ISSI IS66WV1M16DALL

IS66WV1M16DALL
IS66WV1M16DBLL
PRELIMINARY INFORMATION
MARCH 2011
16Mb LOW VOLTAGE,
ULTRA LOW POWER PSEUDO CMOS STATIC RAM
FEATURES
DESCRIPTION
The ISSI IS66WV1M16DALL/DBLL is a high-speed,
16M bit static RAMs organized as 1Mb words by 16
bits. It is fabricated using ISSI's high-performance
CMOS technology. This highly reliable process coupled
with innovative circuit design techniques, yields highperformance and low power consumption devices.
• High-speed access time:
– 70ns (IS66WV1M16DALL/DBLL)
– 55ns (IS66WV1M16DBLL)
• CMOS low power operation
• Single power supply
– Vdd = 1.7V - 1.95V (IS66WV1M16DALL)
– Vdd = 2.5V - 3.6V (IS66WV1M16DBLL)
• Three state outputs
• Data control for upper and lower bytes
• Industrial temperature available
• Lead-free available
When CS1 is HIGH (deselected) or when CS2 is low
(deselected) or when CS1 is low, CS2 is high and both
LB and UB are HIGH, the device assumes a standby mode
at which the power dissipation can be reduced down with
CMOS input levels.
Easy memory expansion is provided by using Chip Enable
and Output Enable inputs. The active LOW Write Enable
(WE) controls both writing and reading of the memory. A
data byte allows Upper Byte (UB) and Lower Byte (LB)
access.
The IS66WV1M16DALL/DBLL is packaged in the JEDEC
standard 48-ball mini BGA (6mm x 8mm). The device is
also available for die sales.
FUNCTIONAL BLOCK DIAGRAM
A0-A19
DECODER
1M x 16
MEMORY ARRAY
I/O
DATA
CIRCUIT
COLUMN I/O
VDD
GND
I/O0-I/O7
Lower Byte
I/O8-I/O15
Upper Byte
CS2
CS1
OE
WE
UB
LB
CONTROL
CIRCUIT
Copyright © 2011 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no
liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on
any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause
failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written
assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
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IS66WV1M16DALL
IS66WV1M16DBLL
PIN CONFIGURATIONS:
48-Ball mini BGA (6mm x 8mm)
1
2
3
4
5
6
A
LB
OE
A0
A1
A2
CS2
B
I/O8
UB
A3
A4
CS1
I/O0
C
I/O9
I/O10
A5
A6
I/O1
I/O2
D
GND
I/O11
A17
A7
I/O3
VDD`
E
VDD
I/O12
NC
A16
I/O4
GND
F
I/O14
I/O13
A14
A15
I/O5
I/O6
G
I/O15
A19
A12
A13
WE
I/O7
H
A18
A8
A9
A10
A11
NC
Note:
TSOP package option is under evaluation.
PIN DESCRIPTIONS
A0-A19
I/O0-I/O15
CS1, CS2 OE WE LB
UB
NC
Vdd
GND
2
Address Inputs
Data Inputs/Outputs
Chip Enable Input
Output Enable Input
Write Enable Input
Lower-byte Control (I/O0-I/O7)
Upper-byte Control (I/O8-I/O15)
No Connection
Power
Ground
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IS66WV1M16DALL
IS66WV1M16DBLL
TRUTH TABLE
I/O PIN
Mode
WE CS1 CS2 OE
LB
UB
I/O0-I/O7
I/O8-I/O15
Not Selected
X
H
X
X
X
X
High-Z
High-Z
X
X
L
X
X
X
High-Z
High-Z
X
X
X
X
H
H
High-Z
High-Z
Output Disabled
H
L
H
H
L
X
High-Z
High-Z
H
L
H
H
X
L
High-Z
High-Z
Read
H
L
H
L
L
H
Dout
High-Z
H
L
H
L
H
L
High-Z
Dout
H
L
H
L
L
LDoutDout
Write
L
L
H
X
L
H
Din
High-Z
L
L
H
X
H
L
High-Z
Din
L
L
H
X
L
LDinDin
Vdd Current
Isb1, Isb2
Isb1, Isb2
Isb1, Isb2
Icc
Icc
Icc
Icc
OPERATING RANGE (Vdd)
Range
Ambient Temperature
(70ns)
(55ns)
Commercial
0°C to +70°C
1.7V - 1.95V, 2.5V - 3.6V
2.5V - 3.6V
Industrial
–40°C to +85°C
1.7V - 1.95V, 2.5V - 3.6V
2.5V - 3.6V
Automotive
–40°C to +105°C
2.5V-3.6V
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IS66WV1M16DALL
IS66WV1M16DBLL
ABSOLUTE MAXIMUM RATINGS(1)
Symbol
Vterm
Tbias
Vdd
Tstg
Pt
Parameter
Terminal Voltage with Respect to GND
Temperature Under Bias
Vdd Related to GND
Storage Temperature
Power Dissipation
Value
–0.2 to Vdd+0.3
–40 to +85
–0.2 to +3.8
–65 to +150
1.0
Unit
V
°C
V
°C
W
Note:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at these or any other conditions above
those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
Vdd = 2.5V-3.6V
Symbol
Voh
Vol
Vih
Vil
Ili
Ilo
Parameter
Test Conditions
Vdd
Output HIGH Voltage
Ioh = -1 mA
2.5-3.6V
Output LOW Voltage
Iol = 2.1 mA
2.5-3.6V
Input HIGH Voltage
2.5-3.6V
Input LOW Voltage
2.5-3.6V
Input Leakage
GND ≤ Vin ≤ Vdd
Output Leakage
GND ≤ Vout ≤ Vdd, Outputs Disabled
Min.
2.2
—
2.2
–0.2
–1
–1
Max.
—
0.4
Vdd + 0.3
0.6
1
1
Unit
V
V
V
V
µA
µA
Min.
1.4
—
1.4
–0.2
–1
–1
Max.
—
0.2
Vdd + 0.2
0.4
1
1
Unit
V
V
V
V
µA
µA
Notes:
Vil (min.) = –2.0V AC (pulse width < 10ns). Not 100% tested.
Vih (max.) = Vdd + 2.0V AC (pulse width < 10ns). Not 100% tested.
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
Vdd = 1.7V-1.95V
Symbol
Voh
Vol
Vih
Vil
Ili
Ilo
Parameter
Test Conditions
Vdd
Output HIGH Voltage
Ioh = -0.1 mA
1.7-1.95V
Output LOW Voltage
Iol = 0.1 mA
1.7-1.95V
Input HIGH Voltage
1.7-1.95V
Input LOW Voltage
1.7-1.95V
Input Leakage
GND ≤ Vin ≤ Vdd
Output Leakage
GND ≤ Vout ≤ Vdd, Outputs Disabled
Notes:
Vil (min.) = –1.0V AC (pulse width < 10ns). Not 100% tested.
Vih (max.) = Vdd + 1.0V AC (pulse width < 10ns). Not 100% tested.
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IS66WV1M16DALL
IS66WV1M16DBLL
CAPACITANCE(1)
Symbol
Cin
Cout
Parameter
Input Capacitance
Input/Output Capacitance
Conditions
Vin = 0V
Vout = 0V
Max.
8
10
Unit
pF
pF
Note:
1. Tested initially and after any design or process changes that may affect these parameters.
AC TEST CONDITIONS
Parameter
Input Pulse Level
Input Rise and Fall Times
Input and Output Timing
and Reference Level
Output Load
R1(Ω)
R2(Ω)
Vref
Vtm
1.7V-1.95V
(Unit)
0.4V to Vdd-0.2
5 ns
1.7V - 1.95V 3070
3150
0.9V
1.8V
2.5V-3.6V
(Unit)
0.4V to Vdd-0.3V
5ns
Vref
Vref
See Figures 1 and 2
See Figures 1 and 2
2.5V - 3.6V
1029
1728
1.4V
2.8V
AC TEST LOADS
R1
R1
VTM
VTM
OUTPUT
OUTPUT
30 pF
Including
jig and
scope
R2
Figure 1
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5 pF
Including
jig and
scope
R2
Figure 2
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IS66WV1M16DALL
IS66WV1M16DBLL
1.7V-1.95V POWER SUPPLY CHARACTERISTICS (Over Operating Range)
Symbol Parameter
Test Conditions
Icc
Vdd Dynamic Operating Vdd = Max.,
Com.
Supply Current
Iout = 0 mA, f = fmax
Ind.
All Inputs 0.4V Auto.
or Vdd – 0.2V Icc1
Operating Supply
Vdd = Max., CS1 = 0.2V
Com.
Current
WE = Vdd – 0.2V
Ind.
CS2 = Vdd – 0.2V, f = 1mhz Auto.
Isb1
TTL Standby Current
Vdd = Max.,
Com.
(TTL Inputs)
Vin = Vih or Vil
Ind.
CS1 = Vih , CS2 = Vil,
Auto.
f = 1 MHz
4
4
10
0.6
0.6
1
mA
100
120
150
µA
mA
OR
ULB Control
Isb2
CMOS Standby
Current (CMOS Inputs)
Max.
Unit
70ns
20
mA
25
30
Vdd = Max., Vin = Vih or Vil
CS1 = Vil, f = 0, UB = Vih, LB = Vih
Vdd = Max., Com.
CS1 ≥ Vdd – 0.2V,
Ind.
CS2 ≤ 0.2V,
Auto.
Vin ≥ Vdd – 0.2V, or
Vin ≤ 0.2V, f = 0
OR
ULB Control
Vdd = Max., CS1 = Vil, CS2=Vih
Vin ≥ Vdd – 0.2V, or Vin ≤ 0.2V, f = 0; UB / LB = Vdd – 0.2V
Note:.
1. At f = fmax, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
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IS66WV1M16DALL
IS66WV1M16DBLL
2.5V-3.6V POWER SUPPLY CHARACTERISTICS (Over Operating Range)
Symbol Parameter
Test Conditions
Icc
Vdd Dynamic Operating Vdd = Max.,
Com.
Supply Current
Iout = 0 mA, f = fmax
Ind.
All Inputs 0.4V
Auto.
or Vdd – 0.3V
typ.(2)
Icc1
Operating Supply
Vdd = Max., CS1 = 0.2V
Com.
Current
WE = Vdd – 0.2V
Ind.
CS2 = Vdd – 0.2V, f = 1mhz Auto.
Isb1
TTL Standby Current
Vdd = Max.,
Com.
(TTL Inputs)
Vin = Vih or Vil
Ind.
CS1 = Vih , CS2 = Vil,
Auto.
f = 1 MHz
OR
ULB Control
Isb2
CMOS Standby
Current (CMOS Inputs)
Max.
Unit
55ns
25
mA
28
35
15
5
mA
5
10
0.6
mA
0.6
1
Vdd = Max., Vin = Vih or Vil
CS1 = Vil, f = 0, UB = Vih, LB = Vih
Vdd = Max., Com.
CS1 ≥ Vdd – 0.2V,
Ind.
CS2 ≤ 0.2V,
Auto.
Vin ≥ Vdd – 0.2V, or
typ.(2)
Vin ≤ 0.2V, f = 0
100
130
150
75
µA
OR
ULB Control
Vdd = Max., CS1 = Vil, CS2=Vih
Vin ≥ Vdd – 0.2V, or Vin ≤ 0.2V, f = 0; UB / LB = Vdd – 0.2V
Note:
1. At f = fmax, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
2. Typical values are measured at Vdd = 3.0V, Ta = 25oC and not 100% tested.
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IS66WV1M16DALL
IS66WV1M16DBLL
READ CYCLE SWITCHING CHARACTERISTICS(1) (Over Operating Range)
55 ns 70 ns
Symbol
Parameter
Min.
Max.
Min.
Max.
trc
Read Cycle Time
55
—
70
—
taa
Address Access Time
—
55
—
70
toha
Output Hold Time
10
—
10
—
tacs1/tacs2
CS1/CS2 Access Time
—
55
—
70
tdoe
OE Access Time
—
25
—
35
(2)
thzoe OE to High-Z Output
—
20
—
25
(2)
tlzoe OE to Low-Z Output
5
—
5
—
thzcs1/thzcs2(2) CS1/CS2 to High-Z Output
0
20
0
25
tlzcs1/tlzcs2(2) CS1/CS2 to Low-Z Output
10
—
10
—
tba
LB, UB Access Time
—
55
—
70
thzb
LB, UB to High-Z Output
0
20
0
25
tlzb
LB, UB to Low-Z Output
0
—
0
—
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Notes:
1. Test conditions assume signal transition times of 5 ns or less, timing reference levels of 0.9V/1.5V, input pulse levels of 0.4 to
Vdd-0.2V/0.4V to Vdd-0.3V and output loading specified in Figure 1.
2. Tested with the load in Figure 2. Transition is measured ±100 mV from steady-state voltage. Not 100% tested.
AC WAVEFORMS
READ CYCLE NO. 1(1,2) (Address Controlled) (CS1 = OE = Vil, CS2 = WE = Vih, UB or LB = Vil)
tRC
ADDRESS
tAA
tOHA
DQ0-D15
8
PREVIOUS DATA VALID
tOHA
DATA VALID
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IS66WV1M16DALL
IS66WV1M16DBLL
AC WAVEFORMS
READ CYCLE NO. 2(1,3) (CS1, CS2, OE, AND UB/LB Controlled)
tRC
ADDRESS
tAA
tOHA
OE
tDOE
CS1
tHZOE
tLZOE
tACE1/tACE2
CS2
tLZCE1/
tLZCE2
tHZCS1/
tHZCS1
LB, UB
tLZB
DOUT
tBA
HIGH-Z
tHZB
DATA VALID
Notes:
1. WE is HIGH for a Read Cycle.
2. The device is continuously selected. OE, CS1, UB, or LB = Vil. CS2=WE=Vih.
3. Address is valid prior to or coincident with CS1 LOW transition.
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IS66WV1M16DALL
IS66WV1M16DBLL
WRITE CYCLE SWITCHING CHARACTERISTICS(1,2) (Over Operating Range)
55 ns 70 ns
Symbol
Parameter Min.
Max. Min. Max.
twc
Write Cycle Time
Unit
55
—
70
—
ns
tscs1/tscs2 CS1/CS2 to Write End
45
—
60
—
ns
taw
Address Setup Time to Write End 45
—
60
—
ns
tha
Address Hold from Write End
0
—
0
—
ns
tsa
Address Setup Time
0
—
0
—
ns
tpwb
LB, UB Valid to End of Write
45
—
60
—
ns
tpwe WE Pulse Width
45
15,000
tsd
Data Setup to Write End
25
(4)
thd
60 15,000
ns
—
30
ns
0
—
0
—­ns
—
Data Hold from Write End
(3)
thzwe WE LOW to High-Z Output
—
20
—
30
ns
tlzwe(3)
WE HIGH to Low-Z Output
5
—
5
—
ns
Notes:
1. Test conditions assume signal transition times of 5 ns or less, timing reference levels of 0.9V/1.5V, input pulse levels of 0.4 to
Vdd-0.2V/0.4V to Vdd-0.3V and output loading specified in Figure 1.
2. The internal write time is defined by the overlap of CS1 LOW, CS2 HIGH and UB or LB, and WE LOW. All signals must be in valid states to initiate a Write, but
any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling edge of the signal that terminates the
write.
3. Tested with the load in Figure 2. Transition is measured ±100 mV from steady-state voltage. Not 100% tested.
4. tpwe > thzwe + tsd when OE is LOW.
AC WAVEFORMS
WRITE CYCLE NO. 1(1,2) (CS1 Controlled, OE = HIGH or LOW)
tWC
ADDRESS
tHA
tSCS1
CS1
tSCS2
CS2
tAW
tPWE
WE
tPWB
LB, UB
tSA
DOUT
DATA UNDEFINED
tHZWE
tLZWE
HIGH-Z
tSD
DIN
tHD
DATA-IN VALID
Notes:
1. WRITE is an internally generated signal asserted during an overlap of the LOW states on the CS1 , CS2 and WE inputs and at
least one of the LB and UB inputs being in the LOW state.
2. WRITE = (CS1) [ (LB) = (UB) ] (WE).
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IS66WV1M16DALL
IS66WV1M16DBLL
WRITE CYCLE NO. 2 (WE Controlled: OE is HIGH During Write Cycle)
tWC
ADDRESS
OE
tHA
tSCS1
CS1
tSCS2
CS2
tAW
t PWE
WE
LB, UB
tSA
DOUT
tHZWE
tLZWE
HIGH-Z
DATA UNDEFINED
tSD
DIN
tHD
DATA-IN VALID
WRITE CYCLE NO. 3 (WE Controlled: OE is LOW During Write Cycle)
tWC
ADDRESS
OE
tHA
tSCS1
CS1
tSCS2
CS2
tAW
t PWE
WE
LB, UB
tSA
DOUT
DATA UNDEFINED
tHZWE
tLZWE
HIGH-Z
tSD
DIN
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tHD
DATA-IN VALID
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IS66WV1M16DALL
IS66WV1M16DBLL
WRITE CYCLE NO. 4 (UB/LB Controlled)
t WC
ADDRESS
t WC
ADDRESS 1
ADDRESS 2
OE
t SA
CS1
LOW
CS2
HIGH
t HA
t SA
WE
UB, LB
t HA
t PWB
t PWB
WORD 1
WORD 2
t HZWE
DOUT
t LZWE
HIGH-Z
DATA UNDEFINED
t HD
t SD
DIN
DATAIN
VALID
t HD
t SD
DATAIN
VALID
UB_CSWR4.eps
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IS66WV1M16DALL
IS66WV1M16DBLL
Please avoid address change for less than trc during the cycle time longer than 15 ms (Figure 1). Figure 2 & 3 provide
work around solution for this issue.
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IS66WV1M16DALL
IS66WV1M16DBLL
IS66WV1M16DALL
Industrial Range: -40°C to +85°C Voltage Range: 1.7V to 1.95V Speed (ns)
70
Order Part No.
IS66WV1M16DALL-70BLI
Package
mini BGA (6mm x 8mm), Lead-free
IS66WV1M16DBLL
Industrial Range: -40°C to +85°C Voltage Range: 2.5V to 3.6V Speed (ns)
55
70
14
Order Part No.
IS66WV1M16DBLL-55BLI
IS66WV1M16DBLL-70BLI
Package
mini BGA (6mm x 8mm), Lead-free
mini BGA (6mm x 8mm), Lead-free
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08/12/2008
Package Outline
1. CONTROLLING DIMENSION : MM .
2. Reference document : JEDEC MO-207
NOTE :
IS66WV1M16DALL
IS66WV1M16DBLL
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