RT9009 2.5A, Ultra-Low Dropout, Ultra-Fast CMOS LDO Regulator General Description The RT9009 is a high performance, 2.5A LDO regulator, offering extremely high PSRR and ultra-low dropout. Ideal for portable RF and wireless applications with demanding performance and space requirements. Regulator ground current increases only slightly in dropout, further prolonging the battery life. The RT9009 also works with low-ESR ceramic capacitors, reducing the amount of board space necessary for power applications that is critical in hand-held wireless devices. The RT9009 consumes less than 1μA in shutdown mode and has fast turn-on time of less than 400μs. The other features include ultra-low dropout voltage, high output accuracy, current limiting protection, and high ripple rejection ratio. The RT9009 is available in the TO-263S-5 package. Ordering Information RT9009 Package Type MS5 : TO-263S-5 Lead Plating System P : Pb Free G : Green (Halogen Free and Pb Free) Note : Features Ultra Fast Response in Line/Load Transient < 1μ μA Shutdown Current Low Dropout : 520mV at 2A Wide Operating Voltage Ranges : 2.5V to 5.5V TTL-Logic-Controlled Shutdown Input Current Limiting Protection Thermal Shutdown Protection Low-ESR Ceramic Output Capacitor Required for Stability High Power Supply Rejection Ratio RoHS Compliant and 100% Lead (Pb)-Free Applications Game Console CDMA/GSM Cellular Handsets Battery-Powered Equipment Laptop, Palmtops, Notebook Computers Hand-Held Instruments Mini PCI & PCI-Express Cards PCMCIA & New Cards Portable Information Appliances Pin Configurations (TOP VIEW) Richtek products are : ` ` RoHS compliant and compatible with the current require- 5 GND ments of IPC/JEDEC J-STD-020. 4 ADJ 3 VOUT (TAB) 2 EN 1 VIN Suitable for use in SnPb or Pb-free soldering processes. TO-263S-5 DS9009-01 April 2011 www.richtek.com 1 RT9009 Typical Application Circuit VOUT 3 1 VIN VIN CIN 2.2uF R1 RT9009 VOUT COUT 4.7uF ADJ 4 Chip Enable 2 EN R2 GND 5 VOUT = 1.25 x (1+ R1 ) Volts R2 Note: The value of R2 should be less than 80k to maintain regulation. Figure 1. Adjustable Operation Function Pin Description Pin No. Pin Name Pin Function 1 VIN Power Supply Input. 2 EN Chip Enable (Active High). When the EN goes to a logic low, the device will be shutdown. 3 VOUT Regulator Output. 4 ADJ Output Voltage Feedback Input. If external feedback resistors are applied, the output voltage will be : 5 GND Ground. VOUT = 1.25 × (1+ R1 ) Volts R2 Function Block Diagram EN Logic Control POR/OCP/OTP - VREF + GND VIN Driver VOUT ADJ www.richtek.com 2 DS9009-01 April 2011 RT9009 Absolute Maximum Ratings (Note 1) Supply Input Voltage ------------------------------------------------------------------------------------------------ 6V EN Input Voltage ----------------------------------------------------------------------------------------------------- 6V Power Dissipation, PD @ TA = 25°C TO-263S-5 ------------------------------------------------------------------------------------------------------------- 3.448W Package Thermal Resistance (Note 2) TO-263S-5, θJA ------------------------------------------------------------------------------------------------------- 29°C/W TO-263S-5, θJC ------------------------------------------------------------------------------------------------------- 7°C/W Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------- 260°C Junction Temperature ----------------------------------------------------------------------------------------------- 150°C Storage Temperature Range --------------------------------------------------------------------------------------- −65°C to 150°C ESD Susceptibility (Note 3) HBM -------------------------------------------------------------------------------------------------------------------- 2kV MM ---------------------------------------------------------------------------------------------------------------------- 200V Recommended Operating Conditions (Note 4) Supply Input Voltage ------------------------------------------------------------------------------------------------ 2.5V to 5.5V EN Input Voltage ----------------------------------------------------------------------------------------------------- 0V to 5.5V Junction Temperature Range -------------------------------------------------------------------------------------- −40°C to 125°C Ambient Temperature Range -------------------------------------------------------------------------------------- −40°C to 85°C Electrical Characteristics (VIN = 3.3V, VEN = VIN, CIN = 2.2μF (Ceramic), COUT = 4.7μF (Ceramic), TA = 25°C unless otherwise specified) Parameter Symbol Test Conditions Min Typ Max Unit Input Voltage Output Voltage Range (Adjustable) V IN 2.5 -- 5.5 V V OUT_Adj 1.25 -- 4.5 V Quiescent Current IQ VEN ≥ VIH, IOUT = 0mA -- 380 500 μA Shutdown Current ISTBY VEN ≤ VIL ,V IN = 3.3V -- 0.1 1 μA Current Limit ILIM 2.6 3.2 -- A Dropout Voltage V DROP VOUT = 2.8V, IOUT = 2A -- 520 790 mV Load Regulation ΔVLOAD 10mA < IOUT < 2A -- 0.4 2 % Line Regulation ΔVLINE VIN = 2.5V to 5.5V, IOUT = 5mA -- -- 1 % Logic-Low Voltage V IL -- -- 0.6 Logic-High Voltage V IH 1.8 -- -- EN Threshold V Enable Pin Current IEN Enable -- 0.1 1 μA Power Supply Rejection Rate PSRR IOUT = 300mA, f = 100Hz -- 60 -- dB Thermal Shutdown Temperature T SD -- 155 -- Thermal Shutdown Hysteresis ΔTSD -- 30 -- Reference Voltage Tolerance V REF 1.225 1.25 1.275 V ADJ Pin Current IADJ -- 10 100 nA °C ADJ DS9009-01 April 2011 VADJ = VREF www.richtek.com 3 RT9009 Note 1. Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device. These are for stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may remain possibility to affect device reliability. Note 2. θJA is measured in the natural convection at TA = 25°C on a high effective four layers thermal conductivity test board of JEDEC 51-7 thermal measurement standard. The case point of θJC is on the exposed pad for the package. The copper area as heat sink is 225mm2. Note 3. Devices are ESD sensitive. Handling precaution is recommended. Note 4. The device is not guaranteed to function outside its operating conditions. www.richtek.com 4 DS9009-01 April 2011 RT9009 Typical Operating Characteristics Output Voltage vs. Temperature 2.00 1.95 1.95 1.90 1.90 Output Voltage (V) Output Voltage (V) Output Voltage vs. Input Voltage 2.00 1.85 1.80 1.75 1.70 1.65 1.85 1.80 1.75 1.70 1.65 VIN = 3.3V, IOUT = 0A, R1 = 1.13kΩ, R2 = 2.7kΩ IOUT = 0A, R1 = 1.13kΩ, R2 = 2.7kΩ 1.60 1.60 2.5 3 3.5 4 4.5 5 5.5 -50 -25 0 Input Voltage (V) Reference Voltage vs. Temperature 75 100 125 Enable Voltage vs. Temperature 1.2 1.2875 1.1 1.2750 1.0 Enable Voltage (V) Reference Voltage (V) 50 Temperature (°C) 1.3000 1.2625 1.2500 1.2375 1.2250 0.9 Rising 0.8 Falling 0.7 0.6 0.5 1.2125 VIN = 3.3V, VOUT = 1.8V, IOUT = 0A VIN = 3.3V, IOUT = 0A 0.4 1.2000 -50 -25 0 25 50 75 100 -50 125 -25 0 25 50 75 100 125 Temperature (°C) Temperature (°C) Quiescent Current vs. Input Voltage Quiescent Current vs. Temperature 500 500 450 450 Quiescent Current (uA) Quiescent Current (uA) 25 400 350 300 250 200 400 350 300 250 200 150 150 VOUT = 1.8V, IOUT = 0A 100 2.5 3 3.5 4 4.5 Input Voltage (V) DS9009-01 April 2011 5 5.5 VIN = 3.3V, VOUT = 1.8V, IOUT = 0A 100 -50 -25 0 25 50 75 100 125 Temperature (°C) www.richtek.com 5 RT9009 Dropout Voltage vs. Output Current PSRR 900 0 -10 TA = 125°C -20 700 TA = 25°C 600 500 400 TA = −40°C 300 IOUT = 300mA -30 PSRR (dB) Dropout Voltage (mV) 800 -40 IOUT = 0A -50 -60 -70 200 -80 100 -90 0 VIN = 3.3V + 0.1VAC, VOUT = 1.8V, CIN = 1μF/X7R, COUT = 2.2μF -100 0 250 500 750 1000 1250 1500 1750 2000 10 100 1,000 Output Current (mA) 100,000 1,000,000 Current Limit vs. Temperature Current Limit vs. Input Voltage 4.0 4.0 3.8 3.8 3.6 3.6 3.4 3.4 Current Limit (A) Current Limit (A) 10,000 Frequency (Hz) 3.2 3.0 2.8 2.6 3.2 3.0 2.8 2.6 2.4 2.4 2.2 2.2 VOUT = 1.8V 2.0 2.5 3 3.5 4 4.5 5 5.5 -50 VOUT (20mV/Div) VOUT (20mV/Div) IOUT (1A/Div) IOUT (1A/Div) www.richtek.com 6 0 25 50 75 100 125 Load Transient Response Load Transient Response Time (250μs/Div) -25 Temperature (°C) Input Voltage (V) VIN = 3.3V, VOUT = 1.8V, IOUT = 0A to 1A VIN = 3.3V, VOUT = 1.8V 2.0 VIN = 3.3V, VOUT = 1.8V, IOUT = 0A to 2.2A Time (250μs/Div) DS9009-01 April 2011 RT9009 Line Transient Response Line Transient Response VIN (1V/Div) VIN (1V/Div) VOUT (20mV/Div) VOUT (20mV/Div) VIN = 3V to 4V, VOUT = 1.8V, IOUT = 2.2A VIN = 3V to 4V, VOUT = 1.8V, IOUT = 1A Time (500μs/Div) Time (500μs/Div) Power On from EN Power Off from EN VEN (2V/Div) VEN (2V/Div) VOUT (1V/Div) VOUT (1V/Div) IOUT (1A/Div) IOUT (1A/Div) VIN = 3.3V, VOUT = 1.8V, IOUT = 2.2A Time (500μs/Div) Time (1ms/Div) Power On from VIN Power Off from VIN VIN (2V/Div) VIN (2V/Div) VOUT (1V/Div) VOUT (1V/Div) IOUT (1A/Div) IOUT (1A/Div) VIN = 3.3V, VOUT = 1.8V, IOUT = 2.2A Time (2.5ms/Div) DS9009-01 April 2011 VIN = 3.3V, VOUT = 1.8V, IOUT = 2.2A VIN = 3.3V, VOUT = 1.8V, IOUT = 2.2A Time (25ms/Div) www.richtek.com 7 RT9009 Applications Information For continuous operation, do not exceed absolute maximum operation junction temperature. The maximum power dissipation depends on the thermal resistance of IC package, PCB layout, the rate of surroundings airflow and temperature difference between junction to ambient. The maximum power dissipation can be calculated by following formula : PD(MAX) = (TJ(MAX) − TA) / θJA Where T J(MAX) is the maximum operation junction temperature, TA is the ambient temperature and the θJA is the junction to ambient thermal resistance. For recommended operating conditions specification of RT9009, the maximum operating junction temperature is 125°C. The junction to ambient thermal resistance θJA is layout dependent. As shown in Figure 2, RT9009 TO-263S-5 with 15mm x 15mm PCB copper area on the standard JEDEC 51-7 four layers thermal test board thermal resistance θJA is about 29°C/W. The maximum power dissipation at TA = 25°C can be calculated by following formula : The maximum power dissipation depends on operating ambient temperature for fixed T J(MAX) and thermal resistance θJA. For the RT9009, the Figure 3 of de-rating curve allows the designer to see the effect of rising ambient temperature on the maximum power dissipation allowed. 4.0 Maximum Power Dissipation (W) Thermal Considerations Four Layers PCB 3.5 3.0 2.5 TO-263S-5 2.0 1.5 1.0 0.5 0.0 0 25 50 75 100 125 Ambient Temperature (°C) Figure 3. Derating Curve for RT9009 Package PD(MAX) = (125°C − 25°C) / (29°C/W) = 3.448W for TO-263S-5 packages Thermal Resistance vs. Copper Area Thermal Resistance (°C/W) 70 60 Single Layout PCB 50 40 Four Layout PCB 30 20 10 TO-263S-5 0 0 50 100 150 200 250 300 350 400 2 PCB Copper Area (mm ) Figure 2. Thermal Resistance θJA vs. Copper Area of TO-263S-5 Package www.richtek.com 8 DS9009-01 April 2011 RT9009 Outline Dimension C D U B V E L1 L2 b e b2 A Dimensions In Millimeters Dimensions In Inches Symbol Min Max Min Max A 4.064 4.826 0.160 0.190 B 1.143 1.397 0.045 0.055 b 0.660 0.914 0.026 0.036 b2 0.305 0.584 0.012 0.023 C 1.250 1.450 0.049 0.057 D 9.652 10.668 0.380 0.420 E 8.128 9.652 0.320 0.380 e 1.524 1.829 0.060 0.072 L1 13.000 14.300 0.512 0.563 L2 1.090 1.590 0.043 0.063 U 7.600 Ref. 0.299 Ref. V 5.900 Ref. 0.232 Ref. 5-Lead TO-263S Surface Mount Package Richtek Technology Corporation Richtek Technology Corporation Headquarter Taipei Office (Marketing) 5F, No. 20, Taiyuen Street, Chupei City 5F, No. 95, Minchiuan Road, Hsintien City Hsinchu, Taiwan, R.O.C. Taipei County, Taiwan, R.O.C. Tel: (8863)5526789 Fax: (8863)5526611 Tel: (8862)86672399 Fax: (8862)86672377 Email: [email protected] Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit design, specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be guaranteed by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek. DS9009-01 April 2011 www.richtek.com 9