HOLTIC HI-8597

HI-8597
3.3V Single-Rail ARINC 429 Differential Line Driver
with Integrated DO-160G Level 3 Lightning Protection
July 2013
GENERAL DESCRIPTION
FEATURES
The HI-8597 is a 3.3V single supply ARINC 429 line driver
with built-in lightning protection. The internal lightning
protection circuitry allows compliance with RTCA/DO160G, Section 22 Level 3 Pin Injection Test Waveform
Set A (3 & 4), Set B (3 & 5A) and Set Z (3 & 5B) without
the use of any external components, an industry first.
Pin surge levels for Level 3 are summarized as follows:
Waveform
3
Waveform
4
Waveform
5A
Waveform
5B
Voc/Isc
Voc/Isc
Voc/Isc
Voc/Isc
600V/24A
300V/60A
300V/300A
300V/300A
An internal 37.5 Ohm resistor on each output enables
direct connection to the ARINC 429 bus.
In addition, the device includes a dual polarity voltage
doubler, allowing it to operate from a single +3.3V supply
using only four external capacitors.
• Internal lightning protection circuitry allows
compliance with RTCA/DO-160G, Section 22
Level 3 Pin Injection Test Waveform Set A (3 &
4), Set B (3 & 5A) and Set Z (3 & 5B).
• Operates from a single +3.3V supply
• Superb short circuit capability on ARINC 429
outputs (±50V for 1 second)
• All ARINC 429 voltage levels generated on-chip
• Digitally selectable rise and fall times
• Tri-state Outputs
• 37.5 Ohm output resistance allows direct
connection to ARINC 429 bus
• Industrial and Extended temperature ranges
• Burn-in available
PIN CONFIGURATION (TOP VIEW)
Other features include high-impedance outputs (tristate) when both data inputs are taken high, allowing
multiple line drivers to be connected to a common bus.
NC 1
Bus pins feature built-in 8kV ESD input protection (HBM),
with 6kV capability on all other pins. All logic inputs are
5V or 3.3V compatible.
o
DS8597 Rev. F.
15 CN+
TXAOUT 3
14 CN-
HI-8597PSIF
HI-8597PSTF
TXBOUT 4
GNDB 5
SLP 6
The HI-8597 line driver is intended for use where logic
signals must be converted to ARINC 429 levels such as
when using an FPGA or the HI-3586 ARINC 429 protocol
IC. The single supply operation and internal lightning
protection circuitry enable huge board space saving,
making HI-8597 the most compact, cost effective ARINC
429 line driver on the market today.
13 GND
12 VDD
11 CP-
TX0IN 7
10 CP+
TX1IN 8
9 VDD2+
16-Pin Plastic ESOIC package
(Wide Body)
Table 1. Function Table
o
The part is available in Industrial -40 C to +85 C, or
o
o
Extended, -55 C to +125 C temperature ranges. Optional
burn-in is available on the extended temperature range.
16 VDD2-
GNDA 2
TX1IN
TX0IN
SLP
TXAOUT
TXBOUT
SLOPE
0
0
X
0V
0V
N/A
0
1
0
-5V
5V
10μs
0
1
1
-5V
5V
1.5μs
1
0
0
5V
-5V
10μs
1
0
1
5V
-5V
1.5μs
1
1
X
Hi-Z
Hi-Z
N/A
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www.holtic.com
1
07/13
HI-8597
BLOCK DIAGRAM
VDD
CSUPPLY
3.3V
SLP
TX0IN
VDD2+
5V
ONE
ESD
PROTECTION
& VOLTAGE
TRANSLATION
CURRENT
CONTROL
NULL
“A” SIDE
Lightning
Protection
ZERO
TX1IN
CONTROL
LOGIC
VDD2+
-5V
CURRENT
CONTROL
NULL
“B” SIDE
VDD
TXBOUT
-5V
Lightning
Protection
CN+
CFLY
GNDB
VDD2+
VDD2+
CP+
CFLY
CP-
GNDA
37.5 OHMS
ZERO
CONTROL
LOGIC
TXAOUT
5V
ONE
GND
37.5 OHMS
Dual Polarity
Voltage Doubler
COUT
VDD2-
VDD2-
CN-
COUT
Figure 1. HI-8597 Block Diagram
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HI-8597
PIN DESCRIPTIONS
Table 2. Pin Descriptions
Pin No.
Pin Name
Function
Description
1
NC
None
No connect.
2
GNDA
POWER
Ground connection of internal lightning protection circuitry for ARINC
high output. MUST be tied to chip ground pin, GND.
3
TXAOUT
OUTPUT
ARINC high output with 37.5 Ohms series resistance
4
TXBOUT
OUTPUT
ARINC low output with 37.5 Ohms series resistance
5
GNDB
POWER
Ground connection of internal lightning protection circuitry for ARINC
low output. MUST be tied to chip ground pin, GND.
6
SLP
INPUT
Output slew rate control. High selects ARINC 429 high-speed. Low
selects ARINC 429 low-speed.
7
TX0IN
INPUT
Data input zero
8
TX1IN
INPUT
Data input one
9
VDD2+
OUTPUT
Voltage doubler positive output (~6.25V for 3.3V supply)
10
CP+
ANALOG
VDD2+ flyback capacitor, CFLY; positive terminal
11
CP-
ANALOG
VDD2+ flyback capacitor, CFLY; negative terminal
12
VDD
POWER
+3.3V power supply
13
GND
POWER
Ground supply
14
CN-
ANALOG
VDD2- flyback capacitor, CFLY; negative terminal
15
CN+
ANALOG
VDD2- flyback capacitor, CFLY; positive terminal
16
VDD2-
OUTPUT
Voltage doubler negative output (~ -6.1V for 3.3V supply)
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HI-8597
FUNCTIONAL DESCRIPTION
Figure 1 shows a block diagram of the line driver. The
HI-8597 is internally lightning protected in compliance
with RTCA/DO-160G, Section 22 Level 3 Pin Injection
Test Waveform Set A (3 & 4), Set B (3 & 5A) and Set Z
(3 & 5B). The waveforms are shown in Figure 5 through
Figure 7. The device requires only a single +3.3V power
supply. An integrated inverting / non-inverting voltage
doubler generates the rail voltages (±6.6V) which are
then used to produce the ±5V ARINC-429 output levels.
The internal dual polarity charge pump circuit requires
four external capacitors, two for each polarity generated
by the doubler. CP+ and CP- connect the external
charge transfer or “fly” capacitor, CFLY, to the positive
portion of the doubler, resulting in twice VDD at the VDD2+
pin. An output “hold” capacitor, COUT, is placed between
VDD2+ and GND. COUT should be ten times the size of CFLY.
The inverting or negative portion of the converter works
in a similar fashion, with CFLY and COUT placed between
CN+ / CN- and VDD2- / GND respectively.
Currents for slope control are set by on-chip resistors.
at Ground until one of the inputs becomes a One. If for
example TX1IN goes high, a charging path is enabled to
5V on an “A” side internal capacitor while the “B” side is
enabled to -5V. The charging current is selected by the
SLP pin. If the SLP pin is high, the capacitor is nominally
charged from 10% to 90% in 1.5μs. If SLP is low, the
rise and fall times are 10μs.
A unity gain buffer receives the internally generated
slopes and differentially drives the ARINC line. Current is
limited by the series output resistors at each pin. There
are no fuses at the outputs of the HI-8597.
The HI-8597 has 37.5 ohms in series with each TXOUT
output, allowing direct connection to the ARINC 429
bus. The outputs are automatically lightning protected
in compliance with RTCA/DO-160G, Section 22 Level 3
Pin Injection Test Waveform Set A (3 & 4), Set B (3 & 5A)
and Set Z (3 & 5B) without any external components.
Tri-stateable outputs allow multiple line drivers to be
connected to the same ARINC 429 bus. Setting TX1IN
and TX0IN both to a logic “1” puts the outputs in the
high-impedance state.
The TX0IN and TX1IN inputs receive logic signals from a
control transmitter chip such as the HI-3584 or HI-3586.
TXAOUT and TXBOUT hold each side of the ARINC bus
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED OPERATING
CONDITIONS
Supply Voltages
VDD .......................................................... +5V
o
Power Dissipation at 25 C
o
plastic SOIC ........... 1.0W, derate 10mW/ C
o
Supply Voltages
VDD ................................... +3.0V to +3.6V
Temperature Range
o
o
Solder Temperature (reflow) .............................. 260 C
Industrial Screening .............. -40 C to +85 C
Storage Temperature ....................... -65 C to +150 C
Hi-Temp Screening .............. -55 C to +125 C
o
o
RTCA/DO-160G, Section 22 pin injection
Waveform
Voc/Isc
3
800V/32A
4
375V/75A
5A
375V/375A
5B
375V/375A
o
o
NOTE: Stresses above absolute maximum ratings or outside recommended operating conditions may cause permanent damage to the
device. These are stress ratings only. Operation at the limits is not
recommended.
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HI-8597
ELECTRICAL CHARACTERISTICS
Table 3. DC Electrical Characteristics
VDD = +3.3V, TA = Operating Temperature Range (unless otherwise stated)
Parameters
Symbol
Test Conditions
Min
Typ
Max
Units
Input Voltage (TX1IN, TX0IN, SLP)
High
VIH
0.7VDD
-
-
V
Low
VIL
-
-
0.3VDD
V
0.1
μA
Input Current (TX1IN, TX0IN, SLP)
Source
IIH
VIN = 0V
-
-
Sink
IIL
VIN = 3.3V, 7.34kΩ pulldown
-
45
one
VDIFF1
no load; TXAOUT - TXBOUT
9
10
11
V
zero
VDIFF0
no load; TXAOUT - TXBOUT
-11
-10
-9
V
null
VDIFFN
no load; TXAOUT - TXBOUT
-0.5
0
0.5
V
one or zero
VDOUT
no load & magnitude at pin
4.5
5.0
5.5
V
null
VNOUT
no load
-0.25
0
0.25
V
μA
ARINC Output Voltage (Differential)
ARINC Output Voltage (Ref. to GND)
Operating Supply Current
SLP = VDD
No load
IDDNL
TX1IN & TX0IN = 0V
-
65
100
mA
Max. Load
IDDL
100kHz, 400Ω load
-
130
-
mA
ARINC Outputs Shorted
IDDS
See Note 1
-
330
-
mA
ARINC Output Impedance
ZOUT
TXOUT pins
37.5
Ohms
TX0IN = TX1IN = VDD,
ARINC Output Tri-State Current
IOZ
TA = 25oC
-200
200
μA
+5.5
V
-5.5V < VOUT < +5.5V
TX0IN = TX1IN = VDD,
ARINC Output Tri-State Voltage
VOZ
TA = 25oC
-150μA < IOUT < +150μA
Note 1: TXAOUT and/or TXBOUT shorted to each other or ground.
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-5.5
-
HI-8597
Table 4. Converter Characteristics
VDD = +3.3V, TA = Operating Temperature Range (unless otherwise stated)
Parameters
Symbol
Start-up transient (V+, V-)
Operating Switching Frequency
Worst case maximum voltage
doubler output
Min
Typ
Max
Units
tSTART
-
-
10
ms
fsw
-
650
-
kHz
6.93
V
VDD2+(max)
Test Conditions
VDD = 3.6V. T = -55oC. Open
load.
DC/DC convertor capacitor recommendations.
For optimum performance use typical (not min.) values. For EMC compliance, see AN-135. CFLY and COUT
caps are Ceramic or Tantalum, preferably multilayer, non polarized dielectric XR7, 10V min. CSUPPLY cap
is Tantalum 10V min.
Ratio of bulk storage to fly-back
capacitors
COUT / CFLY
Fly-back capacitor
(Recommend ceramic, preferably
multilayer, dielectric XR7 caps, 10V min.).
Bulk storage capacitor
(Recommend ceramic, preferably
multilayer, dielectric XR7 caps, 10V min.).
By-pass capacitor
(Recommend tantalum cap, 10V min.).
2.2
10
4.7
CFLY
COUT / CFLY >= 10
1.0
-
CFLY(ESR)
[0.5, 1.0]Mhz
500
COUT
COUT / CFLY >= 10
2.2
COUT(ESR)
[0.5, 1.0]Mhz
300
CSUPPLY
CSUPPLY >= COUT (connect from VDD to GND)
μF
mΩ
47
-
μF
mΩ
Table 5. AC Electrical Characteristics
VDD = +3.3V, TA = Operating Temperature Range (unless otherwise stated)
Parameters
Symbol
Test Conditions
Min
Typ
Max
Units
Output high to low
tphlx
defined in Figure 2, no load
-
500
-
ns
Output low to high
tplhx
-
500
-
ns
Line Driver Propogation Delay
Line Driver Transition Times
High Speed
SLP pin = Logic “1”
Output high to low
tfx
1.0
1.5
2.0
μs
Output low to high
trx
1.0
1.5
2.0
μs
Low Speed
SLP pin = Logic “0”
Output high to low
tfx
5.0
10.0
15.0
μs
Output low to high
trx
5.0
10.0
15.0
μs
CIN
-
-
10
pF
-
-
10
pF
Input Capacitance (Logic)1
Output Capacitance (Tri-state)1
COUT
TX0IN = TX1IN = VDD
Notes: 1. Guaranteed but not tested
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HI-8597
5V
TX1IN
0V
tphlx
tplhx
tplhx
5V
TX0IN
0V
tphlx
trx
trx
VDIFF
(TXAOUT - TXBOUT)
10%
10V
90%
0V
10%
90%
-10V
10%
tfx
tfx
Figure 2. Line Driver Timing
2000
-55C
1500
-40C
25C
+85C
Leakage Current (uA)
1000
+125C
500
0
-500
-1000
-1500
-2000
-5.50
-4.50
-3.50
-2.50
-1.50
-0.50
0.50
1.50
2.50
3.50
4.50
5.50
Bus Voltage (V)
Figure 3. Tri-State Leakage Current vs Bus Voltage at Temperature.
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HI-8597
125
100
25C
75
Leakage Current (uA)
50
25
0
-25
-50
-75
-100
-125
-5.50
-4.50
-3.50
-2.50
-1.50
-0.50
0.50
1.50
2.50
3.50
4.50
5.50
Bus Voltage (V)
Figure 4. Tri-State Leakage Current vs Bus Voltage at Room Temperature.
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HI-8597
LIGHTNING INDUCED TRANSIENT VOLTAGE WAVEFORMS
Waveform 3.
V or I
Largest
Peak
25% to 75%
of Largest Peak
50%
0
t
Figure 5. DO-160G Lightning Induced Transient Voltage Waveform 3.
Voc = 600V, Isc = 24A, Frequency = 1MHz ± 20%.
Waveform 4.
V or I
Peak
T1 = 6.4µs ± 20%
T2 = 70µs ± 20%
50%
0
T1
T2
t
Figure 6. DO-160G Lightning Induced Transient Voltage Waveform 4.
Voc = 300V, Isc = 60A.
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HI-8597
Waveform 5.
V or I
Peak
5A: T1 = 40µs ± 20%
T2 = 120µs ± 20%
5B: T1 = 50µs ± 20%
T2 = 500µs ± 20%
50%
0
T1
t
T2
Figure 7. DO-160G Lightning Induced Transient Voltage Waveforms 5A and 5B.
Voc = 300V, Isc = 300A.
ORDERING INFORMATION
HI - 8597Px x x (Plastic)
PART NUMBER
F
PART NUMBER
LEAD FINISH
100% Matte Tin (Pb-free, RoHS compliant)
TEMPERATURE RANGE
o
o
FLOW
BURN IN
I
-40 C to +85 C
I
No
T
-55oC to +125oC
T
No
M
Yes
M
PART NUMBER
8597PS
o
o
-55 C to +125 C
PACKAGE DESCRIPTION
LEAD
FINISH
16 PIN PLASTIC SMALL OUTLINE - WB SOIC (16HWE)
Solder
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HI-8597
REVISION HISTORY
Revision
DS8597,
Date
Description of Change
Rev. New
11/9/12
Initial Release
Rev. A
12/11/12
Clarify operating supply current for shorted ARINC outputs.
Change “VSS” pin label to “GND” and “-” to “NC” for clarification. Add pin numbers to
Pin Description table.
Rev. B
01/21/13
Rephrase “guarantees” compliance with DO-160G Level 3 to “allows” compliance with
DO-160G Level 3.
Update tri-state leakage parameter to 200μA.
Add Absolute Maximum Ratings for lightning waveforms.
Rev. C
03/14/13
Remove erroneous references to AMPA and AMPB outputs in footnote on page 5.
Rev. D
05/08/13
Corrected state of SLP pin and erroneous reference to pin 1 in Test Conditions for
Line Driver Transition Times (see AC Characteristics Table).
Rev. E
06/13/13
Update operating supply current.
Rev. F
07/19/13
Update operating supply current from 85mA to 100mA max.
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HI-8597
PACKAGE DIMENSIONS
inches (millimeters)
16-PIN PLASTIC SMALL OUTLINE (SOIC) - WB
(Wide Body, Thermally Enhanced)
.008 ± .005
(.215 ± .115)
.406 BSC
(10.3)
.406 BSC
(10.3)
.295 BSC
(7.5)
Top View
Package Type: 16HWE
.245 ± .015
(6.225 ± .385)
.195 ± .015
(4.955 ± .385)
Bottom
View
See Detail A
.050
BSC
(1.27)
.081 min.
(2.05)
.0161 ± .004
(.41 ± .10)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
0° to 8°
Electrically isolated heat sink
pad on bottom of package.
.008 ± .004
(.20 ± .10)
.033 ± .017
(.835 ± .435)
Detail A
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