SEOUL SWT805-S

Z-Power LED
X10490
Technical
Data
Sheet
*Customer :
Specification
SWT805-S
CUSTOMER
Checked by
Approved by
SUPPLIER
Drawn by
Approved by
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Z-Power LED
X10490
Technical
Data
Sheet
Contents
1.
Description
2.
Absolute Maximum Ratings
3.
Electro Characteristics
4.
Optical characteristics
5.
Reliability Test Item and Condition
6.
Color & Binning
7.
Material
8.
Outline Dimension
9.
Packing
10.
Soldering
11.
Precaution for use
12.
Handling of Silicone Resin LEDs
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Z-Power LED
X10490
Technical
Data
Sheet
Revision History
Revision No.
Date
00
October. 23.
2008
Page.
Summary
Initial release
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Z-Power LED
X10490
Technical
Data
Sheet
SWT805-S
1. Description
This surface-mount LED comes in
standard package dimension. It has a
substrate made up of a molded plastic
reflector sitting on top of a bent lead
frame. The die is attached within the
reflector cavity and the cavity is
encapsulated by epoxy or silicone.
The package design coupled with
careful selection of component
materials allow these products to
perform with high reliability in a larger
temperature range -40℃ to 100℃. The
high reliability feature is crucial to
Automotive interior and Indoor ESS.
Features
• White colored SMT package
• InGaN/Sic material
• Suitable for all SMT assembly
and soldering methods
• Pb-Free Reflow soldering
application
• RoHS compliant
Applications
• White Back-light unit
• Electric Signs and Signals
• Interior automotive
• Office Automation,
Electrical Appliances,
Industrial Equipment
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Z-Power LED
X10490
Technical
Data
Sheet
2. Absolute maximum ratings*1
Parameter
Symbol
Value
Unit
Power Dissipation
Pd
120
mW
Forward Current
IF
30
mA
90
mA
Peak Forward Current
IFM
*2
Reverse Voltage
VR
5
V
Operating Temperature
Topr
-40 ~ +85
ºC
Storage Temperature
Tstg
-40 ~ +100
ºC
*1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.
*2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio.
3. Electric characteristics
Symb
ol
Condition
Min
Typ
Max
Unit
Forward Voltage*1
VF
IF =20mA
2.9
3.2
3.4
V
Reverse Current
IR
VR=5V
-
-
10
µA
Luminous Intensity*2
IV
IF =20mA
1,400
1,900
2,500
mcd
Luminous flux
Φ
IF =20mA
Parameter
Viewing Angle
*3
2θ
½
IF =20mA
4.75
-
115
lm
-
deg.
*1.Forward Voltage Measurement allowance is ±0.1V
*2.The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the
mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±7%
*3.2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity.
*4 Estimated time to 50% degradation of initial luminous intensity.
[Note] All measurements were made under the standardized environment of SSC.
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Forward Current vs. Forward Voltage
Relative Luminous Intensity vs Forward Current
(Ta=25 OC )
(Ta=25 OC )
Relative Luminous Intensity [%]
Forward Current IF [mA]
2.0
1
10
0
10
2.6
2.8
3.0
3.2
3.4
3.6
3.8
4.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
4.2
0
10
Forward Voltage VF (V)
20
30
40
Forward Current IF [mA]
Forward Current Derating Curve
Radiation Diagram
(Ta=25 OC )
40
0
Forward Current IF [mA]
Z-Power LED
X10490
Technical
Data
Sheet
4. Optical characteristics
-30
30
30
-60
20
60
10
-90
0
-40
-20
0
20
40
60
80
100
90
120
Ambient Temperature TA [OC]
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Z-Power LED
X10490
Technical
Data
Sheet
5. Reliability Test
Item
Reference
Test Condition
Duration
/ Cycle
Number of
Damage
Thermal Shock
Internal
Reference
Ta =-40oC (30MIN) ~ 100oC (30MIN)
100 Cycle
0/22
Temperature Cycle
EIAJ ED-4701
Ta =-40oC (30MIN) ~ 25oC (5MIN)
~ 100oC (30MIN) ~ 25oC (5MIN)
100 Cycle
0/22
High Temperature
Storage
EIAJ ED-4701
Ta =100oC
1,000 Hours
0/22
High Temperature
High Humidity
Storage
EIAJ ED-4701
Ta =85oC, RH=85%
1,000 Hours
0/22
Low Temperature
Storage
EIAJ ED-4701
Ta =-40oC
1,000 Hours
0/22
Operating
Endurance Test
Internal
Reference
Ta =25oC, IF =20mA
1,000 Hours
0/22
High Temperature /
Humidity Life
Internal
Reference
Ta =60oC, RH=90%, IF =20mA
1,000 Hours
0/22
High Temperature
Life Test
Internal
Reference
Ta =60oC, IF =20mA
1,000 Hours
0/22
Low Temperature
Life Test
Internal
Reference
Ta =-40oC, IF =20mA
1,000 Hours
0/22
ESD(HBM)
MIL-STD883D
1KV at 1.5kΩ; 100pF
3 Time
0/22
* Criteria for Judging the Damage
Item
Symbol
Condition
Forward Voltage
VF
Reverse Current
Luminous Intensity
Criteria for Judgement
MIN
MAX
IF =20mA
-
USL*1 × 1.1
IR
VR=5V
-
100 µA
IV
IF =20mA
LSL*2 × 0.7
-
Note : *1 USL : Upper Standard Level
*2 LSL : Lower Standard Level
*ESD guarantee condition
Item
Test Condition
Criteria for Judgement
Test Form
HBM
1,000 V
IR =100 ㎂ and below
CONTACT
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0.9
520
0.8
525
515
530
535
540
510
545
0.7
550
555
505
560
0.6
565
570
500
CIE (y)
Z-Power LED
X10490
Technical
Data
Sheet
6. Color Coordinate & Bin Code Description
575
0.5
580
585
0.4
590
495
595
600
610
0.3
620
490
630
830
0.2
485
480
0.1
475
470
460
0.0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
C I E (x)
0.36
6300K
0.34
y coords.
0.32
0.30
0.28
0.26
0.24
6500K
M0
M1
L0
7000K
M2
L1
K0
M3
L2
7500K
K1
J0
M4
L3
8000K
K2
J1
M5
I0
L4
K3
J2
8400K
I1
H0
L5
K4
J3
8900K
I2
H1
K5
G0
J4
I3
H2
G1
9900K
F0
J5
I4
H3
G2
10800K
F1
I5
H4
E0
G3
F2
E1
13000K
H5
G4
D0
F3
E2
G5
D1
15000K
F4
E3
C0
D2
F5
E4
C1
20000 K
D3
B0
E5
C2
D4
B1
30000 K
C3
A0
D5
B2
C4
A1
B3
C5
A2
B4
A3
B5
A4
A5
6700K
CCT
0.22
Rev. 00
0.25
0.26
0.27
0.28
0.29
0.30
x coords.
0.31
0.32 January,
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Z-Power LED
X10490
Technical
Data
Sheet
*CIE RANK
<IF=20mA, Ta=25℃>
E2
E3
E4
x
y
x
y
x
y
0.2820
0.2720
0.2850
0.2670
0.2880
0.2620
0.2850
0.2670
0.2880
0.2620
0.2910
0.2570
0.2893
0.2743
0.2920
0.2690
0.2948
0.2638
0.2865
0.2795
0.2893
0.2743
0.2920
0.2690
F2
F3
F4
x
y
x
y
x
y
0.2865
0.2795
0.2893
0.2743
0.2920
0.2690
0.2893
0.2743
0.2920
0.2690
0.2948
0.2638
0.2935
0.2815
0.2960
0.2760
0.2985
0.2705
0.2910
0.2870
0.2935
0.2815
0.2960
0.2760
G2
G3
G4
x
y
x
y
x
y
0.2910
0.2870
0.2935
0.2815
0.2960
0.2760
0.2935
0.2815
0.2960
0.2760
0.2985
0.2705
0.2975
0.2885
0.3000
0.2830
0.3025
0.2775
0.2950
0.2940
0.2975
0.2885
0.3000
0.2830
H2
H3
H4
x
y
x
y
x
y
0.2950
0.2940
0.2975
0.2885
0.3000
0.2830
0.2975
0.2885
0.3000
0.2830
0.3025
0.2775
0.3015
0.2955
0.3040
0.2900
0.3065
0.2845
0.2990
0.3010
0.3015
0.2955
0.3040
0.2900
*Measurement Uncertainty of the Color Coordinates : ± 0.007
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Z-Power LED
X10490
Technical
Data
Sheet
*CIE RANK
<IF=20mA, Ta=25℃>
I2
I3
I4
x
y
x
y
x
y
0.2990
0.3010
0.3015
0.2955
0.3040
0.2900
0.3015
0.2955
0.3040
0.2900
0.3065
0.2845
0.3055
0.3025
0.3080
0.2970
0.3105
0.2915
0.3030
0.3080
0.3055
0.3025
0.3080
0.2970
J2
J3
J4
x
y
x
y
x
y
0.3030
0.3080
0.3055
0.3025
0.3080
0.2970
0.3055
0.3025
0.3080
0.2970
0.3105
0.2915
0.3095
0.3095
0.3120
0.3040
0.3145
0.2985
0.3070
0.3150
0.3095
0.3095
0.3120
0.3040
K2
K3
K4
x
y
x
y
x
y
0.3070
0.3150
0.3095
0.3095
0.3120
0.3040
0.3095
0.3095
0.3120
0.3040
0.3145
0.2985
0.3135
0.3165
0.3160
0.3110
0.3185
0.3055
0.3110
0.3220
0.3135
0.3165
0.3160
0.3110
L2
L3
L4
x
y
x
y
x
y
0.3110
0.3220
0.3135
0.3165
0.3160
0.3110
0.3135
0.3165
0.3160
0.3110
0.3185
0.3055
0.3175
0.3235
0.3200
0.3180
0.3225
0.3125
0.3150
0.3290
0.3175
0.3235
0.3200
0.3180
*Measurement Uncertainty of the Color Coordinates : ± 0.007
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Z-Power LED
X10490
Technical
Data
Sheet
Bin Code Description
▷ Part Number : SWT805 - S
Bin Code
Luminous
Intensity
CIE
Forward
Voltage
J6
EX
Z
Bin
Code
Min.
J6
1,600
1,700
J7
1,700
1,800
J8
1,800
1,900
K9
1,900
2,000
K0
2,000
2,100
K1
2,100
2,200
K2
2,200
2,300
Forward Voltage (V)
@ IF = 20mA
Color Rank
@ IF = 20mA
Luminous Intensity (mcd)
@ IF = 20mA
A0~M0
Max.
A1~M1
Bin
Code
Min.
Max.
Z
2.9
3.4
A2~M2
A3~M3
A4~M4
A5~M5
7. Material
item
Reflector
Wire
Encapsulate
Chip
Material
PPA
Gold
Silicone
SiC
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2.0
0.75
1.3
Anode
3.0
1.5
0.75
2.0
3.0
Z-Power LED
X10490
Technical
Data
Sheet
8. Outline Dimension
Cathode
( Tolerance: ±0.2 mm )
Recommended
Solder Pattern
Management of Molding
surface
( Tolerance:+ 0, - 0.1 mm )
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11.4 ± 0.1
180 +0
-3
9.0 ± 0.3
LABLE
2.0 ± 0.2
13 ±0.2
30°
10
60
Z-Power LED
X10490
Technical
Data
Sheet
9. packing
22
( Tolerance: ±0.2, Unit: mm )
(1) Quantity : 2,000pcs/Reel
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from
the carrier tape at the angle of 10º to the carrier tape
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package
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Z-Power LED
X10490
Technical
Data
Sheet
● Reel Packing Structure
Reel
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR
DESI PAK
Aluminum Vinyl Bag
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B))
TYPE
7inch
SIZE (mm)
c
a
b
245 220 102
245 220 142
1 SIDE
c
TUV
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
MADE IN KOREA
Acriche
1
Semiconductor EcoLight
b
RoHS
a
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Z-Power LED
X10490
Technical
Data
Sheet
10. soldering
(1) Lead Solder
Lead Solder
Lead Solder
Pre-heat
120~150℃
Pre-heat time
120 sec. Max.
Peak-Temperature
240℃ Max.
Soldering time
Condition
10 sec. Max.
2.5~5 o C / sec.
2.5~5 C / sec.
Pre-heating
120~150 oC
240 oC Max.
10 sec. Max.
60sec. Max.
Above 200 oC
120sec. Max.
(2) Lead-Free Solder
Lead-frame Solder
1~5 o C / sec.
Lead Free Solder
Pre-heat
150~200℃
Pre-heat time
120 sec. Max.
Peak-Temperature
260℃ Max.
Soldering time
Condition
10 sec. Max.
1~5 o C / sec.
Pre-heating
150~200 o C
260 oC Max.
10 sec. Max.
60sec. Max.
Above 220 oC
120sec. Max.
(3) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
(4) The encapsulated material of the LEDs is silicone.
Precautions should be taken to avoid the strong pressure on the encapsulated
part.
So when using the chip mounter, the picking up nozzle that does not affect
the silicone resign should be used.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
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Z-Power LED
X10490
Technical
Data
Sheet
11. precaution for use
(1) Storage
In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a
desicator) with a desiccant. Otherwise, to store them in the following
environment is recommended.
Temperature : 5ºC ~30ºC Humidity : maximum 70%RH
(2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may
affect the light transmission efficiency, causing the light intensity to drop. Attention
in followed; Keeping of a fraction
Temperature : 5 ~ 40ºC Humidity : less than 10%
(3) In the case of more than 1 week passed after opening or change color of
indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC.
(4) Any mechanical force or any excess vibration shall not be accepted to apply
during cooling process to normal temperature after soldering.
(5) Quick cooling shall be avoided.
(6) Components shall not be mounted on warped direction of PCB.
(7) Anti radioactive ray design is not considered for the products.
(8) This device should not be used in any type of fluid such as water, oil, organic
solvent etc. When washing is required, IPA should be used.
(9) When the LEDs are illuminating, operating current should be decided after
considering the ambient maximum temperature.
(10) The LEDs must be soldered within seven days after opening the moisture-proof
packing.
(11) Repack unused products with anti-moisture packing, fold to close any opening
and then store in a dry place.
(12) The appearance and specifications of the product may be modified for
improvement without notice.
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Z-Power LED
X10490
Technical
Data
Sheet
12. Handling of Silicone Resin LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as
possible. Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies
to LEDs without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions
regarding the form of the pick and place nozzle, except that mechanical pressure on the
surface of the resin must be prevented.
This is assured by choosing a pick and place nozzle which is larger than the LED’s
reflector area.
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs.
These conditions must be considered during the handling of such devices. Compared to
standard encapsulants, silicone is generally softer, and the surface is more likely to
attract dust.
As mentioned previously, the increased sensitivity to dust requires special care
during processing. In cases where a minimal level of dirt and dust particles cannot be
guaranteed, a suitable cleaning solution must be applied to the surface after the
soldering of components.
(5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it
must be assured that these solvents do not dissolve the package or resin.
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the
LED.
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