SEOUL SFT825N-S_09

Z-Power LED
X10490
Technical
Data
Sheet
Specification
SFT825N-S
SSC
Drawn
Approval
CUSTOMER
Approval
Rev. 07
June 2009
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Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
CONTENTS
1.
Feature & Application
2.
Absolute Maximum Ratings
3.
Electro Characteristics
4.
Optical characteristics
5.
Color & Binning
6.
Rank of SFT825N-S
7.
Outline Dimension
8.
Packing
9.
Soldering
10. Precaution for use
11. Handling of Silicone Resin LEDs
12. Reliability Test Item and Condition
Rev. 07
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Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
SFT825N-S
Description
This surface-mount LED comes
in PLCC standard package
dimension. It has a substrate
made up of a molded plastic
reflector sitting on top of a bent
lead frame. The die is attached
within the reflector cavity and
the cavity is encapsulated by
epoxy or silicone.
The package design coupled
with careful selection of
component materials allow these
products to perform with high
reliability in a larger
temperature range -40℃ to
100℃. The high reliability
feature is crucial to Automotive
interior and Indoor ESS.
SFT825N-S
Features
•
Pb-free Reflow Soldering
application
•
RoHS Compliant
•
6-Pin (R,G,B separate)
type
•
White colored SMT
package and diffused
(milky color)
•
Suitable for all SMT
assembly methods
•
ESD-withstand voltage :
up to 2 kV (MIL-STD-883D)
•
Encapsulating Resin : hard
silicone resin
•
High Reliability (silicone
resin)
Applications
•
Indoor and outdoor
displays
•
LCD Backlights etc.
•
R G B – displays
•
Automotive
•
Signage and Channel
letter
•
Indicator
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Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
2. Absolute maximum ratings
(Ta=25ºC)
*1
*2
*3
*4
Parameter
Symbo
l
Forward Current
Value
Unit
Red
Green
Blue
IF
30
30
30
mA
Forward Peak Surge Current *2
IFM
100
100
100
mA
Reverse Voltage (per die)
VR
5
81*3
120*3
V
114*3
Power Dissipation
Pd
Operating Temperature
Topr
-40 ~ +100
ºC
Storage Temperature
Tstg
-40 ~ +100
ºC
263*4
mW
Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.
IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio.
The value for one LED device.(Single color)
The value for total power dissipation when two and more devices are lit simultaneously.
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Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
3. Electric & Optical characteristics
Parameter
Symbol
Condition
Min
Typ
Max
IF =20mA
1.8
2.1
2.3
IF =20mA
3.0
3.2
3.8
IF =20mA
3.0
3.2
3.6
-
-
1
-
-
1
-
-
1
-
700
1100
-
1200
1600
-
400
560
-
1.7
-
-
2.8
-
-
0.93
-
IF =20mA
-
632
-
IF =20mA
-
518
-
Blue
IF =20mA
-
453
-
Red
IF =20mA
620
623
625
IF =20mA
520
527
535
Blue
IF =20mA
455
460
465
Red
IF =20mA
-
14
-
IF =20mA
-
33
-
IF =20mA
-
23
-
2θ½
IF =20mA
(per die)
-
120
-
IF =20mA
(per chip)
-
41
-
ηop
-
44
-
-
15
-
IF =20mA
-
278
-
IF =20mA
-
277
-
IF =20mA
-
220
-
Red
Forward Voltage
Green
VF
Blue
Red
Reverse Current
Green
IR
Blue
Red
Luminance
Intensity *1
Green
IV
Blue
Red
Luminance Flux
Green
ΦV
Blue
Red
Peak Wavelength
Dominant
Wavelength
Green
Green
Spectral Bandwidth
Green
λP
λd
∆λ
Blue
Viewing Angle
*3
R, G, B
Red
Optical Efficiency
Green
Blue
Thermal Resistance
(one chip on)
(Ta=25ºC)
Red
Green
Blue
Rthja
VR=10V
(per die)
IF =20mA
(per chip)
IF =20mA
(per chip)
Unit
V
µA
mcd
lm
nm
nm
nm
deg.
lm/W
K/W
*1 The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned
with the mechanical axis of the LED package.
Luminous Intensity Measurement allowance is ±10%
*2 Please refer to CIE 1931 chromaticity diagram
*3 2 ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity.
[Note] All measurements were made under the standardized environment of SSC.
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Document No. : SSC-QP-7-07-24 (Rev.00)
Forward Current vs. Forward Voltage (per die)
(Ta=25 OC )
100
G re e n
B lu e
50
Red
20
10
5
1
1 .6
2 .0
2 .4
2 .8
3 .2
3 .6
4 .0
4 .4
4 .8
F o rw a rd V o lta g e V F [V ]
Relative Luminous Intensity vs Forward Current
(Ta=25 OC )
6
RED
BLUE
GREEN
5
Relative Luminosity (a.u.)
Forward Current IFP [mA]
Z-Power LED
X10490
Technical
Data
Sheet
4. Optical characteristics
4
3
2
1
0
0
20
40
60
80
100
120
Forward Current IFP [mA]
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Ambient Temperature vs. Allowable Forward Current (per die)
Red, Green, Blue
1 CHIP ON
30
Forward Current IF[mA]
Z-Power LED
X10490
Technical
Data
Sheet
4. Optical characteristics
3 CHIP ON
20
10
0
0
20
40
60
80
100
Ambient Tenperature[oC]
Radiation Diagram
(Ta=25 OC )
0
-30
-60
-90
30
60
90
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Document No. : SSC-QP-7-07-24 (Rev.00)
Spectrum
(TA=25℃, IF=20mA/chip)
1.0
Relative Intensity [a.u.]
Z-Power LED
X10490
Technical
Data
Sheet
4. Optical characteristics
RED
GREEN
BLUE
0.8
0.6
0.4
0.2
0.0
400
500
600
700
800
Wavelength [nm]
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Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
5. Color & Binning
0.9
0.8
0.7
0.6
y
0.5
0.4
Green
520 525
515
530
535
540
510
545
550
555
505
560
565
570
500
575
580
585
590
495
595
600
0.3
0.2
A B
Red
610
620
630
830
490
485
Bluish White
0.1
475 2
Blue 470460 1
480
0.0
0.0
0.1
0.2
0.3
0.4
0.5
x
0.6
0.7
0.8
0.9
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Document No. : SSC-QP-7-07-24 (Rev.00)
0.30
g
h
0.28
e
f
0.26
y
Z-Power LED
X10490
Technical
Data
Sheet
5. Color & Binning
c
d
0.24
0.20
b
a
0.22
0.22
0.24
0.26
0.28
0.30
x
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Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
6. Rank of SFT825N-S
[Note] All measurements were made under the standardized environment of SSC.
In order to ensure availability, single color rank will not be orderable.
Rev. 07
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.com
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Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
7.Outline Dimension
Package Outlines
6 5 4
Package
Marking
(Cathode )
1 2 3
( Tolerance: ±0.2, Unit: mm )
Circuit Diagram
Blue
Anode
Green
Anode
Red
Anode
6
5
4
1
2
3
Blue
Cathode
Green
Cathode
Recommended
Solder Pad
Red
Cathode
* MATERIALS
PARTS
MATERIALS
Package
Heat-Resistant Polymer
Encapsulating Resin
Hard Silicone Resin (Diffused)
Electrodes
Ag Plating Copper Alloy
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Document No. : SSC-QP-7-07-24 (Rev.00)
Package
Marking
MA
X.5
2.0±0.05
3.7±0.1
1.7±0.1
4±0.1
2.9±0.1
MA
X.5
11.4 ± 0.1
180 +0
-3
9.0 ± 0.3
LABLE
2.0 ± 0.2
13 ±0.2
30°
10
60
Z-Power LED
X10490
Technical
Data
Sheet
8. Packing
22
( Tolerance: ±0.2, Unit: mm )
(1)Quantity : 2000 pcs/Reel
(2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
(3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape
is turned off from the carrier tape at the angle of 10º to the carrier tape
(4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof
Package
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Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
● Reel Packing Structure
Reel
XXX
RANK:
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
XXXXXX
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR
DESI PAK
Aluminum Vinyl Bag
XXX
RANK:
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
XXXXXX
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B))
SIZE (mm)
TYPE
a
c
b
7inch 245 220 142
1 SIDE
c
XXX
RANK:
1
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
RoHS
XXXXXX
SEOUL SEMICONDUCTOR CO., LTD.
b
a
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Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
9. Lot Number
The lot number is composed of the following characters;
SFT○□□◎◎ # ~ #
MFT –First Part Name
○–
Year (6 for 2006, 7 for 2007, 8 for 2008 )
□□ – Month ( 01 for Jan., 02 for Feb.,‥‥‥11 for Nov., 12 for Dec.)
◎◎ – Day ( 01, 02, 03, 04, ‥‥‥‥‥‥28, 29, 30, 31.)
# ~# – The number of the internal quality control
XXX
QUANTITY : 2000
LOT NUMBER : SFT70426 01 512
PART NUMBER : SFT825N-S
SEOUL SEMICONDUCTOR CO., LTD.
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(1) Reflow Soldering Conditions / Profile (Lead Free Solder)
Temp
[°C]
Tm : Reflow machine setting temp (max 30 sec.)
Ts : Surface temp of PCB (max)
Ts : Surface temp of PCB (recommend)
Ts : Surface temp of PCB (min)
260
240
220
200
180
~
Z-Power LED
X10490
Technical
Data
Sheet
10. Soldering
Pre-heating
Rising
5 °C/sec
Cooling
-5 °C/sec
150
0
Time
[Hr]
(3) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
(4) The encapsulated material of the LEDs is silicone.
Precautions should be taken to avoid the strong pressure on the
encapsulated part.
So when using the chip mounter, the picking up nozzle that does not
affect the silicone resign should be used.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
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Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
11. Precaution for use
(1) Storage
In order to avoid the absorption of moisture, it is recommended to store in a dry
box (or a desiccator) with a desiccant. Otherwise, to store them in the following
environment is recommended.
Temperature : 5ºC ~30ºC Humidity : maximum 70%RH
(2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may
affect the light transmission efficiency, causing the light intensity to drop.
Attention in followed;
Keeping of a fraction
Temperature : 5 ~ 40ºC Humidity : less than 10%
(3) In the case of more than 1 week passed after opening or change color of
indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC.
(4) Any mechanical force or any excess vibration shall not be accepted to apply
during cooling process to normal temperature after soldering.
(5) Quick cooling shall be avoided.
(6) Components shall not be mounted on warped direction of PCB.
(7) Anti radioactive ray design is not considered for the products.
(8) This device should not be used in any type of fluid such as water, oil, organic
solvent etc. When washing is required, IPA should be used.
(9) When the LEDs are illuminating, operating current should be decided after
considering the ambient maximum temperature.
(10) The LEDs must be soldered within seven days after opening the moistureproof packing.
(11) Repack unused products with anti-moisture packing, fold to close any opening
and then store in a dry place.
(12) The appearance and specifications of the product may be modified for
improvement without notice.
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Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
12. Reliability Test Item and Condition
Item
Reference
Test Condition
Duration
/ Cycle
Number
of
Damage
Thermal Shock
EIAJ ED4701
Ta =-40oC (30MIN) ~ 100oC
(30MIN)
100
Cycle
0/22
Temperature
Cycle
EIAJ ED4701
Ta =-40oC (30MIN) ~ 25oC (5MIN)
~ 100oC (30MIN) ~ 25oC (5MIN)
100
Cycle
0/22
High
Temperature
Storage
High
Temperature
High Humidity
Storage
Low
Temperature
Storage
EIAJ ED4701
Ta =100oC
1000
Hours
0/22
EIAJ ED4701
Ta =85oC, RH=85%
1000
Hours
0/22
EIAJ ED4701
Ta =-40oC
1000
Hours
0/22
Operating
Endurance Test
Internal
Reference
Ta =25oC, IF =20mA
1000
Hours
0/22
Internal
Reference
Ta =85oC, RH=85%, IF =15mA
300
Hours
0/22
Internal
Reference
Ta =85oC, IF =20mA
500
Hours
0/22
Internal
Reference
Ta =-40oC, IF =20mA
1000
Hours
0/22
MIL-STD883D
1KV at 1.5kΩ; 100pF
3 Time
0/22
High
Temperature
High Humidity
Life Test
High
Temperature
Life Test
Low
Temperature
Life Test
ESD(HBM)
Criteria for Judging the Damage
Item
Symbol
Condition
Forward Voltage
VF
Reverse Current
Luminous
Intensity
Criteria for Judgement
MIN
MAX
IF =20mA
-
USL*1 × 1.2
IR
VR=5V
-
USL*1 × 2.0
IV
IF =20mA
LSL*2 × 0.5
-
Note : *1 USL : Upper Standard Level
*2 LSL : Lower Standard Level
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Document No. : SSC-QP-7-07-24 (Rev.00)