BY228 Standard Avalanche Sinterglass Diode \ Features • Glass passivated junction • Hermetically sealed package Applications High voltage rectification Efficiency diode in horizontal deflection circuits Mechanical Data Case: Sintered glass case, SOD 64 Terminals: Plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any 949588 Weight: 860 mg, (max. 1000 mg) Parts Table Part Type differentiation BY228 Package VR = 1500 V; IFAV = 3 A SOD64 Absolute Maximum Ratings Tamb = 25 °C, unless otherwise specified Parameter Test condition Symbol Value Unit VR 1500 V IR = 100 µA VRRM 1650 V tp = 10 ms, half sinewave IFSM 50 A IFAV 3 A Tj 140 °C Tstg - 55 to + 175 °C ER 10 mJ Reverse voltage see electrical characteristics Repetitive peak reverse voltage Peak forward surge current Sub type Average forward current Junction temperature Storage temperature range Non repetitive reverse avalanche energy I(BR)R = 0.4 A Maximum Thermal Resistance Tamb = 25 °C, unless otherwise specified Parameter Junction ambient Test condition on PC board with spacing 25 mm http://www.luguang.cn Sub type Symbol Value Unit RthJA 70 K/W mail:[email protected] BY228 Standard Avalanche Sinterglass Diode Electrical Characteristics Tamb = 25 °C, unless otherwise specified Parameter Test condition Sub type Symbol Forward voltage IF = 5 A VF Reverse current VR = 1500 V IR VR = 1500 V, Tj = 140 °C Total Reverse recovery time Reverse recovery time Min Typ. Max Unit 1.5 V 5 µA IR 140 µA IF = 1 A, - diF/dt = 0.05 A/µs trr 20 µs IF = 0.5 A, IR = 1 A, iR = 0,25 A trr 2 µs 2 R thJA – Therm. Resist. Junction / Ambient ( K/W ) Typical Characteristics (Tamb = 25 °C unless otherwise specified) 40 I FAV – Average Forward Current ( A ) 3.5 30 20 l l 10 TL=constant 0 0 5 10 15 20 25 2.5 2.0 1.5 1.0 RthJA=70K/W PCB: d=25mm 0.5 0.0 30 l – Lead Length ( mm ) 94 9081 VR=VRRM half sinewave RthJA=25K/W l=10mm 3.0 0 Figure 1. Typ. Thermal Resistance vs. Lead Length 25 50 75 100 125 150 Tamb – Ambient Temperature ( °C ) 16408 Figure 3. Max. Average Forward Current vs. Ambient Temperature 1000 100.000 VR = VRRM IR – Reverse Current ( mA ) I F – Forward Current ( A) 10.000 Tj=150°C 1.000 Tj=25°C 0.100 0.010 0.001 10 1 0.0 16407 100 0.5 1.0 1.5 2.0 2.5 3.0 VF – Forward Voltage ( V ) Figure 2. Forward Current vs. Forward Voltage http://www.luguang.cn 25 16409 50 75 100 125 150 Tj – Junction Temperature ( °C ) Figure 4. Reverse Current vs. Junction Temperature mail:[email protected] BY228 Standard Avalanche Sinterglass Diode PR – Reverse Power Dissipation ( mW ) 350 70 VR = VRRM CD – Diode Capacitance ( pF ) 300 250 PR–Limit @100%VR 200 150 PR–Limit @80%VR 100 50 0 50 40 30 20 10 0 25 16410 f=1MHz 60 50 75 100 125 Tj – Junction Temperature ( °C ) 150 0.1 16411 Figure 5. Max. Reverse Power Dissipation vs. Junction Temperature 1.0 10.0 VR – Reverse Voltage ( V ) Figure 6. Diode Capacitance vs. Reverse Voltage Package Dimensions in mm Sintered Glass Case SOD 64 Weight max. 1.0g Cathode Identification ∅ 4.3 max. technical drawings according to DIN specifications ∅ 1.35 max. 26 min. 4.2 max. http://www.luguang.cn 100.0 26 min. 94 9587 mail:[email protected]