No. STSE-CC5149A <Cat.No.051025> SPECIFICATIONS FOR NICHIA CHIP TYPE GREEN LED MODEL : NFSG036BT NICHIA CORPORATION -0- Nichia STSE-CC5149A <Cat.No.051025> 1.SPECIFICATIONS (1) Absolute Maximum Ratings Item Forward Current Pulse Forward Current Allowable Reverse Current Power Dissipation Operating Temperature Storage Temperature Dice Temperature Soldering Temperature Symbol IF IFP IR PD Topr Tstg Tj Tsld Absolute Maximum Rating 180 350 85 810 -30 ~ + 85 -40 ~ +100 105 Reflow Soldering : 260°C Hand Soldering : 350°C (Ts=25°C) Unit mA mA mA mW °C °C °C for 10sec. for 3sec. IFP Conditions : Pulse Width < = 10msec. and Duty < = 1/10 (2) Initial Electrical/Optical Characteristics Item Symbol Forward Voltage VF Luminous Flux φv Luminous Intensity Iv x Chromaticity Coordinate y - Condition IF=150[mA] IF=150[mA] IF=150[mA] IF=150[mA] IF=150[mA] Typ. (4.0) (12.1) (4.5) 0.20 0.69 (Ts=25°C) Max. Unit 4.5 V lm cd - Min. 15.1 12.7 10.7 9.0 7.6 (Ts=25°C) Max. Unit 18.0 15.1 lm 12.7 10.7 9.0 Please refer to CIE 1931 chromaticity diagram. (3) Ranking Item Luminous Flux Rank P7 Rank P6 Rank P5 Rank P4 Rank P3 Symbol Condition φv IF=150[mA] Luminous Flux Measurement allowance is ± 7%. (IF=150mA,Ts=25°C) Color Rank x y 0.190 0.628 0.136 0.739 Rank G0d 0.176 0.220 0.750 0.745 0.250 0.638 0.219 0.637 Color Coordinates Measurement allowance is ± 0.01. One delivery will include up to one color rank and five luminous flux ranks of the products. The quantity-ratio of the ranks is decided by Nichia. -1- Nichia STSE-CC5149A <Cat.No.051025> (4) Correspondence table of Luminous Flux – Luminous Intensity (Reference) φV (lm) IV (cd) 18.0 (6.8) 15.1 (5.7) 12.7 (4.7) 10.7 (3.9) 9.0 (3.3) 7.6 (2.7) 2.INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS Please refer to figure’s page. 3.OUTLINE DIMENSIONS AND MATERIALS Please refer to figure’s page. Material as follows ; Package Encapsulating Resin Encapsulating Resin Color Electrodes : : : : Ceramics Silicone Resin (with Diffused) Green (with Diffused) Ag Plating 4.PACKAGING · The LEDs are packed in cardboard boxes after taping. Please refer to figure’s page. The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity · In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation. · The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions must be taken to prevent any damage. · The boxes are not water resistant and therefore must be kept away from water and moisture. · When the LEDs are transported, we recommend that you use the same packing method as Nichia. 5.LOT NUMBER The first six digits number shows lot number. The lot number is composed of the following characters; -U - Year ( 4 for 2004, 5 for 2005 ) - Month ( 1 for Jan., 9 for Sep., A for Oct., - Nichia's Product Number U - Ranking by Color Coordinates - Ranking by Luminous Flux -2- B for Nov. ) Nichia STSE-CC5149A <Cat.No.051025> 6.RELIABILITY (1) TEST ITEMS AND RESULTS Test Item Resistance to Soldering Heat (Reflow Soldering) Solderability (Reflow Soldering) Thermal Shock Temperature Cycle High Temperature Storage Temperature Humidity Storage Low Temperature Storage Standard Test Method JEITA ED-4701 300 301 JEITA ED-4701 300 303 JEITA ED-4701 300 307 JEITA ED-4701 100 105 JEITA ED-4701 200 201 JEITA ED-4701 100 103 JEITA ED-4701 200 202 Steady State Operating Life Test Conditions Tsld=260°C, 10sec. (Pre treatment 30°C,70%,168hrs.) Note 2 times Number of Damaged 0/50 1 time over 95% 20 cycles 0/50 100 cycles 0/50 500 hrs. 0/50 Ta=60°C, RH=90% 500 hrs. 0/50 Ta=-40°C 500 hrs. 0/50 Ta=25°C, IF=150mA 500 hrs. 0/50 500 hrs. 0/50 500 hrs. 0/50 500 hrs. 0/50 48min. 0/50 1 time 0/50 1 time 0/50 3 times 0/50 Tsld=215 ± 5°C, 3sec. (Lead Solder) 0°C ~ 100°C 15sec. 15sec. -40°C ~ 25°C ~ 100°C ~ 25°C 30min. 5min. 30min. 5min. Ta=100°C 0/50 Tested with Nichia standard circuit board. Steady State Operating Life of High Temperature Steady State Operating Life of High Humidity Heat Steady State Operating Life of Low Temperature Vibration Ta=70°C, IF=100mA Tested with Nichia standard circuit board. 60°C, RH=90%, IF=100mA Tested with Nichia standard circuit board. Ta=-40°C, IF=150mA Tested with Nichia standard circuit board. JEITA ED-4701 400 403 Substrate Bending JEITA ED-4702 100 ~ 2000 ~ 100Hz Sweep 4min. 200m/s2 3direction, 4cycles 3mm, 5 ± 1 sec. Adhesion Strength JEITA ED-4702 5N, Electrostatic Discharges JEITA ED-4701 300 304 R=1.5kΩ, C=100pF Test Voltage=2kV 10 ± 1 sec. Negative/Positive Thermal resistance of LED with Nichia standard circuit board : Rja ≒ 140°C/W Nichia standard circuit board : FR4, t=1.6mm, Copper foil, t=0.07mm (2) CRITERIA FOR JUDGING DAMAGE Criteria for Judgement Min. Max. Item Symbol Test Conditions Forward Voltage VF IF=150mA Initial Level Luminous Flux φv IF=150mA Initial Level 0.7 The test is performed after the board is cooled down to the room temperature. -3- 1.1 Nichia STSE-CC5149A-3 <Cat.No.071112> 7.CAUTIONS (1) Moisture Proof Package · When moisture is absorbed into the SMT package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage the optical characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package. · The moisture proof package is made of an aluminum moisture proof bag. A package of a moisture absorbent material (silica gel) is inserted into the aluminium moisture proof bag. The silica gel changes its color from blue to pink as it absorbs moisture. (2) Storage · Storage Conditions Before opening the package : The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After opening the package : The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in the moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. · If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following condition. Baking treatment : more than 24 hours at 65 ± 5°C · This product has silver plated metal parts that are inside and/or outside the package body. The silver plating becomes tarnished when being exposed to an environment which contains corrosive gases. Any LED with tarnished leads may lead to poor solderability and deterioration of optical characteristics. Please do not expose the LEDs to corrosive atmosphere during storage. · After assembly and during use, silver plating can be affected by the corrosive gases emitted by components and materials in close proximity of the LEDs within an end product, and the gases entering into the product from the external atmosphere. The above should be taken into consideration when designing. · Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur. (3) Static Electricity · Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. · All devices, equipment and machinery must be properly grounded. It is recommended that precautions be taken against surge voltage to the equipment that mounts the LEDs. · When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended). · Damaged LEDs will show some unusual characteristics such as the forward voltage becomes lower, or the LEDs do not light at the low current. Criteria : (VF > 2.0V at IF=0.5mA) -4- Nichia STSE-CC5149A-1 <Cat.No.060428> (4) Designing the position of LED on a board. · No twist / warp / bent / or other stress shall be applied to the board after mounting LED with solder to avoid a crack of LED package. Refer to the following recommended position and direction of LED. 【No good】 【Recommended Direction】 Cathode mark Cathode mark Appropriate LED mounting is to place perpendicularly against the stress affected side. · Depending on the position and direction of LED, the mechanical stress on the LED package can be changed. Refer to the following figure. E Perforated line D C B A Slit Stress : A > B = C > D > E · Do not split board by hand. Split with exclusive special tool. · If an aluminum circuit board is used, a large stress by thermal shock might cause a solder crack. For this reason, it is recommended an appropriate verification should be taken before use. -5- Nichia STSE-CC5149A-2 <Cat.No.061220> (5) Soldering Conditions · The LEDs can be soldered in place using the reflow soldering method. Nichia cannot make a guarantee on the LEDs after they have been assembled using the dip soldering method. · Recommended soldering conditions Pre-heat Pre-heat time Peak temperature Soldering time Condition Reflow Soldering Lead Solder Lead-free Solder 180 ~ 200°C 120 ~ 150°C 120 sec. Max. 120 sec. Max. 240°C Max. 260°C Max. Hand Soldering Temperature Soldering time 350°C Max. 3 sec. Max. (one time only) 10 sec. Max. 10 sec. Max. refer to refer to Temperature - profile 1. Temperature - profile 2. (N2 reflow is recommended.) Although the recommended soldering conditions are specified in the above table, reflow or hand soldering at the lowest possible temperature is desirable for the LEDs. A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature. [Temperature-profile (Surface of circuit board)] Use the conditions shown to the under figure. <1 : Lead Solder> <2 : Lead-free Solder> 2.5 ~ 5°C / sec. 2.5 ~ 5°C / sec. Pre-heating 120 ~ 150°C 60sec.Max. Above 200°C 1 ~ 5°C / sec. 240°C Max. 10sec. Max. 1 ~ 5°C / sec. Pre-heating 180 ~ 200°C 60sec.Max. 260°C Max. 10sec. Max. Above 220°C 120sec.Max. 120sec.Max. [Recommended soldering pad design] Use the following conditions shown in the figure. 3.7 4.5 1.4 (Unit : mm) · Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during air reflow. It is recommended that the User use the nitrogen reflow method. · The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resin should be used. · Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. · Reflow soldering should not be done more than two times. · When soldering, do not put stress on the LEDs during heating. (6) Cleaning · It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. · Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur. -6- Nichia STSE-CC5149A-2 <Cat.No.061220> (7) Heat Generation · Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. · Please determine the operating current with consideration of the ambient temperature local to the LED and refer to the plot of Ambient temperature vs. Allowable Forward Current on CHARACTERISTICS in this specifications. Please also take measures to remove heat from the area near the LED to improve the operational characteristics of the LED. · The equation 1 indicates correlation between Tj and Ta, and the equation 2 indicates correlation between Tj and Ts. Tj=Ta + Rja W 1 Tj=Ts + Rjs W 2 Tj = Dice Temperature : °C, Ta = Ambient Temperature : °C, Ts = Solder Temperature (Cathode Side) : °C, Rja = Heat resistance from Dice to Ambient temperature : °C /W, Rjs = Heat resistance from Dice to Ts measuring point ≒ 85°C /W, W = Inputting Power (IF VF) : W (8) Others · NFSG036B complies with RoHS Directive. · The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent looking directly at the LEDs with unaided eyes for more than a few seconds. · Flashing lights have been known to cause discomfort in people; you can prevent this by taking precautions during use. Also, people should be cautious when using equipment that has had LEDs incorporated into it. · The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic control equipment, life support systems and safety devices). · User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from Nichia. When defective LEDs are found, the User shall inform Nichia directly before disassembling or analysis. · The formal specifications must be exchanged and signed by both parties before large volume purchase begins. · The appearance and specifications of the product may be modified for improvement without notice. -7- Nichia STSE-CC5149A <Cat.No.051025> ICI Chromaticity Diagram 0.9 520 530 0.8 540 510 0.7 G0d 550 560 0.6 570 500 0.5 y 580 590 0.4 600 0.3 610 620 630 490 0.2 480 0.1 470 460 0 0 0.1 0.2 0.3 0.4 x ½ Color Coordinates Measurement allowance is ± 0.01. -8- 0.5 0.6 0.7 0.8 -9- Forward Voltage VF (V) 10 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Forward Voltage VF (V) Ta=25°C 2.0 1.5 1.0 0.5 0 0 100 200 300 400 500 Forward Current IFP (mA) Ambient Temperature vs. Forward Voltage Ambient Temperature vs. Relative Luminous Flux 5.5 2.0 5.0 IFP=150mA IFP=100mA 4.5 4.0 3.5 3.0 2.5 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (°C) Allowable Forward Current IFP (mA) 50 1000 2.5 IFP=150mA 1.0 0.5 0.2 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (°C) Ta=25°C 500 350 180 Pulse Width < = 10msec. ½ 100 1 5 10 20 50 100 Duty Ratio (%) Ambient Temperature vs. Allowable Forward Current Allowable Forward Current IF (mA) 150 100 Relative Luminous Flux (a.u.) Ta=25°C Relative Luminous Flux (a.u.) Forward Current IFP (mA) 1000 Duty Ratio vs. Allowable Forward Current Forward Current vs. Relative Luminous Flux Forward Voltage vs. Forward Current 250 Rja=110°C/W 200 180 150 100 50 0 0 20 40 60 80 100 Ambient Temperature Ta (°C) NICHIA CORPORATION NFSG036B Title CHARACTERISTICS No. 051014546171 Nichia STSE-CC5149A <Cat.No.051025> Model Forward Current vs. Chromaticity Coordinate (λD) y 0.70 0.65 Ta=25°C 150mA 40mA 180mA (530nm) (539nm) 20mA (529nm) 80mA (542nm) (535nm) 350mA (524nm) 0.60 0.55 0.10 0.15 0.20 0.25 0.30 0.35 560 550 Ta=25°C 540 530 520 510 500 10 100 1000 Forward Current IFP (mA) Ta=25°C IF=150mA 1.0 0.8 0.6 0.4 0.2 0 350 450 550 650 Wavelength λ (nm) 750 Ambient Temperature vs. Dominant Wavelength Dominant Wavelength λ D (nm) -10- Dominant Wavelength λ D (nm) x Forward Current vs. Dominant Wavelength 1.2 Directivity 532 0° 1.0 533 IFP=150mA Relative Illuminance (a.u.) 0.75 Relative Emission Intensity (a.u.) 0.80 Spectrum 531 530 529 528 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (°C) Ta=25°C IFP=150mA 10° 20° 30° 40° 50° 60° 0.5 70° 80° 0 90° 60° 30° Radiation Angle NICHIA CORPORATION 0.5 90° 1.0 NFSG036B Title CHARACTERISTICS No. 051014546181 Nichia STSE-CC5149A <Cat.No.051025> Model 0° 3.3 3.5 φ 2.6 1.6 3.3 3.5 0.8 Cathode mark Anode Cathode -11- A K Protection device MATERIALS PACKAGE Ceramics ENCAPSULATING RESIN Silicone Resin (with Diffused) ENCAPSULATING RESIN COLOR Green (with Diffused) ELECTRODES Ag Plating ½ NFSG036x has a protection device built in as a protection circuit against static electricity. Model NICHIA CORPORATION Title No. NFSG036x OUTLINE DIMENSIONS 051014538652 Unit mm 8/1 Scale Allow ±0.2 Nichia STSE-CC5149A <Cat.No.051025> ITEM +0.1 -0 ±0.1 4 Cathode mark ±1 1.75 φ1.5 Reel PART ±0.1 Taping PART ±0.05 φ180 0.2 ±0.05 +1 1 XXXX LED +0.2 -0 φ1.5 TYPE NFSx036xT LOT XXXXXX-△■ QTY pcs ±0.1 3.85 Reel End of Tape ± 0. 2 Label ±0.1 8 φ 13 ±0.1 φ60-0 5.5 +0.3 12-0.1 8 0. ± 21 φ 3.85 ±0.1 2 15.4 +1 13-0 +0 -3 ±0.05 No LEDs LEDs mounting part No LEDs Top cover tape -12Pull direction Reel Lead Min.40mm (No LEDs) Embossed carrier tape Reel Lead Min.160mm (No LEDs is more than 40) Reel Lead Min.400mm Taping is based on the JIS C 0806 : Packaging of Electronic Components on Continuous Tapes. Model NICHIA CORPORATION Title No. NFSx036xT TAPING DIMENSIONS 050620537332 Unit mm Scale Allow Nichia STSE-CC5149A <Cat.No.051025> 2,000pcs/Reel Nichia STSE-CC5149A <Cat.No.051025> The reel and moisture absorbent material are put in the moisture proof foil bag and then heat sealed. Reel Label NICHIA Seal XXXX LED TYPE LOT QTY NFSx036xT xxxxxx-U PCS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Moisture proof foil bag Moisture absorbent material The box is partitioned with the cardboard. Label NICHIA Nichia XXXX LED LED TYPE RANK QTY NFSx036xT U PCS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Packing unit Moisture proof foil bag Cardboard box Cardboard box S Cardboard box M Cardboard box L Reel/bag 1reel Quantity/bag (pcs) 2,000 MAX. Dimensions (mm) 291¯237¯120¯8t 259¯247¯243¯5t 444¯262¯259¯8t NICHIA CORPORATION -13- Reel/box 5reel MAX. 10reel MAX. 20reel MAX. Quantity/box (pcs) 10,000 MAX. 20,000 MAX. 40,000 MAX. Model NFSx036xT Title PACKING No. 050616541931