TL851 SONAR RANGING CONTROL SLSS004 – SEPTEMBER 1983 – REVISED MARCH 1988 D D D D D D D N PACKAGE (TOP VIEW) Designed for Use With the TL852 in Sonar Ranging Modules Like the SN28827 Operates With Single Supply Accurate Clock Output for External Use Synchronous 4-Bit Gain Control Output Internal 1.2-V Level Detector for Receive TTL-Compatible Interfaces to Electrostatic or Piezoelectric Transducers VCC XMIT GND GCD GCA GCB GCC REC 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 BLNK BINH INIT FILT XTAL2 XTAL1 OSC ECHO description The TL851 is an economical digital I2L ranging control integrated circuit designed for use with the Texas Instruments TL852 sonar ranging receiver integrated circuit. The TL851 is designed for distance measurement from six inches to 35 feet. The device has an internal oscillator that uses a low-cost external ceramic resonator. With a simple interface and a 420-kHz ceramic resonator, the device will drive a 50-kHz electrostatic transducer. The device cycle begins when Initiate (INIT) is taken to the high logic level. There must be at least 5 ms from initial power-up (VCC) to the first initiate signal in order for all the device internal latches to reset and for the ceramic-resonator-controlled oscillator to stabilize. The device will transmit a burst of 16 pulses each time INIT is taken high. The oscillator output (OSC) is enabled by INIT. The oscillator frequency is the ceramic resonator frequency divided by 8.5 for the first 16 cycles (during transmit) and then the oscillator frequency changes to the ceramic resonator frequency divided by 4.5 for the remainder of the device cycle. When used with an external 420-kHz ceramic resonator, the device internal blanking disables the receive input (REC) for 3.8 ms after initiate to exclude false receive inputs that may be caused by transducer ringing. The internal blanking feature also eliminates echos from objects closer than 1.3 feet from the transducer. If it is necessary to detect objects closer than 1.3 feet, then the internal blanking may be shortened by taking the blanking inhibit (BINH) high, enabling the receive input. The blanking input (BLNK) may be used to disable the receive input and reset ECHO to a low logic level at any time during the device cycle for selective echo exclusion or for a multiple-echo mode of operation. The device provides a synchronous 4-bit gain control output (12 steps) designed to control the gain of the TL852 sonar ranging receiver integrated circuit. The digital gain control waveforms are shown in Figure 2 with the nominal transition times from INIT listed in the Gain Control Output Table. The threshold of the internal receive level detector is 1.2 V. The TL851 operates over a supply voltage range of 4.5 V to 6.8 V and is characterized for operation from 0°C to 40°C. Copyright 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 TL851 SONAR RANGING CONTROL SLSS004 – SEPTEMBER 1983 – REVISED MARCH 1988 GAIN CONTROL OUTPUT TABLE STEP NUMBER GCD GCC GCB GCA TIME (ms) FROM INITIATE↑† 0 1 2 3 4 5 6 7 8 9 10 11 L L L L L L L L H H H H L L L L H H H H L L L L L L L H L L H H L L H H L H L H L H L H L H L H 2.38 ms 5.12 ms 7.87 ms 10.61 ms 13.35 ms 16.09 ms 18.84 ms 21.58 ms 27.07 ms 32.55 ms 38.04 ms INIT ↓ † This is the time to the end of the indicated step and assumes a nominal 420-kHz ceramic resonator. functional block diagram VCC FILT 13 1 Filtered Supply 420-kHz Oscillator XTAL1 XTAL2 11 Frequency Divider 10 Gain Step Counter G 2 5 12 6 + 8.5 7 + + 4.5 XMIT Transmit Enable CT≤16 4 CLR INIT OSC GCA GCB GCC GCD CT ≥ 208 14 CLR CT > 16 Internal Blanking Blanking Latch BINH BLNK REC 15 S 16 R Echo Latch R 8 1.2 V GND 2 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 S 9 ECHO TL851 SONAR RANGING CONTROL SLSS004 – SEPTEMBER 1983 – REVISED MARCH 1988 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Voltage range at any pin with respect to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to 7 V Voltage range at any pin with respect to VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 7 V to 0.5 V Continuous total dissipation at (or below) 25°C free-air temperature (see Note 1) . . . . . . . . . . . . . . . 1150 mW Operating free-air temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 40°C Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C † Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions beyond those indicated in the recommended operating conditions section of this specification is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: For operation above 25°C, derate linearly at the rate of 9.2 mW/°C. recommended operating conditions Supply voltage, VCC High-level input voltage, VIH BLNK, BINH, INIT Low-level input voltage, VIL BLNK, BINH, INIT MIN MAX 4.5 6.8 2.1 5 Operating free-air temperature, TA 0 V V 0.6 Delay time, power up to INIT high UNIT V ms 40 °C electrical characteristics over recommended ranges of supply voltage and operating free-air temperature PARAMETER TEST CONDITIONS Input current BLNK, BINH, INIT High-level output current, IOH ECHO, OSC, GCA, GCB, GCC, GCD Low-level output current, IOH ECHO, OSC, GCA, GCB, GCC, GCD On-state output current SMIT output Internal blanking interval REC input Frequency during 16-pulse 16 pulse transmit period Frequency after 16-pulse 16 pulse transmit period Supply current, current ICC MIN TYP‡ VI = 2.1 V VOH = 5.5 V IOL = 1.6 mA VO = 1 V OSC output 93.3§ XMIT output 0 During transmit period 1 mA µA 0.4 XMIT output V mA ms kHz kHz 260 After transmit period UNIT 100 –140 2.38§ 49.4§ 49.4§ OSC output MAX 55 mA ‡ Typical values are at VCC = 5 V and TA = 25°C. § These typical values apply for a 420-kHz ceramic resonator. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 TL851 SONAR RANGING CONTROL SLSS004 – SEPTEMBER 1983 – REVISED MARCH 1988 schematics of inputs and outputs EQUIVALENT OF BLNK, BINH AND INIT INPUTS TYPICAL OF ECHO, OSC, GCA, GCB, GCC, AND GCD OUTPUTS XMIT OUTPUTS VCC Ref Input Output 5Ω Output 500 Ω Step No. 0 1 2 3 4 5 6 7 8 9 10 INIT GCA GCB GCC GCD Figure 1. Digital Gain Control Waveforms 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 11 TL851 SONAR RANGING CONTROL SLSS004 – SEPTEMBER 1983 – REVISED MARCH 1988 VCC INIT 16 Pulses XMIT BINH BLNK (L) (L) Internal Blanking ≈ 2.38 ms REC ≈ 1.2 V (Input from TL852) ECHO Figure 2. Example of Single-Echo-Mode Cycle When Used With the TL852 Receiver and 420-kHz Ceramic Resonator POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 31-Jul-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TL851CD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL851CDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL851CDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL851CDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL851CDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL851CDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL851CDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL851CN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL851CN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL851CNE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL851CNE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device TL851CDR Package Package Pins Type Drawing SOIC D 16 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 10.3 2.1 8.0 W Pin1 (mm) Quadrant 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TL851CDR SOIC D 16 2500 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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