Nichia STS-DA1-0043A <Cat.No.071228> SPECIFICATIONS FOR NICHIA CHIP TYPE WHITE MODEL : NJSW107T NICHIA CORPORATION LED Nichia STS-DA1-0043A <Cat.No.071228> 1.SPECIFICATIONS (1) Absolute Maximum Ratings Item Forward Current Pulse Forward Current Allowable Reverse Current Power Dissipation Operating Temperature Storage Temperature Dice Temperature Soldering Temperature IFP Conditions Symbol IF IFP IR PD Topr Tstg Tj Tsld Pulse Width < = 10msec. : (2) Initial Electrical/Optical Characteristics Item Symbol Forward Voltage VF Luminous Flux φv x Chromaticity Coordinate y - Absolute Maximum Rating 500 800 85 2.2 -40 ~ + 85 -40 ~ +100 130 Reflow Soldering : 260°C and (Tc=25°C) Unit mA mA mA W °C °C °C for 10sec. Duty < = 1/10 Condition IF=350[mA] IF=350[mA] IF=350[mA] IF=350[mA] Typ. (3.7) (72) 0.344 0.355 (Tc=25°C) Max. Unit 4.4 V lm - Min. 4.0 3.6 3.2 72.0 60.5 51.0 (Tc=25°C) Max. Unit 4.4 V 4.0 3.6 85.6 lm 72.0 60.5 Please refer to CIE 1931 chromaticity diagram. (3) Ranking Item Forward Voltage Luminous Flux Rank H Rank M Rank L Rank P16 Rank P15 Rank P14 Symbol Condition VF IF=350[mA] φV IF=350[mA] Forward Voltage Measurement allowance is ± 3%. Luminous Flux Measurement allowance is ± 7%. 0.307 0.315 (IF=350mA,Tc=25°C) Rank b4 0.304 0.330 0.330 0.330 0.360 0.339 0.311 0.294 Rank b6 0.307 0.330 0.315 0.339 Color Ranks x y x y 0.287 0.295 Rank b3 0.283 0.304 0.305 0.330 0.296 0.276 Rank b5 0.287 0.307 0.295 0.315 0.307 0.315 x y 0.311 0.294 x y -1- 0.330 0.318 Nichia STS-DA1-0043A <Cat.No.071228> x y 0.330 0.339 Rank c1 0.330 0.361 0.360 0.385 0.357 0.361 x y 0.330 0.318 Rank c2 0.330 0.357 0.339 0.361 0.356 0.351 Color Coordinates Measurement allowance is ± 0.01. Basically, a shipment shall consist of the LEDs of a combination of the above ranks. The percentage of each rank in the shipment shall be determined by Nichia. 2.INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS Please refer to “CHARACTERISTICS” on the following pages. 3.OUTLINE DIMENSIONS AND MATERIALS Please refer to “OUTLINE DIMENSIONS” on the following page. : Ceramics Material as follows ; Package Encapsulating Resin : Silicone Resin (with Diffused + Phosphor) Electrodes : Au Plating Die Heat sink : Ag Plating Copper 4.PACKAGING · The LEDs are packed in cardboard boxes after taping. Please refer to “TAPING DIMENSIONS” and “PACKING ”on the following pages. The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity · In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation. · The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions must be taken to prevent any damage. · The boxes are not water resistant and therefore must be kept away from water and moisture. · When the LEDs are transported, we recommend that you use the same packing method as Nichia. 5.LOT NUMBER The first six digits number shows lot number. The lot number is composed of the following characters; -U - Year ( 7 for 2007, 8 for 2008 ) - Month ( 1 for Jan., 9 for Sep., A for Oct., - Nichia's Product Number U - Ranking by Color Coordinates - Ranking by Luminous Flux - Ranking by Forward Voltage -2- B for Nov. ) Nichia STS-DA1-0043A <Cat.No.071228> 6.RELIABILITY (1) TEST ITEMS AND RESULTS Test Item Resistance to Soldering Heat (Reflow Soldering) Solderability (Reflow Soldering) Thermal Shock Temperature Cycle Moisture Resistance Cyclic High Temperature Storage Temperature Humidity Storage Low Temperature Storage Standard Test Method JEITA ED-4701 300 301 JEITA ED-4701 300 303 JEITA ED-4701 300 307 JEITA ED-4701 100 105 JEITA ED-4701 200 203 JEITA ED-4701 200 201 JEITA ED-4701 100 103 JEITA ED-4701 200 202 Steady State Operating Life Test Conditions Tsld=260°C, 10sec. (Pre treatment 30°C,70%,168hrs.) Note 2 times Number of Damaged 0/22 Tsld=215 ± 5°C, 3sec. (Lead Solder) 0°C ~ 100°C 15sec. 15sec. -40°C ~ 25°C ~ 100°C ~ 25°C 30min. 5min. 30min. 5min. 25°C ~ 65°C ~ -10°C 90%RH 24hrs./1cycle Ta=100°C 1 time over 95% 20 cycles 0/22 100 cycles 0/22 10 cycles 0/22 1000 hrs. 0/22 Ta=60°C, 1000 hrs. 0/22 Ta=-40°C 1000 hrs. 0/22 Ta=25°C, IF=500mA 1000 hrs. 0/22 1000 hrs. 0/22 500 hrs. 0/22 1000 hrs. 0/22 1 time 0/22 48min. 0/22 3 times 0/22 RH=90% 0/22 Tested with Nichia standard circuit board. Steady State Operating Life of High Temperature Steady State Operating Life of High Humidity Heat Steady State Operating Life of Low Temperature Permanence of Marking Ta=85°C, IF=220mA Tested with Nichia standard circuit board. 60°C, RH=90%, IF=350mA Tested with Nichia standard circuit board. Ta=-40°C, IF=350mA Tested with Nichia standard circuit board. JEITA ED-4701 500 501 Vibration JEITA ED-4701 400 403 Electrostatic Discharges JEITA ED-4701 300 304 Solvent : Isopropyl Alcohol Solvent Temperature : 20 ~ 25°C Dipping Time : 5 min. 100 ~ 2000 ~ 100Hz Sweep 4min. 200m/s2 3directions, 4cycles R=1.5kΩ, C=100pF Test Voltage=2kV Negative/Positive Thermal resistance of LED with Nichia standard circuit board : Rja ≒ 45°C/W Nichia standard circuit board : FR4, t=1.6mm, Copper foil, t=0.07mm (2) CRITERIA FOR JUDGING DAMAGE Criteria for Judgement Min. Max. Item Symbol Test Conditions Forward Voltage VF IF=350mA Initial Level Luminous Flux φv IF=350mA Initial Level 0.7 The test is performed after the board is cooled down to the room temperature. -3- 1.1 Nichia STS-DA1-0043A <Cat.No.071228> 7.CAUTIONS The LEDs are devices which are materialized by combining Blue LEDs and special phosphors. Consequently, the color of the LEDs is changed a little by an operating current. Care should be taken after due consideration when using LEDs. (1) Moisture Proof Package · When moisture is absorbed into the SMT package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage the optical characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package. · The moisture proof package is made of an aluminum moisture proof bag. A package of a moisture absorbent material (silica gel) is inserted into the aluminium moisture proof bag. The silica gel changes its color from blue to pink as it absorbs moisture. (2) Storage · Storage Conditions Before opening the package : The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After opening the package : The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in the moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. · If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following condition. Baking treatment : more than 24 hours at 65 ± 5°C · This product has silver plated metal parts that are inside and/or outside the package body. The silver plating becomes tarnished when being exposed to an environment which contains corrosive gases. Any LED with tarnished leads may lead to poor solderability and deterioration of optical characteristics. Please do not expose the LEDs to corrosive atmosphere during storage. · After assembly and during use, silver plating can be affected by the corrosive gases emitted by components and materials in close proximity of the LEDs within an end product, and the gases entering into the product from the external atmosphere. The above should be taken into consideration when designing. · Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur. -4- Nichia STS-DA1-0043A <Cat.No.071228> (3) Static Electricity · Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. · All devices, equipment and machinery must be properly grounded. It is recommended that precautions be taken against surge voltage to the equipment that mounts the LEDs. · When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended). · Damaged LEDs will show some unusual characteristics such as the forward voltage becomes lower, or the LEDs do not light at the low current. Criteria : (VF > 2.0V at IF=0.5mA) (4) Application Design Considerations · In designing a circuit, the current through each LED must not exceed its absolute maximum rating. It is recommended to use Circuit B which regulates the current flowing through each LED. In the meanwhile, when driving LEDs with a constant voltage in Circuit A, the current through the LEDs may vary due to the variation in forward voltage (VF) of the LEDs. In the worst case, some LED may be subjected to stresses in excess of the absolute maximum rating. (B) (A) ... ... · Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. · Please determine the operating current with consideration of the ambient temperature local to the LED and refer to the plot of Ambient temperature vs. Allowable Forward Current on CHARACTERISTICS in this specifications. Please also take measures to remove heat from the area near the LED (heat sink) to improve the operational characteristics of the LED. · The equation 1 indicates correlation between Tj and Ta, and the equation 2 indicates correlation between Tj and Tc. Tj=Ta + Rja W 1 Tj=Tc + Rjc W 2 Tj = Dice Temperature : °C, Ta = Ambient Temperature : °C, Tc = Die Heat sink Temperature : °C, Rja = Heat resistance from Dice to Ambient temperature : °C /W, Rjc = Heat resistance from Dice to Tc measuring point ≒ 10°C /W, W = Inputting Power (IF VF) : W -5- Nichia STS-DA1-0043A <Cat.No.071228> · Warpage of circuit board with soldered LEDs may result in damage or package breakage of the LEDs. Please pay special attention to the orientation of the LEDs as to avoid LED failure caused by bow, twist and warpage of the board. 【Non-preferable】 【Preferable】 Cathode mark Cathode mark Solder connections Solder connections When mechanical stress from the board affects the soldered LED, place the LED in the preferable location and orientation as shown above. · Depending on the position and direction of LED, the mechanical stress on the LED package can be changed. Refer to the following figure. E D C Perforated line A B Slit Stress : A > B = C > D > E · When separating the circuit boards with soldered LEDs, please use appropriate tools and equipment. Hand brake without these tools and equipment may not be used. · The use of aluminum substrate increases stress to solder joints due to thermal expansion of substrate and subsequently may result in solder joint crack. Users may need to evaluate their specific application to determine any impact due to the use of aluminum substrate. -6- Nichia STS-DA1-0043A <Cat.No.071228> (5) Handling Precautions · Bare Hand When handling the product, touching encapsulant with bare hands will contaminate its surface that could affects on optical characteristics. In the worst cases, excessive force to the encapsulant by hands might result in catastrophic failure of the LEDs due to wire deformation and/or breakage. · Tweezers When handling it with tweezers, the product should only be held by the ceramic body, not by the encapsulant. Failure to comply might result in chip-out and/or delamination of encapsulant, and in the worst cases, catastrophic failure of the LEDs due to wire deformation and/or breakage. Encapsulant Ceramic body · Pick and Place Recommended conditions : Area of outer nozzle ≥ 2 mm2 (more than 30% of encapsulant top surface)** Contact area of nozzle with encapsulant ≥ 0.9 mm2 (15 to 85% of encapsulant top surface)** Placement pressure ≤ 3N/mm2 *max. force : 5N Vacuum pressure ≤ 7.8N/ cm2 (≤ 0.8 kgf/cm2) **For reference. Failure to comply might result in damage to encapsulant and in the worst cases, catastrophic failure of the LEDs due to wire deformation and/or breakage. -7- Nichia STS-DA1-0043A <Cat.No.071228> · Printed Circuit Board Assembled (PCB with LEDs soldered) Do not stack assembled PCBs together. Since silicone is a soft material, abrasion between two PCB assembled with silicone encapsulated LED might cause catastrophic failure of the LEDs due to damage to encapsulant (such as scratch, chip-out and delamination) and wire (such as deformation and breakage) and LED detachment. -8- Nichia STS-DA1-0043A <Cat.No.071228> (6) Soldering Conditions · The LEDs can be soldered in place using the reflow soldering method. Nichia cannot make a guarantee on the LEDs after they have been assembled using the dip or hand soldering method. · Recommended soldering conditions Reflow Soldering Lead Solder Lead-free Solder Pre-heat 120 ~ 150°C 180 ~ 200°C Pre-heat time 120 sec. Max. 120 sec. Max. Peak 240°C Max. 260°C Max. Soldering time 10 sec. Max. 10 sec. Max. Condition refer to refer to temperature Temperature - profile 1. Temperature - profile 2. (N2 reflow is recommended.) Although the recommended soldering conditions are specified in the above table, reflow soldering at the lowest possible temperature is desirable for the LEDs. A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature. Use the conditions shown to the under figure. [Temperature-profile (Surface of circuit board)] <1 : Lead Solder> <2 : Lead-free Solder> 2.5 ~ 5°C / sec. 2.5 ~ 5°C / sec. Pre-heating 120 ~ 150°C 60sec.Max. Above 200°C 1 ~ 5°C / sec. 240°C Max. 10sec. Max. 1 ~ 5°C / sec. Pre-heating 180 ~ 200°C 60sec.Max. 260°C Max. 10sec. Max. Above 220°C 120sec.Max. 120sec.Max. [Recommended soldering pad design] Use the following conditions shown in the figure. 2.9 1.8 4.0 2.8 (Unit : mm) 1.8 4-R0.3 · Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during air reflow. It is recommended that the User use the nitrogen reflow method. · Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a hot plate should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. · Reflow soldering should not be done more than two times. · Die Heat sink is to be soldered. If not, please use the heat conductive adhesive. · When soldering, do not put stress on the LEDs during heating. · After soldering, do not warp the circuit board. -9- Nichia STS-DA1-0043A <Cat.No.071228> (7) Cleaning · It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. · Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur. (8) Others · NJSW107 complies with RoHS Directive. · The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent looking directly at the LEDs with unaided eyes for more than a few seconds. · Flashing lights have been known to cause discomfort in people; you can prevent this by taking precautions during use. Also, people should be cautious when using equipment that has had LEDs incorporated into it. · The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic control equipment, life support systems and safety devices). · User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from Nichia. When defective LEDs are found, the User shall inform Nichia directly before disassembling or analysis. · The formal specifications must be exchanged and signed by both parties before large volume purchase begins. · The appearance and specifications of the product may be modified for improvement without notice. -10- Nichia STS-DA1-0043A <Cat.No.071228> ICI Chromaticity Diagram 0.9 520 530 0.8 540 510 550 0.7 560 0.6 570 500 0.5 580 y 590 0.4 c1 600 b4 b3 610 620 c2 0.3 490 b6 630 b5 0.2 480 0.1 470 460 0 0 0.1 0.2 0.3 0.4 x ½ Color Coordinates Measurement allowance is ± 0.01. -11- 0.5 0.6 0.7 0.8 1000 800 2.5 Ta=25°C 2.0 1.5 1.0 0.5 0 3.0 3.5 4.0 4.5 5.0 Forward Voltage VF (V) 0 200 400 600 800 1000 Forward Current IFP (mA) Ambient Temperature vs. Forward Voltage Ambient Temperature vs. Relative Luminous Flux 5.0 2.0 -12- IFP=350mA 4.5 4.0 3.5 3.0 2.5 -60 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (°C) Forward Current vs. Luminous Efficiency IFP=350mA 1.0 0.5 0.2 -60 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (°C) 500 Luminous Efficiency (lm/W) Luminous Flux (lm) 50 Allowable Forward Current IFP (mA) 100 Duty Ratio vs. Allowable Forward Current Ta=25°C 200 100 1 5 10 20 50 100 Duty Ratio (%) 180 Luminous Efficiency : Luminous Flux : 150 Ta=25°C 120 90 60 30 0 0 200 400 600 800 1000 Forward Current IFP (mA) Ambient Temperature vs. Allowable Forward Current Allowable Forward Current IF (mA) 350 10 2.5 Forward Voltage VF (V) Ta=25°C Relative Luminous Flux (a.u.) Forward Current IFP (mA) 1000 800 Forward Current vs. Relative Luminous Flux Relative Luminous Flux (a.u.) Forward Voltage vs. Forward Current 600 500 Thermal resistance Rja=45°C/W 400 300 227 100 0 0 20 40 60 80 100 Ambient Temperature Ta (°C) NICHIA CORPORATION NJSW107 Title CHARACTERISTICS No. 071023702521 Nichia STS-DA1-0043A <Cat.No.071228> Model Spectrum Forward Current vs. Chromaticity Coordinate Relative Emission Intensity (a.u.) 0.38 Ta=25°C y 0.37 20mA 100mA 0.36 350mA 500mA 800mA 0.35 0.34 0.33 0.34 0.35 0.36 0.37 x Ambient Temperature vs. Chromaticity Coordinate Relative Illuminance (a.u.) -13y 0.37 0.34 0.33 0.8 0.6 0.4 0.2 0 350 450 550 650 Wavelength λ (nm) -40°C 85°C 50°C 0°C 25°C 0.34 0.35 x 0.36 750 0° 1.0 IFP=350mA 0.35 Ta=25°C IFP=350mA 1.0 Directivity 0.38 0.36 1.2 0.37 10° 20° 30° Ta=25°C IFP=350mA 40° 50° 60° 0.5 70° 80° 0 90° 60° 30° Radiation Angle 0° 0.5 NICHIA CORPORATION NJSW107 Title CHARACTERISTICS No. 071023702531 Nichia STS-DA1-0043A <Cat.No.071228> Model 90° 1.0 Cathode mark 3.5 1.5 Die Heat sink 0.8 2.8 2 2.8± 0.1 2 2.8 3.5 Cathode 4-R4 2.9 ± 0.1 3.3 ± 0.1 Anode -14- A K Protection device MATERIALS PACKAGE Ceramics Silicone Resin (with Diffused + Phosphor) Au Plating Ag Plating Copper ENCAPSULATING RESIN ELECTRODES DIE HEAT SINK Note 1) NJSW107 has a protection device built in as a protection circuit against static electricity. Note 2) The die heat sink is electrically neutral. Model NICHIA CORPORATION Title No. NJSW107 OUTLINE DIMENSIONS 070910767912 Nichia STS-DA1-0043A <Cat.No.071228> ITEM Unit mm 8/1 Scale Allow ±0.2 Taping part φ 180+0 -3 5.5±0.05 Cathode mark 0.2±0.05 φ2 1 ±0.8 φ 60+1 -0 2±0.05 4±0.1 15.4±1 13+1 -0 3.85±0.1 8±0.1 12+0.3 - 0.1 φ 1.5+0.1 -0 1.75±0.1 Reel part ±0.2 φ 13 2±0.1 φ 1.5+0.2 -0 Label XXXX LED 3.85±0.1 Reel End of tape LEDs mounting part No LEDs TYPE NJSx107T LOT xxxxxx-Uz QTY pcs RoHS No LEDs -15Pull direction Top cover tape Embossed carrier tape Reel Lead Min.160mm (No LEDs) Reel Lead Min.100mm (No LEDs) Reel Lead Min.400mm 1,200pcs/Reel NICHIA CORPORATION Title No. NJSx107T TAPING DIMENSIONS 070711767921 Nichia STS-DA1-0043A <Cat.No.071228> Model Taping is based on the JIS C 0806 : Packaging of Electronic Components on Continuous Tapes. Unit mm Scale Allow Nichia STS-DA1-0043A <Cat.No.071228> The reel and moisture absorbent material are put in the moisture proof foil bag and then heat sealed. Reel Label NICHIA Seal XXXX LED TYPE LOT QTY NJSx107T xxxxxx-Uz PCS RoHS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Moisture proof foil bag Moisture absorbent material The box is partitioned with the cardboard. Label NICHIA Nichia XXXX LED LED TYPE RANK QTY NJSx107T Uz PCS RoHS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Packing unit Moisture proof foil bag Cardboard box Cardboard box S Cardboard box M Cardboard box L Reel/bag 1reel Quantity/bag (pcs) 1,200 MAX. Dimensions (mm) 291¯237¯120¯8t 259¯247¯243¯5t 444¯262¯259¯8t NICHIA CORPORATION -16- Reel/box 5reel MAX. 10reel MAX. 20reel MAX. Quantity/box (pcs) 6,000 MAX. 12,000 MAX. 24,000 MAX. Model NJSx107T Title PACKING No. 070628767931