HOLTEK HT49R30A-1_12

HT49R30A-1/HT49C30-1/HT49C30L
LCD Type 8-Bit MCU
Technical Document
· Tools Information
· FAQs
· Application Note
- HA0017E Controlling the Read/Write Function of the HT24 Series EEPROM Using the HT49 Series MCUs
- HA0024E Using the RTC in the HT49 MCU Series
- HA0025E Using the Time Base in the HT49 MCU Series
- HA0026E Using the I/O Ports on the HT49 MCU Series
- HA0027E Using the Timer/Event Counter in the HT49 MCU Series
- HA0075E MCU Reset and Oscillator Circuits Application Note
Features
· Operating voltage:
· On-chip crystal, RC and 32768Hz crystal oscillator
fSYS= 4MHz: 2.2V~5.5V for HT49R30A-1/HT49C30-1
fSYS= 8MHz: 3.3V~5.5V for HT49R30A-1/HT49C30-1
fSYS= 500kHz: 1.2V~2.2V for HT49C30L
· HALT function and wake-up feature reduce power
consumption
· 4-level subroutine nesting
· 6 input lines
· Bit manipulation instruction
· 8 bidirectional I/O lines
· 14-bit table read instruction
· Two external interrupt input
· Up to 0.5ms instruction cycle with 8MHz system clock
· One 8-bit programmable timer/event counter with
for HT49R30A-1/HT49C30-1
PFD (programmable frequency divider) function
· Up to 8ms instruction cycle with 500kHz system clock
· LCD driver with 19´2, 19´3 or 18´4 segments
for HT49C30L
· 2K´14 program memory
· 63 powerful instructions
· 96´8 data memory RAM
· All instructions in 1 or 2 machine cycles
· Real Time Clock (RTC)
· Low voltage reset/detector for
· 8-bit prescaler for RTC
HT49R30A-1/HT49C30-1
· 48-pin SSOP package
· Watchdog Timer
· Buzzer output
General Description
The HT49R30A-1/HT49C30-1/HT49C30L are 8-bit,
high performance, RISC architecture microcontroller
devices specifically designed for a wide range of LCD
applications. The mask version HT49C30-1 and
HT49C30L are fully pin and functionally compatible with
the OTP version HT49R30A-1 device. The HT49C30L
is a low voltage version, with the ability to operate at a
minimum power supply of 1.2V, making it suitable for
single cell battery applications.
Rev. 2.10
The advantages of low power consumption, I/O flexibility, programmable frequency divider, timer functions,
oscillator options, HALT and wake-up functions and
buzzer driver in addition to a flexible and configurable
LCD interface, enhance the versatility of these devices
to control a wide range of LCD-based application possibilities such as measuring scales, electronic multimeters, gas meters, timers, calculators, remote
controllers and many other LCD-based industrial and
home appliance applications.
1
July 30, 2012
HT49R30A-1/HT49C30-1/HT49C30L
Block Diagram
In te rru p t
C ir c u it
P ro g ra m
M e m o ry
P ro g ra m
C o u n te r
M
T M R C
S T A C K
T M R
IN T C
M
M P
U
X
D A T A
M e m o ry
fS
M
W D T
Y S
/4
Y S
R T C O u t
P B 2 /T M R
X
R T C
T im e B a s e
U
Y S
/4
R T C O S C
X
O S C 3
O S C 4
W D T O S C
M U X
In s tr u c tio n
D e c o d e r
T im in g
G e n e r a tio n
P O R T B
S T A T U S
A L U
S
S
P O R T A
A C C
C 1
D
P A
P A
P A
P A
P A
P A
L C D
M e m o ry
C 3
P B 0 /IN T 0
P B 1 /IN T 1
P B 2 /T M R
P B 3 ~ P B 5
P B
S h ifte r
B P
O S
R E
V D
V S
O S
fS
fS
P F D
In s tr u c tio n
R e g is te r
O S C 2
O S C 4
U
L C D D r iv e r
H A L T
0 /B Z
1 /B Z
2
3 /P F D
4 ~ P A 7
E N /D IS
L V D /L V R
C O M 0 ~
C O M 2
Rev. 2.10
C O M 3 /
S E G 1 8
S E G 0 ~
S E G 1 7
2
July 30, 2012
HT49R30A-1/HT49C30-1/HT49C30L
Pin Assignment
P A 0 /B Z
1
4 8
R E S
P A 1 /B Z
2
4 7
O S C 1
P A 2
3
4 6
O S C 2
P A 3 /P F D
4
4 5
V D D
P A 4
5
4 4
O S C 3
P A 5
6
4 3
O S C 4
P A 6
7
4 2
S E G 0
P A 7
8
4 1
S E G 1
P B 0 /IN T 0
9
4 0
S E G 2
P B 1 /IN T 1
1 0
3 9
S E G 3
P B 2 /T M R
1 1
3 8
S E G 4
P B 3
1 2
3 7
S E G 5
P B 4
1 3
3 6
S E G 6
P B 5
1 4
3 5
S E G 7
V S S
1 5
3 4
S E G 8
V L C D
1 6
3 3
S E G 9
V 1
1 7
3 2
S E G 1 0
V 2
1 8
3 1
S E G 1 1
C 1
1 9
3 0
S E G 1 2
C 2
2 0
2 9
S E G 1 3
C O M 0
2 1
2 8
S E G 1 4
C O M 1
2 2
2 7
S E G 1 5
C O M 2
2 3
2 6
S E G 1 6
C O M 3 /S E G 1 8
2 4
2 5
S E G 1 7
H T 4 9 R 3 0 A -1 /H T 4 9 C 3 0 -1 /H T 4 9 C 3 0 L
4 8 S S O P -A
Rev. 2.10
3
July 30, 2012
HT49R30A-1/HT49C30-1/HT49C30L
Pad Description
Pad Name
PA0/BZ
PA1/BZ
PA2
PA3/PFD
PA4~PA7
I/O
Options
Description
I/O
Wake-up
Pull-high
or None
CMOS or
NMOS
PA0~PA7 constitute an 8-bit bidirectional input/output port with Schmitt trigger input capability. Each pin on port can be configured as a wake-up input
by options. PA0~PA3 can be configured as a CMOS output or NMOS input/output with or without pull-high resistor by options. PA4~PA7 are always
pull-high NMOS input/output. Of the eight bits, PA0~PA1 can be set as I/O
pins or buzzer outputs by options. PA3 can be set as an I/O pin or as a PFD
output also by options.
PB0/INT0
PB1/INT1
PB2/TMR
PB3~PB5
I
¾
PB0~PB5 constitute a 6-bit Schmitt trigger input port. Each pin on port are
with pull-high resistor. Of the six bits, PB0 and PB1 can be set as input pins or
as external interrupt control pins (INT0) and (INT1) respectively, by software
application. PB2 can be set as an input pin or as a timer/event counter input
pin TMR also by software application.
VLCD
I
¾
LCD power supply for HT49R30A-1/HT49C30-1.
Voltage pump for HT49C30L.
V2
I
¾
Voltage pump for HT49R30A-1/HT49C30-1.
LCD power supply for HT49C30L.
V1,C1,C2
I
¾
Voltage pump
COM0~COM2
COM3/SEG18
O
SEG0~SEG17
O
1/2, 1/3 or 1/4 SEG18 can be set as a segment or as a common output driver for LCD panel
Duty
by options. COM0~COM2 are outputs for LCD panel plate.
¾
LCD driver outputs for LCD panel segments
OSC1
OSC2
I
O
OSC1 and OSC2 are connected to an RC network or a crystal (by options)
for the internal system clock. In the case of RC operation, OSC2 is the output
Crystal or RC terminal for 1/4 system clock.
The system clock may come from the RTC oscillator. If the system clock comes from RTC OSC, these two pins can be floating.
OSC3
OSC4
I
O
Real time clock oscillators. OSC3 and OSC4 are connected to a 32768Hz
RTC or
crystal oscillator for timing purposes or to a system clock source (depending
System Clock
on the options).
VSS
¾
¾
Negative power supply, ground
VDD
¾
¾
Positive power supply
RES
I
¾
Schmitt trigger reset input, active low
Absolute Maximum Ratings
Supply Voltage..........................VSS-0.3V to VSS+6.0V*
Supply Voltage ........................VSS-0.3V to VSS+2.5V**
Storage Temperature ............................-50°C to 125°C
Input Voltage..............................VSS-0.3V to VDD+0.3V
IOL Total ..............................................................150mA
Total Power Dissipation .....................................500mW
Operating Temperature ...........................-40°C to 85°C
IOH Total ............................................................-100mA
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed
in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.
²*² For HT49R30A-1/HT49C30-1
²**² For HT49C30L
Rev. 2.10
4
July 30, 2012
HT49R30A-1/HT49C30-1/HT49C30L
D.C. Characteristics
VDD=1.5V for HT49C30L, VDD=3V & VDD=5V for HT49R30A-1 and HT49C30-1
Ta=25°C
Test Conditions
Symbol
Parameter
Min.
Typ.
Max.
Unit
For HT49C30L
1.2
¾
2.2
V
LVR disable, fSYS=4MHz
(for HT49R30A-1/HT49C30-1)
2.2
¾
5.5
V
fSYS=8MHz
(for HT49R30A-1/HT49C30-1)
3.3
¾
5.5
V
For HT49R30A-1/HT49C30-1,
VA£5.5V
2.2
¾
5.5
V
¾
60
100
mA
¾
1
2
mA
¾
3
5
mA
¾
50
100
mA
¾
1
2
mA
¾
3
5
mA
¾
4
8
mA
¾
2.5
5
mA
¾
0.3
0.6
mA
¾
0.6
1
mA
¾
0.1
0.5
mA
¾
¾
1
mA
¾
¾
2
mA
¾
1
2
mA
¾
2.5
5
mA
¾
10
20
mA
¾
0.5
1
mA
¾
2
5
mA
¾
6
10
mA
¾
17
30
mA
¾
34
60
mA
¾
13
25
mA
¾
26
50
mA
¾
14
25
mA
¾
28
50
mA
¾
10
20
mA
¾
20
40
mA
0
¾
0.3VDD
V
VDD
VDD
Operating Voltage
VLCD
LCD Power Supply (Note *)
IDD1
Operating Current
(Crystal OSC)
¾
¾
Conditions
1.5V No load, fSYS=455kHz
3V
No load, fSYS=4MHz
5V
1.5V No load, fSYS=400kHz
IDD2
Operating Current
(RC OSC)
3V
No load, fSYS=4MHz
5V
IDD3
Operating Current
(Crystal OSC, RC OSC)
IDD4
Operating Current
(fSYS=RTC OSC)
5V
No load, fSYS=8MHz
1.5V
3V
No load
5V
1.5V
ISTB1
Standby Current
(*fS=T1)
3V
No load, system HALT,
LCD Off at HALT
5V
1.5V
ISTB2
Standby Current
(*fS=RTC OSC)
3V
No load, system HALT,
LCD On at HALT, C type
5V
1.5V
ISTB3
Standby Current
(*fS=WDT RC OSC)
3V
No load, system HALT
LCD On at HALT, C type
5V
ISTB4
ISTB5
ISTB6
ISTB7
VIL1
Rev. 2.10
Standby Current
(*fS=RTC OSC)
3V
Standby Current
(*fS=RTC OSC)
3V
Standby Current
(*fS=WDT RC OSC)
3V
Standby Current
(*fS=WDT RC OSC)
3V
5V
No load, system HALT,
LCD On at HALT, R type, 1/3 bias
Input Low Voltage for I/O
Ports, TMR and INT
¾
¾
5V
5V
5V
No load, system HALT,
LCD On at HALT, R type, 1/2 bias
No load, system HALT,
LCD On at HALT, R type, 1/3 bias
No load, system HALT,
LCD On at HALT, R type, 1/2 bias
5
July 30, 2012
HT49R30A-1/HT49C30-1/HT49C30L
Test Conditions
Symbol
Parameter
Min.
Typ.
Max.
Unit
For HT49C30L
0.8VDD
¾
VDD
V
For HT49R30A-1/HT49C30-1
0.7VDD
¾
VDD
V
VDD
Conditions
Input High Voltage for I/O
Ports, TMR and INT
¾
VIL2
Input Low Voltage (RES)
¾
¾
0
¾
0.4VDD
V
VIH2
Input High Voltage (RES)
¾
¾
0.9VDD
¾
VDD
V
0.4
0.8
¾
mA
6
12
¾
mA
5V
10
25
¾
mA
1.5V
-0.3
-0.6
¾
mA
-2
-4
¾
mA
-5
-8
¾
mA
210
420
¾
mA
350
700
¾
mA
-80
-160
¾
mA
5V
-180
-360
¾
mA
1.5V
75
150
300
kW
20
60
100
kW
10
30
50
kW
VIH1
1.5V
IOL1
I/O Port Sink Current
IOH1
I/O Port Source Current
3V
3V
VOL=0.1VDD
VOH=0.9VDD
5V
IOL2
IOH2
RPH
LCD Common and Segment
Current
3V
LCD Common and Segment
Current
3V
Pull-high Resistance
VOL=0.1VDD
5V
VOH=0.9VDD
¾
3V
5V
VLVR
Low Voltage Reset Voltage
¾
¾
2.7
3.2
3.6
V
VLVD
Low Voltage Detector Voltage
¾
¾
3.0
3.3
3.6
V
Note:
²*² for the value of VA refer to the LCD driver section.
²*fS² please refer to the WDT clock option
Rev. 2.10
6
July 30, 2012
HT49R30A-1/HT49C30-1/HT49C30L
A.C. Characteristics
VDD=1.5V for HT49C30L, VDD=3V & VDD=5V for HT49R30A-1 and HT49C30-1
Ta=25°C
Test Conditions
Symbol
Parameter
VDD
fSYS1
fSYS2
System Clock (Crystal OSC)
System Clock (RC OSC)
Min.
Typ.
Max.
Unit
¾
500
kHz
4000
kHz
Conditions
¾
1.2V~2.2V (for HT49C30L)
400
¾
2.2V~5.5V
400
¾
3.3V~5.5V
400
¾
8000
kHz
¾
1.2V~2.2V (for HT49C30L)
400
¾
500
kHz
¾
2.2V~5.5V
400
¾
4000
kHz
¾
3.3V~5.5V
400
¾
8000
kHz
fSYS3
System Clock
(32768Hz Crystal OSC)
¾
¾
¾
32768
¾
Hz
fRTCOSC
RTC Frequency
¾
¾
¾
32768
¾
Hz
fTIMER
Timer I/P Frequency
¾
1.2V~2.2V (for HT49C30L)
0
¾
500
kHz
¾
2.2V~5.5V
0
¾
4000
kHz
¾
3.3V~5.5V
0
¾
8000
kHz
35
70
140
ms
45
90
180
ms
32
65
130
ms
For HT49C30L
10
¾
¾
ms
For HT49R30A-1/HT49C30-1
1
¾
¾
ms
Wake-up from HALT
¾
1024
¾
*tSYS
1.5V
tWDTOSC Watchdog Oscillator Period
¾
3V
5V
tRES
External Reset Low Pulse Width
¾
tSST
System Start-up Timer Period
¾
tLVR
Low Voltage Width to Reset
¾
tINT
Interrupt Pulse Width
¾
¾
0.25
1
2
ms
For HT49C30L
10
¾
¾
ms
For HT49R30A-1/HT49C30-1
1
¾
¾
ms
Note: *tSYS= 1/fSYS1, 1/fSYS2 or 1/fSYS3
Rev. 2.10
7
July 30, 2012
HT49R30A-1/HT49C30-1/HT49C30L
Functional Description
Execution Flow
After accessing a program memory word to fetch an instruction code, the value of the PC is incremented by
one. The PC then points to the memory word containing
the next instruction code.
The system clock is derived from either a crystal or an
RC oscillator or a 32768Hz crystal oscillator. It is internally divided into four non-overlapping clocks. One instruction cycle consists of four system clock cycles.
When executing a jump instruction, conditional skip execution, loading a PCL register, a subroutine call, an initial reset, an internal interrupt, an external interrupt, or
returning from a subroutine, the PC manipulates the
program transfer by loading the address corresponding
to each instruction.
Instruction fetching and execution are pipelined in such
a way that a fetch takes one instruction cycle while decoding and execution takes the next instruction cycle.
The pipelining scheme causes each instruction to effectively execute in a cycle. If an instruction changes the
value of the program counter, two cycles are required to
complete the instruction.
The conditional skip is activated by instructions. Once
the condition is met, the next instruction, fetched during
the current instruction execution, is discarded and a
dummy cycle replaces it to get a proper instruction; otherwise proceed with the next instruction.
Program Counter - PC
The program counter (PC) is of 11 bits wide and controls
the sequence in which the instructions stored in the program ROM are executed. The contents of the PC can
specify a maximum of 2048 addresses.
S y s te m
C lo c k
O S C 2 (R C
T 1
T 2
T 3
T 4
The lower byte of the PC (PCL) is a readable and
writeable register (06H). Moving data into the PCL performs a short jump. The destination is within 256 locations.
T 1
T 2
T 3
T 4
T 1
T 2
T 3
T 4
o n ly )
P C
P C
P C + 1
F e tc h IN S T (P C )
E x e c u te IN S T (P C -1 )
P C + 2
F e tc h IN S T (P C + 1 )
E x e c u te IN S T (P C )
F e tc h IN S T (P C + 2 )
E x e c u te IN S T (P C + 1 )
Execution Flow
Mode
Program Counter
*10
*9
*8
*7
*6
*5
*4
*3
*2
*1
*0
Initial Reset
0
0
0
0
0
0
0
0
0
0
0
External Interrupt 0
0
0
0
0
0
0
0
0
1
0
0
External Interrupt 1
0
0
0
0
0
0
0
1
0
0
0
Timer/Event Counter Overflow
0
0
0
0
0
0
0
1
1
0
0
Time Base Interrupt
0
0
0
0
0
0
1
0
0
0
0
RTC Interrupt
0
0
0
0
0
0
1
0
1
0
0
*10
*9
*8
@7
@3
@2
@1
@0
Skip
Program Counter + 2
Loading PCL
@6
@5
@4
Jump, Call Branch
#10
#9
#8
#7
#6
#5
#4
#3
#2
#1
#0
Return From Subroutine
S10
S9
S8
S7
S6
S5
S4
S3
S2
S1
S0
Program Counter
Note:
*10~*0: Program counter bits
#10~#0: Instruction code bits
Rev. 2.10
S10~S0: Stack register bits
@7~@0: PCL bits
8
July 30, 2012
HT49R30A-1/HT49C30-1/HT49C30L
When a control transfer takes place, an additional
dummy cycle is required.
0 0 0 H
Program Memory - ROM
0 0 8 H
The program memory is used to store the program instructions which are to be executed. It also contains
data, table, and interrupt entries, and is organized into
2048´14 bits which are addressed by the program
counter and table pointer.
0 0 C H
E x te r n a l in te r r u p t 0 s u b r o u tin e
E x te r n a l in te r r u p t 1 s u b r o u tin e
T im e r /e v e n t c o u n te r in te r r u p t s u b r o u tin e
0 1 0 H
T im e B a s e In te r r u p t
0 1 4 H
Certain locations in the ROM are reserved for special
usage:
n 0 0 H
· Location 000H
n F F H
Location 000H is reserved for program initialization.
After chip reset, the program always begins execution
at this location.
P ro g ra m
R O M
R T C In te rru p t
L o o k - u p ta b le ( 2 5 6 w o r d s )
7 0 0 H
L o o k - u p ta b le ( 2 5 6 w o r d s )
7 F F H
· Location 004H
1 4 b its
Location 004H is reserved for the external interrupt
service program. If the INT0 input pin is activated, and
the interrupt is enabled, and the stack is not full, the
program begins execution at location 004H.
N o te : n ra n g e s fro m
0 to 7
Program Memory
· Location 008H
higher-order byte to TBLH (Table Higher-order byte
register) (08H). Only the destination of the lower-order
byte in the table is well-defined; the other bits of the table word are all transferred to the lower portion of
TBLH, and the remaining 2 bit is read as ²0². The
TBLH is read only, and the table pointer (TBLP) is a
read/write register (07H), indicating the table location.
Before accessing the table, the location should be
placed in TBLP. All the table related instructions require 2 cycles to complete the operation. These areas
may function as a normal ROM depending upon the
user¢s requirements.
Location 008H is reserved for the external interrupt
service program also. If the INT1 input pin is activated,
and the interrupt is enabled, and the stack is not full,
the program begins execution at location 008H.
· Location 00CH
Location 00CH is reserved for the timer/event counter
interrupt service program. If a timer interrupt results
from a timer/event counter overflow, and if the interrupt is enabled and the stack is not full, the program
begins execution at location 00CH.
· Location 010H
Location 010H is reserved for the Time Base interrupt
service program. If a Time Base interrupt occurs, and
the interrupt is enabled, and the stack is not full, the
program begins execution at location 010H.
Stack Register - STACK
The stack register is a special part of the memory used
to save the contents of the program counter. The stack
is organized into 4 levels and is neither part of the data
nor part of the program, and is neither readable nor
writeable. Its activated level is indexed by a stack
pointer (SP) and is neither readable nor writeable. At a
commencement of a subroutine call or an interrupt acknowledgment, the contents of the program counter is
pushed onto the stack. At the end of the subroutine or interrupt routine, signaled by a return instruction (RET or
RETI), the contents of the program counter is restored
to its previous value from the stack. After chip reset, the
SP will point to the top of the stack.
· Location 014H
Location 014H is reserved for the real time clock interrupt service program. If a real time clock interrupt occurs, and the interrupt is enabled, and the stack is not
full, the program begins execution at location 014H.
· Table location
Any location in the ROM can be used as a look-up table. The instructions ²TABRDC [m]² (the current page,
1 page=256 words) and ²TABRDL [m]² (the last page)
transfer the contents of the lower-order byte to the
specified data memory, and the contents of the
Instruction(s)
D e v ic e in itia liz a tio n p r o g r a m
0 0 4 H
Table Location
*10
*9
*8
*7
*6
*5
*4
*3
*2
*1
*0
TABRDC [m]
P10
P9
P8
@7
@6
@5
@4
@3
@2
@1
@0
TABRDL [m]
1
1
1
@7
@6
@5
@4
@3
@2
@1
@0
Table Location
Note:
*10~*0: Table location bits
@7~@0: Table pointer bits
Rev. 2.10
P10~P8: Current program counter bits
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July 30, 2012
HT49R30A-1/HT49C30-1/HT49C30L
If the stack is full and a non-masked interrupt takes
place, the interrupt request flag is recorded but the acknowledgment is still inhibited. Once the SP is decremented (by RET or RETI), the interrupt is serviced. This
feature prevents stack overflow, allowing the programmer to use the structure easily. Likewise, if the stack is
full, and a ²CALL² is subsequently executed, a stack
overflow occurs and the first entry is lost (only the most
recent four return addresses are stored).
0 0 H
In d ir e c t A d d r e s s in g R e g is te r 0
0 1 H
0 2 H
M P 0
In d ir e c t A d d r e s s in g R e g is te r 1
0 3 H
M P 1
0 4 H
B P
A C C
P C L
0 9 H
R T C C
Data Memory - RAM
0 A H
S T A T U S
0 B H
IN T C 0
0 5 H
0 6 H
0 7 H
0 8 H
The data memory (RAM) is designed with 113´8 bits,
and is divided into two functional groups, namely special
function registers and general purpose data memory,
most of which are readable/writeable, although some
are read only.
0 C H
0 D H
0 E H
S p e c ia l P u r p o s e
D a ta M e m o ry
T M R
T M R C
0 F H
1 0 H
Of the two types of functional groups, the special function registers consist of an Indirect addressing register 0
(00H), a Memory pointer register 0 (MP0;01H), an Indirect addressing register 1 (02H), a Memory pointer register 1 (MP1;03H), a Bank pointer (BP;04H), an
A c c u m u lat or ( A C C ; 0 5 H ) , a P r ogr a m co u n t e r
lower-order byte register (PCL;06H), a Table pointer
(TBLP;07H), a Table higher-order byte register
(TBLH;08H), a Real time clock control register
(RTCC;09H), a Status register (STATUS;0AH), an Interrupt control register 0 (INTC0;0BH), a timer/event counter (TMR;0DH), a timer/event counter control register
(TMRC;0EH), I/O registers (PA;12H, PB;14H), and Interrupt control register 1 (INTC1;1EH). On the other
hand, the general purpose data memory, addressed
from 20H to 7FH, is used for data and control information under instruction commands.
1 1 H
1 2 H
P A
1 3 H
1 4 H
P B
1 5 H
1 6 H
1 7 H
1 8 H
: U n u s e d .
1 9 H
1 A H
R e a d a s "0 "
1 B H
1 C H
1 D H
1 E H
1 F H
2 0 H
IN T C 1
G e n e ra l P u rp o s e
D a ta M e m o ry
(9 6 B y te s )
The areas in the RAM can directly handle arithmetic,
logic, increment, decrement, and rotate operations. Except some dedicated bits, Each pin in the RAM can be
set and reset by ²SET [m].i² and ²CLR [m].i² They are
also indirectly accessible through the Memory pointer
register 0 (MP0;01H) or the Memory pointer register 1
(MP1;03H).
7 F H
RAM Mapping
Accumulator - ACC
The accumulator (ACC) is related to the ALU operations. It is also mapped to location 05H of the RAM and
is capable of operating with immediate data. The data
movement between two data memory locations must
pass through the ACC.
Indirect Addressing Register
Location 00H and 02H are indirect addressing registers
that are not physically implemented. Any read/write operation of [00H] and [02H] accesses the RAM pointed to
by MP0 (01H) and MP1(03H) respectively. Reading location 00H or 02H indirectly returns the result 00H.
While, writing it indirectly leads to no operation.
Arithmetic and Logic Unit - ALU
This circuit performs 8-bit arithmetic and logic operations and provides the following functions:
The function of data movement between two indirect addressing registers is not supported. The memory pointer
registers, MP0 (7-bit) and MP1 (7-bit), used to access
the RAM by combining corresponding indirect addressing registers. MP0 can only be applied to data memory,
while MP1 can be applied to data memory and LCD display memory.
Rev. 2.10
T B L P
T B L H
· Arithmetic operations (ADD, ADC, SUB, SBC, DAA)
· Logic operations (AND, OR, XOR, CPL)
· Rotation (RL, RR, RLC, RRC)
· Increment and Decrement (INC, DEC)
· Branch decision (SZ, SNZ, SIZ, SDZ etc.)
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July 30, 2012
HT49R30A-1/HT49C30-1/HT49C30L
scheme may prevent any further interrupt nesting. Other
interrupt requests may take place during this interval,
but only the interrupt request flag will be recorded. If a
certain interrupt requires servicing within the service
routine, the EMI bit and the corresponding bit of the
INTC0 or of INTC1 may be set in order to allow interrupt
nesting. Once the stack is full, the interrupt request will
not be acknowledged, even if the related interrupt is enabled, until the SP is decremented. If immediate service
is desired, the stack should be prevented from becoming full.
The ALU not only saves the results of a data operation
but also changes the status register.
Status Register - STATUS
The status register (0AH) is of 8 bits wide and contains,
a carry flag (C), an auxiliary carry flag (AC), a zero flag
(Z), an overflow flag (OV), a power down flag (PDF), and
a watchdog time-out flag (TO). It also records the status
information and controls the operation sequence.
Except the TO and PDF flags, bits in the status register can be altered by instructions similar to other registers. Data written into the status register does not alter
the TO or PDF flags. Operations related to the status
register, however, may yield different results from those
intended. The TO and PDF flags can only be changed
by a Watchdog Timer overflow, chip power-up, or clearing the Watchdog Timer and executing the ²HALT² instruction. The Z, OV, AC, and C flags reflect the status of
the latest operations.
All these interrupts can support a wake-up function. As
an interrupt is serviced, a control transfer occurs by
pushing the contents of the program counter onto the
stack followed by a branch to a subroutine at the specified location in the ROM. Only the contents of the program counter is pushed onto the stack. If the contents of
the register or of the status register (STATUS) is altered
by the interrupt service program which corrupts the desired control sequence, the contents should be saved in
advance.
On entering the interrupt sequence or executing the
subroutine call, the status register will not be automatically pushed onto the stack. If the contents of the status
is important, and if the subroutine is likely to corrupt the
status register, the programmer should take precautions
and save it properly.
External interrupts are triggered by a high to low transition of INT0 or INT1, and the related interrupt request
flag (EIF0;bit 4 of INTC0, EIF1;bit 5 of INTC0) is set as
well. After the interrupt is enabled, the stack is not full,
and the external interrupt is active, a subroutine call to
location 04H or 08H occurs. The interrupt request flag
(EIF0 or EIF1) and EMI bits are all cleared to disable
other interrupts.
Interrupts
The device provides two external interrupts, an internal
timer/event counter interrupt, an internal time base interrupt, and an internal real time clock interrupt. The interrupt control register 0 (INTC0;0BH) and interrupt
control register 1 (INTC1;1EH) both contain the interrupt
control bits that are used to set the enable/disable status
and interrupt request flags.
The internal timer/event counter interrupt is initialized by
setting the timer/event counter interrupt request flag
(TF;bit 6 of INTC0), which is normally caused by a timer
overflow. After the interrupt is enabled, and the stack is
not full, and the TF bit is set, a subroutine call to location
0CH occurs. The related interrupt request flag (TF) is reset, and the EMI bit is cleared to disable further interrupts.
Once an interrupt subroutine is serviced, other interrupts are all blocked (by clearing the EMI bit). This
Bit No.
Label
Function
0
C
C is set if the operation results in a carry during an addition operation or if a borrow does not
take place during a subtraction operation; otherwise C is cleared. C is also affected by a rotate through carry instruction.
1
AC
AC is set if the operation results in a carry out of the low nibbles in addition or no borrow from
the high nibble into the low nibble in subtraction; otherwise AC is cleared.
2
Z
3
OV
OV is set if the operation results in a carry into the highest-order bit but not a carry out of the
highest-order bit, or vice versa; otherwise OV is cleared.
4
PDF
PDF is cleared by either a system power-up or executing the ²CLR WDT² instruction. PDF is
set by executing the ²HALT² instruction.
5
TO
TO is cleared by a system power-up or executing the ²CLR WDT² or ²HALT² instruction. TO
is set by a WDT time-out.
6, 7
¾
Unused bit, read as ²0²
Z is set if the result of an arithmetic or logic operation is zero; otherwise Z is cleared.
Status (0AH) Register
Rev. 2.10
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July 30, 2012
HT49R30A-1/HT49C30-1/HT49C30L
Bit No.
Label
0
EMI
Control the master (global) interrupt (1=enabled; 0=disabled)
Function
1
EEI0
Control the external interrupt 0 (1=enabled; 0=disabled)
2
EEI1
Control the external interrupt 1 (1=enabled; 0=disabled)
3
ETI
Control the timer/event counter interrupt (1=enabled; 0=disabled)
4
EIF0
External interrupt 0 request flag (1=active; 0=inactive)
5
EIF1
External interrupt 1 request flag (1=active; 0=inactive)
6
TF
Internal timer/event counter request flag (1=active; 0=inactive)
7
¾
Unused bit, read as ²0²
INTC0 (0BH) Register
Bit No.
Label
Function
0
ETBI
Control the time base interrupt (1=enabled; 0:disabled)
1
ERTI
Control the real time clock interrupt (1=enabled; 0:disabled)
2, 3
¾
4
TBF
Time base request flag (1=active; 0=inactive)
5
RTF
Real time clock request flag (1=active; 0=inactive)
6, 7
¾
Unused bit, read as ²0²
Unused bit, read as ²0²
INTC1 (1EH) Register
The time base interrupt is initialized by setting the time
base interrupt request flag (TBF;bit 4 of INTC1), that is
caused by a regular time base signal. After the interrupt
is enabled, and the stack is not full, and the TBF bit is
set, a subroutine call to location 10H occurs. The related
interrupt request flag (TBF) is reset and the EMI bit is
cleared to disable further interrupts.
Interrupt Source
The real time clock interrupt is initialized by setting the
real time clock interrupt request flag (RTF;bit 5 of
INTC1), that is caused by a regular real time clock signal. After the interrupt is enabled, and the stack is not
full, and the RTF bit is set, a subroutine call to location
14H occurs. The related interrupt request flag (RTF) is
reset and the EMI bit is cleared to disable further interrupts.
Vector
1
04H
External interrupt 1
2
08H
Timer/event counter overflow
3
0CH
Time base interrupt
4
10H
Real time clock interrupt
5
14H
The timer/event counter interrupt request flag (TF), external interrupt 1 request flag (EIF1), external interrupt 0
request flag (EIF0), enable timer/event counter interrupt
bit (ETI), enable external interrupt 1 bit (EEI1), enable
external interrupt 0 bit (EEI0), and enable master interrupt bit (EMI) make up of the Interrupt Control register 0
(INTC0) which is located at 0BH in the RAM. The real
time clock interrupt request flag (RTF), time base interrupt request flag (TBF), enable real time clock interrupt
bit (ERTI), and enable time base interrupt bit (ETBI),
constitute the Interrupt Control register 1 (INTC1) which
is located at 1EH in the RAM. EMI, EEI0, EEI1, ETI,
ETBI, and ERTI are all used to control the enable/disable status of interrupts. These bits prevent the requested interrupt from being serviced. Once the
interrupt request flags (RTF, TBF, TF, EIF1, EIF0) are all
set, they remain in the INTC1 or INTC0 respectively until
the interrupts are serviced or cleared by a software instruction.
During the execution of an interrupt subroutine, other interrupt acknowledgments are all held until the ²RETI² instruction is executed or the EMI bit and the related
interrupt control bit are set both to 1 (if the stack is not
full). To return from the interrupt subroutine, ²RET² or
²RETI² may be invoked. RETI sets the EMI bit and enables an interrupt service, but RET does not.
Interrupts occurring in the interval between the rising
edges of two consecutive T2 pulses are serviced on the
latter of the two T2 pulses if the corresponding interrupts
are enabled. In the case of simultaneous requests, the
priorities in the following table apply. These can be
masked by resetting the EMI bit.
Rev. 2.10
Priority
External interrupt 0
It is recommended that a program not use the ²CALL
subroutine² within the interrupt subroutine. It¢s because
interrupts often occur in an unpredictable manner or re-
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July 30, 2012
HT49R30A-1/HT49C30-1/HT49C30L
quire to be serviced immediately in some applications.
At this time, if only one stack is left, and enabling the interrupt is not well controlled, operation of the ²call² in the
interrupt subroutine may damage the original control sequence.
On the other hand, if the crystal oscillator is selected, a
crystal across OSC1 and OSC2 is needed to provide the
feedback and phase shift required for the oscillator, and
no other external components are required. A resonator
may be connected between OSC1 and OSC2 to replace
the crystal and to get a frequency reference, but two external capacitors in OSC1 and OSC2 are required.
Oscillator Configuration
The device provides three oscillator circuits for system
clocks, i.e., RC oscillator, crystal oscillator and 32768Hz
crystal oscillator, determined by options. No matter what
type of oscillator is selected, the signal is used for the
system clock. The HALT mode stops the system oscillator (RC and crystal oscillator only) and ignores external
signal to conserve power. The 32768Hz crystal oscillator
(system oscillator) still runs at HALT mode. If the
32768Hz crystal oscillator is selected as the system oscillator, the system oscillator is not stopped; but the instruction execution is stopped. Since the (used as system
oscillator or oscillator) is also designed for timing purposes, the internal timing (RTC, time base, WDT) operation still runs even if the system enters the HALT mode.
There is another oscillator circuit designed for the real
time clock. In this case, only the 32.768kHz crystal oscillator can be applied. The crystal should be connected
between OSC3 and OSC4.
The RTC oscillator circuit can be controlled to oscillate
quickly by setting the ²QOSC² bit (bit 4 of RTCC). It is
recommended to turn on the quick oscillating function
upon power on, and then turn it off after 2 seconds.
The WDT oscillator is a free running on-chip RC oscillator, and no external components are required. Although
the system enters the power down mode, the system
clock stops, and the WDT oscillator still works with a period of approximately 65ms at 5V. The WDT oscillator
can be disabled by options to conserve power.
Of the three oscillators, if the RC oscillator is used, an
external resistor between OSC1 and VSS is required,
and the range of the resistance should be from 24kW to
1MW for HT49R30A-1/HT49C30-1 and from 560kW to
1MW for HT49C30L. The system clock, divided by 4, is
available on OSC2 with pull-high resistor, which can be
used to synchronize external logic. The RC oscillator
provides the most cost effective solution. However, the
frequency of the oscillation may vary with VDD, temperature, and the chip itself due to process variations. It is
therefore, not suitable for timing sensitive operations
where accurate oscillator frequency is desired.
Symbol
Parameter
Watchdog Timer - WDT
The WDT clock source is implemented by a dedicated
RC oscillator (WDT oscillator) or an instruction clock
(system clock/4) or a real time clock oscillator (RTC oscillator). The timer is designed to prevent a software
malfunction or sequence from jumping to an unknown
location with unpredictable results. The WDT can be
disabled by options. But if the WDT is disabled, all executions related to the WDT lead to no operation.
Min.
Typ.
Max.
Unit
fO
Nominal Frequency
¾
32.768
¾
kHz
ESR
Series Resistance
¾
50
65
kW
CL
Load Capacitance
¾
9
¾
pF
Note:
1. It is strongly recommended to use a crystal with load capacitance 9pF.
2. The oscillator selection can be optimized using a high quality resonator with small ESR value. Refer to
crystal manufacturer for more details: www.microcrystal.com
Crystal Specifications
V
O S C 3
O S C 4
3 2 7 6 8 H z C r y s ta l/
R T C O s c illa to r
D D
4 7 0 p F
O S C 1
V
fS
O S C 2
C r y s ta l O s c illa to r
Y S
/4
O S C 1
D D
O S C 2
R C O s c illa to r
System Oscillator
Rev. 2.10
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July 30, 2012
HT49R30A-1/HT49C30-1/HT49C30L
The WDT time-out period is fS/215~fS/216. If the WDT
clock source chooses the internal WDT oscillator, the
time-out period may vary with temperature, VDD, and
process variations. On the other hand, if the clock
source selects the instruction clock and the ²HALT²
instruction is executed, WDT may stop counting and
lose its protecting purpose, and the logic can only be restarted by an external logic.
The multi-function timer consists of a 8-stage divider
and an 7-bit prescaler, with the clock source coming
from the WDT OSC or RTC OSC or the instruction clock
(i.e., system clock divided by 4). The multi-function timer
also provides a selectable frequency signal (ranges
from fS/22 to fS/28) for LCD driver circuits, and a
selectable frequency signal (ranges from fS/22 to fS/29)
for the buzzer output by options. It is recommended to
select a near 4kHz signal to LCD driver circuits for
proper display.
When the device operates in a noisy environment, using
the on-chip RC oscillator (WDT OSC) is strongly recommended, since the HALT can stop the system clock.
Time Base
The WDT overflow under normal operation initializes a
²chip reset² and sets the status bit ²TO². In the HALT
mode, the overflow initializes a ²warm reset², and only
the program counter and SP are reset to zero. To clear
the contents of the WDT, there are three methods to be
adopted, i.e., external reset (a low level to RES), software instruction, and a ²HALT² instruction. There are
two types of software instructions; ²CLR WDT² and the
other set - ²CLR WDT1² and ²CLR WDT2². Of these
two types of instruction, only one type of instruction can
be active at a time depending on the options - ²CLR
WDT² times selection option. If the ²CLR WDT² is selected (i.e., CLR WDT times equal one), any execution
of the ²CLR WDT² instruction clears the WDT. In the
case that ²CLR WDT1² and ²CLR WDT2² are chosen
(i.e., CLR WDT times equal two), these two instructions
have to be executed to clear the WDT; otherwise, the
WDT may reset the chip due to time-out.
The time base offers a periodic time-out period to generate a regular internal interrupt. Its time-out period
ranges from fS/212 to fS/215 selected by options. If time
base time-out occurs, the related interrupt request flag
(TBF; bit 4 of INTC1) is set. But if the interrupt is enabled, and the stack is not full, a subroutine call to location 10H occurs.
Real Time Clock - RTC
The real time clock (RTC) is operated in the same manner as the time base that is used to supply a regular internal interrupt. Its time-out period ranges from fS/28 to
fS/215 by software programming . Writing data to RT2,
RT1 and RT0 (bit2, 1, 0 of RTCC;09H) yields various
time-out periods. If the RTC time-out occurs, the related
interrupt request flag (RTF;bit 5 of INTC1) is set. But if the
interrupt is enabled, and the stack is not full, a subroutine
call to location 14H occurs. The real time clock time-out
signal also can be applied to be a clock source of
timer/event counter for getting a longer time-out period.
Multi-function Timer
The device provides a multi-function timer for the WDT,
time base and RTC but with different time-out periods.
S y s te m
C lo c k /4
R T C
O S C 3 2 7 6 8 H z
O p tio n
S e le c t
fS
D iv id e r
D iv id e r
C K
W D T
1 2 k H z
O S C
T
C K
R
T
R
T im e - o u t R e s e t fS /2
1 5
~ fS /2
1 6
W D T C le a r
Watchdog Timer
fs
D iv id e r
P r e s c a le r
O p tio n
L C D D r iv e r ( fS /2 2 ~ fS /2 8 )
B u z z e r (fS /2 2~ fS /2 9)
O p tio n
fS
P r e s c a le r
R T 2
R T 1
R T 0
T im e B a s e In te r r u p t
fS /2 12~ fS /2 15
Time Base
Rev. 2.10
D iv id e r
8 to 1
M u x .
fS /2 8~ fS /2 15
R T C In te rru p t
Real Time Clock
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July 30, 2012
HT49R30A-1/HT49C30-1/HT49C30L
RT2
RT1
RT0
RTC Clock Divided Factor
8
0
0
0
2 *
0
0
1
2 9*
0
1
0
210*
0
1
1
211*
1
0
0
212
1
0
1
213
1
1
0
214
1
1
1
215
Note:
When an interrupt request flag is set before entering the
²HALT² status, the system cannot be awaken using that
interrupt.
If wake-up events occur, it takes 1024 tSYS (system
clock period) to resume normal operation. In other
words, a dummy period is inserted after the wake-up. If
the wake-up results from an interrupt acknowledgment,
the actual interrupt subroutine execution is delayed by
more than one cycle. However, if the Wake-up results in
the next instruction execution, the execution will be performed immediately after the dummy period is finished.
To minimize power consumption, all the I/O pins should
be carefully managed before entering the HALT status.
²*² not recommended for use
Power Down Operation - HALT
Reset
The HALT mode is initialized by the ²HALT² instruction
and results in the following.
· RES is reset during normal operation
· The system oscillator turns off but the WDT or RTC
· RES is reset during HALT
There are three ways in which reset may occur.
oscillator keeps running (if the WDT oscillator or the
real time clock is selected).
· WDT time-out is reset during normal operation
The WDT time-out during HALT differs from other chip
reset conditions, for it can perform a ²warm reset² that
resets only the program counter and SP and leaves the
other circuits at their original state. Some registers remain unaffected during any other reset conditions. Most
registers are reset to the ²initial condition² once the reset conditions are met. Examining the PDF and TO
flags, the program can distinguish between different
²chip resets².
· The contents of the on-chip RAM and of the registers
remain unchanged.
· The WDT is cleared and start recounting (if the WDT
clock source is from the WDT oscillator or the real time
clock oscillator).
· All I/O ports maintain their original status.
· The PDF flag is set but the TO flag is cleared.
· LCD driver is still running (if the WDT OSC or RTC
OSC is selected).
Note:
The system quits the HALT mode by an external reset,
an interrupt, an external falling edge signal on port A, or
a WDT overflow. An external reset causes device initialization, and the WDT overflow performs a ²warm reset².
After examining the TO and PDF flags, the reason for
chip reset can be determined. The PDF flag is cleared
by system power-up or by executing the ²CLR WDT²
instruction, and is set by executing the ²HALT²
instruction. On the other hand, the TO flag is set if WDT
time-out occurs, and causes a wake-up that only resets
the program counter and SP, and leaves the others at
their original state.
Rev. 2.10
TO
PDF
0
0
RES reset during power-up
u
u
RES reset during normal operation
0
1
RES Wake-up HALT
1
u
WDT time-out during normal operation
1
1
WDT Wake-up HALT
Note:
The port A wake-up and interrupt methods can be considered as a continuation of normal execution. Each pin
in port A can be independently selected to wake up the
device by options. Awakening from an I/O port stimulus,
the program resumes execution of the next instruction.
On the other hand, awakening from an interrupt, two sequences may occur. If the related interrupt is disabled or
the interrupt is enabled but the stack is full, the program
resumes execution at the next instruction. But if the interrupt is enabled, and the stack is not full, the regular interrupt response takes place.
²*² Make the length of the wiring, which is connected to the RES pin as short as possible, to
avoid noise interference.
RESET Conditions
²u² stands for unchanged
To guarantee that the system oscillator is started and
stabilized, the SST (System Start-up Timer) provides an
extra-delay of 1024 system clock pulses when the system awakes from the HALT state. Awaking from the
HALT state, the SST delay is added.
An extra option load time delay is added during reset
and power on.
15
July 30, 2012
HT49R30A-1/HT49C30-1/HT49C30L
H A L T
The functional unit chip reset status is shown below.
Program Counter
W D T
000H
Interrupt
Disabled
Prescaler, Divider
Cleared
WDT, RTC,
Time Base
Cleared. After master reset,
WDT starts counting
Timer/Event Counter
Off
Input/output Ports
Input mode
Stack Pointer
Points to the top of the stack
W a rm
W D T
R e s e t
T im e - o u t
R e s e t
E x te rn a l
R E S
C o ld
R e s e t
S S T
1 0 - b it R ip p le
C o u n te r
O S C 1
P o w e r - o n D e te c tio n
Reset Configuration
V
V
D D
D D
0 .0 1 m F
1 0 0 k W
V D D
R E S
tS
R E S
S T
S S T T im e - o u t
C h ip
1 0 0 k W
R E S
0 .1 m F
1 0 k W
B a s ic
R e s e t
C ir c u it
R e s e t
0 .1 m F
H i-n o is e
R e s e t
C ir c u it
Reset Timing Chart
Reset Circuit
Note: Most applications can use the Basic Reset Circuit
as shown, however for applications with extensive noise,
it is recommended to use the Hi-noise Reset Circuit.
The states of the registers are summarized below:
Register
Reset
(Power On)
WDT Time-out
RES Reset
(Norma Operation) (Normal Operation)
RES Reset
(HALT)
WDT Time-out
(HALT)*
TMR
xxxx xxxx
xxxx xxxx
xxxx xxxx
xxxx xxxx
uuuu uuuu
TMRC
0000 1---
0000 1---
0000 1---
0000 1---
uuuu u---
Program Counter
0000H
0000H
0000H
0000H
0000H
MP0
-xxx xxxx
-uuu uuuu
-uuu uuuu
-uuu uuuu
-uuu uuuu
MP1
-xxx xxxx
-uuu uuuu
-uuu uuuu
-uuu uuuu
-uuu uuuu
---- ---0
---- ---0
---- ---0
---- ---0
---- ---u
ACC
xxxx xxxx
uuuu uuuu
uuuu uuuu
uuuu uuuu
uuuu uuuu
TBLP
xxxx xxxx
uuuu uuuu
uuuu uuuu
uuuu uuuu
uuuu uuuu
TBLH
--xx xxxx
--uu uuuu
--uu uuuu
--uu uuuu
--uu uuuu
STATUS
--00 xxxx
--1u uuuu
--uu uuuu
--01 uuuu
--11 uuuu
INTC0
-000 0000
-000 0000
-000 0000
-000 0000
-uuu uuuu
INTC1
--00 --00
--00 --00
--00 --00
--00 --00
--uu --uu
BP
RTCC
--00 0111
--00 0111
--00 0111
--00 0111
--uu uuuu
PA
1111 1111
1111 1111
1111 1111
1111 1111
uuuu uuuu
PB
--xx xxxx
--xx xxxx
--xx xxxx
--xx xxxx
--uu uuuu
Note:
²*² stands for warm reset
²u² stands for unchanged
²x² stands for unknown
Rev. 2.10
16
July 30, 2012
HT49R30A-1/HT49C30-1/HT49C30L
The measured result remains in the timer/event counter
even if the activated transient occurs again. In other
words, only one cycle measurement can be made until
the TON is set. The cycle measurement will re-function
as long as it receives further transient pulse. In this operation mode, the timer/event counter begins counting according not to the logic level but to the transient edges.
In the case of counter overflows, the counter is reloaded
from the timer/event counter preload register and issues
an interrupt request, as in the other two modes, i.e.,
event and timer modes.
Timer/Event Counter
One timer/event counters is implemented in the device.
It contains an 8-bit programmable count-up counter.
The timer/event counter clock source may come from
the system clock or system clock/4 or RTC time-out signal or external source. System clock source or system
clock/4 is selected by options. Using external clock input
allows the user to count external events, measure time
internals or pulse widths, or generate an accurate time
base. While using the internal clock allows the user to
generate an accurate time base.
To enable the counting operation, the Timer ON bit
(TON;bit 4 of TMRC) should be set to 1. In the pulse
width measurement mode, the TON is automatically
cleared after the measurement cycle is completed. But
in the other two modes, the TON can only be reset by instructions. The overflow of the Timer/Event Counter is
one of the wake-up sources and can also be applied to a
PFD (Programmable Frequency Divider) output at PA3
by options. No matter what the operation mode is, writing
a 0 to ETI disables the related interrupt service. When the
PFD function is selected, executing ²CLR [PA].3² instruction to enable PFD output and executing ²SET [PA].3² instruction to disable PFD output.
There are two registers related to the timer/event counter, i.e., TMR ([0DH]) and TMRC ([0EH]). There are also
two physical registers which are mapped to TMR location; writing TMR places the starting value in the
timer/event counter preload register, while reading it
yields the contents of the timer/event counter. TMRC is
a timer/event counter control register used to define
some options.
The TM0 and TM1 bits define the operation mode. The
event count mode is used to count external events,
which means that the clock source is from an external
TMR pin. The timer mode functions as a normal timer
with the clock source coming from the internal selected
clock source. Finally, the pulse width measurement
mode can be used to count the high or low level duration
of the external signal TMR, and the counting is based on
the internal selected clock source.
In the case of timer/event counter OFF condition, writing
data to the timer/event counter preload register also reloads that data to the timer/event counter. But if the
timer/event counter is turn on, data written to the
timer/event counter is kept only in the timer/event counter preload register. The timer/event counter still continues its operation until an overflow occurs.
In the event count or timer mode, the timer/event counter starts counting at the current contents in the
timer/event counter and ends at FFH. Once an overflow
occurs, the counter is reloaded from the timer/event
counter preload register, and generates an interrupt request flag (TF; bit 6 of INTC0).
When the timer/event counter (reading TMR) is read,
the clock is blocked to avoid errors. As this may results
in a counting error, blocking of the clock should be taken
into account by the programmer.
In the pulse width measurement mode with the values
of the TON and TE bits equal to one, after the TMR
has received a transient from low to high (or high to
low if the TE bit is ²0²), it will start counting until the
TMR returns to the original level and resets the TON.
S y s te m
S y s te m
C lo c k
C lo c k /4
M
O p tio n
f IN
U
It is strongly recommended to load a desired value into
the TMR register first, then turn on the related
timer/event counter for proper operation, because the
initial value of TMR is unknown.
T
X
D a ta B u s
R T C O u t
T M 1
T M 0
T S
T M R
T im e r /E v e n t C o u n te r
P r e lo a d R e g is te r
R e lo a d
T E
T M 1
T M 0
T O N
P u ls e W id th
M e a s u re m e n t
M o d e C o n tro l
T im e r /E v e n t
C o u n te r
T
O v e r flo w
to In te rru p t
Q
P F D
P A 3 D a ta C T R L
Timer/Event Counter
Rev. 2.10
17
July 30, 2012
HT49R30A-1/HT49C30-1/HT49C30L
Bit No.
Label
0~2
¾
Unused bit, read as ²0²
3
TE
Defines the TMR active edge of the timer/event counter:
In Event Counter Mode (TM1,TM0)=(0,1):
1:count on falling edge;
0:count on rising edge
In Pulse Width measurement mode (TM1,TM0)=(1,1):
1: start counting on the rising edge, stop on the falling edge;
0: start counting on the falling edge, stop on the rising edge
4
TON
5
TS
6
7
TM0
TM1
Function
To enable/disable timer counting
(0=disabled; 1=enabled)
2 to 1 multiplexer control inputs to select the timer/event counter clock source
(0=RTC outputs; 1= system clock or system clock/4)
To define the operating mode (TM1, TM0)
01= Event count mode (External clock)
10= Timer mode (Internal clock)
11= Pulse Width measurement mode (External clock)
00= Unused
TMRC (0EH) Register
output operations. For example, ²SET [m].i², ²CLR
[m].i², ²CPL [m]², ²CPLA [m]² read the entire port states
into the CPU, execute the defined operations
(bit-operation), and then write the results back to the
latches or to the accumulator. When a PA line is used as
an I/O line, the related PA line options should be configured as NMOS with or without pull-high resistor. Once a
PA line is selected as a CMOS output, the I/O function
cannot be used.
Due to the timer/event scheme, the programmer should
pay special attention on the instruction to enable then
disable the timer for the first time, whenever there is a
need to use the timer/event function, to avoid unpredictable result. After this procedure, the timer/event function
can be operated normally.
Input/Output Ports
There are a 8-bit bidirectional input/output port, an 6-bit
input port in the device, labeled PA, PB which are
mapped to [12H], [14H] of the RAM, respectively.
PA0~PA3 can be configured as CMOS (output) or
NMOS (input/output) with or without pull-high resistor by
options. PA4~PA7 are always pull-high and NMOS (input/output).
The input state of a PA line is read from the related PA
pad. When the PA is configured as NMOS with or without pull-high resistor, one should be careful when applying a read-modify-write instruction to PA. Since the
read-modify-write will read the entire port state (pads
state) firstly, execute the specified instruction and then
write the result to the port data register. When the read
operation is executed, a fault pad state (caused by the
load effect or floating state) may be read. Errors will then
occur.
If you choose NMOS (input), Each pin on the port
(PA0~PA7) can be configured as a wake-up input. PB
can only be used for input operation. All the ports for the
input operation (PA, PB), are non-latched, that is, the inputs should be ready at the T2 rising edge of the instruction ²MOV A, [m]² (m=12H or 14H).
There are three function pins that share with the PA port:
PA0/BZ, PA1/BZ and PA3/PFD.
For PA output operation, all data are latched and remain
unchanged until the output latch is rewritten.
The BZ and BZ are buzzer driving output pair and the
PFD is a programmable frequency divider output. If the
user wants to use the BZ/BZ or PFD function, the related
PA port should be set as a CMOS output. The buzzer
output signals are controlled by PA0 and PA1 data registers and defined in the following table.
When the PA structures are open drain NMOS type, it
should be noted that, before reading data from the pads,
a ²1² should be written to the related bits to disable the
NMOS device. That is executing first the instruction
²SET [m].i² (i=0~7 for PA) to disable related NMOS device, and then ²MOV A, [m]² to get stable data.
After chip reset, these input lines remain at the high level
or are left floating (by options). Each pin of these output
latches can be set or cleared by the ²MOV [m], A²
(m=12H) instruction.
PA0 Data
Register
0
0
PA0=BZ, PA1=BZ
1
0
PA0=BZ, PA1=0
X
1
PA0=0, PA1=0
PA0/PA1 Pad State
Note: ²X² stands for unused
Some instructions first input data and then follow the
Rev. 2.10
PA1 Data
Register
18
July 30, 2012
HT49R30A-1/HT49C30-1/HT49C30L
The PFD output signal function is controlled by the PA3 data register and the timer/event counter state. The PFD output
signal frequency is also dependent on the timer/event counter overflow period. The definitions of PFD control signal
and PFD output frequency are listed in the following table.
Timer
Timer Preload Value
PA3 Data Register
PA3 Pad State
PFD Frequency
OFF
X
0
U
X
OFF
X
1
0
X
ON
N
0
PFD
fINT/[2´(256-N)]
ON
N
1
0
X
Note:
²X² stands for unused
²U² stands for unknown
V
V
D a ta B u s
W r ite
D
D D
W e a k
P u ll- u p
C /N M O S
O p tio n
(P A 0 ~ P A 3 )
Q
C K
D D
O p tio n
(P A 0 ~ P A 3 )
V
P A 0 ~ P A 7
Q
S
D D
W e a k
P u ll- u p
C h ip R e s e t
D a ta b u s
P B 0 ~ P B 5
R e a d I/O
R e a
S y
W a k
(P A
d I/O
s te m
e -u p
o n ly )
O p tio n
PA Input/Output Ports
PB Input Ports
memory. The LCD display memory can be read and
written to only by indirect addressing mode using MP1.
When data is written into the display data area, it is automatically read by the LCD driver which then generates
the corresponding LCD driving signals. To turn the display on or off, a ²1² or a ²0² is written to the corresponding bit of the display memory, respectively. The figure
illustrates the mapping between the display memory
and LCD pattern for the device.
LCD Display Memory
The device provides an area of embedded data memory
for LCD display. This area is located from 40H to 52H of
the RAM at Bank 1. Bank pointer (BP; located at 04H of
the RAM) is the switch between the RAM and the LCD
display memory. When the BP is set as ²01H², any data
written into 40H~52H will effect the LCD display. When
the BP is cleared to ²00H², any data written into
40H~52H means to access the general purpose data
C O M
4 0 H
4 1 H
4 2 H
4 3 H
5 0
5 1
5 2
B it
0
0
1
1
2
2
3
3
S E G M E N T
0
1
2
3
1 6
1 7
1 8
Display Memory
Rev. 2.10
19
July 30, 2012
HT49R30A-1/HT49C30-1/HT49C30L
voltage for HT49C30L can only be 1/2 bias. If 1/2 bias is
selected, a capacitor mounted between V2 pin and
ground is required. If 1/3 bias is selected, two capacitors
are needed for V1 and V2 pins.
LCD Driver Output
The output number of the LCD driver device can be
19´2, 19´3 or 18´4 by option (i.e., 1/2 duty, 1/3 duty or
1/4 duty). The bias type LCD driver can be ²R² type or
²C² type for HT49R30A-1/HT49C30-1 while the bias
type LCD driver can only be ²C² type for HT49C30L. If
the ²R² bias type is selected, no external capacitor is required. If the ²C² bias type is selected, a capacitor
mounted between C1 and C2 pins is needed. The LCD
driver bias voltage for HT49R30A-1/HT49C30-1 can be
1/2 bias or 1/3 bias by option, while the LCD driver bias
LCD bias power supply selection for HT49R30A-1/
HT49C30-1: There are two types of selections: 1/2 bias
or 1/3 bias.
LCD bias type selection for HT49R30A-1/HT49C30-1:
This option is to determine what kind of bias is selected,
R type or C type.
D u r in g a r e s e t p u ls e
V A
C O M 0 ,C O M 1 ,C O M 2
A ll L C D
V B
V S S
V A
V B
V S S
d r iv e r o u tp u ts
N o r m a l o p e r a tio n m o d e
*
*
*
C O M 0
C O M 1
C O M 2 *
L C D s e g m e n ts O N
C O M 0 ,1 ,2 s id e s a r e u n lig h te d
O n ly L C D s e g m e n ts O N
C O M 0 s id e a r e lig h te d
O n ly L C D s e g m e n ts O N
C O M 1 s id e a r e lig h te d
O n ly L C D s e g m e n ts O N
C O M 2 s id e a r e lig h te d
L C D s e g m e n ts O N
C O M 0 ,1 s id e s a r e lig h te d
L C D
s e g m e n ts O N
C O M 0 , 2 s id e s a r e lig h te d
L C D s e g m e n ts O N
C O M 1 ,2 s id e s a r e lig h te d
L C D s e g m e n ts O N
C O M 0 ,1 ,2 s id e s a r e lig h te d
H A L T M o d e
N o te :
V B
V S
V A
V B
V S
V A
V B
V S
V A
V B
V S
V A
V B
V S
V A
V B
V S
V A
V B
V S
V A
V B
V S
V A
V B
V S
V A
V B
V S
V A
V B
V S
S
S
S
S
S
S
S
S
S
S
S
V A
V B
V S S
V A
V B
V S S
C O M 0 ,C O M 1 ,C O M 2 *
A ll L C D
V A
d r iv e r o u tp u ts
" * " O m it th e C O M 2 s ig n a l, if th e 1 /2 d u ty L C D is u s e d .
V A = V L C D , V B = 1 /2 V L C D fo r H T 4 9 R 3 0 A -1 /H T 4 9 C 3 0 -1
V A = 2 V 2 , V B = V 2 , C ty p e fo r H T 4 9 C 3 0 L
LCD Driver Output (1/3 Duty, 1/2 Bias, R/C Type)
Rev. 2.10
20
July 30, 2012
HT49R30A-1/HT49C30-1/HT49C30L
V A
V B
C O M 0
V C
V S S
V A
V B
C O M 1
V C
V S S
V A
V B
C O M 2
V C
V S S
V A
V B
C O M 3
V C
V S S
V A
V B
L C D s e g m e n ts O N
C O M 2 s id e lig h te d
V C
V S S
N o te : 1 /4 d u ty , 1 /3 b ia s , C ty p e : " V A " 3 /2 V L C D , " V B " V L C D , " V C " 1 /2 V L C D
1 /4 d u ty , 1 /3 b ia s , R ty p e : " V A " V L C D , " V B " 2 /3 V L C D , " V C " 1 /3 V L C D
1 /3 b ia s o n ly fo r H T 4 9 R 3 0 A - 1 /H T 4 9 C 3 0 - 1
LCD Driver Output
Low Voltage Reset/Detector Functions for
HT49R30A-1/HT49C30-1
and read the LVD detector status (0/1) from RTCC.5;
otherwise, the LVD function is disabled.
There is a low voltage detector (LVD) and a low voltage
reset circuit (LVR) implemented in the microcontroller.
These two functions can be enabled/disabled by options. Once the options of LVD is enabled, the user can
use the RTCC.3 to enable/disable (1/0) the LVD circuit
The LVR has the same effect or function with the external RES signal which performs chip reset. During HALT
state, LVR is disabled.
The definitions of RTCC register are listed in the following table.
Bit No.
Label
Read/Write Reset
Function
0~2
RT0~RT2
R/W
111B
3
LVDC*
R/W
0
LVD enable/disable (1/0)
4
QOSC
R/W
0
32768Hz OSC quick start-up oscillating
0/1: quickly/slowly start
5
LVDO*
R
0
LVD detection output (1/0)
1: low voltage detected
6~7
¾
¾
¾
Unused bit, read as ²0²
8 to 1 multiplexer control inputs to select the real clock prescaler output
Note: ²*² For HT49R30A-1/HT49C30-1
RTCC (09H) Register
Rev. 2.10
21
July 30, 2012
HT49R30A-1/HT49C30-1/HT49C30L
Options
The following shows the options in the device. All these options should be defined in order to ensure proper functioning
system.
Options
OSC type selection.
This option is to determine whether an RC or crystal or 32768Hz crystal oscillator is chosen as system clock.
WDT Clock source selection.
RTC and Time Base. There are three types of selection: system clock/4 or RTC OSC or WDT OSC.
WDT enable/disable selection.
WDT can be enabled or disabled by options.
CLR WDT times selection.
This option defines how to clear the WDT by instruction. ²One time² means that the ²CLR WDT² can clear the WDT.
²Two times² means that if both of the ²CLR WDT1² and ²CLR WDT2² have been executed, only then will the WDT be
cleared.
Time Base time-out period selection.
The Time Base time-out period ranges from clock/212 to clock/215 ²Clock² means the clock source selected by options.
Buzzer output frequency selection.
There are eight types of frequency signals for buzzer output: Clock/22~Clock/29. ²Clock² means the clock source selected by options.
Wake-up selection.
This option defines the wake-up capability. External I/O pins (PA only) all have the capability to wake-up the chip
from a HALT by a falling edge.
Pull-high selection.
This option is to decide whether the pull-high resistance is visible or not on the PA0~PA3. (PB and PA4~PA7 are always pull-high)
PA0~PA3 CMOS or NMOS selection.
The structure of PA0~PA3 4 bits can be selected as CMOS or NMOS individually. When the CMOS is selected, the
related pins only can be used for output operations. When the NMOS is selected, the related pins can be used for input or output operations. (PA4~PA7 are always NMOS)
Clock source selection of timer/event counter.
There are two types of selection: system clock or system clock/4.
I/O pins share with other functions selection.
PA0/BZ, PA1/BZ: PA0 and PA1 can be set as I/O pins or buzzer outputs.
PA3/PFD: PA3 can be set as I/O pins or PFD output.
LCD common selection.
There are three types of selection: 2 common (1/2 duty) or 3 common (1/3 duty) or 4 common (1/4 duty). If the 4 common is selected, the segment output pin ²SEG18² will be set as a common output.
LCD bias power supply selection.
There are two types of selection: 1/2 bias or 1/3 bias for HT49R30A-1/HT49C30-1.
LCD bias type selection.
This option is to determine what kind of bias is selected, R type or C type for HT49R30A-1/HT49C30-1, C type for
HT49C30L.
LCD driver clock selection.
There are seven types of frequency signals for the LCD driver circuits: fS/22~fS/28.
²fS² means the clock source selection by options.
LCD ON/OFF at HALT selection
LVR selection.
LVR has enable or disable options for HT49R30A-1/HT49C30-1
LVD selection.
LVD has enable or disable options for HT49R30A-1/HT49C30-1
Rev. 2.10
22
July 30, 2012
HT49R30A-1/HT49C30-1/HT49C30L
Application Circuits
For HT49R30A-1/HT49C30-1 Application Circuit
V
D D
C O M 0 ~ C O M 3
S E G 0 ~ S E G 1 7
V D D
R e s e t
C ir c u it
1 0 0 k W
0 .1 m F
R E S
V L C D
L C D
P A N E L
L C D
P o w e r S u p p ly
C 1
0 .1 m F
0 .1 m F
V S S
0 .1 m F
0 .1 m F
O S C 4
O S C 2
P A 0 ~ P A 7
O S C
C 1
C 2
P B 0 ~ P B 5
fS
Y S
/4
O S C 1
O S C 2
IN T 1
O S C 2
T M R
R C S y s te m O s c illa to r
2 4 k W < R O S C < 1 M W
O S C 2
O S C 1
H T 4 9 R 3 0 A -1 /H T 4 9 C 3 0 -1
Note:
R
R 1
IN T 0
O S C 1
O S C 1
V 1
O S C 3
1 0 p F
O S C
C ir c u it
D D
4 7 0 p F
V 2
3 2 7 6 8 H z
V
C 2
O S C
C r y s ta l/R e s o n a to r
S y s te m O s c illa to r
F o r R 1 , C 1 , C 2 s e e n o te
3 2 7 6 8 H z C ry s ta l S y s te m
O s c illa to r
O S C 1 a n d O S C 2 le ft
u n c o n n e c te d
C ir c u it
1. Crystal/resonator system oscillators
For crystal oscillators, C1 and C2 are only required for some crystal frequencies to ensure oscillation. For
resonator applications C1 and C2 are normally required for oscillation to occur. For most applications it is
not necessary to add R1. However if the LVR function is disabled, and if it is required to stop the oscillator
when VDD falls below its operating range, it is recommended that R1 is added. The values of C1 and C2
should be selected in consultation with the crystal/resonator manufacturer specifications.
2. Reset circuit
The reset circuit resistance and capacitance values should be chosen to ensure that VDD is stable and remains within its operating voltage range before the RES pin reaches a high level. Ensure that the length of
the wiring connected to the RES pin is kept as short as possible, to avoid noise interference.
3. For applications where noise may interfere with the reset circuit and for details on the oscillator external
components, refer to Application Note HA0075E for more information.
Rev. 2.10
23
July 30, 2012
HT49R30A-1/HT49C30-1/HT49C30L
For HT49C30L Application Circuit
O S C 3
C O M 0 ~ C O M 3
S E G 0 ~ S E G 1 7
L C D
P A N E L
V
O S C 4
4 7 0 p F
V L C D
0 .1 m F
V
R
D D
0 .1 m F
1 0 0 k W
V
O S C 2
T M R
P B 0 ~ P B 5
C ry s ta l S y s te m
O s c illa to r
D D
O S C 1
P A 0 ~ P A 7
O s c illa to r
< 1 M W
O S C 2
IN T 0
IN T 1
S C
2 0 0 p F
0 .1 m F
V 2
/4
R C S y s te m
5 6 0 k W < R O
D D
O S C 1
V 1
0 .1 m F
Y S
O S C 1
2 0 0 p F
C 2
R E S
V
O S C
fS
C 1
O S C 2
H T 4 9 C 3 0 L
Note:
D D
O S C
3 2 7 6 8 H z C ry s ta l S y s te m
O s c illa to r
O S C 1 a n d O S C 2 le ft
u n c o n n e c te d
C ir c u it
The resistance and capacitance for reset circuit should be designed in such a way as to ensure that the VDD is
stable and remains within a valid operating voltage range before bringing RES to high.
Rev. 2.10
24
July 30, 2012
HT49R30A-1/HT49C30-1/HT49C30L
Instruction Set
subtract instruction mnemonics to enable the necessary
arithmetic to be carried out. Care must be taken to ensure correct handling of carry and borrow data when results exceed 255 for addition and less than 0 for
subtraction. The increment and decrement instructions
INC, INCA, DEC and DECA provide a simple means of
increasing or decreasing by a value of one of the values
in the destination specified.
Introduction
C e n t ra l t o t he s uc c es s f ul oper a t i on o f a n y
microcontroller is its instruction set, which is a set of program instruction codes that directs the microcontroller to
perform certain operations. In the case of Holtek
microcontrollers, a comprehensive and flexible set of
over 60 instructions is provided to enable programmers
to implement their application with the minimum of programming overheads.
Logical and Rotate Operations
For easier understanding of the various instruction
codes, they have been subdivided into several functional groupings.
The standard logical operations such as AND, OR, XOR
and CPL all have their own instruction within the Holtek
microcontroller instruction set. As with the case of most
instructions involving data manipulation, data must pass
through the Accumulator which may involve additional
programming steps. In all logical data operations, the
zero flag may be set if the result of the operation is zero.
Another form of logical data manipulation comes from
the rotate instructions such as RR, RL, RRC and RLC
which provide a simple means of rotating one bit right or
left. Different rotate instructions exist depending on program requirements. Rotate instructions are useful for
serial port programming applications where data can be
rotated from an internal register into the Carry bit from
where it can be examined and the necessary serial bit
set high or low. Another application where rotate data
operations are used is to implement multiplication and
division calculations.
Instruction Timing
Most instructions are implemented within one instruction cycle. The exceptions to this are branch, call, or table read instructions where two instruction cycles are
required. One instruction cycle is equal to 4 system
clock cycles, therefore in the case of an 8MHz system
oscillator, most instructions would be implemented
within 0.5ms and branch or call instructions would be implemented within 1ms. Although instructions which require one more cycle to implement are generally limited
to the JMP, CALL, RET, RETI and table read instructions, it is important to realize that any other instructions
which involve manipulation of the Program Counter Low
register or PCL will also take one more cycle to implement. As instructions which change the contents of the
PCL will imply a direct jump to that new address, one
more cycle will be required. Examples of such instructions would be ²CLR PCL² or ²MOV PCL, A². For the
case of skip instructions, it must be noted that if the result of the comparison involves a skip operation then
this will also take one more cycle, if no skip is involved
then only one cycle is required.
Branches and Control Transfer
Program branching takes the form of either jumps to
specified locations using the JMP instruction or to a subroutine using the CALL instruction. They differ in the
sense that in the case of a subroutine call, the program
must return to the instruction immediately when the subroutine has been carried out. This is done by placing a
return instruction RET in the subroutine which will cause
the program to jump back to the address right after the
CALL instruction. In the case of a JMP instruction, the
program simply jumps to the desired location. There is
no requirement to jump back to the original jumping off
point as in the case of the CALL instruction. One special
and extremely useful set of branch instructions are the
conditional branches. Here a decision is first made regarding the condition of a certain data memory or individual bits. Depending upon the conditions, the program
will continue with the next instruction or skip over it and
jump to the following instruction. These instructions are
the key to decision making and branching within the program perhaps determined by the condition of certain input switches or by the condition of internal data bits.
Moving and Transferring Data
The transfer of data within the microcontroller program
is one of the most frequently used operations. Making
use of three kinds of MOV instructions, data can be
transferred from registers to the Accumulator and
vice-versa as well as being able to move specific immediate data directly into the Accumulator. One of the most
important data transfer applications is to receive data
from the input ports and transfer data to the output ports.
Arithmetic Operations
The ability to perform certain arithmetic operations and
data manipulation is a necessary feature of most
microcontroller applications. Within the Holtek
microcontroller instruction set are a range of add and
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Bit Operations
Other Operations
The ability to provide single bit operations on Data Memory is an extremely flexible feature of all Holtek
microcontrollers. This feature is especially useful for
output port bit programming where individual bits or port
pins can be directly set high or low using either the ²SET
[m].i² or ²CLR [m].i² instructions respectively. The feature removes the need for programmers to first read the
8-bit output port, manipulate the input data to ensure
that other bits are not changed and then output the port
with the correct new data. This read-modify-write process is taken care of automatically when these bit operation instructions are used.
In addition to the above functional instructions, a range
of other instructions also exist such as the ²HALT² instruction for Power-down operations and instructions to
control the operation of the Watchdog Timer for reliable
program operations under extreme electric or electromagnetic environments. For their relevant operations,
refer to the functional related sections.
Instruction Set Summary
The following table depicts a summary of the instruction
set categorised according to function and can be consulted as a basic instruction reference using the following listed conventions.
Table Read Operations
Table conventions:
Data storage is normally implemented by using registers. However, when working with large amounts of
fixed data, the volume involved often makes it inconvenient to store the fixed data in the Data Memory. To overcome this problem, Holtek microcontrollers allow an
area of Program Memory to be setup as a table where
data can be directly stored. A set of easy to use instructions provides the means by which this fixed data can be
referenced and retrieved from the Program Memory.
Mnemonic
x: Bits immediate data
m: Data Memory address
A: Accumulator
i: 0~7 number of bits
addr: Program memory address
Description
Cycles
Flag Affected
1
1Note
1
1
1Note
1
1
1Note
1
1Note
1Note
Z, C, AC, OV
Z, C, AC, OV
Z, C, AC, OV
Z, C, AC, OV
Z, C, AC, OV
Z, C, AC, OV
Z, C, AC, OV
Z, C, AC, OV
Z, C, AC, OV
Z, C, AC, OV
C
1
1
1
1Note
1Note
1Note
1
1
1
1Note
1
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
1
1Note
1
1Note
Z
Z
Z
Z
Arithmetic
ADD A,[m]
ADDM A,[m]
ADD A,x
ADC A,[m]
ADCM A,[m]
SUB A,x
SUB A,[m]
SUBM A,[m]
SBC A,[m]
SBCM A,[m]
DAA [m]
Add Data Memory to ACC
Add ACC to Data Memory
Add immediate data to ACC
Add Data Memory to ACC with Carry
Add ACC to Data memory with Carry
Subtract immediate data from the ACC
Subtract Data Memory from ACC
Subtract Data Memory from ACC with result in Data Memory
Subtract Data Memory from ACC with Carry
Subtract Data Memory from ACC with Carry, result in Data Memory
Decimal adjust ACC for Addition with result in Data Memory
Logic Operation
AND A,[m]
OR A,[m]
XOR A,[m]
ANDM A,[m]
ORM A,[m]
XORM A,[m]
AND A,x
OR A,x
XOR A,x
CPL [m]
CPLA [m]
Logical AND Data Memory to ACC
Logical OR Data Memory to ACC
Logical XOR Data Memory to ACC
Logical AND ACC to Data Memory
Logical OR ACC to Data Memory
Logical XOR ACC to Data Memory
Logical AND immediate Data to ACC
Logical OR immediate Data to ACC
Logical XOR immediate Data to ACC
Complement Data Memory
Complement Data Memory with result in ACC
Increment & Decrement
INCA [m]
INC [m]
DECA [m]
DEC [m]
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Increment Data Memory with result in ACC
Increment Data Memory
Decrement Data Memory with result in ACC
Decrement Data Memory
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Mnemonic
Description
Cycles
Flag Affected
Rotate Data Memory right with result in ACC
Rotate Data Memory right
Rotate Data Memory right through Carry with result in ACC
Rotate Data Memory right through Carry
Rotate Data Memory left with result in ACC
Rotate Data Memory left
Rotate Data Memory left through Carry with result in ACC
Rotate Data Memory left through Carry
1
1Note
1
1Note
1
1Note
1
1Note
None
None
C
C
None
None
C
C
Move Data Memory to ACC
Move ACC to Data Memory
Move immediate data to ACC
1
1Note
1
None
None
None
Clear bit of Data Memory
Set bit of Data Memory
1Note
1Note
None
None
Jump unconditionally
Skip if Data Memory is zero
Skip if Data Memory is zero with data movement to ACC
Skip if bit i of Data Memory is zero
Skip if bit i of Data Memory is not zero
Skip if increment Data Memory is zero
Skip if decrement Data Memory is zero
Skip if increment Data Memory is zero with result in ACC
Skip if decrement Data Memory is zero with result in ACC
Subroutine call
Return from subroutine
Return from subroutine and load immediate data to ACC
Return from interrupt
2
1Note
1note
1Note
1Note
1Note
1Note
1Note
1Note
2
2
2
2
None
None
None
None
None
None
None
None
None
None
None
None
None
Read table (current page) to TBLH and Data Memory
Read table (last page) to TBLH and Data Memory
2Note
2Note
None
None
No operation
Clear Data Memory
Set Data Memory
Clear Watchdog Timer
Pre-clear Watchdog Timer
Pre-clear Watchdog Timer
Swap nibbles of Data Memory
Swap nibbles of Data Memory with result in ACC
Enter power down mode
1
1Note
1Note
1
1
1
1Note
1
1
None
None
None
TO, PDF
TO, PDF
TO, PDF
None
None
TO, PDF
Rotate
RRA [m]
RR [m]
RRCA [m]
RRC [m]
RLA [m]
RL [m]
RLCA [m]
RLC [m]
Data Move
MOV A,[m]
MOV [m],A
MOV A,x
Bit Operation
CLR [m].i
SET [m].i
Branch
JMP addr
SZ [m]
SZA [m]
SZ [m].i
SNZ [m].i
SIZ [m]
SDZ [m]
SIZA [m]
SDZA [m]
CALL addr
RET
RET A,x
RETI
Table Read
TABRDC [m]
TABRDL [m]
Miscellaneous
NOP
CLR [m]
SET [m]
CLR WDT
CLR WDT1
CLR WDT2
SWAP [m]
SWAPA [m]
HALT
Note:
1. For skip instructions, if the result of the comparison involves a skip then two cycles are required,
if no skip takes place only one cycle is required.
2. Any instruction which changes the contents of the PCL will also require 2 cycles for execution.
3. For the ²CLR WDT1² and ²CLR WDT2² instructions the TO and PDF flags may be affected by
the execution status. The TO and PDF flags are cleared after both ²CLR WDT1² and
²CLR WDT2² instructions are consecutively executed. Otherwise the TO and PDF flags
remain unchanged.
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Instruction Definition
ADC A,[m]
Add Data Memory to ACC with Carry
Description
The contents of the specified Data Memory, Accumulator and the carry flag are added. The
result is stored in the Accumulator.
Operation
ACC ¬ ACC + [m] + C
Affected flag(s)
OV, Z, AC, C
ADCM A,[m]
Add ACC to Data Memory with Carry
Description
The contents of the specified Data Memory, Accumulator and the carry flag are added. The
result is stored in the specified Data Memory.
Operation
[m] ¬ ACC + [m] + C
Affected flag(s)
OV, Z, AC, C
ADD A,[m]
Add Data Memory to ACC
Description
The contents of the specified Data Memory and the Accumulator are added. The result is
stored in the Accumulator.
Operation
ACC ¬ ACC + [m]
Affected flag(s)
OV, Z, AC, C
ADD A,x
Add immediate data to ACC
Description
The contents of the Accumulator and the specified immediate data are added. The result is
stored in the Accumulator.
Operation
ACC ¬ ACC + x
Affected flag(s)
OV, Z, AC, C
ADDM A,[m]
Add ACC to Data Memory
Description
The contents of the specified Data Memory and the Accumulator are added. The result is
stored in the specified Data Memory.
Operation
[m] ¬ ACC + [m]
Affected flag(s)
OV, Z, AC, C
AND A,[m]
Logical AND Data Memory to ACC
Description
Data in the Accumulator and the specified Data Memory perform a bitwise logical AND operation. The result is stored in the Accumulator.
Operation
ACC ¬ ACC ²AND² [m]
Affected flag(s)
Z
AND A,x
Logical AND immediate data to ACC
Description
Data in the Accumulator and the specified immediate data perform a bitwise logical AND
operation. The result is stored in the Accumulator.
Operation
ACC ¬ ACC ²AND² x
Affected flag(s)
Z
ANDM A,[m]
Logical AND ACC to Data Memory
Description
Data in the specified Data Memory and the Accumulator perform a bitwise logical AND operation. The result is stored in the Data Memory.
Operation
[m] ¬ ACC ²AND² [m]
Affected flag(s)
Z
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CALL addr
Subroutine call
Description
Unconditionally calls a subroutine at the specified address. The Program Counter then increments by 1 to obtain the address of the next instruction which is then pushed onto the
stack. The specified address is then loaded and the program continues execution from this
new address. As this instruction requires an additional operation, it is a two cycle instruction.
Operation
Stack ¬ Program Counter + 1
Program Counter ¬ addr
Affected flag(s)
None
CLR [m]
Clear Data Memory
Description
Each bit of the specified Data Memory is cleared to 0.
Operation
[m] ¬ 00H
Affected flag(s)
None
CLR [m].i
Clear bit of Data Memory
Description
Bit i of the specified Data Memory is cleared to 0.
Operation
[m].i ¬ 0
Affected flag(s)
None
CLR WDT
Clear Watchdog Timer
Description
The TO, PDF flags and the WDT are all cleared.
Operation
WDT cleared
TO ¬ 0
PDF ¬ 0
Affected flag(s)
TO, PDF
CLR WDT1
Pre-clear Watchdog Timer
Description
The TO, PDF flags and the WDT are all cleared. Note that this instruction works in conjunction with CLR WDT2 and must be executed alternately with CLR WDT2 to have effect. Repetitively executing this instruction without alternately executing CLR WDT2 will have no
effect.
Operation
WDT cleared
TO ¬ 0
PDF ¬ 0
Affected flag(s)
TO, PDF
CLR WDT2
Pre-clear Watchdog Timer
Description
The TO, PDF flags and the WDT are all cleared. Note that this instruction works in conjunction with CLR WDT1 and must be executed alternately with CLR WDT1 to have effect. Repetitively executing this instruction without alternately executing CLR WDT1 will have no
effect.
Operation
WDT cleared
TO ¬ 0
PDF ¬ 0
Affected flag(s)
TO, PDF
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CPL [m]
Complement Data Memory
Description
Each bit of the specified Data Memory is logically complemented (1¢s complement). Bits
which previously contained a 1 are changed to 0 and vice versa.
Operation
[m] ¬ [m]
Affected flag(s)
Z
CPLA [m]
Complement Data Memory with result in ACC
Description
Each bit of the specified Data Memory is logically complemented (1¢s complement). Bits
which previously contained a 1 are changed to 0 and vice versa. The complemented result
is stored in the Accumulator and the contents of the Data Memory remain unchanged.
Operation
ACC ¬ [m]
Affected flag(s)
Z
DAA [m]
Decimal-Adjust ACC for addition with result in Data Memory
Description
Convert the contents of the Accumulator value to a BCD ( Binary Coded Decimal) value resulting from the previous addition of two BCD variables. If the low nibble is greater than 9 or
if AC flag is set, then a value of 6 will be added to the low nibble. Otherwise the low nibble
remains unchanged. If the high nibble is greater than 9 or if the C flag is set, then a value of
6 will be added to the high nibble. Essentially, the decimal conversion is performed by adding 00H, 06H, 60H or 66H depending on the Accumulator and flag conditions. Only the C
flag may be affected by this instruction which indicates that if the original BCD sum is
greater than 100, it allows multiple precision decimal addition.
Operation
[m] ¬ ACC + 00H or
[m] ¬ ACC + 06H or
[m] ¬ ACC + 60H or
[m] ¬ ACC + 66H
Affected flag(s)
C
DEC [m]
Decrement Data Memory
Description
Data in the specified Data Memory is decremented by 1.
Operation
[m] ¬ [m] - 1
Affected flag(s)
Z
DECA [m]
Decrement Data Memory with result in ACC
Description
Data in the specified Data Memory is decremented by 1. The result is stored in the Accumulator. The contents of the Data Memory remain unchanged.
Operation
ACC ¬ [m] - 1
Affected flag(s)
Z
HALT
Enter power down mode
Description
This instruction stops the program execution and turns off the system clock. The contents
of the Data Memory and registers are retained. The WDT and prescaler are cleared. The
power down flag PDF is set and the WDT time-out flag TO is cleared.
Operation
TO ¬ 0
PDF ¬ 1
Affected flag(s)
TO, PDF
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INC [m]
Increment Data Memory
Description
Data in the specified Data Memory is incremented by 1.
Operation
[m] ¬ [m] + 1
Affected flag(s)
Z
INCA [m]
Increment Data Memory with result in ACC
Description
Data in the specified Data Memory is incremented by 1. The result is stored in the Accumulator. The contents of the Data Memory remain unchanged.
Operation
ACC ¬ [m] + 1
Affected flag(s)
Z
JMP addr
Jump unconditionally
Description
The contents of the Program Counter are replaced with the specified address. Program
execution then continues from this new address. As this requires the insertion of a dummy
instruction while the new address is loaded, it is a two cycle instruction.
Operation
Program Counter ¬ addr
Affected flag(s)
None
MOV A,[m]
Move Data Memory to ACC
Description
The contents of the specified Data Memory are copied to the Accumulator.
Operation
ACC ¬ [m]
Affected flag(s)
None
MOV A,x
Move immediate data to ACC
Description
The immediate data specified is loaded into the Accumulator.
Operation
ACC ¬ x
Affected flag(s)
None
MOV [m],A
Move ACC to Data Memory
Description
The contents of the Accumulator are copied to the specified Data Memory.
Operation
[m] ¬ ACC
Affected flag(s)
None
NOP
No operation
Description
No operation is performed. Execution continues with the next instruction.
Operation
No operation
Affected flag(s)
None
OR A,[m]
Logical OR Data Memory to ACC
Description
Data in the Accumulator and the specified Data Memory perform a bitwise logical OR operation. The result is stored in the Accumulator.
Operation
ACC ¬ ACC ²OR² [m]
Affected flag(s)
Z
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OR A,x
Logical OR immediate data to ACC
Description
Data in the Accumulator and the specified immediate data perform a bitwise logical OR operation. The result is stored in the Accumulator.
Operation
ACC ¬ ACC ²OR² x
Affected flag(s)
Z
ORM A,[m]
Logical OR ACC to Data Memory
Description
Data in the specified Data Memory and the Accumulator perform a bitwise logical OR operation. The result is stored in the Data Memory.
Operation
[m] ¬ ACC ²OR² [m]
Affected flag(s)
Z
RET
Return from subroutine
Description
The Program Counter is restored from the stack. Program execution continues at the restored address.
Operation
Program Counter ¬ Stack
Affected flag(s)
None
RET A,x
Return from subroutine and load immediate data to ACC
Description
The Program Counter is restored from the stack and the Accumulator loaded with the
specified immediate data. Program execution continues at the restored address.
Operation
Program Counter ¬ Stack
ACC ¬ x
Affected flag(s)
None
RETI
Return from interrupt
Description
The Program Counter is restored from the stack and the interrupts are re-enabled by setting the EMI bit. EMI is the master interrupt global enable bit. If an interrupt was pending
when the RETI instruction is executed, the pending Interrupt routine will be processed before returning to the main program.
Operation
Program Counter ¬ Stack
EMI ¬ 1
Affected flag(s)
None
RL [m]
Rotate Data Memory left
Description
The contents of the specified Data Memory are rotated left by 1 bit with bit 7 rotated into bit
0.
Operation
[m].(i+1) ¬ [m].i; (i = 0~6)
[m].0 ¬ [m].7
Affected flag(s)
None
RLA [m]
Rotate Data Memory left with result in ACC
Description
The contents of the specified Data Memory are rotated left by 1 bit with bit 7 rotated into bit
0. The rotated result is stored in the Accumulator and the contents of the Data Memory remain unchanged.
Operation
ACC.(i+1) ¬ [m].i; (i = 0~6)
ACC.0 ¬ [m].7
Affected flag(s)
None
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RLC [m]
Rotate Data Memory left through Carry
Description
The contents of the specified Data Memory and the carry flag are rotated left by 1 bit. Bit 7
replaces the Carry bit and the original carry flag is rotated into bit 0.
Operation
[m].(i+1) ¬ [m].i; (i = 0~6)
[m].0 ¬ C
C ¬ [m].7
Affected flag(s)
C
RLCA [m]
Rotate Data Memory left through Carry with result in ACC
Description
Data in the specified Data Memory and the carry flag are rotated left by 1 bit. Bit 7 replaces
the Carry bit and the original carry flag is rotated into the bit 0. The rotated result is stored in
the Accumulator and the contents of the Data Memory remain unchanged.
Operation
ACC.(i+1) ¬ [m].i; (i = 0~6)
ACC.0 ¬ C
C ¬ [m].7
Affected flag(s)
C
RR [m]
Rotate Data Memory right
Description
The contents of the specified Data Memory are rotated right by 1 bit with bit 0 rotated into
bit 7.
Operation
[m].i ¬ [m].(i+1); (i = 0~6)
[m].7 ¬ [m].0
Affected flag(s)
None
RRA [m]
Rotate Data Memory right with result in ACC
Description
Data in the specified Data Memory and the carry flag are rotated right by 1 bit with bit 0 rotated into bit 7. The rotated result is stored in the Accumulator and the contents of the Data
Memory remain unchanged.
Operation
ACC.i ¬ [m].(i+1); (i = 0~6)
ACC.7 ¬ [m].0
Affected flag(s)
None
RRC [m]
Rotate Data Memory right through Carry
Description
The contents of the specified Data Memory and the carry flag are rotated right by 1 bit. Bit 0
replaces the Carry bit and the original carry flag is rotated into bit 7.
Operation
[m].i ¬ [m].(i+1); (i = 0~6)
[m].7 ¬ C
C ¬ [m].0
Affected flag(s)
C
RRCA [m]
Rotate Data Memory right through Carry with result in ACC
Description
Data in the specified Data Memory and the carry flag are rotated right by 1 bit. Bit 0 replaces the Carry bit and the original carry flag is rotated into bit 7. The rotated result is
stored in the Accumulator and the contents of the Data Memory remain unchanged.
Operation
ACC.i ¬ [m].(i+1); (i = 0~6)
ACC.7 ¬ C
C ¬ [m].0
Affected flag(s)
C
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SBC A,[m]
Subtract Data Memory from ACC with Carry
Description
The contents of the specified Data Memory and the complement of the carry flag are subtracted from the Accumulator. The result is stored in the Accumulator. Note that if the result
of subtraction is negative, the C flag will be cleared to 0, otherwise if the result is positive or
zero, the C flag will be set to 1.
Operation
ACC ¬ ACC - [m] - C
Affected flag(s)
OV, Z, AC, C
SBCM A,[m]
Subtract Data Memory from ACC with Carry and result in Data Memory
Description
The contents of the specified Data Memory and the complement of the carry flag are subtracted from the Accumulator. The result is stored in the Data Memory. Note that if the result of subtraction is negative, the C flag will be cleared to 0, otherwise if the result is
positive or zero, the C flag will be set to 1.
Operation
[m] ¬ ACC - [m] - C
Affected flag(s)
OV, Z, AC, C
SDZ [m]
Skip if decrement Data Memory is 0
Description
The contents of the specified Data Memory are first decremented by 1. If the result is 0 the
following instruction is skipped. As this requires the insertion of a dummy instruction while
the next instruction is fetched, it is a two cycle instruction. If the result is not 0 the program
proceeds with the following instruction.
Operation
[m] ¬ [m] - 1
Skip if [m] = 0
Affected flag(s)
None
SDZA [m]
Skip if decrement Data Memory is zero with result in ACC
Description
The contents of the specified Data Memory are first decremented by 1. If the result is 0, the
following instruction is skipped. The result is stored in the Accumulator but the specified
Data Memory contents remain unchanged. As this requires the insertion of a dummy instruction while the next instruction is fetched, it is a two cycle instruction. If the result is not
0, the program proceeds with the following instruction.
Operation
ACC ¬ [m] - 1
Skip if ACC = 0
Affected flag(s)
None
SET [m]
Set Data Memory
Description
Each bit of the specified Data Memory is set to 1.
Operation
[m] ¬ FFH
Affected flag(s)
None
SET [m].i
Set bit of Data Memory
Description
Bit i of the specified Data Memory is set to 1.
Operation
[m].i ¬ 1
Affected flag(s)
None
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SIZ [m]
Skip if increment Data Memory is 0
Description
The contents of the specified Data Memory are first incremented by 1. If the result is 0, the
following instruction is skipped. As this requires the insertion of a dummy instruction while
the next instruction is fetched, it is a two cycle instruction. If the result is not 0 the program
proceeds with the following instruction.
Operation
[m] ¬ [m] + 1
Skip if [m] = 0
Affected flag(s)
None
SIZA [m]
Skip if increment Data Memory is zero with result in ACC
Description
The contents of the specified Data Memory are first incremented by 1. If the result is 0, the
following instruction is skipped. The result is stored in the Accumulator but the specified
Data Memory contents remain unchanged. As this requires the insertion of a dummy instruction while the next instruction is fetched, it is a two cycle instruction. If the result is not
0 the program proceeds with the following instruction.
Operation
ACC ¬ [m] + 1
Skip if ACC = 0
Affected flag(s)
None
SNZ [m].i
Skip if bit i of Data Memory is not 0
Description
If bit i of the specified Data Memory is not 0, the following instruction is skipped. As this requires the insertion of a dummy instruction while the next instruction is fetched, it is a two
cycle instruction. If the result is 0 the program proceeds with the following instruction.
Operation
Skip if [m].i ¹ 0
Affected flag(s)
None
SUB A,[m]
Subtract Data Memory from ACC
Description
The specified Data Memory is subtracted from the contents of the Accumulator. The result
is stored in the Accumulator. Note that if the result of subtraction is negative, the C flag will
be cleared to 0, otherwise if the result is positive or zero, the C flag will be set to 1.
Operation
ACC ¬ ACC - [m]
Affected flag(s)
OV, Z, AC, C
SUBM A,[m]
Subtract Data Memory from ACC with result in Data Memory
Description
The specified Data Memory is subtracted from the contents of the Accumulator. The result
is stored in the Data Memory. Note that if the result of subtraction is negative, the C flag will
be cleared to 0, otherwise if the result is positive or zero, the C flag will be set to 1.
Operation
[m] ¬ ACC - [m]
Affected flag(s)
OV, Z, AC, C
SUB A,x
Subtract immediate data from ACC
Description
The immediate data specified by the code is subtracted from the contents of the Accumulator. The result is stored in the Accumulator. Note that if the result of subtraction is negative, the C flag will be cleared to 0, otherwise if the result is positive or zero, the C flag will
be set to 1.
Operation
ACC ¬ ACC - x
Affected flag(s)
OV, Z, AC, C
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SWAP [m]
Swap nibbles of Data Memory
Description
The low-order and high-order nibbles of the specified Data Memory are interchanged.
Operation
[m].3~[m].0 « [m].7 ~ [m].4
Affected flag(s)
None
SWAPA [m]
Swap nibbles of Data Memory with result in ACC
Description
The low-order and high-order nibbles of the specified Data Memory are interchanged. The
result is stored in the Accumulator. The contents of the Data Memory remain unchanged.
Operation
ACC.3 ~ ACC.0 ¬ [m].7 ~ [m].4
ACC.7 ~ ACC.4 ¬ [m].3 ~ [m].0
Affected flag(s)
None
SZ [m]
Skip if Data Memory is 0
Description
If the contents of the specified Data Memory is 0, the following instruction is skipped. As
this requires the insertion of a dummy instruction while the next instruction is fetched, it is a
two cycle instruction. If the result is not 0 the program proceeds with the following instruction.
Operation
Skip if [m] = 0
Affected flag(s)
None
SZA [m]
Skip if Data Memory is 0 with data movement to ACC
Description
The contents of the specified Data Memory are copied to the Accumulator. If the value is
zero, the following instruction is skipped. As this requires the insertion of a dummy instruction while the next instruction is fetched, it is a two cycle instruction. If the result is not 0 the
program proceeds with the following instruction.
Operation
ACC ¬ [m]
Skip if [m] = 0
Affected flag(s)
None
SZ [m].i
Skip if bit i of Data Memory is 0
Description
If bit i of the specified Data Memory is 0, the following instruction is skipped. As this requires the insertion of a dummy instruction while the next instruction is fetched, it is a two
cycle instruction. If the result is not 0, the program proceeds with the following instruction.
Operation
Skip if [m].i = 0
Affected flag(s)
None
TABRDC [m]
Read table (current page) to TBLH and Data Memory
Description
The low byte of the program code (current page) addressed by the table pointer (TBLP) is
moved to the specified Data Memory and the high byte moved to TBLH.
Operation
[m] ¬ program code (low byte)
TBLH ¬ program code (high byte)
Affected flag(s)
None
TABRDL [m]
Read table (last page) to TBLH and Data Memory
Description
The low byte of the program code (last page) addressed by the table pointer (TBLP) is
moved to the specified Data Memory and the high byte moved to TBLH.
Operation
[m] ¬ program code (low byte)
TBLH ¬ program code (high byte)
Affected flag(s)
None
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HT49R30A-1/HT49C30-1/HT49C30L
XOR A,[m]
Logical XOR Data Memory to ACC
Description
Data in the Accumulator and the specified Data Memory perform a bitwise logical XOR operation. The result is stored in the Accumulator.
Operation
ACC ¬ ACC ²XOR² [m]
Affected flag(s)
Z
XORM A,[m]
Logical XOR ACC to Data Memory
Description
Data in the specified Data Memory and the Accumulator perform a bitwise logical XOR operation. The result is stored in the Data Memory.
Operation
[m] ¬ ACC ²XOR² [m]
Affected flag(s)
Z
XOR A,x
Logical XOR immediate data to ACC
Description
Data in the Accumulator and the specified immediate data perform a bitwise logical XOR
operation. The result is stored in the Accumulator.
Operation
ACC ¬ ACC ²XOR² x
Affected flag(s)
Z
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HT49R30A-1/HT49C30-1/HT49C30L
Package Information
Note that the package information provided here is for consultation purposes only. As this information may be updated at regular intervals users are reminded to consult the Holtek website (http://www.holtek.com.tw/english/literature/package.pdf) for
the latest version of the package information.
48-pin SSOP (300mil) Outline Dimensions
4 8
2 5
A
B
1
2 4
C
C '
G
H
D
E
Symbol
A
F
Dimensions in inch
Min.
Nom.
Max.
0.395
¾
0.420
B
0.291
¾
0.299
C
0.008
¾
0.012
C¢
0.613
¾
0.637
D
0.085
¾
0.099
E
¾
0.025
¾
F
0.004
¾
0.010
G
0.025
¾
0.035
H
0.004
¾
0.012
a
0°
¾
8°
Symbol
Rev. 2.10
a
Dimensions in mm
Min.
Nom.
Max.
A
10.03
¾
10.67
B
7.39
¾
7.59
C
0.20
¾
0.30
C¢
15.57
¾
16.18
D
2.16
¾
2.51
E
¾
0.64
¾
F
0.10
¾
0.25
G
0.64
¾
0.89
H
0.10
¾
0.30
a
0°
¾
8°
38
July 30, 2012
HT49R30A-1/HT49C30-1/HT49C30L
Product Tape and Reel Specifications
Reel Dimensions
D
T 2
A
C
B
T 1
SSOP 48W
Symbol
Description
Dimensions in mm
A
Reel Outer Diameter
330.0±1.0
B
Reel Inner Diameter
100.0±0.1
C
Spindle Hole Diameter
D
Key Slit Width
T1
Space Between Flange
T2
Reel Thickness
Rev. 2.10
13.0
+0.5/-0.2
2.0±0.5
32.2
+0.3/-0.2
38.2±0.2
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HT49R30A-1/HT49C30-1/HT49C30L
Carrier Tape Dimensions
P 0
D
P 1
t
E
F
W
D 1
C
B 0
K 1
P
K 2
A 0
R e e l H o le ( C ir c le )
IC
p a c k a g e p in 1 a n d th e r e e l h o le s
a r e lo c a te d o n th e s a m e s id e .
R e e l H o le ( E llip s e )
SSOP 48W
Symbol
Description
Dimensions in mm
W
Carrier Tape Width
32.0±0.3
P
Cavity Pitch
16.0±0.1
E
Perforation Position
1.75±0.10
F
Cavity to Perforation (Width Direction)
14.2±0.1
D
Perforation Diameter
1.50
+0.10/-0.00
D1
Cavity Hole Diameter
1.50
+0.25/-0.00
P0
Perforation Pitch
4.0±0.1
P1
Cavity to Perforation (Length Direction)
2.0±0.1
A0
Cavity Length
10.9±0.1
B0
Cavity Width
16.2±0.1
K1
Cavity Depth
2.4±0.1
K2
Cavity Depth
3.2±0.1
t
Carrier Tape Thickness
0.35±0.05
C
Cover Tape Width
25.5±0.1
Rev. 2.10
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HT49R30A-1/HT49C30-1/HT49C30L
Holtek Semiconductor Inc. (Headquarters)
No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan
Tel: 886-3-563-1999
Fax: 886-3-563-1189
http://www.holtek.com.tw
Holtek Semiconductor Inc. (Taipei Sales Office)
4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan
Tel: 886-2-2655-7070
Fax: 886-2-2655-7373
Fax: 886-2-2655-7383 (International sales hotline)
Holtek Semiconductor Inc. (Shenzhen Sales Office)
5F, Unit A, Productivity Building, No.5 Gaoxin M 2nd Road, Nanshan District, Shenzhen, China 518057
Tel: 86-755-8616-9908, 86-755-8616-9308
Fax: 86-755-8616-9722
Holtek Semiconductor (USA), Inc. (North America Sales Office)
46729 Fremont Blvd., Fremont, CA 94538, USA
Tel: 1-510-252-9880
Fax: 1-510-252-9885
http://www.holtek.com
Copyright Ó 2012 by HOLTEK SEMICONDUCTOR INC.
The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used
solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable
without further modification, nor recommends the use of its products for application that may present a risk to human life
due to malfunction or otherwise. Holtek¢s products are not authorized for use as critical components in life support devices
or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information,
please visit our web site at http://www.holtek.com.tw.
Rev. 2.10
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July 30, 2012