LDIP-IPM IM13400 Description Cyntec IPM is integrated drive, protection and system control functions that is designed for high performance 3-phase motor driver application like： Home appliances applications. Inverter drive parts for AC/DC motor driving. Features High latch-up immunity. Low switching loss and higher short-circuit withstanding capability. Low temperature coefficient effect both for driver and IGBT. Integrated driver IC to reduce the PCB size and layout effort. High noise rejection capability. Under-voltage lockout protection both for high and low side IGBT. High Vcc and Input signal port voltage rating. Good thermal performance. Matched propagation delay for three arms. Automatic shut-off the high and low side IGBT to avoid shoot-through conduction in case the driving signal is abnormal. Provided a fault signal (FO pin) and shut-off internal IGBT, when OC/SC and under-voltage situation are occurred. HEAT SINK SIDE Detail A Detail B (t=0.7) Stand off lrrgulor solder remains Stand off lrrgulor solder remains 1 1 1~5° TERMINAL CODE 14 VCC 1 HIN1 15 GND 2 VCC 3 VB1 16 CIN 4 VS1 17 CFO 5 HIN2 18 FO 6 VCC 19 LIN1 7 VB2 20 LIN2 8 VS2 21 LIN3 9 HIN3 22 P 10 VCC 23 U 11 VSS 24 V 12 VB3 25 W 13 VS3 26 N Detail C (t=0.7) Figure 1. Package Outlines UNLESS OTHERWISE SPECIFIED TOLERQNCES ON ﹕ X = ± X.X = ± X.XX = ± ANGLES ± HOLE DIA. ± DRAWN BY ﹕ DESIGNED BY ﹕ CHECKED BY ﹕ APPROVED BY ﹕ SCALE ﹕ X UNIT ﹕ X TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A CYNTEC CO., LTD. THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD. AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION DOCUMENT NO. PAGE REV. IM13400 PAGE A6 1 OF 1 Table 1. Pin Descriptions No. Symbol 1 HIN1 2 VCC Supply Voltage Terminal for Driver IC 3 VB1 High -side Bias Voltage for U Phase IGBT Driving 4 VS1 High -side Bias Voltage Ground for U Phase IGBT Driving 5 HIN2 6 VCC Supply Voltage Terminal for Driver IC 7 VB2 High -side Bias Voltage for V Phase IGBT Driving 8 VS2 High -side Bias Voltage Ground for V Phase IGBT Driving 9 HIN3 10 VCC 11 GND 12 VB3 High -side Bias Voltage for W Phase IGBT Driving 13 VS3 High -side Bias Voltage Ground for W Phase IGBT Driving 14 VCC Supply Voltage Terminal for Driver IC 15 GND Signal Ground 16 CIN Comparator Input 17 CFO Capacitor for Fault Output Duration Time Selection 18 FO 19 LIN1 Signal Input Terminal for Low-side U Phase 20 LIN2 Signal Input Terminal for Low-side V Phase 21 LIN3 Signal Input Terminal for Low-side W Phase 22 P Positive DC-Bus Input Terminal 23 U Output Terminal for U Phase 24 V Output Terminal for V Phase 25 W Output Terminal for W Phase 26 N Negative DC-Bus Input Terminal UNLESS OTHERWISE SPECIFIED TOLERQNCES ON ﹕ X = ± X.X = ± X.XX = ± ANGLES ± HOLE DIA. ± Pin Description Signal Input Terminal for High-side U Phase Signal Input Terminal for High-side V Phase Signal Input Terminal for High-side W Phase Supply Voltage Terminal for Driver IC Signal Ground Fault Output Terminal DRAWN BY ﹕ DESIGNED BY ﹕ CHECKED BY ﹕ APPROVED BY ﹕ SCALE ﹕ X UNIT ﹕ X TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A CYNTEC CO., LTD. THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD. AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION DOCUMENT NO. PAGE REV. IM13400 PAGE A6 2 OF 2 LDIP-IPM Internal Block Diagram VS1 VB1 VCC VS2 VB2 VS3 VB3 VCC 4 3 2 8 7 13 12 6 1 5 9 +5V Logic 19 20 21 18 10 HIN1 HIN2 HIN3 LIN1 LIN2 LIN3 FO VCC Q1 Signal Input 23 U D2 Q2 Circuit Fault Logic 24 V 25 W 26 N MOTOR D3 Q3 GND 11 P D1 Gate Driver 22 D4 14 Protection Circuit VCC Q4 D5 Q5 Supply Circuit +15V D6 Q6 15 GND 17 CFO CIN 16 Shunt Resistor Figure 2. LDIP-IPM Internal Block Diagram UNLESS OTHERWISE SPECIFIED TOLERQNCES ON ﹕ X = ± X.X = ± X.XX = ± ANGLES ± HOLE DIA. ± DRAWN BY ﹕ DESIGNED BY ﹕ CHECKED BY ﹕ APPROVED BY ﹕ SCALE ﹕ X UNIT ﹕ X TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A CYNTEC CO., LTD. THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD. AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION DOCUMENT NO. PAGE REV. IM13400 PAGE A6 3 OF 3 MAXIMUM RATINGS (Tj = 25℃) INVERTER PART Item Between collector to emitter voltage Each IGBT collector current Each IGBT collector current (peak) Junction temperature Symbol VCES ± IC ( Tc = 25℃ ) ± ICP ( Tc = 25℃, pulse ) Tj Min. -20 Max. 600 20 40 +150 Unit V A A ℃ Symbol VCC VB1S1,B2S2,B3S3 VCIN HIN1,HIN2,HIN3, LIN1,LIN2,LIN3 VFO Min. -0.3 -0.3 -0.3 Max. 25 20 25 Unit V V V -0.3 25 V -0.3 25 V Min. -20 -40 Max. +100 +150 Unit ℃ ℃ - 2500 Vrms CONTROL PART Item Driver IC supply voltage P- side floating supply voltage Current sensing input voltage Logic input voltage Fault output voltage TOTAL SYSTEM Item Module case operating temperature Storage temperature Isolation voltage (60Hz Sinusoidal, AC 1 minute, pins to heat-sink plate) Symbol TC Tstg (Note 1) Viso Note 1：Tc Measurement Point. Control Terminals Heat sink boundary Tc Power Terminals Heat sink Tc Figure 3. Tc Measurement Point UNLESS OTHERWISE SPECIFIED TOLERQNCES ON ﹕ X = ± X.X = ± X.XX = ± ANGLES ± HOLE DIA. ± DRAWN BY ﹕ DESIGNED BY ﹕ CHECKED BY ﹕ APPROVED BY ﹕ SCALE ﹕ X UNIT ﹕ X TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A CYNTEC CO., LTD. THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD. AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION DOCUMENT NO. PAGE REV. IM13400 PAGE A6 4 OF 4 ELECTRICAL CHARACTERISTICS (Tj = 25℃) INVERTER PART Item Collector-emitter saturation voltage FWD forward voltage drop Symbol Condition = V VCC B1S1,B2S2,B3S3 = 15V, IC =20A, VCIN = 0V Tj = 25℃, - IC = 20A, VCIN = 5V VD = 300V, VCC = VB1S1,B2S2,B3S3 = 15V, IC = 20A, Tj =25℃, VHIN =5V<―> 0V, VCIN = 0V, Inductive Load VCE (sat) VF Ton Switching times (Fig. 4) Tr Toff Tf Collector-emitter cut-off current ICES Tj=25℃ VCE =VCES Min. Typ. Max. Unit - 2.3 2.8 V V - 2.0 2.4 - 0.6 0.8 - 0.06 1.0 0.12 1.2 - 0.05 0.1 - - 0.32 μs mA Figure 4. Switching Time Define UNLESS OTHERWISE SPECIFIED TOLERQNCES ON ﹕ X = ± X.X = ± X.XX = ± ANGLES ± HOLE DIA. ± DRAWN BY ﹕ DESIGNED BY ﹕ CHECKED BY ﹕ APPROVED BY ﹕ SCALE ﹕ X UNIT ﹕ X TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A CYNTEC CO., LTD. THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD. AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION DOCUMENT NO. PAGE REV. IM13400 PAGE A6 5 OF 5 Test condition：Vdc =300V, Ic = 20A, Vcc = 15V, Vin = 0V→5V (Inductive Load), TC = 25℃ Vce：(100V/div) Ic：(5A/div) Figure 5. Testing Switching Waveform CONTROL PART (Tj = 25℃) Item HIN1,2,3 , LIN1,2,3 ON threshold voltage HIN1,2,3 , LIN1,2,3 OFF threshold voltage Symbol HIN1,2,3 input current LIN1,2,3 input current Driver IC supply voltage P-side floating supply voltage VCC terminal input current Fault output voltage Short circuit trip level Fault output pulse width Supply circuit under voltage protection Min. Typ. Max. Unit Vth(on) 1.4- 1.7 2.0 V Vth(off) 2.2 2.5 2.8 V 13.5 13.5 4.9 0.37 10.4 10.6 - 15.0 15.0 0.46 1.8 10.9 11.1 0.2 220 300 220 300 16.5 16.5 2.3 200 0.55 11.4 11.6 - IHIN(HI) IHIN(LO) ILIN(HI) ILIN(LO) VCC VB1S1,B2S2,B3S3 IC VFOH VFOL VSC(ref) tFO UVTVCC UVRVCC UVH Condition VHIN1,2,3 = 5V VHIN1,2,3 = 0V VLIN1,2,3 = 5V VLIN1,2,3 = 0V VCIN =0V VCIN =1V VCC=15V, Tj = 25℃ CF O =22nF ~ 33nF Trip level Reset level Hysteresis (Note 2) (Note 2) (Note 3) μA μA V V mA V mV V ms V V V Note 2 : FO output is open collector type, so this signal line should be pulled up to the +5V power supply with approximately 5.1KΩ. Note 3：CFO need to adjust if output can not fit 1.8 ms demand. UNLESS OTHERWISE SPECIFIED TOLERQNCES ON ﹕ X = ± X.X = ± X.XX = ± ANGLES ± HOLE DIA. ± DRAWN BY ﹕ DESIGNED BY ﹕ CHECKED BY ﹕ APPROVED BY ﹕ SCALE ﹕ X UNIT ﹕ X TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A CYNTEC CO., LTD. THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD. AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION DOCUMENT NO. PAGE REV. IM13400 PAGE A6 6 OF 6 THERMAL RESISTANCE Item Junction to case thermal resistance Symbol Rth(j-c)Q Rth(j-c)F Condition IGBT part (1/6) FWD part (1/6) Min. - Typ. - Max. 1.1 1.6 Unit ℃/W RECOMMENDED OPERATION CONDITIONS Item DC_ Link Supply voltage Control supply voltage Control supply voltage Input ON threshold voltage Input OFF threshold voltage Supply voltage ripple Arm shoot-through blocking time PWM Input frequency Symbol VD VCC VB1S1,B2S2,B3S3 VCIN(ON) VCIN(OFF) ΔVD , ΔVDB Condition Applied between P-N Applied between VCC - GND Applied between VB1,2,3 – VS1,2,3 Applied between HIN1,2,3 - GND and LIN1,2,3 - GND Min. 0 13.5 13.5 -1 t dead (Note 4) Unit V V V V V V/μs 2 - - μs - 15 - kHz Min. Typ. Max. Unit Recommended 1.18 N•m 0.98 1.18 1.37 N-m --- -50 75 - 100 g μm TC≦100℃, Tj≦125℃ fPWM Typ. Max. 300 400 15.0 16.5 15.0 16.5 0 ~ 0.65 4.0 ~ 5.5 1 Note 4：To prevent high and low side IGBT occurred shoot-through. MECHANICAL CHARACTERISTICS AND RATINGS Item Mounting torque Condition Mounting screw：M4 Weight Heat-sink flatness (Note 5) Note 5：Measurement point of heat-sink flatness. DIP-IPM Measurement point Place to contact a heat sink Heat sink Heat sink Figure 6. Measurement Point of Heat-sink Flatness UNLESS OTHERWISE SPECIFIED TOLERQNCES ON ﹕ X = ± X.X = ± X.XX = ± ANGLES ± HOLE DIA. ± DRAWN BY ﹕ DESIGNED BY ﹕ CHECKED BY ﹕ APPROVED BY ﹕ SCALE ﹕ X UNIT ﹕ X TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A CYNTEC CO., LTD. THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD. AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION DOCUMENT NO. PAGE REV. IM13400 PAGE A6 7 OF 7 Input/Output Timing Diagram Figure 7. Input/Output Timing Diagram Note 6：The shaded area indicates that both high-side and low-side switches are off and therefore the half-bridge output voltage would be determined by the direction of current flow in the load. Figure 8. Input/Output Signal Circuit UNLESS OTHERWISE SPECIFIED TOLERQNCES ON ﹕ X = ± X.X = ± X.XX = ± ANGLES ± HOLE DIA. ± DRAWN BY ﹕ DESIGNED BY ﹕ CHECKED BY ﹕ APPROVED BY ﹕ SCALE ﹕ X UNIT ﹕ X TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A CYNTEC CO., LTD. THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD. AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION DOCUMENT NO. PAGE REV. IM13400 PAGE A6 8 OF 8 LDIP-IPM Short-Circuit Protection Function S1. Normal operation：IGBT ON and carrying current. S2. Short circuit current detection (SC trigger). S3. IGBT gate interrupt and FO signal starts. S4. IGBT turns OFF. S5. IGBT OFF state. S6. FO signal reset. S7. Normal operation. Figure 9. Timing Chart of SC Operation UNLESS OTHERWISE SPECIFIED TOLERQNCES ON ﹕ X = ± X.X = ± X.XX = ± ANGLES ± HOLE DIA. ± DRAWN BY ﹕ DESIGNED BY ﹕ CHECKED BY ﹕ APPROVED BY ﹕ SCALE ﹕ X UNIT ﹕ X TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A CYNTEC CO., LTD. THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD. AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION DOCUMENT NO. PAGE REV. IM13400 PAGE A6 9 OF 9 LDIP-IPM Under-Voltage Protection Function S1. Normal operation：IGBT ON and carrying current. S2. Under-Voltage detection. S3. IGBT gate interrupt. S4. IGBT OFF state. S5. Under-Voltage reset. S6. Normal operation. Figure 10. Timing Chart of Under-Voltage Operation Recommended CPU I/O Interface Circuit Figure 11. I/O Interface Circuit Note 7：Depending on the wiring impedances and the PWM control circuit of the application’s PCB, the RC coupling at each input may be changed. UNLESS OTHERWISE SPECIFIED TOLERQNCES ON ﹕ X = ± X.X = ± X.XX = ± ANGLES ± HOLE DIA. ± DRAWN BY ﹕ DESIGNED BY ﹕ CHECKED BY ﹕ APPROVED BY ﹕ SCALE ﹕ X UNIT ﹕ X TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A CYNTEC CO., LTD. THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD. AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION DOCUMENT NO. PAGE REV. IM13400 PAGE A6 10 OF 10 Recommended Circuit Example When Using a Photo Coupler 5V 5V 15V Vcc P IN Microcomputer GND N (a) IPM input pin (high-side 3-phase and low-side 3-phase) 5V 15V Vcc P Microcomputer FO N GND (b) Fault output pin Figure 12. I/O Interface Circuit When Using Photo Coupler UNLESS OTHERWISE SPECIFIED TOLERQNCES ON ﹕ X = ± X.X = ± X.XX = ± ANGLES ± HOLE DIA. ± DRAWN BY ﹕ DESIGNED BY ﹕ CHECKED BY ﹕ APPROVED BY ﹕ SCALE ﹕ X UNIT ﹕ X TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A CYNTEC CO., LTD. THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD. AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION DOCUMENT NO. PAGE REV. IM13400 PAGE A6 11 OF 11 Direct Input (without Photo-Coupler) Interface Example +5V D1 D1 R2x6 M C2 R3 C5 C2 R3 C5 R3 D1 R1 C5 VS1 VB1 VCC VS2 VB2 VS3 VB3 VCC 4 3 2 8 7 13 12 C2 6 10 HIN1 HIN2 HIN3 LIN1 LIN2 LIN3 FO VCC 11 GND 14 VCC 1 C 5 9 19 U 20 21 18 C1 C1 Signal Input P 23 U Driver Circuit 24 Fault Logic V MOTOR 25 W 26 N Protection Circuit C1 C1 Gate 22 C1 C1 Supply Circuit +15V 15 GND 17 C3 CFO CIN C4 16 Shunt Resistor R4 Figure 13. Typical Application Circuit Interface Example with Direct Input Component selection : 1. R1：5.1KΩ ( FO output is open collector type. It is necessary to apply a resistor. ) 2. R2：4.7KΩ 3. R3：20Ω ( It could be adjusted depending on the PWM frequency. ) 4. R4：100Ω ( Recommended the time constant R4xC4 is 2μS. ) 5. C1：100 ~ 1000pF ( Ceramic ) ( The capacitor could filter the noise, but should be careful to the dead time) 6. C2：10 ~ 100μF ( Electrolytic, low impendence ) 7. C3：22nF ( Ceramic ) 8. C4：0.02μF ( Ceramic ) 9. C5：0.22 ~ 2μF ( Ceramic ) 10. D1：600V/1A ( Ultra-Fast recovery diode ) UNLESS OTHERWISE SPECIFIED TOLERQNCES ON ﹕ X = ± X.X = ± X.XX = ± ANGLES ± HOLE DIA. ± DRAWN BY ﹕ DESIGNED BY ﹕ CHECKED BY ﹕ APPROVED BY ﹕ SCALE ﹕ X UNIT ﹕ X TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A CYNTEC CO., LTD. THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD. AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION DOCUMENT NO. PAGE REV. IM13400 PAGE A6 12 OF 12 Interface Example when a Photo-Coupler is used +5V R2 U1 R5 R2 U1 R5 R1 Q1 C1 D1 R1 D1 Q1 C1 D1 C5 C2 R3 C5 C2 R3 C5 R3 4 3 C2 2 8 7 13 12 6 10 HIN1 HIN2 HIN3 LIN1 LIN2 LIN3 FO VCC 11 GND 14 VCC 1 5 9 R2 M U1 R5 C R6 U C6 R1 19 20 21 Q1 C1 18 R7 VS1 VB1 VCC VS2 VB2 VS3 VB3 VCC Signal U1 R5 Circuit R2 C1 U1 R5 V MOTOR 25 W 26 N Supply Circuit +15V 15 GND R1 Q1 C1 CFO CIN C3 16 C4 Shunt Resistor R4 +5V R2 U Protection Circuit 17 U1 R5 23 24 Fault Logic R1 Q1 P Driver U1 R2 Gate Input 22 R1 Q1 C1 Figure 14. Typical Application Circuit Interface Example with Photo Coupler Component selection : 1. R1：4.7KΩ 2. R2：150Ω 3. R3：20Ω ( It could be adjusted depending on the PWM frequency. ) 4. R4：100Ω ( Recommended the time constant R4xC4 is 2μS. ) 5. R5：1KΩ 6. R6：1KΩ 7. R7：1KΩ 8. C1：0.1μF 9. C2：10 ~ 100μF ( Electrolytic, low impendence ) 10. C3：22nF ( Ceramic ) 11. C4：0.02μF ( Ceramic ) 12. C5：0.22 ~ 2μF ( Ceramic ) 13. C6：0.1μF 14. D1：600V/1A ( Ultra-Fast recovery diode ) 15. Q1：NPN transistor 2N3904 16. U1：Photo coupler TLP521 UNLESS OTHERWISE SPECIFIED TOLERQNCES ON ﹕ X = ± X.X = ± X.XX = ± ANGLES ± HOLE DIA. ± DRAWN BY ﹕ DESIGNED BY ﹕ CHECKED BY ﹕ APPROVED BY ﹕ SCALE ﹕ X UNIT ﹕ X TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A CYNTEC CO., LTD. THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD. AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION DOCUMENT NO. PAGE REV. IM13400 PAGE A6 13 OF 13 Precautions on Electrostatic Electricity (1) Operators must wear anti-static clothing and conductive shoes (or a leg or heel strap). (2) Operators must wear a wrist strap grounded to earth via a resistor of about 1 MΩ. (3) Soldering irons must be grounded from iron tip to earth, and must be used only at low voltages. (4) If the tweezers you use are likely to touch the device terminals, use anti-static tweezers and in particular avoid metallic tweezers. If a charged device touches a low-resistance tool, rapid discharge can occur. When using vacuum tweezers, attach a conductive chucking pat to the tip, and connect it to a dedicated ground used especially for anti-static purposes (suggested resistance value: 104 to 108Ω). (5) Do not place devices or their containers near sources of strong electrical fields (such as above a CRT). (6) When storing printed circuit boards which have devices mounted on them, use a board container or bag that’s protected against static charge. To avoid the occurrence of static charge or discharge due to friction, keep the boards separate from one other and do not stack them directly on top of one another. (7) Ensure, if possible, that any articles (such as clipboards) which are brought to any location where the level of static electricity must be closely controlled are constructed of anti-static materials. (8) In cases where the human body comes into direct contact with a device, be sure to wear anti-static finger covers or gloves (suggested resistance value: 108Ω or less). (9) Equipment safety covers installed near devices should have resistance ratings of 109Ω or less. (10) If a wrist strap cannot be used for some reason, and there is a possibility of imparting friction to devices, use an ionizer. UNLESS OTHERWISE SPECIFIED TOLERQNCES ON ﹕ X = ± X.X = ± X.XX = ± ANGLES ± HOLE DIA. ± DRAWN BY ﹕ DESIGNED BY ﹕ CHECKED BY ﹕ APPROVED BY ﹕ SCALE ﹕ X UNIT ﹕ X TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A CYNTEC CO., LTD. THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD. AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION DOCUMENT NO. PAGE REV. IM13400 PAGE A6 14 OF 14