HSMx-A10x-xxxxx PLCC-2 Surface Mount LED Indicator Data Sheet Description Features This family of SMT LEDs is packaged in the industry standard PLCC-2 package. These SMT LEDs have high reliability performance and are designed to work under a wide range of environmental conditions. This high reliability feature makes them ideally suited to be used under harsh interior automotive as well as interior signs application conditions. • Industry standard PLCC-2 package To facilitate easy pick & place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel will be shipped in single intensity and color bin, except red color, to provide close uniformity. • Available in 8 mm carrier tape on 7 inch reel (2000 pieces) These LEDs are compatible with IR solder reflow process. Due to the high reliability feature of these products, they can also be mounted using through-the-wave soldering process. The super wide viewing angle at 120˚ makes these LEDs ideally suited for panel, push button, or general backlighting in automotive interior, office equipment, industrial equipment, and home appliances. The flat top emitting surface makes it easy for these LEDs to mate with light pipes. With the built-in reflector pushing up the intensity of the light output, these LEDs are also suitable to be used as LED pixels in interior electronic signs. • High reliability LED package • High brightness using AlInGaP and InGaN dice technologies • Available in full selection of colors • Super wide viewing angle at 120˚ • Compatible with both IR and TTW soldering process Applications • Interior automotive – Instrument panel backlighting – Central console backlighting – Cabin backlighting • Electronic signs and signals – Interior full color sign – Variable message sign • Office automation, home appliances, industrial equipment – Front panel backlighting – Push button backlighting – Display backlighting CAUTION: HSMN,M,K and E-A10x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details. Package Dimensions 2.8 ± 0.2 2.2 ± 0.2 3.2 ± 0.2 1.9 ± 0.2 0.1 TYP. 0.8 ± 0.1 3.5 ± 0.2 0.8 ± 0.3 0.5 ± 0.1 CATHODE MARKING (ANODE MARKING FOR AlGaAs DEVICES) TOP MOUNT 2.8 ± 0.2 2.2 ± 0.2 1.9 ± 0.2 5.2 ± 0.2 3.2 ± 0.2 0.1 TYP. CATHODE MARKING REVERSE MOUNT NOTE: ALL DIMENSIONS IN MILLIMETERS. 0.5 ± 0.1 Device Selection Guide Red Part Number Min. Iv (mcd) Typ. Iv (mcd) Max. Iv (mcd) Test Current (mA) Dice Technology HSMS-A100-J00J1 4.0 15.0 - 20 GaP HSMS-A100-L00J1 10.0 15.0 - 20 GaP HSMS-A100-H70J23.0 - 8.0 10 GaP HSMS-A100-J80J2 5.0 - 15.5 10 GaP HSMH-A100-L00J1 10.0 15.0 - 20 AlGaAs HSMH-A100-N00J1 25.0 50.0 - 20 AlGaAs HSMH-A100-L70J2 12.5 -32.0 10 AlGaAs HSMH-A100-M80J2 20.0 - 62.0 10 AlGaAs HSMH-A100-P30J1 40.0 - 100.0 20 AlGaAs HSMC-A100-J00J1 4.0 100.0 - 20 AlInGaP HSMC-A100-Q00J1 63.0 100.0 - 20 AlInGaP HSMC-A100-R00J1 100.0 140.0 - 20 AlInGaP HSMC-A101-S00J1 160.0 220.0 - 20 AlInGaP HSMZ-A100-T00J1 250.0350.0 - 20 AlInGaP HSMC-A100-P30J1 40.0 - 100.0 20 AlInGaP HSMC-A101-R80J1 125.0 -395.0 20 AlInGaP HSMZ-A100-S80J1 200.0 - 620.0 20 AlInGaP Part Number Min. Iv (mcd) Typ. Iv (mcd) Max. Iv (mcd) Test Current (mA) Dice Technology HSMJ-A100-Q00J1 63.0 100.0 - 20 AlInGaP HSMJ-A101-S00J1 160.0 200.0 - 20 AlInGaP HSMV-A100-T00J1 250.0350.0 - 20 AlInGaP HSMJ-A100-Q30J1 63.0 - 155.0 20 AlInGaP HSMJ-A100-R40J1 100.0 -315.0 20 AlInGaP HSMJ-A101-R80J1 125.0 -395.0 20 AlInGaP HSMV-A100-S80J1 200.0 - 620.0 20 AlInGaP Part Number Min. Iv (mcd) Typ. Iv (mcd) Max. Iv (mcd) Test Current (mA) Dice Technology HSMD-A100-J00J1 4.0 15.0 - 20 GaP HSMD-A100-L00J1 10.0 15.0 - 20 GaP HSMD-A100-J7PJ2 5.0 - 12.5 10 GaP HSMD-A100-K4PJ2 6.3 - 20.0 10 GaP HSML-A100-Q00J1 63.0 100.0 - 20 AlInGaP HSML-A101-S00J1 160.0 220.0 - 20 AlInGaP HSML-A100-Q7PJ1 80.0 - 200.0 20 AlInGaP HSML-A100-R7PJ1 125.0 -315.0 20 AlInGaP HSML-A101-R8WJ1 125.0 -395.0 20 AlInGaP Red Orange Orange Device Selection Guide, continued Yellow/Amber Part Number Min. Iv (mcd) Typ. Iv (mcd) Max. Iv (mcd) Test Current (mA) Dice Technology HSMY-A100-J00J1 4.0 12.0 - 20 GaP HSMY-A100-L00J1 10.0 12.0 - 20 GaP HSMY-A100-J35J2 4.0 - 10.0 10 GaP HSMY-A100-K45J2 6.3 - 20.0 10 GaP HSMA-A100-Q00J1 63.0 100.0 - 20 AlInGaP HSMA-A101-S00J1 160.0 220.0 - 20 AlInGaP HSMU-A100-S00J1 160.0320.0 - 20 AlInGaP HSMA-A100-Q35J1 63.0 - 155.0 20 AlInGaP HSMA-A100-R45J1 100.0 -315.0 20 AlInGaP HSMA-A101-R8WJ1 125.0 -395.0 20 AlInGaP HSMU-A100-S4WJ1 160.0 - 500.0 20 AlInGaP Part Number Min. Iv (mcd) Typ. Iv (mcd) Max. Iv (mcd) Test Current (mA) Dice Technology HSMG-A100-J02J1 4.0 18.0 - 20 GaP HSMG-A100-K72J2 8.0 - 20.0 10 GaP HSME-A100-M02J1 16.0 70.0 - 20 AlInGaP - 100.0 20 AlInGaP Yellow Green HSME-A100-N82J130.0 Emerald Green Part Number Min. Iv (mcd) Typ. Iv (mcd) Max. Iv (mcd) Test Current (mA) Dice Technology HSMG-A100-H01J1 2.5 8.0 - 20 GaP HSMG-A100-G31J2 1.6 - 4.0 10 GaP HSMG-A100-H41J2 2.5 - 8.0 10 GaP HSME-A100-L01J1 10.0 40.0 - 20 AlInGaP HSME-A100-M3PJ1 16.0 - 40.0 20 AlInGaP Green Part Number HSMM-A101-R00J1 HSMM-A100-S00J1 HSMM-A101-Q7PJ1 HSMM-A101-R7PJ1 HSMM-A101-R8PJ1 HSMM-A100-S8PJ1 Min. Iv (mcd) Typ. Iv (mcd) Max. Iv (mcd) 100.0 200.0 - 160.0350.0 - 80.0 - 200.0 125.0 -315.0 125.0 -395.0 200.0 - 620.0 Test Current (mA) 20 20 20 20 20 20 Dice Technology InGaN InGaN InGaN InGaN InGaN InGaN Device Selection Guide, continued Cyan Part Number Min. Iv (mcd) Typ. Iv (mcd) Max. Iv (mcd) Test Current (mA) Dice Technology HSMK-A101-R00J1 100.0 170.0 - 20 InGaN HSMK-A100-S00J1 160.0 280.0 - 20 InGaN HSMK-A100-S8WJ1 200.0 - 620.0 20 InGaN HSMK-A101-Q3WJ1 63.0 - 155.0 20 InGaN HSMK-A101-R4WJ1 100.0 -315.0 20 InGaN Part Number Min. Iv (mcd) Typ. Iv (mcd) Max. Iv (mcd) Test Current (mA) Dice Technology HSMB-A100-J00J1 4.0 15.0 - 20 GaN HSMB-A100-J70J2 5.0 - 12.5 10 GaN HSMB-A100-K80J2 8.0 - 25.0 10 GaN HSMN-A101-N00J1 25.0 50.0 - 20 InGaN HSMN-A100-P00J1 40.0 70.0 - 20 InGaN HSMN-A101-N7YJ130.0 - 80.0 20 InGaN HSMN-A100-P8YJ1 - 155.0 20 InGaN Blue 50.0 Note: 1. The luminous intensity, Iv, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned with this axis. Part Numbering System HSM x 1 - A x 2 x 3 x 4 - x 5 x 6 x 7 x 8 x 9 Packaging Option Color Bin Selection Intensity Bin Select Device Specific Configuration Package Type LED Chip Color Absolute Maximum Ratings (TA = 25°C) Parameters HSMS/D/Y/G HSMH HSMC/J/L/A HSME HSMZ/V/U HSMM/K/B/N DC Forward Current[1]30 mA30 mA30 mA[3,4] 20 mA[4]30 mA[3,4]30 mA Peak Forward Current[2] 100 mA 100 mA 100 mA 100 mA 100 mA 100 mA Power Dissipation 60 mW 63 mW 48 mW 72 mW 114 mW 63 mW Reverse Voltage 5V Junction Temperature 110°C Operating Temperature –55°C to +100°C Storage Temperature –55°C to +100°C Notes: 1. Derate linearly as shown in Figure 4. 2. Duty factor = 10%, Frequency = 1 kHz. 3. Drive current between 10 mA and 30 mA is recommended for best long term performance. 4. Operation at current below 5 mA is not recommended. Optical Characteristics (TA = 25˚C) Peak Dominant Wavelength Wavelength[1] Dice λPEAK (nm) λD (nm) Color Part Number Technology Typ. Typ. Viewing Angle Luminous 2 θ1/2[2] Efficacy ηv[3] (Degrees) (lm/W) Typ. Typ. Luminous Intensity/ Total Flux Iv(mcd)/Φv(mlm) Typ. Red HSMS-A100 GaP 635 626 120 120 0.45 HSMH-A100 AlGaAs 645 637 120 63 0.45 HSMC-A10x AlInGaP 635 626 120 150 0.45 HSMZ-A100 AlInGaP 639 630 120 155 0.45 Red Orange HSMJ-A10x AlInGaP 621 615 120 240 0.45 HSMV-A100 AlInGaP 623 617 120 263 0.45 Orange HSMD-A100 GaP 600 602 120380 0.45 HSML-A10x AlInGaP 609 605 120320 0.45 Amber HSMY-A100 GaP 583 585 120 520 0.45 HSMA-A10x AlInGaP 592 590 120 480 0.45 HSMU-A100 AlInGaP 594 592 120 500 0.45 Yellow Green HSMG-A100 GaP 565 569 120 590 0.45 HSME-A100 AlInGaP 575 570 120 560 0.45 Emerald Green HSMG-A100 GaP 558 560 120 650 0.45 HSME-A100 AlInGaP 566 560 120 610 0.45 Green HSMM-A10x InGaN 523 525 120 500 0.45 Cyan HSMK-A10x InGaN 502 505 120300 0.45 Blue HSMB-A100 HSMN-A10x GaN InGaN 428 468 462 470 120 120 0.45 0.45 65 75 Notes: 1. The dominant wavelength, λD, is derived from the CIE Chromaticity Diagram and represents the color of the device. 2. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 3. Radiant intensity, Ie in watts/steradian, may be calculated from the equation Ie = Iv/ηv, where Iv is the luminous intensity in candelas and ηv is the luminous efficacy in lumens/watt. Electrical Characteristics (TA = 25˚C) Part Number Forward Voltage Reverse Voltage Reverse Voltage VF (Volts) @ IF = 20 mA VR @ 100 µA Typ. Max. Min. Thermal VR @ 10 µA Min. Resistance RθJP (°C/W) HSMS/D/Y/G 2.2 2.6 5 — 180 HSMH 1.9 2.6 5 — 180 HSMC/J/L/A/E 1.9 2.4 5 — 280 HSMZ/V/U 2.2 2.6 5 — 280 HSMB3.9 4.3 — 5 280 HSMM/K/N3.4 4.05 — 5 280 FORWARD CURRENT – mA 35 30 HSMS/D/Y/G HSMZ/V/U 25 20 HSMH 15 HSMC/J/L/A/E HSMM/K/N 10 HSMB 5 0 0 1 2 3 4 5 FORWARD VOLTAGE – V Figure 2. Forward current vs. forward voltage. Figure 1. Relative intensity vs. wavelength. Figure 3. Relative intensity vs. forward current. 35 30 HSMS/D/G/ Y/H/Z/V/U 25 CURRENT - mA CURRENT - mA 30 HSMC/J/L/A 20 HSME 15 HSMM/K/B/N 10 0 20 40 60 80 100 TEMPERATURE (°C) 120 Figure 4. Maximum forward current vs. ambient temperature. Derated based on TJMAX = 110˚C, RθJA = 500˚C/W. HSMS/D/G/Y/H 25 HSMC/J/L/A HSMZ/V/U 20 HSME 15 HSMM/K/N HSMB 10 5 5 0 540 DOMINANT WAVELENGTH – nm 35 0 530 510 20 40 60 80 TEMPERATURE (°C) 100 120 Figure 4b. Maximum Forward Current Vs. Solder Point Temperature. Derated based on TJMAX = 110°C, RθJP = 180°C/W or 280°C/W. CYAN 500 490 480 BLUE 470 460 0 GREEN 520 0 5 10 15 20 25 30 CURRENT – mA Figure 5. Dominant wavelength vs. forward current – InGaN devices. HSMx-A100 fig 5 35 DELTA VF (NORMALIZED AT 25°C) 0.5 0.4 0.3 0.2 0.1 GaP/AlGaAs/ AlInGaP 0 -0.1 -0.2 -0.3 -100 InGaN/GaN -50 0 50 100 150 TEMPERATURE – °C Figure 6. Forward voltage shift vs. temperature. Figure 7. Radiation Pattern. TEMPERATURE 10 to 30 SEC. 217 °C 200 °C 255 - 260 °C 3 °C/SEC. MAX. 6 °C/SEC. MAX. 150 °C 3 °C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. TIME (Acc. to J-STD-020C) Figure 8a. Recommended SnPb reflow soldering profile. Figure 8b. Recommended Pb-free reflow soldering profile. Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components. LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE TEMPERATURE – °C 250 4.50 1.50 2.60 200 150 FLUXING 100 BOTTOM SIDE OF PC BOARD 50 30 TOP SIDE OF PC BOARD PREHEAT 0 10 20 30 40 50 60 70 80 90 100 TIME – SECONDS CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150°C (100°C PCB) SOLDER WAVE TEMPERATURE = 245°C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40° LEADED SOLDER: SN63; FLUX: RMA LEAD-FREE SOLDER: 96.5 wt% SN, 3 wt% Ag, 0.5 wt% Cu NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. SOLDER RESIST Figure 9. Recommended wave soldering profile. Figure 10. Recommended soldering pad pattern. Figure 11. Tape leader and trailer dimensions. Figure 12. Tape dimensions. 10 Figure 13. Reel dimensions. Figure 14. Reeling orientation. 11 Intensity Bin Select (X5X6) Individual reel will contain parts from one half bin only. X5 Min Iv Bin X6 0 Full Distribution 33 half bins starting from X51 4 4 half bins starting from X51 5 5 half bins starting from X51 73 half bins starting from X52 8 4 half bins starting from X52 9 5 half bins starting from X52 Intensity Bin Limits Bin ID Min. (mcd) Max. (mcd) G1 1.80 2.24 G2 2.24 2.80 H1 2.803.55 H23.55 4.50 J1 4.50 5.60 J2 5.60 7.20 K1 7.20 9.00 K2 9.00 11.20 L1 11.20 14.00 L2 14.00 18.00 M1 18.00 22.40 M2 22.40 28.50 N1 28.5035.50 N235.50 45.00 P1 45.00 56.00 P2 56.00 71.50 Q1 71.50 90.00 Q2 90.00 112.50 R1 112.50 140.00 R2 140.00 180.00 S1 180.00 224.00 S2 224.00 285.00 T1 285.00355.00 T2355.00 450.00 U1 450.00 560.00 U2 560.00 715.00 V1 715.00 900.00 V2 900.00 1125.00 Tolerance of each bin limit = ± 12%. 12 Color Bin Select (X7) Individual reel will contain parts from one full bin only. X7 0 Full Distribution Z A and B only Y B and C only W C and D only V D and E only U E and F only T F and G only S G and H only Q A, B, and C only P B, C, and D only N C, D, and E only M D, E, and F only L E, F, and G only K F, G, and H only 1 A, B, C, and D only 2 E, F, G, and H only 3 B, C, D, and E only 4 C, D, E, and F only 5 A, B, C, D, and E only 6 B, C, D, E, and F only Color Bin Limits Emerald Green Min. (nm) Max. (nm) A 552.5 555.5 B 555.5 558.5 C 558.5 561.5 D 561.5 564.5 Amber A B C D E F Min. (nm) 582.0 584.5 587.0 589.5 592.0 594.5 Max. (nm) 584.5 587.0 589.5 592.0 594.5 597.0 Orange A B C D E Min. (nm) 597.0 600.0 603.0 606.0 609.0 Max. (nm) 600.0 603.0 606.0 609.0 612.0 Color Bin Limits Blue Min. (nm) A 460.0 B 465.0 C 470.0 D 475.0 Max. (nm) 465.0 470.0 475.0 480.0 Cyan A B C D Min. (nm) 490.0 495.0 500.0 505.0 Max. (nm) 495.0 500.0 505.0 510.0 Green Min. (nm) Max. (nm) A B C D 515.0 520.0 525.0 530.0 520.0 525.0 530.0 535.0 Yellow Green Min. (nm) Max. (nm) E 564.5 567.5 F 567.5 570.5 G 570.5 573.5 H 573.5 576.5 Red Orange A B Min. (nm) 611.0 616.0 Red Min. (nm) Full Distribution Max. (nm) 616.0 620.0 Max. (nm) Tolerance of each bin limit = ± 1 nm. Packaging Option (X8X9) Option Test Current J1 20 mA J4 20 mA H1 20 mA H4 20 mA J2 10 mA J5 10 mA H2 10 mA H5 10 mA Moisture Sensitivity Package Type Top Mount Top Mount Reverse Mount Reverse Mount Top Mount Top Mount Reverse Mount Reverse Mount Reel Size 7 inch 13 inch 7 inch 13 inch 7 inch 13 inch 7 inch 13 inch This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use - Unopen moisture barrier bag (MBB) can be stored at <40°C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. - It is not recommended to open the MBB prior to assembly (e.g. for IQC). B. Control after opening the MBB - The humidity indicator card (HIC) shall be read immediately upon opening of MBB. - The LEDs must be kept at <30°C / 60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours. C. Control for unfinished reel - For any unuse LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH. D. Control of assembled boards - If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of 672 hours. E. Baking is required if: - “10%” or “15%” HIC indicator turns pink. - The LEDs are exposed to condition of >30°C / 60% RH at any time. - The LEDs floor life exceeded 672 hours. Recommended baking condition: 60±5°C for 20 hours. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0040EN AV02-0198EN - May 30, 2007