ICHAUS IC

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iC-HG
3 A LASER SWITCH
Rev A2, Page 1/21
FEATURES
APPLICATIONS
♦
♦
♦
♦
♦
♦
♦
♦ Pump lasers
♦ Laser projection
♦ Laser TV
♦
♦
♦
♦
♦
♦
♦
♦
Six channel laser switch from CW up to 200 MHz
CW operation with up to 500 mA per channel
Spike-free switching of the laser current
6 x 1 channels with TTL inputs
3 x 2 channels with LVDS inputs
Operates as six independent voltage-controlled current sinks
Switching outputs (LDKx) are 12 V capable for blue laser
diodes
Fast and slow switching mode
Simple current control at pins CIx
CIx voltage < 3 V for full current
Wide supply voltage range from 3 to 5.5 V
All channels can be paralleled for 3 A operation
Multiple iC-HG can be connected in parallel for higher currents
Open drain error output
Thermal shutdown
PACKAGES
QFN28 5 mm x 5 mm
BLOCK DIAGRAM
VDD
iC-HG
LDK1
CI1
EN1
&
AGND1
+
LDK2
-
CI2
EN2
&
AGND2
CI3
LDK3
EN3
AGND3
CI4
LDK4
EN4
AGND4
CI5
LDK5
EN5
AGND5
CI6
LDK6
EN6
AGND6
VDD
NER
ELVDS
60%
&
80%
40%
Power &
Temperature
Monitor
20%
GND
Copyright © 2011 iC-Haus
http://www.ichaus.com
iC-HG
3 A LASER SWITCH
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DESCRIPTION
Six channel Laser Switch iC-HG enables the spikefree switching of laser diodes with well-defined current pulses at frequencies ranging from DC to
200 MHz.
The diode current is determined by the voltages at
pins CIx.
The six fast switches are controlled independently via
TTL inputs. Input ELVDS = hi selects LVDS type inputs and three channel mode. TTL slow switch mode
is selected with 30% VDD and LVDS slow switch
mode with 70% VDD at input ELVDS.
The laser diode can thus be turned on and off or
switched between different current levels (LDKx connected) defined by the voltages at CIx.
Each channel can be operated up to 500 mA DC current depending on the heat dissipation.
The integrated thermal shutdown feature protects the
iC-HG from damage by excessive temperature.
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iC-HG
3 A LASER SWITCH
Rev A2, Page 3/21
PACKAGES QFN28 5 mm x 5 mm to JEDEC
PIN CONFIGURATION QFN28 5 mm x 5 mm
28
27
26
25
24
23
PIN FUNCTIONS
No. Name Function
22
1
21
2
20
3
19
HG
code...
...
4
5
6
18
17
16
15
7
1
2
3
4
5
6
7
8
9
10
11
12
13
14
CI1
CI2
CI3
GND
CI4
CI5
CI6
AGND6
LDK6
AGND5
LDK5
AGND4
LDK4
EN6
15 EN5
8
9
10
11
12
13
14
16 EN4
17 EN3
18 VDD
19 ELVDS
20 EN2
21 EN1
22
23
24
25
26
27
28
NER
LDK3
AGND3
LDK2
AGND2
LDK1
AGND1
Current control voltage channel 1
Current control voltage channel 2
Current control voltage channel 3
Ground
Current control voltage channel 4
Current control voltage channel 5
Current control voltage channel 6
Analog ground channel 6
Laser diode cathode channel 6
Analog ground channel 5
Laser diode cathode channel 5
Analog ground channel 4
Laser diode cathode channel 4
TTL switching input channel 6
Negative LVDS Input channel 5 and 6
TTL switching input channel 5
Positive LVDS Input channel 5 and 6
TTL switching input channel 4
Negative LVDS Input channel 3 and 4
TTL switching input channel 3
Positive LVDS Input channel 3 and 4
Supply voltage
TTL/LVDS Fast/Slow Input selector
TTL switching input channel 2
Negative LVDS Input channel 1 and 2
TTL switching input channel 1
Positive LVDS Input channel 1 and 2
Error monitor output
Laser diode cathode channel 3
Analog ground channel 3
Laser diode cathode channel 2
Analog ground channel 2
Laser diode cathode channel 1
Analog ground channel 1
The Thermal Pad is to be connected to a Ground Plane (GND, AGND1. . . 6) on the PCB.
Only pin 1 marking on top or bottom defines the package orientation ( HG label and coding is subject
to change).
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iC-HG
3 A LASER SWITCH
Rev A2, Page 4/21
PACKAGE DIMENSIONS
RECOMMENDED PCB-FOOTPRINT
4.60
3
15
R0.
4.60
1
3
0.90
SIDE
0.50
0.30
BOTTOM
5
3.15
0.50
0.25
0.55
5
3.15
TOP
dra_qfn28-2_pack_1, 10:1
All dimensions given in mm.
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iC-HG
3 A LASER SWITCH
Rev A2, Page 5/21
ABSOLUTE MAXIMUM RATINGS
Beyond these values damage may occur; device operation is not guaranteed.
Item
No.
Symbol
Parameter
Conditions
Unit
Min.
Max.
G001 VDD
Voltage at VDD
-0.3
6
V
G002 I(VDD)
Current in VDD
-10
750
mA
G003 V(CI)
Voltage at CI1. . . 6
-0.3
6
V
G004 V()
Voltage at EN1. . . 6, AGND1. . . 6,
ELVDS, NER
-0.3
6
V
G005 V(LDK)
Voltage at LDK1. . . 6
-0.3
12
V
G006 I(LDK)
Current in LDK1. . . 6
DC current
-10
600
mA
G007 I(AGND)
Current in AGND1. . . 6
DC current
-600
10
mA
G008 I()
Current in CI1. . . 6, EN1. . . 6, ELVDS
-10
10
mA
G009 I(NER)
Current in NER
-10
20
mA
G010 Vd()
ESD Susceptibility at all pins
2
kV
G011 Tj
Operating Junction Temperature
-40
125
°C
G012 Ts
Storage Temperature Range
-40
150
°C
HBM 100 pF discharged through 1.5 k Ω
THERMAL DATA
Item
No.
Symbol
Parameter
Conditions
Unit
Min.
T01
Ta
Operating Ambient Temperature Range
(extended range on request)
T02
Rthja
Thermal Resistance Chip/Ambient
Typ.
-25
Mounted onto the Evaluation Board HG1D
All voltages are referenced to ground unless otherwise stated.
All currents flowing into the device pins are positive; all currents flowing out of the device pins are negative.
Max.
85
25
°C
K/W
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3 A LASER SWITCH
Rev A2, Page 6/21
ELECTRICAL CHARACTERISTICS
Operating Conditions: VDD = 3.0...5.5 V, AGND1. . . 6 = GND, Tj = -25...125 °C unless otherwise stated
Item
No.
Symbol
Parameter
Conditions
Unit
Min.
Typ.
Max.
Total Device (x = 1. . . 6)
001
VDD
Permissible Supply Voltage
5.5
V
002
I(VDD)
Supply Current in VDD
CW operation
3
10
mA
003
I(VDD)
Supply Current in VDD
pulsed operation, f(ENx) = 200 MHz
700
mA
004
V(LDKx)
Permissible Voltage at LDKx
-0.3
12
V
005
V(NER)
Permissible Voltage at NER
-0.3
5.5
V
006
Vc()hi
Clamp Voltage hi at LDKx
I(LDK) = 10 mA
12.1
18
V
007
Vc(NER)
Clamp Voltage hi at NER
I(NER) = 1 mA
7
18
V
008
Vc(CIx)hi
Clamp Voltage hi at CIx
Vc(CIx) = V(CIx) − VDD;
I(CI) = 10 mA, other pins open
0.3
1.6
V
009
Vc()hi
Clamp Voltage hi at ENx, ELVDS Vc() = V() − VDD;
I() = 1 mA, other pins open
0.8
3
V
010
Vc()lo
Clamp Voltage lo at VDD, LDKx, I() = -10 mA, other pins open
CIx, ENx, AGNDx, ELVDS, NER
-1.6
-0.3
V
500
mA
15
Laser Control LDK1. . . 6, CI1. . . 6 (x = 1. . . 6)
101
Icw(LDKx) Permissible CW Current in LDKx
(per channel)
102
Vs(LDKx)
Saturation Voltage at LDKx
I(LDKx) = 450 mA,
V(CIx) = V(CIx)@I(LDKx) = 500 mA
1.5
V
103
I0(LDKx)
Leakage Current in LDKx
ENx = lo, V(LDKx) = 12 V
100
µA
104
tr()
LDKx Current Rise Time Fast
Iop(LDKx) = 500 mA, I(LDKx): 10% → 90% Iop,
V(ELVDS) = 0 V or VDD
1
ns
105
tf()
LDKx Current Fall Time Fast
Iop(LDKx) = 500 mA, I(LDKx): 90% → 10% Iop,
V(ELVDS) = 0 V or VDD
1
ns
106
tr()
LDKx Current Rise Time Slow
Iop(LDKx) = 500 mA, I(LDKx): 10% → 90% Iop,
V(ELVDS) = 30% VDD or 70% VDD, VDD = 5 V
5
10
40
ns
107
tf()
LDKx Current Fall Time Slow
Iop(LDKx) = 500 mA, I(LDKx): 90% → 10% Iop,
V(ELVDS) = 30% VDD or 70% VDD, VDD = 5 V
5
10
40
ns
108
tr()
LDKx Current Rise Time Slow
Iop(LDKx) = 500 mA, I(LDKx): 10% → 90% Iop,
V(ELVDS) = 30% VDD or 70% VDD,
VDD = 3.3 V
10
30
90
ns
109
tf()
LDKx Current Fall Time Slow
Iop(LDKx) = 500 mA, I(LDKx): 90% → 10% Iop,
V(ELVDS) = 30% VDD or 70% VDD,
VDD = 3.3 V
10
30
90
ns
110
tp()
Propagation Delay Fast
V(ENx) → I(LDKx)
V(ELVDS) = 0 V or VDD, Differential LVDS Rise
and Fall Time < 0.5 ns
3
5
14
ns
111
CR()
Current Matching all Channels
0.9
1.1
112
V(CIx)
Permissible Voltage at CIx
-0.3
VDD
V
113
Vt(CIx)
Threshold Voltage at CIx
I(LDKx) < 5 mA
0.5
1.2
V
114
V(CIx)
Operating Voltage at CIx
I(LDKx) = 500 mA, V(LDKx) > 1.8 V
115
Ipd(CIx)
Pull-Down Current at CIx
V(CIx) = 0.5. . . 5.5 V
116
C(CIx)
Capacity at CIx
117
Vc(LDKx)
Clamp Voltage at LDKx
2
2.9
V
1
2.5
5
µA
V(CIx) = 2 V
500
635
760
pF
I(LDKx) = 100 mA, tclamp < 1 ms,
tclamp/T < 1:100
12.5
20
V
2
V
Input EN1. . . 6 (x = 1. . . 6)
201
Vt(TTL)hi
Input Threshold Voltage hi
V(ELVDS) < 35% VDD, TTL
202
Vt(TTL)lo
Input Threshold Voltage lo
V(ELVDS) < 35% VDD, TTL
0.8
V
203
Vhys(TTL) Hysteresis
Vhys() = Vt()hi − Vt()lo;
V(ELVDS) < 35% VDD, TTL
50
mV
204
I(ENx)
Pulldown Current
V(ELVDS) < 35% VDD, V() = 0.8 V. . . VDD, TTL
4
205
R(ENx)
Differential Input Impedance at
ENx
V(ELVDS) > 65% VDD, V(ENx) < VDD − 1.4 V,
LVDS
14
206
Vdiff
Differential Voltage
Vdiff = |V(EN1,3,5) − V(EN2,4,6)|;
V(ELVDS) > 65% VDD, LVDS
200
30
80
µA
28
kΩ
mV
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3 A LASER SWITCH
Rev A2, Page 7/21
ELECTRICAL CHARACTERISTICS
Operating Conditions: VDD = 3.0...5.5 V, AGND1. . . 6 = GND, Tj = -25...125 °C unless otherwise stated
Item
No.
207
Symbol
Parameter
Conditions
Unit
Min.
V()
Input Voltage Range
V(ELVDS) > 65% VDD, LVDS
0.6
ELVDS open
Typ.
Max.
VDD −
1.4
V
%VDD
Input ELVDS
301
V(ELVDS) Voltage at ELVDS
48
50
52
302
Ri(ELVDS)
35
50
70
kΩ
303
Vt(ELVDS) Threshold Voltage TTL Fast to
TTL Slow
16
20
24
%VDD
304
Vt(ELVDS) Threshold Voltage TTL Slow to
Error
36
40
44
%VDD
305
Vt(ELVDS) Threshold Voltage Error to LVDS
Slow
56
60
64
%VDD
306
Vt(ELVDS) Threshold Voltage LVDS Slow to
LVDS Fast
74
80
84
%VDD
307
Vhys()
10
25
50
mV
3
9
Hysteresis
Ouput NER
401
Vsat(NER) Saturation Voltage at NER
ELVDS open, I(NER) = 2 mA
402
I(NER)
Current in NER
ELVDS open, V(NER) > 0.6 V
0.6
V
20
mA
Overtemperature
501
Toff
Overtemperature Shutdown
rising temperature
130
170
°C
502
Ton
Overtemperature Release
falling temperature
120
160
°C
503
Thys
Hysteresis
Toff − Ton
5
°C
Power On
601
VON
Power On Voltage VDD
rising voltage
602
VOFF
Power Down Voltage VDD
falling voltage
603
Vhys
Hysteresis
2.9
V
500
mV
1.5
50
V
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iC-HG
3 A LASER SWITCH
Rev A2, Page 8/21
CONFIGURATION INPUT ELVDS
Pin ELVDS selects between 6 channel TTL mode or 3
channel LVDS mode and chooses slow or fast switching speed. The unconnected pin ELVDS is an error
condition signaled at pin NER with the laser current
disabled.
Pin ELVDS connected to GND selects the six channel
fast TTL mode. Pin ELVDS connected to 30% VDD
selects the six channel slow TTL mode. Pin ELVDS
connected to 70% VDD selects the three channel slow
LVDS mode. Pin ELVDS connected to VDD selects the
three channel fast LVDS mode.
An easy way to set the slow operation mode for TTL
and LVDS mode is to connect a voltage divider at pin
ELVDS. Figure 1 shows the recommended voltage divider for slow TTL mode and Figure 2 shows the recommended voltage divider for slow LVDS mode.
Figure 1: TTL Slow
Figure 2: LVDS Slow
DIGITAL INPUTS EN1. . . 6
EN1. . . 6 are the digital switching inputs. With pin
ELVDS set to 6 channel TTL mode, each pin ENx enables the current sink at the respective LDKx. With pin
ELVDS set to 3 channel LVDS mode, the odd ENx pins
are the positive and the even ENx pins are the negative LVDS inputs. EN1 and EN2 control LDK1 and
LDK2, EN3 and EN4 control LDK3 and LDK4 and EN5
and EN6 control LDK5 and LDK6. For correct LVDS
operation 100 Ω terminating resistors between the respective EPx and ENx pins, very close to the inputs,
are strongly recommended. Input pins from unused
channels have to be connected to GND (TTL operation) resp. EPx to GND and ENx to VDD (LVDS operation).
ANALOG CURRENT CONTROL VOLTAGE INPUTS CI1. . . 6
The Voltage at pins CI1. . . 6 set the current value at
pins LDK1. . . 6. The figures 3 and 4 shows the temperature dependency of the current at LDK versus the
Voltage at CI. The figures 5 and 6 shows the min., typ.
and max. variations between devices.
iC-HG
3 A LASER SWITCH
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Rev A2, Page 9/21
Figure 3: I(LDK) vs. V(CI) at VDD = 5 V
Figure 4: I(LDK) vs. V(CI) at VDD = 3.3 V
iC-HG
3 A LASER SWITCH
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Rev A2, Page 10/21
Figure 5: I(LDK) vs. V(CI) at VDD = 5 V and TJ = 27 °C
Figure 6: I(LDK) vs. V(CI) at VDD = 3.3 V and TJ = 27 °C
iC-HG
3 A LASER SWITCH
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Rev A2, Page 11/21
LASER OUTPUTS LDK1. . . 6
LDK1. . . 6 are the current pins for the laser diode cathode. For high speed operation connect the laser diode
as close as possible to this pins to minimize the induc-
tance. It may still be necessary though to use an RC
snubber network for damping LC oscillations.
ANALOG GROUNDS AGND1. . . 6
AGND1. . . 6 are the ground pins for the channels. It is
recommended to connect all AGND1. . . 6 pins to GND.
ERROR OUTPUT NER
The open drain NER pin is a low-active error output.
Signalled errors are ELVDS open or at 50% VDD, VDD
undervoltage and thermal shutdown.
THERMAL SHUTDOWN
iC-HG is protected by an integrated thermal shutdown
feature. When the shutdown temperature is reached
all channels are disabled. Falling temperature after
this shutdown will unconditionally enable all channels
again. Necessary precaution to prevent damage of the
laser may be to also disable any external control circuits for the laser output power or current control during thermal shutdown. The error signal at pin NER can
be used to e.g. disable the control circuit.
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iC-HG
3 A LASER SWITCH
Rev A2, Page 12/21
APPLICATION EXAMPLES
..12V
CLDA1
100μF
CLDA2
10μF
CLDA3
100nF
CLDA4
10nF
3..5.5V
CVDD1
10μF
VDD
CVDD2
100nF
CVDD3
10nF
iC-HG
LDK1
CI1
EN1
EN+LVDS
&
AGND1
+
EN-LVDS
CI
CI
10nF
LDK2
-
CI2
EN2
&
AGND2
CI3
LDK3
EN3
AGND3
CI4
LDK4
EN4
AGND4
CI5
LDK5
EN5
AGND5
CI6
LDK6
EN6
AGND6
RNER
10K
NER
VDD
80%
ELVDS
60%
&
RLVDS
100
40%
Power &
Temperature
Monitor
20%
GND
Figure 7: 1 channel LVDS fast
NERROR
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3 A LASER SWITCH
Rev A2, Page 13/21
..12V
CLDA1
100μF
CLDA2
10μF
CLDA3
100nF
CLDA4
10nF
3..5.5V
CVDD1
10μF
VDD
CVDD2
100nF
CVDD3
10nF
iC-HG
LDK1
CI1
EN1
EN+LVDS
&
AGND1
+
RLVDS
100
LDK2
-
CI2
EN2
EN-LVDS
&
AGND2
CI3
CI
CI
10nF
LDK3
EN3
AGND3
CI4
LDK4
EN4
AGND4
CI5
LDK5
EN5
AGND5
CI6
LDK6
EN6
AGND6
RNER
10K
NER
VDD
RELVDS1
3.32k
ELVDS
RELVDS2
7.5k
60%
&
80%
40%
Power &
Temperature
Monitor
20%
GND
Figure 8: 1 channel LVDS slow
NERROR
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3 A LASER SWITCH
Rev A2, Page 14/21
..12V
CLDA1
100μF
CLDA2
10μF
CLDA3
100nF
CLDA4
10nF
3..5.5V
CVDD1
10μF
VDD
CVDD2
100nF
CVDD3
10nF
iC-HG
LDK1
CI1
ENTTL
EN1
&
AGND1
+
LDK2
-
CI2
EN2
CI
10nF
AGND2
CI3
LDK3
EN3
AGND3
CI4
LDK4
EN4
AGND4
CI5
LDK5
EN5
AGND5
CI6
LDK6
EN6
AGND6
RNER
10K
NER
VDD
80%
ELVDS
60%
&
CI
&
40%
Power &
Temperature
Monitor
20%
GND
Figure 9: 1 channel TTL fast
NERROR
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3 A LASER SWITCH
Rev A2, Page 15/21
..12V
CLDA1
100μF
CLDA2
10μF
CLDA3
100nF
CLDA4
10nF
3..5.5V
CVDD1
10μF
VDD
CVDD2
100nF
CVDD3
10nF
iC-HG
LDK1
CI1
EN1
ENTTL
&
AGND1
+
LDK2
-
CI2
EN2
&
AGND2
CI3
CI
CI
10nF
LDK3
EN3
AGND3
CI4
LDK4
EN4
AGND4
CI5
LDK5
EN5
AGND5
CI6
LDK6
EN6
AGND6
RNER
10K
NER
VDD
RELVDS1
7.5k
ELVDS
RELVDS2
3.32k
60%
&
80%
40%
Power &
Temperature
Monitor
20%
GND
Figure 10: 1 channel TTL slow
NERROR
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3 A LASER SWITCH
Rev A2, Page 16/21
..12V
CLDA1
100μF
CLDA2
10μF
CLDA3
100nF
CLDA4
10nF
3..5.5V
CVDD1
10μF
VDD
CVDD2
100nF
CVDD3
10nF
iC-HG
LD1
LDK1
CI1
CI1
EN1
EN+LVDS1
&
AGND1
+
RLVDS1
100
LDK2
-
CI2
EN2
EN-LVDS1
&
CI1
10nF
AGND2
LD2
CI3
CI2
LDK3
EN3
EN+LVDS2
AGND3
CI4
RLVDS2
100
LDK4
EN4
EN-LVDS2
AGND4
LD3
CI5
CI3
LDK5
EN5
EN+LVDS3
RLVDS3
100
LDK6
EN6
AGND6
RNER
10K
CI3
10nF
NER
VDD
80%
ELVDS
60%
&
EN-LVDS3
CI2
10nF
AGND5
CI6
40%
Power &
Temperature
Monitor
20%
GND
Figure 11: 3 channel LVDS fast
NERROR
Figure 12: 6 channel TTL fast
ENTTL6
CI6
ENTTL5
CI1
10nF
CI2
10nF
CI3
10nF
CI4
10nF
CI5
10nF
CVDD1
10μF
CI6
10nF
EN6
CI6
EN5
CI5
EN4
CI4
EN3
CI3
EN2
CI2
EN1
CI1
ELVDS
CVDD2
100nF
VDD
20%
40%
60%
80%
-
+
iC-HG
GND
&
&
VDD
CLDA1
100μF
Power &
Temperature
Monitor
CLDA2
10μF
NER
AGND6
LDK6
AGND5
LDK5
AGND4
LDK4
AGND3
LDK3
AGND2
LDK2
AGND1
LDK1
CVDD3
10nF
CLDA3
100nF
CLDA4
10nF
NERROR
RNER
10K
LD1
LD2
LD3
LD4
LD5
LD6
3 A LASER SWITCH
CI5
ENTTL4
CI4
ENTTL3
CI3
ENTTL2
CI2
ENTTL1
CI1
3..5.5V
&
..12V
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J4
2
J4
3
J2-LVDS_P
9
J2-LVDS_N
11
J2-GND6
12
J2-GND5
10
J2-GND4
8
J2-GND3
5
J2-GND2
4
J2-GND1
2
J2-GND
1
J4
1
VDD
J2-TTL
3
J2-V5D1
7
J2-V5D
6
iC149_1
S S1
EN4
J3
6
Figure 13: Schematic of the evaluation board
EN6
J3
9
J3
10
EN5
J3
8
R56
100
R34
100
R12
100
J5
2
J5
3
J5
1
A
A
A
A
A
L
R
1k
P6
A
C
C
C
C
C
C
R3
3.32k
R2
4.22k
R1
3.32k
VDD
L
R
1k
P5
VDD
L
R
1k
P4
VDD
L
R
1k
P3
VDD
L
R
1k
P2
VDD
L
R
1k
P1
VDD
GND1
GND
VDD
VLDA
JP6
JP5
JP4
JP3
JP2
JP1
VDD
A
A
A
A
A
A
JP7_4
JP7_3
JP7_2
JP7_1
CI6
CI5
CI4
CI3
CI2
CI1
C6
100nF
C5
100nF
C4
100nF
C3
100nF
C2
100nF
C1
100nF
C7
10μF
LVDS
/TTL
&
&
&
&
&
&
18
VDD
A
SUB
GND
EPAD 4
C9
10nF
PWR & TEMP
MONITOR
19 ELVDS
14 EN6
7 CI6
15 EN5
6 CI5
16 EN4
5 CI4
17 EN3
3 CI3
20 EN2
2 CI2
21 EN1
1 CI1
U1
iC-HG
C8
100nF
NER 22
AGND6 8
LDK6 9
AGND5 10
LDK5 11
AGND4 12
LDK4 13
AGND3 24
LDK3 23
AGND2 26
LDK2 25
AGND1 28
LDK1 27
A
A
A
A
A
A
NER
LDK6
LDK5
LDK4
LDK3
LDK2
LDK1
562
R7
JP56
JP34
JP12
D7
RD
D6
D5
D4
D3
D2
D1
VDD
A
A
A
A
A
A
C16
10nF
C15
10nF
C14
10nF
C13
10nF
C12
10nF
C11
10nF
A
A
A
A
A
A
C26
1μF
C25
1μF
C24
1μF
C23
1μF
C22
1μF
C21
1μF
A
A
A
A
A
A
C36
10μF
C35
10μF
C34
10μF
C33
10μF
C32
10μF
C31
10μF
A
A
C17
47μF
C10
47μF
3 A LASER SWITCH
J3
7
EN3
EN2
EN1
8
7
6
5
4
3
2
1
J3
5
J3
4
J3
3
J3
2
J3
1
LVDS _P
LVDS _N
GND
NC
NC
GND
TT L
GND
J1
iC149_1
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EVALUATION BOARD
iC-HG comes with an evaluation board for test purpose. Figures 13 and 14 show both the schematic and the
component side of the evaluation board.
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Figure 14: Evaluation board (component side)
Figure 15: Evaluation board (solder side) with mounting option for heat sink
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iC-Haus expressly reserves the right to change its products and/or specifications. An info letter gives details as to any amendments and additions made to the
relevant current specifications on our internet website www.ichaus.de/infoletter; this letter is generated automatically and shall be sent to registered users by
email.
Copying – even as an excerpt – is only permitted with iC-Haus’ approval in writing and precise reference to source.
iC-Haus does not warrant the accuracy, completeness or timeliness of the specification and does not assume liability for any errors or omissions in these
materials.
The data specified is intended solely for the purpose of product description. No representations or warranties, either express or implied, of merchantability, fitness
for a particular purpose or of any other nature are made hereunder with respect to information/specification or the products to which information refers and no
guarantee with respect to compliance to the intended use is given. In particular, this also applies to the stated possible applications or areas of applications of
the product.
iC-Haus conveys no patent, copyright, mask work right or other trade mark right to this product. iC-Haus assumes no liability for any patent and/or other trade
mark rights of a third party resulting from processing or handling of the product and/or any other use of the product.
As a general rule our developments, IPs, principle circuitry and range of Integrated Circuits are suitable and specifically designed for appropriate use in technical
applications, such as in devices, systems and any kind of technical equipment, in so far as they do not infringe existing patent rights. In principle the range of
use is limitless in a technical sense and refers to the products listed in the inventory of goods compiled for the 2008 and following export trade statistics issued
annually by the Bureau of Statistics in Wiesbaden, for example, or to any product in the product catalogue published for the 2007 and following exhibitions in
Hanover (Hannover-Messe).
We understand suitable application of our published designs to be state-of-the-art technology which can no longer be classed as inventive under the stipulations
of patent law. Our explicit application notes are to be treated only as mere examples of the many possible and extremely advantageous uses our products can
be put to.
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ORDERING INFORMATION
Type
Package
Order Designation
iC-HG
QFN28 5 mm x 5 mm
Evaluation Board
iC-HG QFN28
iC-HG EVAL HG1D
For technical support, information about prices and terms of delivery please contact:
iC-Haus GmbH
Am Kuemmerling 18
D-55294 Bodenheim
GERMANY
Tel.: +49 (61 35) 92 92-0
Fax: +49 (61 35) 92 92-192
Web: http://www.ichaus.com
E-Mail: [email protected]
Appointed local distributors: http://www.ichaus.com/sales_partners