RT9009

RT9009
2.5A, Ultra-Low Dropout, Ultra-Fast CMOS LDO Regulator
General Description
The RT9009 is a high performance, 2.5A LDO regulator,
offering extremely high PSRR and ultra-low dropout. Ideal
for portable RF and wireless applications with demanding
performance and space requirements.
Regulator ground current increases only slightly in dropout,
further prolonging the battery life. The RT9009 also works
with low-ESR ceramic capacitors, reducing the amount of
board space necessary for power applications that is critical
in hand-held wireless devices.
The RT9009 consumes less than 1μA in shutdown mode
and has fast turn-on time of less than 400μs. The other
features include ultra-low dropout voltage, high output
accuracy, current limiting protection, and high ripple
rejection ratio. The RT9009 is available in the TO-263S-5
package.
Ordering Information
RT9009
Package Type
MS5 : TO-263S-5
Lead Plating System
P : Pb Free
G : Green (Halogen Free and Pb Free)
Note :
Features
Ultra Fast Response in Line/Load Transient
< 1μ
μA Shutdown Current
Low Dropout : 520mV at 2A
Wide Operating Voltage Ranges : 2.5V to 5.5V
TTL-Logic-Controlled Shutdown Input
Current Limiting Protection
Thermal Shutdown Protection
Low-ESR Ceramic Output Capacitor Required for
Stability
High Power Supply Rejection Ratio
RoHS Compliant and 100% Lead (Pb)-Free
Applications
Game Console
CDMA/GSM Cellular Handsets
Battery-Powered Equipment
Laptop, Palmtops, Notebook Computers
Hand-Held Instruments
Mini PCI & PCI-Express Cards
PCMCIA & New Cards
Portable Information Appliances
Pin Configurations
(TOP VIEW)
Richtek products are :
`
`
RoHS compliant and compatible with the current require-
5
GND
ments of IPC/JEDEC J-STD-020.
4
ADJ
3
VOUT (TAB)
2
EN
1
VIN
Suitable for use in SnPb or Pb-free soldering processes.
TO-263S-5
DS9009-01 April 2011
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RT9009
Typical Application Circuit
VOUT 3
1 VIN
VIN
CIN
2.2uF
R1
RT9009
VOUT
COUT
4.7uF
ADJ 4
Chip Enable
2 EN
R2
GND
5
VOUT = 1.25 x (1+
R1
) Volts
R2
Note: The value of R2 should be less than 80k to
maintain regulation.
Figure 1. Adjustable Operation
Function Pin Description
Pin No.
Pin Name
Pin Function
1
VIN
Power Supply Input.
2
EN
Chip Enable (Active High). When the EN goes to a logic low, the device will be
shutdown.
3
VOUT
Regulator Output.
4
ADJ
Output Voltage Feedback Input. If external feedback resistors are applied, the output
voltage will be :
5
GND
Ground.
VOUT = 1.25 × (1+
R1
) Volts
R2
Function Block Diagram
EN
Logic Control
POR/OCP/OTP
-
VREF
+
GND
VIN
Driver
VOUT
ADJ
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DS9009-01 April 2011
RT9009
Absolute Maximum Ratings
(Note 1)
Supply Input Voltage ------------------------------------------------------------------------------------------------ 6V
EN Input Voltage ----------------------------------------------------------------------------------------------------- 6V
Power Dissipation, PD @ TA = 25°C
TO-263S-5 ------------------------------------------------------------------------------------------------------------- 3.448W
Package Thermal Resistance (Note 2)
TO-263S-5, θJA ------------------------------------------------------------------------------------------------------- 29°C/W
TO-263S-5, θJC ------------------------------------------------------------------------------------------------------- 7°C/W
Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------- 260°C
Junction Temperature ----------------------------------------------------------------------------------------------- 150°C
Storage Temperature Range --------------------------------------------------------------------------------------- −65°C to 150°C
ESD Susceptibility (Note 3)
HBM -------------------------------------------------------------------------------------------------------------------- 2kV
MM ---------------------------------------------------------------------------------------------------------------------- 200V
Recommended Operating Conditions
(Note 4)
Supply Input Voltage ------------------------------------------------------------------------------------------------ 2.5V to 5.5V
EN Input Voltage ----------------------------------------------------------------------------------------------------- 0V to 5.5V
Junction Temperature Range -------------------------------------------------------------------------------------- −40°C to 125°C
Ambient Temperature Range -------------------------------------------------------------------------------------- −40°C to 85°C
Electrical Characteristics
(VIN = 3.3V, VEN = VIN, CIN = 2.2μF (Ceramic), COUT = 4.7μF (Ceramic), TA = 25°C unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Input Voltage
Output Voltage Range
(Adjustable)
V IN
2.5
--
5.5
V
V OUT_Adj
1.25
--
4.5
V
Quiescent Current
IQ
VEN ≥ VIH, IOUT = 0mA
--
380
500
μA
Shutdown Current
ISTBY
VEN ≤ VIL ,V IN = 3.3V
--
0.1
1
μA
Current Limit
ILIM
2.6
3.2
--
A
Dropout Voltage
V DROP
VOUT = 2.8V, IOUT = 2A
--
520
790
mV
Load Regulation
ΔVLOAD
10mA < IOUT < 2A
--
0.4
2
%
Line Regulation
ΔVLINE
VIN = 2.5V to 5.5V, IOUT = 5mA
--
--
1
%
Logic-Low Voltage V IL
--
--
0.6
Logic-High Voltage V IH
1.8
--
--
EN Threshold
V
Enable Pin Current
IEN
Enable
--
0.1
1
μA
Power Supply Rejection Rate
PSRR
IOUT = 300mA, f = 100Hz
--
60
--
dB
Thermal Shutdown Temperature
T SD
--
155
--
Thermal Shutdown Hysteresis
ΔTSD
--
30
--
Reference Voltage Tolerance
V REF
1.225
1.25
1.275
V
ADJ Pin Current
IADJ
--
10
100
nA
°C
ADJ
DS9009-01 April 2011
VADJ = VREF
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RT9009
Note 1. Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational
sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may
remain possibility to affect device reliability.
Note 2. θJA is measured in the natural convection at TA = 25°C on a high effective four layers thermal conductivity test board of
JEDEC 51-7 thermal measurement standard. The case point of θJC is on the exposed pad for the package. The copper
area as heat sink is 225mm2.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
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DS9009-01 April 2011
RT9009
Typical Operating Characteristics
Output Voltage vs. Temperature
2.00
1.95
1.95
1.90
1.90
Output Voltage (V)
Output Voltage (V)
Output Voltage vs. Input Voltage
2.00
1.85
1.80
1.75
1.70
1.65
1.85
1.80
1.75
1.70
1.65
VIN = 3.3V, IOUT = 0A, R1 = 1.13kΩ, R2 = 2.7kΩ
IOUT = 0A, R1 = 1.13kΩ, R2 = 2.7kΩ
1.60
1.60
2.5
3
3.5
4
4.5
5
5.5
-50
-25
0
Input Voltage (V)
Reference Voltage vs. Temperature
75
100
125
Enable Voltage vs. Temperature
1.2
1.2875
1.1
1.2750
1.0
Enable Voltage (V)
Reference Voltage (V)
50
Temperature (°C)
1.3000
1.2625
1.2500
1.2375
1.2250
0.9
Rising
0.8
Falling
0.7
0.6
0.5
1.2125
VIN = 3.3V, VOUT = 1.8V, IOUT = 0A
VIN = 3.3V, IOUT = 0A
0.4
1.2000
-50
-25
0
25
50
75
100
-50
125
-25
0
25
50
75
100
125
Temperature (°C)
Temperature (°C)
Quiescent Current vs. Input Voltage
Quiescent Current vs. Temperature
500
500
450
450
Quiescent Current (uA)
Quiescent Current (uA)
25
400
350
300
250
200
400
350
300
250
200
150
150
VOUT = 1.8V, IOUT = 0A
100
2.5
3
3.5
4
4.5
Input Voltage (V)
DS9009-01 April 2011
5
5.5
VIN = 3.3V, VOUT = 1.8V, IOUT = 0A
100
-50
-25
0
25
50
75
100
125
Temperature (°C)
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RT9009
Dropout Voltage vs. Output Current
PSRR
900
0
-10
TA = 125°C
-20
700
TA = 25°C
600
500
400
TA = −40°C
300
IOUT = 300mA
-30
PSRR (dB)
Dropout Voltage (mV)
800
-40
IOUT = 0A
-50
-60
-70
200
-80
100
-90
0
VIN = 3.3V + 0.1VAC, VOUT = 1.8V,
CIN = 1μF/X7R, COUT = 2.2μF
-100
0
250
500
750
1000 1250 1500 1750 2000
10
100
1,000
Output Current (mA)
100,000
1,000,000
Current Limit vs. Temperature
Current Limit vs. Input Voltage
4.0
4.0
3.8
3.8
3.6
3.6
3.4
3.4
Current Limit (A)
Current Limit (A)
10,000
Frequency (Hz)
3.2
3.0
2.8
2.6
3.2
3.0
2.8
2.6
2.4
2.4
2.2
2.2
VOUT = 1.8V
2.0
2.5
3
3.5
4
4.5
5
5.5
-50
VOUT
(20mV/Div)
VOUT
(20mV/Div)
IOUT
(1A/Div)
IOUT
(1A/Div)
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0
25
50
75
100
125
Load Transient Response
Load Transient Response
Time (250μs/Div)
-25
Temperature (°C)
Input Voltage (V)
VIN = 3.3V, VOUT = 1.8V, IOUT = 0A to 1A
VIN = 3.3V, VOUT = 1.8V
2.0
VIN = 3.3V, VOUT = 1.8V, IOUT = 0A to 2.2A
Time (250μs/Div)
DS9009-01 April 2011
RT9009
Line Transient Response
Line Transient Response
VIN
(1V/Div)
VIN
(1V/Div)
VOUT
(20mV/Div)
VOUT
(20mV/Div)
VIN = 3V to 4V, VOUT = 1.8V, IOUT = 2.2A
VIN = 3V to 4V, VOUT = 1.8V, IOUT = 1A
Time (500μs/Div)
Time (500μs/Div)
Power On from EN
Power Off from EN
VEN
(2V/Div)
VEN
(2V/Div)
VOUT
(1V/Div)
VOUT
(1V/Div)
IOUT
(1A/Div)
IOUT
(1A/Div)
VIN = 3.3V, VOUT = 1.8V, IOUT = 2.2A
Time (500μs/Div)
Time (1ms/Div)
Power On from VIN
Power Off from VIN
VIN
(2V/Div)
VIN
(2V/Div)
VOUT
(1V/Div)
VOUT
(1V/Div)
IOUT
(1A/Div)
IOUT
(1A/Div)
VIN = 3.3V, VOUT = 1.8V, IOUT = 2.2A
Time (2.5ms/Div)
DS9009-01 April 2011
VIN = 3.3V, VOUT = 1.8V, IOUT = 2.2A
VIN = 3.3V, VOUT = 1.8V, IOUT = 2.2A
Time (25ms/Div)
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RT9009
Applications Information
For continuous operation, do not exceed absolute
maximum operation junction temperature. The maximum
power dissipation depends on the thermal resistance of
IC package, PCB layout, the rate of surroundings airflow
and temperature difference between junction to ambient.
The maximum power dissipation can be calculated by
following formula :
PD(MAX) = (TJ(MAX) − TA) / θJA
Where T J(MAX) is the maximum operation junction
temperature, TA is the ambient temperature and the θJA is
the junction to ambient thermal resistance.
For recommended operating conditions specification of
RT9009, the maximum operating junction temperature is
125°C. The junction to ambient thermal resistance θJA is
layout dependent. As shown in Figure 2, RT9009
TO-263S-5 with 15mm x 15mm PCB copper area on the
standard JEDEC 51-7 four layers thermal test board
thermal resistance θJA is about 29°C/W. The maximum
power dissipation at TA = 25°C can be calculated by
following formula :
The maximum power dissipation depends on operating
ambient temperature for fixed T J(MAX) and thermal
resistance θJA. For the RT9009, the Figure 3 of de-rating
curve allows the designer to see the effect of rising ambient
temperature on the maximum power dissipation allowed.
4.0
Maximum Power Dissipation (W)
Thermal Considerations
Four Layers PCB
3.5
3.0
2.5
TO-263S-5
2.0
1.5
1.0
0.5
0.0
0
25
50
75
100
125
Ambient Temperature (°C)
Figure 3. Derating Curve for RT9009 Package
PD(MAX) = (125°C − 25°C) / (29°C/W) = 3.448W for
TO-263S-5 packages
Thermal Resistance vs. Copper Area
Thermal Resistance (°C/W)
70
60
Single Layout PCB
50
40
Four Layout PCB
30
20
10
TO-263S-5
0
0
50
100
150
200
250
300
350
400
2
PCB Copper Area (mm )
Figure 2. Thermal Resistance θJA vs. Copper Area of
TO-263S-5 Package
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DS9009-01 April 2011
RT9009
Outline Dimension
C
D
U
B
V
E
L1
L2
b
e
b2
A
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
4.064
4.826
0.160
0.190
B
1.143
1.397
0.045
0.055
b
0.660
0.914
0.026
0.036
b2
0.305
0.584
0.012
0.023
C
1.250
1.450
0.049
0.057
D
9.652
10.668
0.380
0.420
E
8.128
9.652
0.320
0.380
e
1.524
1.829
0.060
0.072
L1
13.000
14.300
0.512
0.563
L2
1.090
1.590
0.043
0.063
U
7.600 Ref.
0.299 Ref.
V
5.900 Ref.
0.232 Ref.
5-Lead TO-263S Surface Mount Package
Richtek Technology Corporation
Richtek Technology Corporation
Headquarter
Taipei Office (Marketing)
5F, No. 20, Taiyuen Street, Chupei City
5F, No. 95, Minchiuan Road, Hsintien City
Hsinchu, Taiwan, R.O.C.
Taipei County, Taiwan, R.O.C.
Tel: (8863)5526789 Fax: (8863)5526611
Tel: (8862)86672399 Fax: (8862)86672377
Email: [email protected]
Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit design,
specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be guaranteed
by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek.
DS9009-01 April 2011
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