RFM SF2204E-1

Preliminary
SF2204E-1
•
•
•
•
Low-loss RF SAW Filter
Low Amplitude Ripple
No Matching Required for 50Ω Operation
Complies with Directive 2002/95/EC (RoHS)
1900 MHz
SAW Filter
Pb
Absolute Maximum Ratings
Rating
Value
Units
Input Power Level
15
dBm
DC Voltage on any Non-ground Terminal
12
V
Operating Temperature Range
-40 to +85
°C
Storage Temperature Range in Tape and Reel
-40 to +85
°C
265
°C
Maximum Soldering Profile, 5 Cycles/10 seconds Maximum
SM3030-6
Electrical Characteristics
Characteristic
Sym
Center Frequency
fC
Notes
Min
1900
Insertion Loss, 1880 to 1920 MHz
IL
1.8
3.0
dB
0.6
1.3
dBP-P
1.4:1
2.0:1
Amplitude Ripple, 1880 to 1920 MHz
VSWR, 1880 to 1920 MHz
Typ
Max
Units
MHz
Attenuation Referenced to 0 dB:
0.3 to 960 MHz
30
34
960 to 1805 MHz
30
34
1805 to 1830 MHz
30
35
1830 to 1850 MHz
30
35
1950 to 2010 MHz
15
30
2010 to 2025 MHz
40
45
2110 to 2170 MHz
35
44
2300 to 2400 MHz
35
40
2400 to 3000 MHz
28
dB
33
Source Impedance
ZS
50
Ω
Load Impedance
ZL
50
Ω
Case Style
SM3030-6 3.0 x 3.0 mm Nominal Footprint
Lid Symbolization, Y=year, WW=week, S=shift, Dot=pin 1 indicator
Standard Reel Quantity
976, YWWS
Reel Size 7 Inch
500 Pieces/Reel
Reel Size 13 Inch
3000 Pieces/Reel
Electrical Connections
Connection
Terminals
Port 1
2
Port 2
5
Case Ground
All others
CAUTION: Electrostatic Sensitive Device. Observe precautions for handling.
Notes:
1.
2.
3.
4.
5.
6.
Unless noted otherwise, all specifications apply over the operating temperature range with filter soldered to the specified demonstration board with impedance
matching to 50 Ω and measured with 50 Ω network analyzer.
Unless noted otherwise, all frequency specifications are referenced to the nominal center frequency, fc.
Rejection is measured as attenuation below the minimum IL point in the passband. Rejection in final user application is dependent on PCB layout and external
impedance matching design. See Application Note No. 42 for details.
The design, manufacturing process, and specifications of this filter are subject to change.
US and international patents may apply.
RFM, stylized RFM logo, and RF Monolithics, Inc. are registered trademarks of RF Monolithics, Inc.
www.RFM.com E-mail: [email protected]
©2011 by RF Monolithics, Inc.
Page 1 of 7
SF2204E-1 2/8/11
Filter Response Plots
www.RFM.com E-mail: [email protected]
©2011 by RF Monolithics, Inc.
Page 2 of 7
SF2204E-1 2/8/11
Filter Input/Output SWR Plots
www.RFM.com E-mail: [email protected]
©2011 by RF Monolithics, Inc.
Page 3 of 7
SF2204E-1 2/8/11
Filter Input/Output Impedance Plots
www.RFM.com E-mail: [email protected]
©2011 by RF Monolithics, Inc.
Page 4 of 7
SF2204E-1 2/8/11
SM3030-6 Case
6-Terminal Ceramic Surface-Mount Case
3.0 X 3.0 mm Nominal Footprint
Case and PCB Footprint Dimensions
Dimension
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
K
L
N
K
N
Min
2.87
2.87
1.12
0.77
2.67
1.47
0.72
1.37
0.47
1.17
mm
Nom
3.00
3.00
1.25
0.90
2.80
1.60
0.85
1.50
0.60
1.30
3.20
1.70
1.05
0.81
0.38
Max
3.13
3.13
1.40
1.03
2.93
1.73
0.98
1.63
0.73
1.43
Inches
Nom
0.118
0.118
0.049
0.035
0.110
0.063
0.033
0.059
0.024
0.051
0.126
0.067
0.041
0.032
0.015
Min
0.113
0.113
0.044
0.030
0.105
0.058
0.028
0.054
0.019
0.046
Max
0.123
0.123
0.055
0.040
0.115
0.068
0.038
0.064
0.029
0.056
Case Materials
O
Materials
N
M
M
PCB Footprint Top View
Solder Pad
Plating
0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel
Lid Plating
2.0 to 3.0 µm Nickel
Body
Al2O3 Ceramic
Pb Free
Top View
Bottom View
B
1
3
6
976
YWWS
A 2
5
E
4
D
www.RFM.com E-mail: [email protected]
©2011 by RF Monolithics, Inc.
G
C
F
H
6
1
5
2
4
3
I
J
Page 5 of 7
SF2204E-1 2/8/11
“B”
"B" REF.
100 REF.
Tape and Reel Specifications
Quantity Per Reel
Inches
millimeters
7
178
500
13
330
3000
See Detail "A"
13.
0
12.0
20
.2
2.0
COMPONENT ORIENTATION and DIMENSIONS
Carrier Tape Dimensions
2.0
3.35 mm
Bo
3.35 mm
Ko
1.40 mm
Pitch
8.0 mm
W
12.0 mm
4.0
PIN #1
A
1.50
1.75
0.3 ± 0.05
Ao
Bo
B
Ao
12.0
5.5
RO.3
(MAX.)
B
Pitch
A
Ko
R0.5
(MAX.)
1.5
SECTION A-A
SECTION B-B
www.RFM.com E-mail: [email protected]
©2011 by RF Monolithics, Inc.
USER DIRECTION OF FEED
Page 6 of 7
SF2204E-1 2/8/11
Typical Solder Reflow Profile
R a m p u p
3 0 0
P re h e a t
R e flo w
C o o l D o w n
T e m p e ra tu re (d e g C )
2 5 0
2 0 0
1 5 0
1 0 0
5 0
0
0
6 0
1 2 0
1 8 0
2 4 0
3 0 0
3 6 0
T im e (s e c o n d s )
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©2011 by RF Monolithics, Inc.
Page 7 of 7
SF2204E-1 2/8/11