Z-Power LED X10490 Technical Data Sheet *Customer : Specification KWT806 CUSTOMER Checked by Approved by SUPPLIER Drawn by Approved by Rev. 00 January, 2009 www.acriche .com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet Contents 1. Description 2. Absolute Maximum Ratings 3. Electro Characteristics 4. Optical characteristics 5. Reliability Test Item and Condition 6. Color & Binning 7. Material 8. Outline Dimension 9. Packing 10. Soldering 11. Precaution for use 12. Handling of Silicone Resin LEDs Rev. 00 January, 2009 www.acriche .com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet Revision History Revision No. Date 00 September. 30. 2008 Page. Summary Initial release Rev. 00 January, 2009 www.acriche .com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet KWT806-S 1. Description This surface-mount LED comes in PLCC standard package dimension. It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. The die is attached within the reflector cavity and the cavity is encapsulated by epoxy or silicone. The package design coupled with careful selection of component materials allow these products to perform with high reliability in a larger temperature range -40℃ to 100℃. The high reliability feature is crucial to Automotive interior and Indoor ESS. • White colored SMT package • InGaN/Sic material • Suitable for all SMT assembly and soldering methods • Pb-Free Reflow soldering application • RoHS compliant • MSL 2a Applications • White Back-light unit • Electric Signs and Signals • Interior automotive • Office Automation, Electrical Appliances, Industrial Equipment Rev. 00 January, 2009 www.acriche .com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 2. Absolute maximum ratings*1 Parameter Symbol Value Unit Power Dissipation Pd 120 mW Forward Current IF 30 mA 100 mA Peak Forward Current IFM *2 Reverse Voltage VR 5 V Operating Temperature Topr -30 ~ +85 ºC Storage Temperature Tstg -40 ~ +100 ºC *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio. 3. Electric characteristics Parameter Symbol Condition Min Typ Max Unit Forward Voltage*1 VF IF =20mA 2.9 3.2 3.4 V Reverse Current IR VR=5V - - 50 µA Luminous Intensity*2 IV IF =20mA 14,00 1,900 2,500 mcd Luminous flux Φ IF =20mA 4.75 lm IF =20mA 120 deg. Viewing Angle Life time *3 2θ ½ IF =20mA o Ta = 60 C 15,00 0 - - hrs *1.Forward Voltage Measurement allowance is ±0.1V *2.The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±7% *3.2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. *4 Estimated time to 50% degradation of initial luminous intensity. [Note] All measurements were made under the standardized environment of SSC. Rev. 00 January, 2009 www.acriche .com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00) Relative Luminous Intensity vs Forward Current Forward Current vs. Forward Voltage (Ta=25 OC ) (Ta=25 OC ) 2.0 Relative Luminous Intensity [%] Forward Current IF [mA] 1.8 1 10 0 10 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 4.2 0 10 Forward Voltage VF (V) 20 30 40 Forward Current IF [mA] Radiation Diagram Forward Current Derating Curve (Ta=25 OC ) 40 0 Forward Current IF [mA] Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics -30 30 30 -60 20 60 10 90 -90 0 -40 -20 0 20 40 60 80 100 120 Ambient Temperature TA [OC] Rev. 00 January, 2009 www.acriche .com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 5. Reliability Test Item Reference Test Condition Duration / Cycle Number of Damage Thermal Shock Internal Reference Ta =-40oC (30MIN) ~ 100oC (30MIN) 100 Cycle 0/22 Temperature Cycle EIAJ ED-4701 Ta =-40oC (30MIN) ~ 25oC (5MIN) ~ 100oC (30MIN) ~ 25oC (5MIN) 100 Cycle 0/22 High Temperature Storage EIAJ ED-4701 Ta =100oC 1,000 Hours 0/22 High Temperature High Humidity Storage EIAJ ED-4701 Ta =85oC, RH=85% 1,000 Hours 0/22 Low Temperature Storage EIAJ ED-4701 Ta =-40oC 1,000 Hours 0/22 Operating Endurance Test Internal Reference Ta =25oC, IF =20mA 1,000 Hours 0/22 High Temperature / Humidity Life Internal Reference Ta =60oC, RH=90%, IF =20mA 1,000 Hours 0/22 High Temperature Life Test Internal Reference Ta =60oC, IF =20mA 1,000 Hours 0/22 Low Temperature Life Test Internal Reference Ta =-40oC, IF =20mA 1,000 Hours 0/22 ESD(HBM) MIL-STD883D 1KV at 1.5kΩ; 100pF 3 Time 0/22 * Criteria for Judging the Damage Item Symbol Condition Forward Voltage VF Reverse Current Luminous Intensity Criteria for Judgement MIN MAX IF =20mA - USL*1 × 1.1 IR VR=5V - 100 µA IV IF =20mA LSL*2 × 0.7 - Note : *1 USL : Upper Standard Level *2 LSL : Lower Standard Level *ESD guarantee condition Item Test Condition Criteria for Judgement Test Form HBM 1,000 V IR =100 ㎂ and below CONTACT Rev. 00 January, 2009 www.acriche .com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00) 0.9 520 0.8 525 515 530 535 540 510 545 0.7 550 555 505 560 0.6 565 570 500 CIE (y) Z-Power LED X10490 Technical Data Sheet 6. Color Coordinate & Bin Code Description 575 0.5 580 585 0.4 590 495 595 600 610 0.3 620 490 630 830 0.2 485 480 0.1 475 470 460 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 C I E (x) 0.36 6300K 0.34 y coords. 0.32 0.30 0.28 0.26 0.24 6500K M0 M1 L0 7000K M2 L1 K0 M3 L2 7500K K1 J0 M4 L3 8000K K2 J1 M5 I0 L4 K3 J2 8400K I1 H0 L5 K4 J3 8900K I2 H1 K5 G0 J4 I3 H2 G1 9900K F0 J5 I4 H3 G2 10800K F1 I5 H4 E0 G3 F2 E1 13000K H5 G4 D0 F3 E2 G5 D1 15000K F4 E3 C0 D2 F5 E4 C1 20000 K D3 B0 E5 C2 D4 B1 30000 K C3 A0 D5 B2 C4 A1 B3 C5 A2 B4 A3 B5 A4 A5 6700K CCT 0.22 Rev. 00 0.25 0.26 0.27 0.28 0.29 0.30 x coords. 0.31 0.32 January, 0.33 2009 www.acriche .com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet *CIE RANK <IF=20mA, Ta=25℃> E2 E3 E4 x y x y x y 0.2820 0.2720 0.2850 0.2670 0.2880 0.2620 0.2850 0.2670 0.2880 0.2620 0.2910 0.2570 0.2893 0.2743 0.2920 0.2690 0.2948 0.2638 0.2865 0.2795 0.2893 0.2743 0.2920 0.2690 F2 F3 F4 x y x y x y 0.2865 0.2795 0.2893 0.2743 0.2920 0.2690 0.2893 0.2743 0.2920 0.2690 0.2948 0.2638 0.2935 0.2815 0.2960 0.2760 0.2985 0.2705 0.2910 0.2870 0.2935 0.2815 0.2960 0.2760 G2 G3 G4 x y x y x y 0.2910 0.2870 0.2935 0.2815 0.2960 0.2760 0.2935 0.2815 0.2960 0.2760 0.2985 0.2705 0.2975 0.2885 0.3000 0.2830 0.3025 0.2775 0.2950 0.2940 0.2975 0.2885 0.3000 0.2830 H2 H3 H4 x y x y x y 0.2950 0.2940 0.2975 0.2885 0.3000 0.2830 0.2975 0.2885 0.3000 0.2830 0.3025 0.2775 0.3015 0.2955 0.3040 0.2900 0.3065 0.2845 0.2990 0.3010 0.3015 0.2955 0.3040 0.2900 *Measurement Uncertainty of the Color Coordinates : ± 0.007 Rev. 00 January, 2009 www.acriche .com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet *CIE RANK <IF=20mA, Ta=25℃> I2 I3 I4 x y x y x y 0.2990 0.3010 0.3015 0.2955 0.3040 0.2900 0.3015 0.2955 0.3040 0.2900 0.3065 0.2845 0.3055 0.3025 0.3080 0.2970 0.3105 0.2915 0.3030 0.3080 0.3055 0.3025 0.3080 0.2970 J2 J3 J4 x y x y x y 0.3030 0.3080 0.3055 0.3025 0.3080 0.2970 0.3055 0.3025 0.3080 0.2970 0.3105 0.2915 0.3095 0.3095 0.3120 0.3040 0.3145 0.2985 0.3070 0.3150 0.3095 0.3095 0.3120 0.3040 K2 K3 K4 x y x y x y 0.3070 0.3150 0.3095 0.3095 0.3120 0.3040 0.3095 0.3095 0.3120 0.3040 0.3145 0.2985 0.3135 0.3165 0.3160 0.3110 0.3185 0.3055 0.3110 0.3220 0.3135 0.3165 0.3160 0.3110 L2 L3 L4 x y x y x y 0.3110 0.3220 0.3135 0.3165 0.3160 0.3110 0.3135 0.3165 0.3160 0.3110 0.3185 0.3055 0.3175 0.3235 0.3200 0.3180 0.3225 0.3125 0.3150 0.3290 0.3175 0.3235 0.3200 0.3180 *Measurement Uncertainty of the Color Coordinates : ± 0.007 Rev. 00 January, 2009 www.acriche .com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet Bin Code Description ▷ Part Number : KWT806 - S Bin Code Luminous Intensity CIE Forward Voltage J6 EX Z Luminous Intensity (mcd) @ IF = 20mA Bin Code Min. J6 1,600 1,700 J7 1,700 1,800 J8 1,800 1,900 K9 1,900 2,000 K0 2,000 2,100 K1 2,100 2,200 K2 2,200 2,300 Max. Forward Voltage (V) @ IF = 20mA Color Rank @ IF = 20mA A0~M0 A1~M1 A2~M2 Bin Code Min. Max. Z 2.9 3.4 A3~M3 A4~M4 A5~M5 7. Material item Reflector Wire Encapsulate Chip Material PPA Gold Silicone SiC Rev. 00 January, 2009 www.acriche .com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 8. Outline Dimension Package Outlines 2 1 Package Marking Front View (Cathode) Right View Rear View ( Tolerance: ±0.1, Unit: mm ) Circuit Diagram Recommended Solder Pad Anode (+) 2 1 Cathode (-) Rev. 00 January, 2009 www.acriche .com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 9. packing Package Marking (Cathode) (1) Quantity : 2000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover(tape is turned from Tolerance: ±0.1, off Unit: mm ) the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package Rev. 00 January, 2009 www.acriche .com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet ● Reel Packing Structure Reel QUANTITY : XXXX LOT NUM BER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag QUANTITY : XXXX LOT NUM BER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure M aterial : Paper(SW 3B(B)) TYPE 7inch SIZE (mm) c a b 245 220 102 245 220 142 1 SIDE c TUV QUANTITY : XXXX LOT NUM BER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. M ADE IN KOREA Acriche 1 Sem iconductor EcoLight b RoHS a Rev. 00 January, 2009 www.acriche .com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 10. soldering (1) Lead Solder Lead Solder Lead Solder Pre-heat 120~150℃ Pre-heat time 120 sec. Max. Peak-Temperature 240℃ Max. Soldering time Condition 10 sec. Max. 2.5~5 o C / sec. 2.5~5 C / sec. Pre-heating 120~150 oC 240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC 120sec. Max. (2) Lead-Free Solder Lead-frame Solder 1~5 o C / sec. Lead Free Solder Pre-heat 150~200℃ Pre-heat time 120 sec. Max. Peak-Temperature 260℃ Max. Soldering time Condition 10 sec. Max. 1~5 o C / sec. Pre-heating 150~200 o C 260 oC Max. 10 sec. Max. 60sec. Max. Above 220 oC 120sec. Max. (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. Rev. 00 January, 2009 www.acriche .com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 11. precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desicator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 70%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 10% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) The LEDs must be soldered within seven days after opening the moisture-proof packing. (11) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (12) The appearance and specifications of the product may be modified for improvement without notice. Rev. 00 January, 2009 www.acriche .com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 12. Handling of Silicone Resin LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. Rev. 00 January, 2009 www.acriche .com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00)