MPS MP4560DN

MP4560
2A, 2MHz, 55V
Step-Down Converter
The Future of Analog IC Technology
FEATURES
DESCRIPTION
The MP4560 is a high frequency step-down
switching regulator with integrated internal highside high voltage power MOSFET. It provides 2A
output with current mode control for fast loop
response and easy compensation.
The wide 3.8V to 55V input range accommodates
a variety of step-down applications, including
those in automotive input environment. A 12µA
shutdown mode supply current allows use in
battery-powered applications.
High power conversion efficiency over a wide
load range is achieved by scaling down the
switching frequency at light load condition to
reduce the switching and gate driving losses.
The frequency foldback helps prevent inductor
current runaway during startup and thermal
shutdown provides reliable, fault tolerant
operation.
By switching at 2MHz, the MP4560 is able to
prevent EMI (Electromagnetic Interference) noise
problems, such as those found in AM radio and
ADSL applications.
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•
Wide 3.8V to 55V Operating Input Range
250mΩ Internal Power MOSFET
Up to 2MHz Programmable Switching
Frequency
140μA Quiescent Current
Ceramic Capacitor Stable
Internal Soft-Start
Up to 95% Efficiency
Output Adjustable from 0.8V to 52V
Available in 3x3 10-Pin QFN and SOIC8
with Exposed Pad Packages
APPLICATIONS
•
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High Voltage Power Conversion
Automotive Systems
Industrial Power Systems
Distributed Power Systems
Battery Powered Systems
All MPS parts are lead-free and adhere to the RoHS directive.For MPS green
status, please visit MPS website under Quality Assurance. “MPS” and “The
Future of Analog IC Technology” are Registered Trademarks of Monolithic
Power Systems, Inc.
The MP4560 is available in small 3mm x 3mm
10-pin QFN and SOIC8 with exposed pad
packages.
TYPICAL APPLICATION
C4
100nF
Efficiency @VOUT=3.3V
fs=500kHz
100
10
8,9
VIN
BST
SW
1,2
D1
EN
3
7
EN
MP4560
FB
COMP
FREQ
GND
6
C6
NS
5
4
C3
680pF
C5
NS
Vin=12V
90
VOUT
3.3V
80
EFFICIENCY (%)
VIN
70
Vin=55V
60
50
40
30
20
10
0
0
0.5
1
1.5
2
OUTPUT CURRENT (A)
MP4560 Rev. 1.0
11/5/2012
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1
MP4560 – 2A, 2MHz, 55V STEP-DOWN CONVERTER
ORDERING INFORMATION
Part Number
Package
3x3 QFN10
SOIC8E
MP4560DQ*
MP4560DN**
Top Marking
T8
MP4560DN
* For Tape & Reel, add suffix –Z (e.g. MP4560DQ–Z).
For RoHS compliant packaging, add suffix –LF (e.g. MP4560DQ–LF–Z)
** For Tape & Reel, add suffix –Z (e.g. MP4560DN–Z).
For RoHS compliant packaging, add suffix –LF (e.g. MP4560DN–LF–Z)
PACKAGE REFERENCE
TOP VIEW
TOP VIEW
SW
1
10
BST
SW
2
9
VIN
EN
3
8
VIN
COMP
4
7
FREQ
FB
5
6
GND
SW
1
8
BST
EN
2
7
VIN
COMP
3
6
FREQ
FB
4
5
GND
EXPOSED PAD
EXPOSED PAD
3x3 QFN10
SOIC8E
ABSOLUTE MAXIMUM RATINGS (1)
Thermal Resistance
Supply Voltage (VIN).....................–0.3V to +60V
Switch Voltage (VSW)............ –0.5V to VIN + 0.5V
BST to SW .....................................–0.3V to +5V
All Other Pins .................................–0.3V to +5V
(2)
Continuous Power Dissipation(TA = +25°C)
3x3 QFN10……………………………………2.5W
SOIC8 (Exposed Pad)………………………2.5W
Junction Temperature ...............................150°C
Lead Temperature ....................................260°C
Storage Temperature.............. –65°C to +150°C
3x3 QFN10..............................50 ...... 12 ... °C/W
SOIC8 (Exposed Pad) ............50 ...... 10 ... °C/W
Recommended Operating Conditions
(3)
Supply Voltage VIN ...........................3.8V to 55V
Output Voltage VOUT .........................0.8V to 52V
Operating Junction Temp. (TJ). -40°C to +125°C
MP4560 Rev. 1.0
11/5/2012
(4)
θJA
θJC
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ (MAX), the junction-toambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = (TJ
(MAX)-TA)/θJA. Exceeding the maximum allowable power
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.
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2
MP4560 – 2A, 2MHz, 55V STEP-DOWN CONVERTER
ELECTRICAL CHARACTERISTICS
VIN = 12V, VEN = 2.5V, VCOMP = 1.4V, TA= +25°C, unless otherwise noted.
Specifications over temperature are guaranteed by design and characterization.
Parameter
Feedback Voltage
Upper Switch On Resistance (5)
Upper Switch Leakage
Symbol Condition
4.5V < VIN < 55V
VFB
–40°C to +85°C
VBST – VSW = 5V
RDS(ON)
–40°C to +85°C
VEN = 0V, VSW = 0V
Current Limit
–40°C to +85°C
COMP to Current Sense
Transconductance
Error Amp Voltage Gain
Error Amp Transconductance
Error Amp Min Source current
Error Amp Min Sink current
VIN UVLO Threshold
VIN UVLO Hysteresis
Soft-Start Time (5)
Oscillator Frequency
Minimum Switch On Time
Shutdown Supply Current
Quiescent Supply Current
Thermal Shutdown
Minimum Off Time
Minimum On Time (5)
EN Up Threshold
Min
0.780
0.772
175
160
2.6
2.2
GCS
ICOMP = ±3µA
VFB = 0.7V
VFB = 0.9V
–40°C to +85°C
0V < VFB < 0.8V
RFREQ = 95kΩ
–40°C to +85°C
2.7
2.4
0.8
0.7
VEN < 0.3V
No load, VFB = 0.9V
Hysteresis = 20°C
–40°C to +85°C
EN Threshold Hysteresis
1.4
1.3
Typ
0.800
250
1
3.2
Max
0.820
0.829
330
400
Units
V
mΩ
μA
4.5
4.7
A
5.7
A/V
400
120
10
-10
3.0
V/V
µA/V
µA
µA
0.35
0.5
1
100
12
140
150
100
100
1.55
320
3.3
3.6
V
V
ms
1.2
1.3
20
1.7
1.8
MHz
ns
µA
µA
°C
ns
ns
V
mV
Note:
5) Derived from bench characterization. Not tested in production.
MP4560 Rev. 1.0
11/5/2012
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3
MP4560 – 2A, 2MHz, 55V STEP-DOWN CONVERTER
PIN FUNCTIONS
QFN
Pin #
SOIC8
Pin #
1, 2
1
3
2
4
3
5
4
6
5
7
6
8, 9
7
10
8
MP4560 Rev. 1.0
11/5/2012
Name
Description
Switch Node. This is the output from the high-side switch. A low VF Schottky rectifier
to ground is required. The rectifier must be close to the SW pins to reduce switching
spikes.
Enable Input. Pulling this pin below the specified threshold shuts the chip down.
EN
Pulling it up above the specified threshold or leaving it floating enables the chip.
Compensation. This node is the output of the GM error amplifier. Control loop
COMP
frequency compensation is applied to this pin.
Feedback. This is the input to the error amplifier. An external resistive divider
FB
connected between the output and GND is compared to the internal +0.8V reference
to set the regulation voltage.
GND, Ground. It should be connected as close as possible to the output capacitor avoiding
Exposed the high current switch paths. Connect exposed pad to GND plane for optimal thermal
pad
performance.
Switching Frequency Program Input. Connect a resistor from this pin to ground to set
FREQ
the switching frequency.
Input Supply. This supplies power to all the internal control circuitry, both BS
VIN
regulators and the high-side switch. A decoupling capacitor to ground must be placed
close to this pin to minimize switching spikes.
Bootstrap. This is the positive power supply for the internal floating high-side
BST
MOSFET driver. Connect a bypass capacitor between this pin and SW pin.
SW
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MP4560 – 2A, 2MHz, 55V STEP-DOWN CONVERTER
TYPICAL PERFORMANCE CHARACTERISTICS
VIN = 12V, VOUT =3.3V, C1 = 4.7µF, C2 = 22µF, L1 = 10µH and TA = +25°C, unless otherwise noted.
Efficiency @VOUT=2.5V
Efficiency @VOUT=5V
100
90
Vin=12V
80
EFFICIENCY (%)
EFFICIENCY (%)
50
40
30
20
70
Vin=55V
60
50
Vsw
10V/div
40
30
20
IL
500mA/div
10
10
0
VOUT
AC Coupled
10mV/div
80
Vin=48V
IOUT=0.1A
Vin=12V
90
70
60
Output Voltage Ripple
L1=15uH, fs=500kHz
0
0
0.5
1
1.5
2
0
0.5
1
1.5
OUTPUT CURRENT (A)
OUTPUT CURRENT (A)
Output Voltage Ripple
Output Voltage Ripple
IOUT=1A
IOUT=2A
VOUT
AC Coupled
10mV/div
VOUT
AC Coupled
10mV/div
Vsw
10V/div
Vsw
10V/div
IL
1A/div
IL
2A/div
MP4560 Rev. 1.0
11/5/2012
2
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5
MP4560 – 2A, 2MHz, 55V STEP-DOWN CONVERTER
TYPICAL PERFORMANCE CHARACTERISTICS
VIN = 12V, VOUT =3.3V, C1 = 4.7µF, C2 = 22µF, L1 = 10µH and TA = +25°C, unless otherwise noted.
Strart up
Strart up
Strart up
IOUT=0.1A
IOUT=1A
IOUT=2A
VEN
2V/div
VEN
2V/div
VEN
2V/div
VOUT
2V/div
VOUT
2V/div
VOUT
2V/div
Vsw
10V/div
IL
1A/div
Vsw
10V/div
Vsw
10V/div
IL
1A/div
IL
2A/div
10ms/div
4ms/div
4ms/div
Shut down
Shut down
Shut down
IOUT=0.1A
IOUT=1A
IOUT=2A
VEN
2V/div
VEN
2V/div
VEN
2V/div
VOUT
2V/div
VOUT
2V/div
VOUT
2V/div
Vsw
10V/div
IL
1A/div
Vsw
10V/div
Vsw
10V/div
IL
1A/div
IL
2A/div
1ms/div
Short Circuit Entry
Short Circuit Steady State
Short Circuit Recovery
IOUT=0.1A to Short
IOUT=Short to 0A
VOUT
2V/div
VOUT
2V/div
VOUT
2V/div
Vsw
10V/div
Vsw
10V/div
Vsw
10V/div
IL
1A/div
IL
1A/div
IL
2A/div
MP4560 Rev. 1.0
11/5/2012
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6
MP4560 – 2A, 2MHz, 55V STEP-DOWN CONVERTER
BLOCK DIAGRAM
VIN
REFERENCE
UVLO
EN
INTERNAL
REGULATORS
BST
ISW
0.5ms SS
-+
SS
LOGIC
SW
FB
SS
0V8
--
COMP
+
OSCILLATOR
COMP
GND
FREQ
Figure 1—Functional Block Diagram
OPERATION
The MP4560 is a programmable frequency,
non-synchronous, step-down switching regulator
with an integrated high-side high voltage power
MOSFET. It provides a single highly efficient
solution with current mode control for fast loop
response and easy compensation. It features a
wide input voltage range, internal soft-start
control and precision current limiting. Its very low
operational quiescent current makes it suitable
for battery powered applications.
PWM Control Mode
At moderate to high output current, the MP4560
operates in a fixed frequency, peak current
control mode to regulate the output voltage. A
PWM cycle is initiated by the internal clock. The
power MOSFET is turned on and remains on
until its current reaches the value set by the
COMP voltage. When the power switch is off, it
remains off for at least 100ns before the next
cycle starts. If, in one PWM period, the current in
MP4560 Rev. 1.0
11/5/2012
the power MOSFET does not reach the COMP
set current value, the power MOSFET remains
on, saving a turn-off operation.
Pulse Skipping Mode
Under light load condition the switching
frequency stretches down zero to reduce the
switching loss and driving loss.
Error Amplifier
The error amplifier compares the FB pin voltage
with the internal reference (REF) and outputs a
current proportional to the difference between the
two. This output current is then used to charge
the external compensation network to form the
COMP voltage, which is used to control the
power MOSFET current.
During operation, the minimum COMP voltage is
clamped to 0.9V and its maximum is clamped to
2.0V. COMP is internally pulled down to GND in
shutdown mode. COMP should not be pulled up
beyond 2.6V.
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7
MP4560 – 2A, 2MHz, 55V STEP-DOWN CONVERTER
Internal Regulator
Most of the internal circuitries are powered from
the 2.6V internal regulator. This regulator takes
the VIN input and operates in the full VIN range.
When VIN is greater than 3.0V, the output of the
regulator is in full regulation. When VIN is lower
than 3.0V, the output decreases.
Enable Control
The MP4560 has a dedicated enable control pin
(EN). With high enough input voltage, the chip
can be enabled and disabled by EN which has
positive logic. Its falling threshold is a precision
1.2V, and its rising threshold is 1.5V (300mV
higher).
When floating, EN is pulled up to about 3.0V by
an internal 1µA current source so it is enabled.
To pull it down, 1µA current capability is needed.
When EN is pulled down below 1.2V, the chip is
put into the lowest shutdown current mode.
When EN is higher than zero but lower than its
rising threshold, the chip is still in shutdown
mode but the shutdown current increases slightly.
Under-Voltage Lockout (UVLO)
Under-voltage lockout (UVLO) is implemented to
protect the chip from operating at insufficient
supply voltage. The UVLO rising threshold is
about 3.0V while its falling threshold is a
consistent 2.6V.
Internal Soft-Start
The soft-start is implemented to prevent the
converter output voltage from overshooting
during startup and short circuit recovery. When
the chip starts, the internal circuitry generates a
soft-start voltage (SS) ramping up from 0V to
2.6V. When it is lower than the internal reference
(REF), SS overrides REF so the error amplifier
uses SS as the reference. When SS is higher
than REF, REF regains control.
Thermal Shutdown
Thermal shutdown is implemented to prevent the
chip from operating at exceedingly high
temperatures. When the silicon die temperature
is higher than its upper threshold, it shuts down
the whole chip. When the temperature is lower
than its lower threshold, the chip is enabled again.
MP4560 Rev. 1.0
11/5/2012
Floating Driver and Bootstrap Charging
The floating power MOSFET driver is powered by
an external bootstrap capacitor. This floating
driver has its own UVLO protection. This UVLO’s
rising threshold is 2.2V with a hysteresis of
150mV. The driver’s UVLO is soft-start related. In
case the bootstrap voltage hits its UVLO, the
soft-start circuit is reset. To prevent noise, there
is 20µs delay before the reset action. When
bootstrap UVLO is gone, the reset is off and then
soft-start process resumes.
The bootstrap capacitor is charged and regulated
to about 5V by the dedicated internal bootstrap
regulator. When the voltage between the BST
and SW nodes is lower than its regulation, a
PMOS pass transistor connected from VIN to
BST is turned on. The charging current path is
from VIN, BST and then to SW. External circuit
should provide enough voltage headroom to
facilitate the charging.
As long as VIN is sufficiently higher than SW, the
bootstrap capacitor can be charged. When the
power MOSFET is ON, VIN is about equal to SW
so the bootstrap capacitor cannot be charged.
When the external diode is on, the difference
between VIN and SW is largest, thus making it
the best period to charge. When there is no
current in the inductor, SW equals the output
voltage VOUT so the difference between VIN and
VOUT can be used to charge the bootstrap
capacitor.
At higher duty cycle operation condition, the time
period available to the bootstrap charging is less
so the bootstrap capacitor may not be sufficiently
charged.
In case the internal circuit does not have
sufficient voltage and the bootstrap capacitor is
not charged, extra external circuitry can be used
to ensure the bootstrap voltage is in the normal
operational region. Refer to External Bootstrap
Diode in Application section.
The DC quiescent current of the floating driver is
about 20µA. Make sure the bleeding current at
the SW node is higher than this value, such that:
IO +
VO
> 20μA
(R1 + R2)
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8
MP4560 – 2A, 2MHz, 55V STEP-DOWN CONVERTER
Current Comparator and Current Limit
The power MOSFET current is accurately sensed
via a current sense MOSFET. It is then fed to the
high speed current comparator for the current
mode control purpose. The current comparator
takes this sensed current as one of its inputs.
When the power MOSFET is turned on, the
comparator is first blanked till the end of the turnon transition to avoid noise issues. The
comparator then compares the power switch
current with the COMP voltage. When the
sensed current is higher than the COMP voltage,
the comparator output is low, turning off the
power MOSFET. The cycle-by-cycle maximum
current of the internal power MOSFET is
internally limited.
Short Circuit Protection
When the output is shorted to the ground, the
switching frequency is folded back and the
current limit is reduced to lower the short circuit
current. When the voltage of FB is at zero, the
current limit is reduced to about 50% of its full
current limit. When FB voltage is higher than
0.4V, current limit reaches 100%.
In short circuit FB voltage is low, the SS is pulled
down by FB and SS is about 100mV above FB.
In case the short circuit is removed, the output
voltage will recover at the SS pace. When FB is
high enough, the frequency and current limit
return to normal values.
MP4560 Rev. 1.0
11/5/2012
Startup and Shutdown
If both VIN and EN are higher than their
appropriate thresholds, the chip starts. The
reference block starts first, generating stable
reference voltage and currents, and then the
internal regulator is enabled. The regulator
provides stable supply for the remaining
circuitries.
While the internal supply rail is up, an internal
timer holds the power MOSFET OFF for about
50µs to blank the startup glitches. When the
internal soft-start block is enabled, it first holds its
SS output low to ensure the remaining circuitries
are ready and then slowly ramps up.
Three events can shut down the chip: EN low,
VIN low and thermal shutdown. In the shutdown
procedure, power MOSFET is turned off first to
avoid any fault triggering. The COMP voltage and
the internal supply rail are then pulled down.
Programmable Oscillator
The MP4560 oscillating frequency is set by an
external resistor, RFREQ from the FREQ pin to
ground. The value of RFREQ can be calculated
from:
RFREQ (kΩ) =
100000
-5
fS (kHz)
To get fSW=500kHz, RFREQ=195kΩ.
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9
MP4560 – 2A, 2MHz, 55V STEP-DOWN CONVERTER
APPLICATION INFORMATION
COMPONENT SELECTION
Setting the Output Voltage
The output voltage is set using a resistive voltage
divider from the output voltage to FB pin. The
voltage divider divides the output voltage down to
the feedback voltage by the ratio:
VFB =VOUT ×
R2
R1+R2
Thus the output voltage is:
VOUT =VFB ×
R1+R2
R2
For example, the value for R2 can be 10kΩ. With
this value, R1 can be determined by:
R1=12.5 × (VOUT -0.8)(KΩ)
For example, for a 3.3V output voltage, R2 is
10kΩ, and R1 is 31.6kΩ.
Inductor
The inductor is required to supply constant
current to the output load while being driven by
the switched input voltage. A larger value
inductor will result in less ripple current that will
result in lower output ripple voltage. However, the
larger value inductor will have a larger physical
size, higher series resistance, and/or lower
saturation current.
A good rule for determining the inductance to use
is to allow the peak-to-peak ripple current in the
inductor to be approximately 30% of the
maximum switch current limit. Also, make sure
that the peak inductor current is below the
maximum switch current limit. The inductance
value can be calculated by:
L1=
VOUT
fs × ΔIL
× (1-
VOUT
VIN
)
Where VOUT is the output voltage, VIN is the input
voltage, fS is the switching frequency, and ∆IL is
the peak-to-peak inductor ripple current.
Choose an inductor that will not saturate under
the maximum inductor peak current. The peak
inductor current can be calculated by:
ILP = ILOAD +
⎛
⎞
VOUT
V
× ⎜⎜1 − OUT ⎟⎟
2 × fS × L1 ⎝
VIN ⎠
Where ILOAD is the load current.
Table 1 lists a number of suitable inductors from
various manufacturers. The choice of which style
inductor to use mainly depends on the price vs.
size requirements and any EMI requirement.
MP4560 Rev. 1.0
11/5/2012
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10
MP4560 – 2A, 2MHz, 55V STEP-DOWN CONVERTER
Table 1—Inductor Selection Guide
Inductance
(µH)
Max DCR
(Ω)
Current Rating
(A)
Dimensions
L x W x H (mm3)
7447789004
4.7
0.033
2.9
7.3x7.3x3.2
744066100
10
0.035
3.6
10x10x3.8
744771115
15
0.025
3.75
12x12x6
744771122
22
0.031
3.37
12x12x6
RLF7030T-4R7
4.7
0.031
3.4
7.3x6.8x3.2
SLF10145T-100
10
0.0364
3
10.1x10.1x4.5
SLF12565T-150M4R2
15
0.0237
4.2
12.5x12.5x6.5
SLF12565T-220M3R5
22
0.0316
3.5
12.5x12.5x6.5
FDV0630-4R7M
4.7
0.049
3.3
7.7x7x3
919AS-100M
10
0.0265
4.3
10.3x10.3x4.5
919AS-160M
16
0.0492
3.3
10.3x10.3x4.5
919AS-220M
22
0.0776
3
10.3x10.3x4.5
Part Number
Wurth Electronics
TDK
Toko
Output Rectifier Diode
The output rectifier diode supplies the current to
the inductor when the high-side switch is off. To
reduce losses due to the diode forward voltage
and recovery times, use a Schottky diode.
Choose a diode whose maximum reverse voltage
rating is greater than the maximum input voltage,
and whose current rating is greater than the
maximum load current. Table 2 lists example
Schottky diodes and manufacturers.
Table 2—Diode Selection Guide
Diodes
B290-13-F
B380-13-F
CMSH2-100M
CMSH3-100MA
MP4560 Rev. 1.0
11/5/2012
Voltage/
Current
Rating
90V, 2A
80V, 3A
100V, 2A
100V, 3A
Manufacturer
Diodes Inc.
Diodes Inc.
Central Semi
Central Semi
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11
MP4560 – 2A, 2MHz, 55V STEP-DOWN CONVERTER
Input Capacitor
The input current to the step-down converter is
discontinuous, therefore a capacitor is required to
supply the AC current to the step-down converter
while maintaining the DC input voltage. Use low
ESR capacitors for the best performance.
Ceramic capacitors are preferred, but tantalum or
low-ESR electrolytic capacitors may also suffice.
For simplification, choose the input capacitor with
RMS current rating greater than half of the
maximum load current. The input capacitor (C1)
can be electrolytic, tantalum or ceramic.
When using electrolytic or tantalum capacitors, a
small, high quality ceramic capacitor, i.e. 0.1μF,
should be placed as close to the IC as possible.
When using ceramic capacitors, make sure that
they have enough capacitance to provide
sufficient charge to prevent excessive voltage
ripple at input. The input voltage ripple caused by
capacitance can be estimated by:
⎛
I
V
V
ΔVIN = LOAD × OUT × ⎜⎜1 − OUT
fS × C1 VIN ⎝
VIN
⎞
⎟⎟
⎠
Output Capacitor
The output capacitor (C2) is required to maintain
the DC output voltage. Ceramic, tantalum, or low
ESR electrolytic capacitors are recommended.
Low ESR capacitors are preferred to keep the
output voltage ripple low. The output voltage
ripple can be estimated by:
ΔVOUT =
VOUT ⎛
V
× ⎜1 − OUT
f S × L ⎜⎝
VIN
⎞
⎞ ⎛
1
⎟
⎟⎟ × ⎜ R ESR +
⎜
⎟
8
×
f
×
C
2
S
⎠ ⎝
⎠
Where L is the inductor value and RESR is the
equivalent series resistance (ESR) value of the
output capacitor.
In the case of ceramic capacitors, the impedance
at the switching frequency is dominated by the
capacitance. The output voltage ripple is mainly
caused by the capacitance. For simplification, the
output voltage ripple can be estimated by:
ΔVOUT =
⎛
⎞
V
× ⎜⎜1 − OUT ⎟⎟
V
× L × C2 ⎝
IN ⎠
VOUT
8 × fS
2
ΔVOUT =
VOUT ⎛
V
× ⎜⎜1 − OUT
fS × L ⎝
VIN
⎞
⎟⎟ × R ESR
⎠
The characteristics of the output capacitor also
affect the stability of the regulation system. The
MP4560 can be optimized for a wide range of
capacitance and ESR values.
Compensation Components
MP4560 employs current mode control for easy
compensation and fast transient response. The
system stability and transient response are
controlled through the COMP pin. COMP pin is
the output of the internal error amplifier. A series
capacitor-resistor combination sets a pole-zero
combination to control the characteristics of the
control system. The DC gain of the voltage
feedback loop is given by:
A VDC = R LOAD × G CS × A VEA ×
VFB
VOUT
Where AVEA is the error amplifier voltage gain,
is
the
current
sense
400V/V;
GCS
transconductance, 5.6A/V; RLOAD is the load
resistor value.
The system has two poles of importance. One is
due to the compensation capacitor (C3), the
output resistor of error amplifier. The other is due
to the output capacitor and the load resistor.
These poles are located at:
f P1 =
G EA
2 π× C 3 × A VEA
fP2 =
1
2 π× C 2 × R LOAD
is
the
Where,
GEA
transconductance, 120μA/V.
error
amplifier
The system has one zero of importance, due to
the compensation capacitor (C3) and the
compensation resistor (R3). This zero is located
at:
f Z1 =
1
2 π× C 3 × R 3
In the case of tantalum or electrolytic capacitors,
the ESR dominates the impedance at the
switching frequency. For simplification, the output
ripple can be approximated to:
MP4560 Rev. 1.0
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MP4560 – 2A, 2MHz, 55V STEP-DOWN CONVERTER
The system may have another zero of
importance, if the output capacitor has a large
capacitance and/or a high ESR value. The zero,
due to the ESR and capacitance of the output
capacitor, is located at:
f ESR =
1
2π × C2 × R ESR
In this case, a third pole set by the compensation
capacitor (C5) and the compensation resistor (R3)
is used to compensate the effect of the ESR zero
on the loop gain. This pole is located at:
fP3 =
1
2 π× C 5 × R 3
2. Choose the compensation capacitor (C3) to
achieve the desired phase margin. For
applications with typical inductor values, setting
the compensation zero, fZ1, below one forth of the
crossover frequency provides sufficient phase
margin. Determine the C3 value by the following
equation:
C3 >
4
2 π× R 3 × f C
3. Determine if the second compensation
capacitor (C5) is required. It is required if the
ESR zero of the output capacitor is located at
less than half of the switching frequency, or the
following relationship is valid:
The goal of compensation design is to shape the
converter transfer function to get a desired loop
gain. The system crossover frequency where the
feedback loop has the unity gain is important.
Lower crossover frequencies result in slower line
and load transient responses, while higher
crossover frequencies could cause system
unstable. A good rule of thumb is to set the
crossover frequency to approximately one-tenth
of the switching frequency.
If this is the case, then add the second
compensation capacitor (C5) to set the pole fP3 at
the location of the ESR zero. Determine the C5
value by the equation:
Table 3—Compensation Values for Typical
Output Voltage/Capacitor Combinations
High Frequency Operation
The switching frequency of MP4560 can be
programmed up to 2MHz by an external resistor.
VOUT
(V)
1.8
2.5
3.3
5
12
L (µH)
4.7
4.7 - 6.8
6.8 -10
15 - 22
10
C2
(µF)
33
22
22
33
22
R3
(kΩ)
32.4
26.1
68.1
47.5
16
C3
(pF)
680
680
220
330
470
C6
(pF)
None
None
None
None
2
To optimize the compensation components for
conditions not listed in Table 3, the following
procedure can be used.
1. Choose the compensation resistor (R3) to set
the desired crossover frequency. Determine the
R3 value by the following equation:
2 π× C 2 × f C VOUT
R3=
×
G EA × G CS
VFB
f
1
< S
2π × C2 × R ESR
2
C5 =
C 2 × R ESR
R3
The minimum on time of MP4560 is about 100ns
(typ). Pulse skipping operation can be seen more
easily at higher switching frequency due to the
minimum on time.
Since the internal bootstrap circuitry has higher
impedance, which may not be adequate to
charge the bootstrap capacitor during each
(1-D)×Ts charging period, an external bootstrap
charging diode is strongly recommended if the
switching frequency is about 2MHz (see External
Bootstrap
Diode
section
for
detailed
implementation information).
With higher switching frequencies, the inductive
reactance (XL) of capacitor comes to dominate,
so that the ESL of input/output capacitor
Where fC is the desired crossover frequency.
MP4560 Rev. 1.0
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MP4560 – 2A, 2MHz, 55V STEP-DOWN CONVERTER
determines the input/output ripple voltage at
higher switching frequency. As a result of that,
high frequency ceramic capacitor is strongly
recommended as input decoupling capacitor and
output filtering capacitor for such high frequency
operation.
Layout becomes more important when the device
switches at higher frequency. It is essential to
place the input decoupling capacitor, catch diode
and the MP4560 (VIN pin, SW pin and PGND) as
close as possible, with traces that are very short
and fairly wide. This can help to greatly reduce
the voltage spike on SW node, and lower the EMI
noise level as well.
Try to run the feedback trace as far from the
inductor and noisy power traces as possible. It is
often a good idea to run the feedback trace on
the side of the PCB opposite of the inductor with
a ground plane separating the two. The
compensation components should be placed
closed to the MP4560. Do not place the
compensation components close to or under high
dv/dt SW node, or inside the high di/dt power
loop. If you have to do so, the proper ground
plane must be in place to isolate those. Switching
loss is expected to be increased at high switching
frequency. To help to improve the thermal
conduction, a grid of thermal vias can be created
right under the exposed pad. It is recommended
that they be small (15mil barrel diameter) so that
the hole is essentially filled up during the plating
process, thus aiding conduction to the other side.
Too large a hole can cause ‘solder wicking’
problems during the reflow soldering process.
The pitch (distance between the centers) of
several such thermal vias in an area is typically
40mil.
The bootstrap diode can be a low cost one such
as IN4148 or BAT54.
5V
BST
MP4560
SW
Figure 2—External Bootstrap Diode
At no load or light load, the converter may
operate in pulse skipping mode in order to
maintain the output voltage in regulation. Thus
there is less time to refresh the BS voltage. In
order to have enough gate voltage under such
operating conditions, the difference of (VIN –VOUT
should be greater than 3V. For example, if the
VOUT is set to 3.3V, the VIN needs to be higher
than 3.3V+3V=6.3V to maintain enough BST
voltage at no load or light load. To meet this
requirement, EN pin can be used to program the
input UVLO voltage to VOUT+3V.
External Bootstrap Diode
An external bootstrap diode may enhance the
efficiency of the regulator. In below cases, an
external BST diode is recommended from the 5V
to BST pin:
z
There is a 5V rail available in the system;
z
VIN is no greater than 5V;
z
VOUT is between 3.3V and 5V;
This diode is also recommended for high duty
cycle operation (when VOUT/VIN > 65%)
applications.
MP4560 Rev. 1.0
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MP4560 – 2A, 2MHz, 55V STEP-DOWN CONVERTER
TYPICAL APPLICATION CIRCUITS
C4
100nF
10
VIN
8,9
VIN
BST
SW
1,2
VOUT
1.8V
D1
EN
3
7
EN
MP4560
FB
COMP
FREQ
5
4
C3
680pF
GND
6
C5
NS
Figure 3—1.8V Output Typical Application Schematic
C4
100nF
10
VIN
8,9
VIN
BST
SW
1,2
VOUT
5V
D1
EN
3
7
EN
MP4560
FB
COMP
FREQ
GND
6
5
4
C3
330pF
C5
NS
Figure 4—5V Output Typical Application Schematic
MP4560 Rev. 1.0
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MP4560 – 2A, 2MHz, 55V STEP-DOWN CONVERTER
PCB LAYOUT GUIDE
2)
PCB layout is very important to achieve stable
operation. It is highly recommended to duplicate
EVB layout for optimum performance.
Bypass ceramic capacitors are suggested
to be put close to the VIN Pin.
3)
Ensure all feedback connections are short
and direct. Place the feedback resistors
and compensation components as close to
the chip as possible.
4)
Route SW away from sensitive analog
areas such as FB.
5)
Connect IN, SW, and especially GND
respectively to a large copper area to cool
the chip to improve thermal performance
and long-term reliability.
If change is necessary, please follow these
guidelines and take Figure 5 for reference.
1)
Keep the path of switching current short
and minimize the loop area formed by Input
cap, high-side MOSFET and external
switching diode.
MP4560
MP4560 Typical Application Circuit
TOP Layer
Bottom Layer
MP4560DN Layout Guide
MP4560 Rev. 1.0
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MP4560 – 2A, 2MHz, 55V STEP-DOWN CONVERTER
Bottom Layer
TOP Layer
MP4560DQ Layout Guide
Figure 5―MP4560 Typical Application Circuit and PCB Layout Guide
MP4560 Rev. 1.0
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MP4560 – 2A, 2MHz, 55V STEP-DOWN CONVERTER
PACKAGE INFORMATION
3mm x 3mm QFN10 (EXPOSED PAD)
2.90
3.10
0.30
0.50
PIN 1 ID
MARKING
0.18
0.30
2.90
3.10
PIN 1 ID
INDEX AREA
1.45
1.75
PIN 1 ID
SEE DETAIL A
10
1
2.25
2.55
0.50
BSC
5
6
TOP VIEW
BOTTOM VIEW
PIN 1 ID OPTION A
R0.20 TYP.
PIN 1 ID OPTION B
R0.20 TYP.
0.80
1.00
0.20 REF
0.00
0.05
SIDE VIEW
DETAIL A
NOTE:
2.90
0.70
1) ALL DIMENSIONS ARE IN MILLIMETERS.
2) EXPOSED PADDLE SIZE DOES NOT INCLUDE MOLD FLASH.
3) LEAD COPLANARITY SHALL BE 0.10 MILLIMETER MAX.
4) DRAWING CONFORMS TO JEDEC MO-229, VARIATION VEED-5.
5) DRAWING IS NOT TO SCALE.
1.70
0.25
2.50
0.50
RECOMMENDED LAND PATTERN
MP4560 Rev. 1.0
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MP4560 – 2A, 2MHz, 55V STEP-DOWN CONVERTER
SOIC8 (EXPOSED PAD)
0.189(4.80)
0.197(5.00)
0.124(3.15)
0.136(3.45)
8
5
0.150(3.80)
0.157(4.00)
PIN 1 ID
1
0.228(5.80)
0.244(6.20)
0.089(2.26)
0.101(2.56)
4
TOP VIEW
BOTTOM VIEW
SEE DETAIL "A"
0.051(1.30)
0.067(1.70)
SEATING PLANE
0.000(0.00)
0.006(0.15)
0.013(0.33)
0.020(0.51)
0.0075(0.19)
0.0098(0.25)
SIDE VIEW
0.050(1.27)
BSC
FRONT VIEW
0.010(0.25)
x 45o
0.020(0.50)
GAUGE PLANE
0.010(0.25) BSC
0.050(1.27)
0.024(0.61)
0o-8o
0.016(0.41)
0.050(1.27)
0.063(1.60)
DETAIL "A"
0.103(2.62)
0.138(3.51)
RECOMMENDED LAND PATTERN
0.213(5.40)
NOTE:
1) CONTROL DIMENSION IS IN INCHES. DIMENSION IN
BRACKET IS IN MILLIMETERS.
2) PACKAGE LENGTH DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS.
3) PACKAGE WIDTH DOES NOT INCLUDE INTERLEAD FLASH
OR PROTRUSIONS.
4) LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING)
SHALL BE 0.004" INCHES MAX.
5) DRAWING CONFORMS TO JEDEC MS-012, VARIATION BA.
6) DRAWING IS NOT TO SCALE.
NOTICE: The information in this document is subject to change without notice. Users should warrant and guarantee that third
party Intellectual Property rights are not infringed upon when integrating MPS products into any application. MPS will not
assume any legal responsibility for any said applications.
MP4560 Rev. 1.0
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19