H Surface Mount High Performance AlInGaP LED Indicators Technical Data SunPower Series HSMA-TX25 HSMD-TX25 HSMJ-TX25 Features Description • Outstanding LED Material Efficiency • Exceptional Light Output Over a Wide Range of Drive Currents • Colors: 590 nm Amber, 603 nm Orange, and 615 nm Reddish-Orange • Compatible with Automatic Placement Equipment • Compatible with Convective IR, Vapor Phase Reflow, and TTW Solder Processes • Packaged in 12 mm or 8 mm Tape on 7" or 13" Diameter Reels • EIA Standard Package • Low Package Profile • Non-diffused Package Excellent for Backlighting and Coupling to Light Pipes The LED material used in these devices is the very efficient absorbing Substrate aluminum indium gallium phosphide (AS AlInGaP), capable of producing high light output over a wide range of drive currents. These solid state surface mount indicators are designed with a flat top and sides to be easily handled by automatic placement equipment. A glue pad is provided for adhesive mounting processes. They are compatible with convective IR and vapor phase reflow soldering, through the wave (TTW) soldering, and conductive epoxy attachment processes. The package size and configuration conform to the EIA-535 BAAC standard specification for case size 3528 tantalum capacitors. The folded leads permit dense placement and provide an external solder joint for ease of inspection. These devices are non-diffused, providing high intensity for applications such as backlighting, light pipe illumination, and front panel indication. Device Selection Guide Amber λd = 590 nm Orange λd = 603 nm Reddish-Orange λd = 615 nm Description HSMA-T425 HSMD-T425 HSMJ-T425 12 mm Tape, 7" Reel, 2000 Devices HSMA-T525 HSMD-T525 HSMJ-T525 12 mm Tape, 13" Reel, 8000 Devices HSMA-T625 HSMD-T625 HSMJ-T625 8 mm Tape, 7" Reel, 2000 Devices HSMA-T725 HSMD-T725 HSMJ-T725 8 mm Tape, 13" Reel, 8000 Devices 5964-9352E 1-199 Package Dimensions 3.5 ± 0.2 (0.138 ± 0.008) 2.8 ± 0.2 (0.110 ± 0.008) 2.7 NOM. (0.106) 2.2 NOM. (0.087) NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. THE LEADS ARE COPPER ALLOY, 85% Sn/15% Pb PLATING. CATHODE NOTCH 3.1 NOM. (0.122) 1.9 ± 0.2 (0.075 ± 0.008) 0.7 MIN. (0.028) 0.1 (0.004) NOM. 0.8 ± 0.3 (0.031 ± 0.012) (2 PLACES) 2.2 ± 0.1 (0.087 ± 0.004) 1.3 (0.050) MIN. Tape and Reel Specifications Hewlett Packard surface mount LEDs are packaged tape and reel in accordance with EIA-481A, Taping of Surface Mount Components for Automatic Placement. This packaging system is compatible with tapefed automatic pick and place systems. Each reel is sealed in a vapor barrier bag for added protection. Bulk packaging in vapor barrier bags is available upon special request. USER FEED DIRECTION CATHODE PITCH: 4 mm (0.157 IN.) p h T T E D L R W A E K H C A P REEL DIAMETER: 178 mm (7 IN.) OR 330 mm (13 IN.) CARRIER TAPE WIDTH: 12 mm (0.472 IN.) OR 8 mm (0.315 IN.) 1-200 Absolute Maximum Ratings at TA = 25°C DC Forward Current[1,4,5] ............................................................ 50 mA Peak Forward Current[2] ........................................................... 200 mA Average Forward Current ........................................................... 45 mA (at IPEAK = 200 mA, f ≥ 1 KHz)[2] Transient Forward Current (10 µs Pulse)[3] .............................. 500 mA Reverse Voltage (IR = 100 µA) ......................................................... 5 V LED Junction Temperature ............................................................ 95°C Operating Temperature Range ....................................... -40°C to +85°C Storage Temperature Range .......................................... -40°C to +85°C Reflow Soldering Temperatures Convective IR ...................... 235°C Peak, above 183°C for 90 seconds Vapor Phase ........................................................ 215°C for 3 minutes Notes: 1. Derate linerally as shown in Figure 4. 2. Refer to Figure 5 to establish pulsed operating conditions. 3. The transient peak current is the maximum non-recurring peak current the device can withstand without damaging the LED die and wire bonds. 4. Drive currents between 5 mA and 30 mA are recommended for best long term performance. 5. Operation at currents below 5 mA is not recommended, please contact your HewlettPackard sales representative. Optical Characteristics at TA = 25°C Part Number Luminous Intensity IV (mcd) @ 10 mA Min. Typ. Peak Wavelength λPEAK (nm) Typ. Color, Dominant Wavelength λd[1] (nm) Typ. Viewing Angle 2 θ1/2 Degrees[2] Typ. Luminous Efficacy ηv (lm/w) HSMA-TX25 10 25 592 590 120 480 HSMD-TX25 10 25 607 603 120 370 HSMJ-TX25 10 25 621 615 120 263 Notes: 1. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the device. 2. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Electrical Characteristics at TA = 25°C Part Number Forward Voltage VF (Volts) @ IF = 10 mA Typ. Max. Reverse Breakdown VR (Volts) @ IR = 100 µA Min. Typ. Capacitance C (pF) VF = 0, f = 1 MHz Typ. Thermal Resistance RθJ-PIN (°C/W) Speed of Response τs (ns) Time Constant e-t/τ s Typ. HSMA-TX25 1.9 2.4 5 25 40 180 13 HSMD-TX25 1.9 2.4 5 25 40 180 13 HSMJ-TX25 1.9 2.4 5 25 40 180 13 1-201 200 1.0 ORANGE IF – FORWARD CURRENT – mA RELATIVE INTENSITY AMBER REDDISH ORANGE 0.5 0 550 594 600 607 621 650 180 160 140 120 100 80 60 40 20 0 1.0 700 WAVELENGTH – nm 1.5 2.0 2.5 3.0 VF – FORWARD VOLTAGE – V Figure 1. Relative Intensity vs. Wavelength. Figure 2. Forward Current vs. Forward Voltage. 55 5.0 60 4.0 3.0 2.0 1.0 45 40 35 RθJ-A = 439° C/W 30 RθJ-A = 244° C/W 25 20 15 10 5 0 0 0 10 20 30 40 0 10 20 30 40 50 60 70 80 90 100 110 50 TA – AMBIENT TEMPERATURE – °C IF – DC FORWARD CURRENT – mA Figure 4. Maximum Forward Current vs. Ambient Temperature. Derating Based on TJ Max = 95°C. Figure 3. Relative Luminous Intensity vs. Forward Current. 1.0 0.9 NORMALIZED INTENSITY 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 100 90 80 70 60 50 40 30 20 10 0 10 20 30 40 50 θ – ANGULAR DISPLACEMENT – DEGREES Figure 6. Relative Intensity vs. Angular Displacement. 1-202 60 70 80 90 100 IAVG – AVERAGE CURRENT – mA IF – FORWARD CURRENT – mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 50 f > 1 KHz 50 40 f > 300 Hz 30 f > 100 Hz 20 10 0 50 100 150 200 IPEAK – PEAK FORWARD CURRENT – mA Figure 5. Maximum Average Current vs. Peak Forward Current. Recommended Printed Circuit Board Attachment Pad Geometries INFRARED/VAPOR PHASE REFLOW SOLDERING COMPONENT LOCATION ON PAD 4.45 (0.175) 2.41 (0.095) 1.65 (0.065) COMPONENT LOCATION ON PAD CONDUCTIVE ATTACHMENT 4.45 (0.175) 2.41 (0.095) 1.65 (0.065) 0.64 (0.025) SQ. CENTERED HOLE NOTE: ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). Convective IR Reflow Soldering For information on convective IR reflow soldering, refer to the Supplement to Application Note 1060, Surface Mounting SMT LED Components. 1-203