SCES626B – MARCH 2005 – JUNE 2005 D Available in the Texas Instruments D D D D 1 6 D DCK PACKAGE (TOP VIEW) DBV PACKAGE (TOP VIEW) A D Max tpd of 3 ns at 1.8 V VCC D Low Power Consumption, 10-µA Max ICC D Latch-Up Performance Exceeds 100 mA Per NanoStart and NanoFreet Package Optimized for 1.8-V Operation and is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation Ioff Supports Partial-Power-Down Mode Operation Sub-1-V Operable ±8-mA Output Drive at 1.8 V VCC A Y0 GND 2 5 VCC E 3 4 Y1 1 6 JESD 78, Class II ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 200-V Machine Model (A115-A) − 1000-V Charged-Device Model (C101) YEA, YEP, YZA, OR YZP PACKAGE (BOTTOM VIEW) DRL PACKAGE (TOP VIEW) Y0 A GND 2 5 VCC E 3 4 Y1 GND E 1 2 3 6 5 4 E 3 4 Y1 GND 2 5 VCC A 1 6 Y0 Y0 VCC Y1 See mechanical drawings for dimensions. description/ordering information This 1-of-2 decoder/demultiplexer is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation. The SN74AUC1G19 is a 1-of-2 decoder/demultiplexer. This device buffers the data on input A and passes it to the outputs Y0 (true) and Y1 (complement) when the enable (E) input signal is low. NanoStart and NanoFreet package technology is a major breakthrough in IC packaging concepts, using the die as the package. ORDERING INFORMATION ORDERABLE PART NUMBER PACKAGE† TA NanoStar − WCSP (DSBGA) 0.23-mm Large Bump − YEP NanoFree − WCSP (DSBGA) 0.23-mm Large Bump − YZP (Pb-free) −40°C to 85°C SOT (SOT-23) − DBV SOT (SC-70) − DCK SOT (SOT-553) − DRL TOP-SIDE MARKING‡ SN74AUC1G19YEPR Reel of 3000 U5_ SN74AUC1G19YZPR Reel of 3000 SN74AUC1G19DBVR U19_ Reel of 250 SN74AUC1G19DBVT U19_ Reel of 3000 SN74AUC1G19DCKR Reel of 250 SN74AUC1G19DCKT Reel of 4000 SN74AUC1G19DRLR U5_ U5_ † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. ‡ DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site. YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoStar and NanoFree are trademarks of Texas Instruments. Copyright 2005, Texas Instruments Incorporated ! " #$%! " &$'(#! )!%* )$#!" # ! "&%##!" &% !+% !%" %," "!$%!" "!)) -!.* )$#! &#%""/ )%" ! %#%""(. #($)% !%"!/ (( &%!%"* POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCES626B – MARCH 2005 – JUNE 2005 description/ordering information This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. For more information about AUC Little Logic devices, please refer to the TI application report, Applications of Texas Instruments AUC Sub−1−V Little Logic Devices, literature number SCEA027. FUNCTION TABLE OUTPUTS INPUTS E A L L Y0 L Y1 H L H H L H X H H logic diagram (positive logic) A 6 4 E Y0 Y1 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 3.6 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 3.6 V Voltage range applied to any output in the high-impedance or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 3.6 V Voltage range applied to any output in the high or low state, VO (see Note 1 and Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA Continuous output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA Package thermal impedance, θJA (see Note 3): DBV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206°C/W DCK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252°C/W DRL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142°C/W YEP/YZP package . . . . . . . . . . . . . . . . . . . . . . . . . . . 123°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The value of VCC is provided in the recommended operatng conditions table. 3. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCES626B – MARCH 2005 – JUNE 2005 recommended operating conditions (see Note 4) VCC VIH Supply voltage Operating High-level control input voltage VCC = 0.8 V VCC = 1.1 V to 1.95 V MIN MAX 0.8 2.7 V 3.6 V VCC 0.65 × VCC VCC = 2.3 V to 2.7 V VCC = 0.8 V VIL VO 3.6 1.7 0 Output voltage 0 0.7 0 VCC −0.7 ∆t/∆v Input transition rise or fall rate mA −8 −9 0.7 VCC = 1.1 V VCC = 1.4 V VCC = 1.65 V Low-level control output current V −5 VCC = 2.3 V VCC = 0.8 V IOL V −3 VCC = 1.4 V VCC = 1.65 V High-level control output current V 0.35 × VCC VCC = 0.8 V VCC = 1.1 V IOH V 3.6 0 VCC = 1.1 V to 1.95 V VCC = 2.3 V to 2.7 V Low-level control input voltage UNIT 3 5 mA 8 VCC = 2.3 V VCC = 0.8 V to 1.95 V 20 9 ns/V VCC = 2.3 V to 2.7 V 15 ns/V TA Operating free-air temperature −40 85 °C NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = −100 µA IOH = −0.7 mA VOH VOL II Ioff ICC Ci TYP† VCC MIN 0.8 V to 2.7 V VCC − 0.1 0.8 V 1.1 V 0.8 1.4 V 1 IOH = −8 mA IOH = −9 mA 1.65 V 1.2 2.3 V 1.8 IOL = 100 µA IOL = 0.7 mA 0.8 V to 2.7 V V 0.2 0.25 IOL = 3 mA IOL = 5 mA 1.1 V 0.3 1.4 V 0.4 IOL = 8 mA IOL = 9 mA 1.65 V 0.45 2.3 V 0.6 VI = VCC or GND VI or VO = 2.7 V VI = VCC or GND, VI = VCC or GND IO = 0 UNIT 0.55 IOH = −3 mA IOH = −5 mA 0.8 V MAX V 0 to 2.7 V ±5 µA 0 ±10 µA 10 µA 0.8 V to 2.7 V 2.5 V 2.5 pF † All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SCES626B – MARCH 2005 – JUNE 2005 switching characteristics over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 1) PARAMETER VCC = 1.1 V ± 0.1 V VCC = 1.5 V ± 0.1 V VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V FROM (INPUT) TO (OUTPUT) VCC = 0.8 V TYP MIN MAX MIN MAX MIN MAX MIN MAX A or E Y 7.5 0.5 4.6 0.4 3.0 0.3 2.4 0.2 1.7 tpd UNIT ns switching characteristics over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 2) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A or E Y0 or Y1 VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V MIN MAX MIN MAX 0.5 2.8 0.4 2.0 UNIT ns operating characteristics, TA = 25°C PARAMETER Cpd 4 Power dissipation capacitance TEST CONDITIONS f = 10 MHz VCC = 0.8 V TYP 13 POST OFFICE BOX 655303 VCC = 1.2 V TYP VCC = 1.5 V TYP 13 • DALLAS, TEXAS 75265 13 VCC = 1.8 V TYP 13 VCC = 2.5 V TYP 14 UNIT pF SCES626B – MARCH 2005 – JUNE 2005 PARAMETER MEASUREMENT INFORMATION 2 × VCC S1 RL From Output Under Test Open GND CL (see Note A) RL VCC 0.8 V 1.2 V ± 0.1 V 1.5 V ± 0.1 V 1.8 V ± 0.15 V 2.5 V ± 0.2 V 1.8 V ± 0.15 V 2.5 V ± 0.2 V LOAD CIRCUIT TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 2 × VCC GND CL RL 15 pF 15 pF 15 pF 15 pF 15 pF 30 pF 30 pF 2 kΩ 2 kΩ 2 kΩ 2 kΩ 2 kΩ 1 kΩ 500 Ω V∆ 0.1 V 0.1 V 0.1 V 0.15 V 0.15 V 0.15 V 0.15 V VCC Timing Input VCC/2 0V tw tsu VCC VCC/2 Input th VCC VCC/2 VCC/2 Data Input VCC/2 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC VCC/2 Input 0V tPHL tPLH VOH VCC/2 Output VCC/2 VOL Output Waveform 1 S1 at 2 × VCC (see Note B) VOH Output VCC/2 VCC/2 VCC/2 VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VCC/2 0V tPLZ tPZL VCC VCC/2 Output Waveform 2 S1 at GND (see Note B) VOL + V∆ VOL tPHZ tPZH tPLH tPHL VCC Output Control VCC/2 VCC/2 VOH − V∆ VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, slew rate ≥ 1 V/ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 6-Jun-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74AUC1G19DBVR ACTIVE SOT-23 DBV 6 3000 Pb-Free (RoHS) CU NIPDAU Level-1-260C-UNLIM SN74AUC1G19DBVRE4 ACTIVE SOT-23 DBV 6 3000 Pb-Free (RoHS) CU NIPDAU Level-1-260C-UNLIM SN74AUC1G19DBVT ACTIVE SOT-23 DBV 6 250 Pb-Free (RoHS) CU NIPDAU Level-1-260C-UNLIM SN74AUC1G19DBVTE4 ACTIVE SOT-23 DBV 6 250 Pb-Free (RoHS) CU NIPDAU Level-1-260C-UNLIM SN74AUC1G19DCKR ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUC1G19DCKRE4 ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUC1G19DCKT ACTIVE SC70 DCK 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUC1G19DCKTE4 ACTIVE SC70 DCK 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUC1G19DRLR ACTIVE SOP DRL 6 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUC1G19YEPR ACTIVE WCSP YEP 6 3000 TBD SNPB Level-1-260C-UNLIM SN74AUC1G19YZPR ACTIVE WCSP YZP 6 3000 Pb-Free (RoHS) SNAGCU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MPDS114 – FEBRUARY 2002 DCK (R-PDSO-G6) PLASTIC SMALL-OUTLINE PACKAGE 0,30 0,15 0,65 6 0,10 M 4 1,40 1,10 1 0,13 NOM 2,40 1,80 3 Gage Plane 2,15 1,85 0,15 0°–8° 0,46 0,26 Seating Plane 1,10 0,80 0,10 0,00 0,10 4093553-3/D 01/02 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. 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