj and Ta, and the equation 2 indicates correlation
between Tj and Ts.
Tj=Ta + Rja W
1
Tj=Ts + Rjs W
2
Tj = Dice Temperature : °C, Ta = Ambient Temperature : °C,
Ts = Solder Temperature (Cathode Side) : °C,
Rja = Heat resistance from Dice to Ambient temperature : °C /W,
Rjs = Heat resistance from Dice to Ts measuring point ≒ 55°C /W,
W = Inputting Power (IF VF) : W
-7-
Nichia STS-DA1-0037-1
<Cat.No.080110>
· Warpage of circuit board with soldered LEDs may result in damage or package breakage of the LEDs.
Please pay special attention to the orientation of the LEDs as to avoid LED failure caused by bow, twist
and warpage of the board.
【Non-preferable】
【Preferable】
Cathode mark
Cathode mark
When mechanical stress from the board affects the soldered LED, place the LED in the preferable
location and orientation as shown above.
· Depending on the position and direction of LED, the mechanical stress on the LED package can be
changed. Refer to the following figure.
E
Perforated line
D
C
B
A
Slit
Stress : A > B = C > D > E
· When separating the circuit boards with soldered LEDs, please use appropriate tools and equipment.
Hand brake without these tools and equipment may not be used.
· The use of aluminum substrate increases stress to solder joints due to thermal expansion of substrate and
subsequently may result in solder joint crack. Users may need to evaluate their specific application to
determine any impact due to the use of aluminum substrate.
-8-
Nichia STS-DA1-0037-1
<Cat.No.080110>
(5) Handling Precautions
· Bare Hand
When handling the product, touching encapsulant with bare hands will contaminate its surface that could
affects on optical characteristics. In the worst cases, excessive force to the encapsulant by hands might
result in catastrophic failure of the LEDs due to wire deformation and/or breakage.
· Tweezers
When handling it with tweezers, the product should only be held by the package body, on the short side.
Failure to comply might result in chip-out and/or delamination of encapsulant, and in the worst cases,
catastrophic failure of the LEDs due to wire deformation and/or breakage.
· Pick and Place
Recommended conditions :
Area of outer nozzle ≥ 1.5 mm2
(more than 45% of encapsulant top surface)**
Contact area of nozzle with encapsulant ≥ 1.0 mm2
(30 to 60% of encapsulant top surface)**
Placement pressure ≤ 3N/mm2 *max. force : 5N
Vacuum pressure ≤ 7.8N/ cm2 (≤ 0.8 kgf/cm2)
**For reference.
Failure to comply might result in damage to encapsulant and in the worst cases,
catastrophic failure of the LEDs due to wire deformation and/or breakage.
-9-
Nichia STS-DA1-0037
<Cat.No.071122>
· Printed Circuit Board Assembled (PCB with LEDs soldered)
Do not stack assembled PCBs together. Since silicone is a soft material, abrasion
between two PCB assembled with silicone encapsulated LED might cause catastrophic failure
of the LEDs due to damage to encapsulant (such as scratch, chip-out and delamination) and wire
(such as deformation and breakage) and LED detachment.
-10-
Nichia STS-DA1-0037
<Cat.No.071122>
(6) Soldering Conditions
· The LEDs can be soldered in place using the reflow soldering method.
Nichia cannot make a
guarantee on the LEDs after they have been assembled using the dip soldering method.
· Recommended soldering conditions
Reflow Soldering
Hand Soldering
Lead Solder
Lead-free Solder
Pre-heat
120 ~ 150°C
180 ~ 200°C
Temperature
350°C Max.
Pre-heat time
120 sec. Max.
120 sec. Max.
Soldering time
3 sec. Max.
Peak
240°C Max.
260°C Max.
Soldering time
10 sec. Max.
10 sec. Max.
Condition
refer to
refer to
(one time only)
temperature
Temperature - profile 1.
Temperature - profile 2.
(N2 reflow is recommended.)
Although the recommended soldering conditions are specified in the above table, reflow or hand
soldering at the lowest possible temperature is desirable for the LEDs.
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
Use the conditions shown to the under figure.
[Temperature-profile (Surface of circuit board)]
<1 : Lead Solder>
<2 : Lead-free Solder>
2.5 ~ 5°C / sec.
2.5 ~ 5°C / sec.
Pre-heating
120 ~ 150°C 60sec.Max.
Above 200°C
1 ~ 5°C / sec.
240°C Max.
10sec. Max.
1 ~ 5°C / sec.
Pre-heating
180 ~ 200°C 60sec.Max.
260°C Max.
10sec. Max.
Above 220°C
120sec.Max.
120sec.Max.
[Recommended soldering pad design]
Use the following conditions shown in the figure.
1.5
0.8
3.4
(Unit : mm)
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere
during air reflow.
It is recommended that the User use the nitrogen reflow method.
· Repairing should not be done after the LEDs have been soldered.
When repairing is unavoidable,
a double-head soldering iron should be used.
It should be confirmed beforehand whether the
characteristics of the LEDs will or will not be damaged by repairing.
· Reflow soldering should not be done more than two times.
· When soldering, do not put stress on the LEDs during heating.
-11-
Nichia STS-DA1-0037
<Cat.No.071122>
(7) Cleaning
· It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs.
When using
other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the
resin or not.
Freon solvents should not be used to clean the LEDs because of worldwide regulations.
· Do not clean the LEDs by the ultrasonic.
When it is absolutely necessary, the influence of ultrasonic
cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition.
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.
(8) Others
· NS2W095A complies with RoHS Directive.
· The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent
looking directly at the LEDs with unaided eyes for more than a few seconds.
· Flashing lights have been known to cause discomfort in people; you can prevent this by taking
precautions during use. Also, people should be cautious when using equipment that has had LEDs
incorporated into it.
· The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such
as office equipment, communications equipment, measurement instruments and household appliances).
Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality
and reliability are required, particularly when the failure or malfunction of the LEDs may directly
jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor
control systems, automobiles, traffic control equipment, life support systems and safety devices).
· User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written
consent from Nichia.
When defective LEDs are found, the User shall inform Nichia directly before
disassembling or analysis.
· The formal specifications must be exchanged and signed by both parties before large volume purchase begins.
· The appearance and specifications of the product may be modified for improvement without notice.
-12-
Nichia STS-DA1-0037
<Cat.No.071122>
ICI Chromaticity Diagram
0.9
520
530
0.8
540
510
550
0.7
560
0.6
570
500
0.5
580
y
590
0.4
c1
600
b4
b3
0.3 490
a0
610
620
c2
b6
630
b5
0.2
480
0.1
470
460
0
0
0.1
0.2
0.3
0.4
x
½ Color Coordinates Measurement allowance is ± 0.01.
-13-
0.5
0.6
0.7
0.8
20
10
5
2.0
1.5
1.0
0.5
0
50 100 150 200 250
Forward Current IFP (mA)
Ambient Temperature vs.
Forward Voltage
Ambient Temperature vs.
Relative Luminous Flux
5.0
2.0
4.5
IFP=60mA
4.0
3.5
3.0
2.5
2.0
-40 -20 0 20 40 60 80 100
Ambient Temperature Ta (°C)
Relative Luminous Flux (a.u.)
-14-
Forward Voltage VF (V)
2.5
0
1
2.0 2.5 3.0 3.5 4.0 4.5 5.0
Forward Voltage VF (V)
Ta=25°C
3.0
IFP=60mA
1.0
0.5
0.2
-40 -20 0 20 40 60 80 100
Ambient Temperature Ta (°C)
Allowable Forward Current IFP (mA)
Ta=25°C
100
60
3.5
Duty Ratio vs.
Allowable Forward Current
300
200
120
Ta=25°C
50
20
10
1
5 10 20
50 100
Duty Ratio (%)
Ambient Temperature vs.
Allowable Forward Current
Allowable Forward Current IF (mA)
300
200
Forward Current vs.
Relative Luminous Flux
Relative Luminous Flux (a.u.)
Forward Current IFP (mA)
Forward Voltage vs.
Forward Current
200
150
120
110
50
0
0
Thermal resistance
Rja=110°C/W
20
40
60
80 100
Ambient Temperature Ta (°C)
NICHIA CORPORATION
NS2W095A
Title
CHARACTERISTICS
No.
071016701641
Nichia STS-DA1-0037
<Cat.No.071122>
Model
Forward Current vs.
Chromaticity Coordinate
Ta=25°C
1mA
0.37
5mA
y
0.36
60mA
0.35
100mA
200mA
0.34
0.33
0.32 0.33 0.34 0.35 0.36 0.37
Relative Emission Intensity (a.u.)
0.38
Spectrum
x
Ambient Temperature vs.
Chromaticity Coordinate
-30°C
0°C
25°C
50°C
85°C
0.34
0.33
0.32 0.33 0.34 0.35 0.36 0.37
x
Relative Illuminance (a.u.)
-15-
0.37
y
0.8
0.6
0.4
0.2
0
350
450
550
650
Wavelength λ (nm)
750
0°
1.0
IFP=60mA
0.35
Ta=25°C
IF=60mA
1.0
Directivity
0.38
0.36
1.2
Y
10° 20°
30°
X
X
40°
Y
50°
60°
0.5
Ta=25°C
IFP=60mA
X-X
Y-Y
0
90°
60°
30°
Radiation Angle
70°
80°
0°
0.5
NICHIA CORPORATION
NS2W095A
Title
CHARACTERISTICS
No.
071016701651
Nichia STS-DA1-0037
<Cat.No.071122>
Model
90°
1.0
3
2.3
2.8
0.8
1.3
1
1.5
0.6
0.15
Cathode mark
Anode
Cathode
K
-16-
0.45
0.85
A
Protection device
ITEM
MATERIALS
PACKAGE
ENCAPSULATING RESIN
ELECTRODES
Ceramics
Silicone Resin (with Phosphor)
Ag Plating
NICHIA CORPORATION
Title
No.
NS2W095A
OUTLINE DIMENSIONS
070903770431
Nichia STS-DA1-0037
<Cat.No.071122>
Model
Unit
mm
10/1
Scale
Allow
±0.1
4±0.1
φ 1.5+0.1
-0
Reel part
1.75±0.1
Taping part
2±0.05
11.4±1
9±0.3
φ 180+0
-3
0.2±0.05
1.1±0.1
4±0.1
φ
No LEDs
φ 60+1
-0
1 ±0.8
±0.2
φ 13
Label
XXXX LED
1+0.2
-0
TYPE NS2x095AT
LOT xxxxxx-U„
QTY
pcs
RoHS
1.7±0.1
Reel End of tape
φ2
3.2±0.1
8+0.3
- 0.1
3.5±0.05
Cathode mark
LEDs mounting part
No LEDs
-17-
Pull direction
Top cover
tape
Embossed carrier tape
Reel Lead Min.160mm (No LEDs)
Reel Lead Min.100mm (No LEDs)
Reel Lead Min.400mm
Taping is based on the JIS C 0806 : Packaging of Electronic
Components on Continuous Tapes.
Model
NICHIA CORPORATION
Title
No.
NS2x095AT
TAPING DIMENSIONS
070905770491
Nichia STS-DA1-0037
<Cat.No.071122>
3,000pcs/Reel
Unit
mm
Scale
Allow
Nichia STS-DA1-0037
<Cat.No.071122>
The reel and moisture absorbent material are put in the moisture proof foil bag
and then heat sealed.
Reel
Label
NICHIA
Seal
XXXX LED
TYPE
LOT
QTY
NS2x095AT
xxxxxx-U„
PCS RoHS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Moisture proof foil bag
Moisture
absorbent material
The box is partitioned with the
cardboard.
Label
NICHIA
Nichia
XXXX LED
LED
TYPE
RANK
QTY
NS2x095AT
U„
RoHS
PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Packing unit
Moisture proof foil bag
Cardboard box
Cardboard box S
Cardboard box M
Cardboard box L
Reel/bag
1reel
Quantity/bag (pcs)
3,000 MAX.
Dimensions (mm)
291¯237¯120¯8t
259¯247¯243¯5t
444¯262¯259¯8t
NICHIA CORPORATION
-18-
Reel/box
7reel MAX.
15reel MAX.
30reel MAX.
Quantity/box (pcs)
21,000 MAX.
45,000 MAX.
90,000 MAX.
Model
NS2x095AT
Title
PACKING
No.
070905770511