SN75LVDS84A, SN65LVDS84AQ FLATLINK TRANSMITTER SLLS354E – MAY 1999 – REVISED JANUARY 2001 D D D D D D D D D D D D D 21:3 Data Channel Compression at up to 196 Million Bytes per Second Throughput Suited for SVGA, XGA, or SXGA Data Transmission From Controller to Display With Very Low EMI 21 Data Channels Plus Clock In Low-Voltage TTL Inputs and 3 Data Channels Plus Clock Out Low-Voltage Differential Signaling (LVDS) Outputs Operates From a Single 3.3-V Supply and 89 mW (Typ) Ultralow-Power 3.3-V CMOS Version of the SN75LVDS84. Power Consumption About One Third of the ’LVDS84 Packaged in Thin Shrink Small-Outline Package (TSSOP) With 20 Mil Terminal Pitch Consumes Less Than 0.54 mW When Disabled Wide Phase-Lock Input Frequency Range: 31 MHz to 75 MHz No External Components Required for PLL Outputs Meet or Exceed the Requirements of ANSI EIA/TIA-644 Standard SSC Tracking Capability of 3% Center Spread at 50-kHz Modulation Frequency Improved Replacement for SN75LVDS84 and NSC’s DS90CF363A 3-V Device Available in Q-Temp Automotive High Reliability Automotive Applications Configuration Control / Print Support Qualification to Automotive Standards DGG PACKAGE (TOP VIEW) D4 VCC D5 D6 GND D7 D8 VCC D9 D10 GND D11 D12 NC D13 D14 GND D15 D16 D17 VCC D18 D19 GND 1 48 2 47 3 46 4 45 5 44 6 43 7 42 8 41 9 40 10 39 11 38 12 37 13 36 14 35 15 34 16 33 17 32 18 31 19 30 20 29 21 28 22 27 23 26 24 25 D3 D2 GND D1 D0 NC LVDSGND Y0M Y0P Y1M Y1P LVDSVCC LVDSGND Y2M Y2P CLKOUTM CLKOUTP LVDSGND PLLGND PLLVCC PLLGND SHTDN CLKIN D20 NC – Not Connected description The SN75LVDS84A and SN65LVDS84AQ FlatLink transmitters contains three 7-bit parallel-load serial-out shift registers, and four low-voltage differential signaling (LVDS) line drivers in a single integrated circuit. These functions allow 21 bits of single-ended LVTTL data to be synchronously transmitted over 3 balanced-pair conductors for receipt by a compatible receiver, such as the SN75LVDS82 or SN75LVDS86/86A. When transmitting, data bits D0 – D20 are each loaded into registers of the ’LVDS84A upon the falling edge. The internal PLL is frequency-locked to CLKIN and then used to unload the data registers in 7-bit slices. The three serial streams and a phase-locked clock (CLKOUT) are then output to LVDS output drivers. The frequency of CLKOUT is the same as the input clock, CLKIN. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. FlatLink is a trademark of Texas Instruments. Copyright 2001, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN75LVDS84A, SN65LVDS84AQ FLATLINK TRANSMITTER SLLS354E – MAY 1999 – REVISED JANUARY 2001 description (continued) The ’LVDS84A requires no external components and little or no control. The data bus appears the same at the input to the transmitter and output of the receiver with the data transmission transparent to the user(s). The only user intervention is the possible use of the shutdown/clear (SHTDN) active-low input to inhibit the clock and shut off the LVDS output drivers for lower power consumption. A low-level on this signal clears all internal registers to a low level. The SN75LVDS84A is characterized for operation over ambient free-air temperatures of 0°C to 70°C. The SN65LVDS84AQ is characterized for operation over the full Automotive temperature range of – 40°C to 125°C. functional block diagram 7 D0 – D6 Parallel-Load 7-Bit Shift Register A,B, ...G SHIFT/LOAD Y0P Y0M CLK 7 Parallel-Load 7-Bit Shift Register Y1P A,B, ...G D7 – D13 SHIFT/LOAD Y1M CLK 7 D14 – D20 Parallel-Load 7-Bit Shift Register Y2P A,B, ...G SHIFT/LOAD Y2M CLK Control Logic SHTDN PLL CLKOUTP CLKIN CLKOUTM CLK CLKINH 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN75LVDS84A, SN65LVDS84AQ FLATLINK TRANSMITTER SLLS354E – MAY 1999 – REVISED JANUARY 2001 schematics of input and output EQUIVALENT OF EACH INPUT EQUIVALENT OF EACH OUTPUT VCC VCC 7V 180 Ω D or SHTDN YnP or YnM 5V 7V absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 4 V Input and output voltage ranges, VI, VO (all terminals) . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table Operating virtual junction temperature range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to 150°C Electrostatic discharge: ESD machine model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 V ESD human-body model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6000 V ESD charged-device model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1500 V Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: All voltage values are with respect to the GND terminals. PACKAGE TA ≤ 25°C POWER RATING DISSIPATION RATING TABLE DERATING FACTOR‡ TA = 70°C POWER RATING ABOVE TA = 25°C TA = 125°C POWER RATING DGG 1637 mW 13.1 mW/°C 1048 mW 327 mW ‡ This is the inverse of the junction-to-ambient thermal resistance when board mounted and with no air flow. recommended operating conditions MIN NOM Supply voltage, VCC 3 3.3 High-level input voltage, VIH 2 Low-level input voltage, VIL Differential load impedance, ZL SN75LVDS84A Operating free-air free air temperature, temperature TA SN65LVDS84AQ POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MAX UNIT 3.6 V V 0.8 V 90 132 Ω 0 70 –40 125 °C 3 SN75LVDS84A, SN65LVDS84AQ FLATLINK TRANSMITTER SLLS354E – MAY 1999 – REVISED JANUARY 2001 timing requirements tc tw Input clock period tt tsu Transition time, input signal th Hold time, data, D0 – D20 valid after CLKIN↓ (see Figure 2) Pulse duration, high-level input clock MIN NOM MAX UNIT 13.3 tc 32.4 ns 0.6 tc ns 5 ns 0.4 tc Setup time, data, D0 – D20 valid before CLKIN↓ (see Figure 2) 3 ns 1.5 ns electrical characteristics over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS VIT Input threshold voltage |VOD| Differential steady-state output voltage magnitude ∆|VOD| Change in the steady-state differential output voltage magnitude between opposite binary states RL = 100 Ω, IIH High level input current High-level VIH = VCC IIL Low-level input current VIL = 0 VO(Yn) = 0 Peak-to-peak common-mode output voltage IOZ High-impedance output current ICC(AVG) See Figure 3 RL = 100 Ω, See Figure 3 Steady-state common-mode output voltage Short circuit output current Short-circuit MAX 1.125 UNIT V 454 mV 50 mV 1.375 150 SN75LVDS84A 20 SN65LVDS84AQ 25 V mV µA ±10 µA –6 ±24 mA –6 ±12 mA ±10 µA Disabled,, All inputs at GND SN75LVDS84A 15 150 SN65LVDS84AQ 15 170 Enabled, RL = 100 Ω (4 ( places)) Gray-scale pattern (see Figure 4) f = 65 MHz 27 35 f = 75 MHz 30 38 Enabled, RL = 100 Ω,, (4 ( places)) Worst-case pattern (see Figure 5) f = 65 MHz 28 36 f = 75 MHz 31 39 VOD = 0 VO = 0 to VCC Quiescent supply current (average) 247 80 POST OFFICE BOX 655303 µA mA CI Input capacitance † All typical values are at VCC = 3.3 V, TA = 25°C. 4 TYP† 1.4 VOC(SS) VOC(PP) IOS MIN 2 • DALLAS, TEXAS 75265 pF SN75LVDS84A, SN65LVDS84AQ FLATLINK TRANSMITTER SLLS354E – MAY 1999 – REVISED JANUARY 2001 switching characteristics over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP† MAX td0 Delay time, CLKOUT↑ to serial bit position 0 td1 Delay time, CLKOUT↑ to serial bit position 1 1t 7 c * 0.2 1t 7 c ) 0.2 td2 Delay time, CLKOUT↑ to serial bit position 2 2t 7 c * 0.2 2t 7 c ) 0.2 td3 Delay time, CLKOUT↑ to serial bit position 3 3t 7 c ) 0.2 td4 Delay time, CLKOUT↑ to serial bit position 4 * 0.2 4 t * 0.2 7 c td5 Delay time, CLKOUT↑ to serial bit position 5 5t 7 c td6 Delay time, CLKOUT↑ to serial bit position 6 tsk(o) Output skew, t n td7 – 0.2 tc = 15.38 ns (± 0.2%), |Input clock jitter| < 50 ps‡, See Figure 6 0.2 3t 7 c ) 0.2 5 t ) 0.2 7 c 6t 7 c – 0.2 tc = 15.38 ns (± 0.2%), |Input clock jitter| < 50 ps‡, See Figure 6 time CLKIN↓ to CLKOUT↑ Delay time, tc = 13.33 ns ~ 32.25 ns (± 0.2%), |Input clock jitter| < 50 ps‡, See Figure 6 ∆ tc(o) C cle time, time output o tp t clock jitter§ ( ) Cycle ns 4t 7 c * 0.2 6 t * 0.2 7 c * n7 tc UNIT ) 0.2 0.2 ns 2.7 ns 1 4.5 tc = 15.38 + 0.308 sin (2π500E3t) ± 0.05 ns, See Figure 7 ± 62 tc = 15.38 + 0.308 sin (2π3E6t) ± 0.05 ns, See Figure 7 ± 121 ps 4t 7 c tw Pulse duration, high-level output clock ns tt Transition time, differential output voltage (tr or tf) See Figure 3 700 ten Enable time, SHTDN↑ to phase lock (Yn valid) See Figure 8 1 ms tdis Disable time, SHTDN↓ to off state (CLKOUT low) See Figure 9 6.5 ns 1500 ps † All typical values are at VCC = 3.3 V, TA = 25°C. ‡ |Input clock jitter| is the magnitude of the change in the input clock period. § Output clock jitter is the change in the output clock period from one cycle to the next cycle observed over 15 000 cycles. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SN75LVDS84A, SN65LVDS84AQ FLATLINK TRANSMITTER SLLS354E – MAY 1999 – REVISED JANUARY 2001 D0 CLKIN ÏÏÏ ÏÏÏ ÏÏÏ PARAMETER MEASUREMENT INFORMATION ÏÏÏÏ ÏÏÏÏ ÏÏÏÏ ÏÏ ÏÏ CLKOUT ÎÎÎ ÎÎÎ ÏÏ ÏÏ Previous Cycle ÎÎ ÎÎ Current Cycle Y0 D0–1 D6 D5 D4 D3 D2 D1 D0 D6+1 Y1 D7–1 D13 D12 D11 D10 D9 D8 D7 D13+1 Y2 D14–1 D20 D19 D18 D17 D16 D15 D14 D20+1 Figure 1. Typical Load and Shift Sequences Dn ÏÏÏÏÏÏ ÏÏÏÏÏÏ tsu th ÏÏÏÏ ÏÏÏÏ CLKIN NOTE A: All input timing is defined at 1.4 V on an input signal with a 10%-to-90% rise or fall time of less than 5 ns. Figure 2. Setup and Hold Time Definition 6 Next Cycle POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN75LVDS84A, SN65LVDS84AQ FLATLINK TRANSMITTER SLLS354E – MAY 1999 – REVISED JANUARY 2001 49.9 Ω ± 1% (2 Places) YP VOD VOC YM CL = 10 pF Max (2 Places) NOTE A: The lumped instrumentation capacitance for any single-ended voltage measurement is less than or equal to 10 pF. When making measurements at YP or YM, the complementary output is similarly loaded. (a) SCHEMATIC 100% 80% VOD(H) 0V VOD(L) 20% 0% tf tr VOC(PP) VOC(SS) VOC(SS) 0V (b) WAVEFORMS Figure 3. Test Load and Voltage Definitions for LVDS Outputs POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 SN75LVDS84A, SN65LVDS84AQ FLATLINK TRANSMITTER SLLS354E – MAY 1999 – REVISED JANUARY 2001 PARAMETER MEASUREMENT INFORMATION CLKIN D0, 6, 12 D1, 7, 13 D2, 8, 14 D3, 9, 15 D18, 19, 20 All others NOTES: A. The 16-grayscale test-pattern test device power consumption for a typical display pattern. B. VIH = 2 V and VIL = 0.8 V Figure 4. 16-Grayscale Test-Pattern Waveforms tc CLKIN Even Dn Odd Dn NOTES: A. The worst-case test pattern produces nearly the maximum switching frequency for all of the LVDS outputs. B. VIH = 2 V and VIL = 0.8 V Figure 5. Worst-Case Test-Pattern Waveforms 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN75LVDS84A, SN65LVDS84AQ FLATLINK TRANSMITTER SLLS354E – MAY 1999 – REVISED JANUARY 2001 PARAMETER MEASUREMENT INFORMATION td7 CLKIN ÏÏ ÏÏ ÏÏ ÏÏ ÏÏ ÏÏ CLKOUT ÎÎ ÏÏÏ ÎÎ ÏÏÏ ÏÏ ÏÏ ÏÏ ÏÏ ÏÏ ÏÏ ÏÏ ÏÏ ÏÏ ÏÏ ÏÏ ÏÏ td0 Yn td1 td2 td3 td4 td5 td6 VOD(H) CLKIN CLKOUT or Yn 1.4 V 0V VOD(L) td7 td0 – td6 Figure 6. Timing Definitions + Reference ∑ Device Under Test VCO + Modulation V(t) = A sin (2 π f(mod) t) HP8665A Synthesized Signal Generator 0.1 MHz – 4200 MHz HP8133A Pulse Generator OUTPUT RF Output Device Under Test CLKIN CLKOUT Tek TDS794D Digital Scope Input Ext. Input Figure 7. Clock Jitter Test Setup POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9 SN75LVDS84A, SN65LVDS84AQ FLATLINK TRANSMITTER SLLS354E – MAY 1999 – REVISED JANUARY 2001 TYPICAL CHARACTERISTICS CLKIN Dn ten SHTDN ÌÌÌÌÌÌÌÌÌÌÌÌÌÌÌÌÌÌÌÌÌÌÌÌÌ ÌÌÌÌÌÌÌÌÌÌÌÌÌÌÌÌÌÌÌÌÌÌÌÌÌ Invalid Yn Valid Figure 8. Enable Time Waveforms CLKIN tdis SHTDN CLKOUT Figure 9. Disable Time Waveforms PEAK-TO-PEAK OUTPUT JITTER (NORMALIZED) vs MODULATION FREQUENCY AVERAGE SUPPLY CURRENT vs CLOCK FREQUENCY 10 Peak-To-Peak OutpuT Jitter (Normalized) I CC – Average Supply Current – mA 31 29 VCC = 3.6 V 27 25 VCC = 3.3 V 23 VCC = 3 V 21 19 17 15 30 0.1 0.1 35 40 45 50 55 60 65 70 75 fc – Clock Frequency – MHz Figure 10. Grayscale Input Pattern 10 1 POST OFFICE BOX 655303 1 f(mod) – Modulation Frequency – MHz Figure 11. Output Period Jitter vs Modulation Frequency • DALLAS, TEXAS 75265 10 SN75LVDS84A, SN65LVDS84AQ FLATLINK TRANSMITTER SLLS354E – MAY 1999 – REVISED JANUARY 2001 APPLICATION INFORMATION Host Graphics Controller 12-BIT RED0 RED1 RED2 RED3 NA NA GREEN0 GREEN1 GREEN2 GREEN3 NA NA BLUE0 BLUE1 BLUE2 BLUE3 NA NA H_SYNC V_SYNC ENABLE CLOCK 18-BIT RED0 RED1 RED2 RED3 RED4 RED5 GREEN0 GREEN1 GREEN2 GREEN3 GREEN4 GREEN5 BLUE0 BLUE1 BLUE2 BLUE3 BLUE4 BLUE5 H_SYNC V_SYNC ENABLE CLOCK 44 45 47 48 1 3 4 6 7 9 10 12 13 15 16 18 19 20 22 23 25 26 SN75LVDS84A/ SN65LVDS84AQ D0 Y0M D1 D2 D3 Y0P D4 D5 D6 Y1M D7 D8 D9 Y1P D10 D11 D12 Y2M D13 D14 D15 Y2P D16 D17 D18 CLKOUTM D19 D20 CLKIN CLKOUTP Cable Flat Panel Display SN75LVDS86/86A 41 8 A0M 100 Ω 40 9 39 10 A0P A1M 100 Ω 38 11 35 14 A1P A2M 100 Ω 34 15 33 16 A2P CLKINM 100 Ω 32 17 CLKINP NOTES: A. The five 100-Ω terminating resistors are recommended to be 0603 types. B. NA – not applicable, these unused inputs should be left open. Figure 12. Color Host to LCD Panel Application POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 11 SN75LVDS84A, SN65LVDS84AQ FLATLINK TRANSMITTER SLLS354E – MAY 1999 – REVISED JANUARY 2001 APPLICATION INFORMATION Host Graphics Controller 12-BIT RED0 RED1 RED2 RED3 NA NA GREEN0 GREEN1 GREEN2 GREEN3 NA NA BLUE0 BLUE1 BLUE2 BLUE3 NA NA H_SYNC V_SYNC ENABLE CLOCK 18-BIT RED0 RED1 RED2 RED3 RED4 RED5 GREEN0 GREEN1 GREEN2 GREEN3 GREEN4 GREEN5 BLUE0 BLUE1 BLUE2 BLUE3 BLUE4 BLUE5 H_SYNC V_SYNC ENABLE CLOCK 44 45 47 48 1 3 4 6 7 9 10 12 13 15 16 18 19 20 22 23 25 26 SN75LVDS84A/ SN65LVDS84AQ D0 Y0M D1 D2 D3 Y0P D4 D5 D6 Y1M D7 D8 D9 Y1P D10 D11 D12 Y2M D13 D14 D15 Y2P D16 D17 D18 CLKOUTM D19 D20 CLKIN CLKOUTP Cable Flat Panel Display SN75LVDS82 41 9 A0M 100 Ω 40 10 39 11 A0P A1M 100 Ω 38 12 35 15 A1P A2M 100 Ω 34 16 33 A2P CLKINM 100 Ω 32 CLKINP A3M 100 Ω A3P NOTES: A. The four 100-Ω terminating resistors are recommended to be 0603 types. B. NA – not applicable, these unused inputs should be left open. Figure 13. 18-Bit Color Host to 24-Bit LCD Display Panel Application 12 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 24-Dec-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN65LVDS84AQDGG ACTIVE TSSOP DGG 48 SN65LVDS84AQDGGR ACTIVE TSSOP DGG 48 SN75LVDS84ADGG ACTIVE TSSOP DGG 48 40 SN75LVDS84ADGGG4 ACTIVE TSSOP DGG 48 40 SN75LVDS84ADGGR ACTIVE TSSOP DGG SN75LVDS84ADGGRG4 ACTIVE TSSOP DGG 40 Lead/Ball Finish MSL Peak Temp (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN65LVDS84AQDGGR TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1 SN75LVDS84ADGGR TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN65LVDS84AQDGGR TSSOP DGG 48 2000 367.0 367.0 45.0 SN75LVDS84ADGGR TSSOP DGG 48 2000 367.0 367.0 45.0 Pack Materials-Page 2 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. 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