THC63LVD1024_Rev.2.4_E THC63LVD1024 135MHz 67Bits LVDS Receiver General Description Features The THC63LVD1024 receiver is designed to support Dual Link transmission between Host and Flat Panel Display up to 1080p/QXGA resolutions. The THC63LVD1024 converts the LVDS data streams back into 67bits of CMOS/TTL data with falling edge or rising edge clock for convenient with a variety of LCD panel controllers. In Dual Link, data transmit clock frequency of 135MHz, 67bits of RGB data are transmitted at an effective rate of 945Mbps per LVDS channel. Using a 135MHz clock, the data throughput is 1.1Gbytes per second. • Wide dot clock range suited for TV Signal(480i1080p), PC Signal(VGA-QXGA) Dual LVDS port IN/Dual TTL port Out Mode: 8 - 135MHz(CLKOUT) Dual LVDS port IN/Single TTL port Out Mode: 40 - 150MHz(CLKOUT) • PLL requires No external components • Flexible Input/Output mode 1. Single/Dual LVDS port IN /Single/Dual TTL port OUT • • • • • • • 2. Double Edge output 50% output clock duty cycle TTL clock edge selectable TTL clock output timing programmable(3 step) 2 Output data mapping for simplifying PCB layout. Power down mode Low power single 3.3V CMOS design 144pin LQFP Exposed PAD Block Diagram LVDS INPUT Port1 RC1 +/RD1 +/RE1 +/- RA2 +/RB2 +/LVDS INPUT Port2 RC2 +/RD2 +/RE2 +/- RCLK +/(8 to 135MHz) 32 R1[9:0] G1[9:0] B1[9:0] CONT1[2:1] 32 R2[9:0] G2[9:0] B2[9:0] CONT2[2:1] 35 Data Formatter 1) DEMUX 2) MUX 3) DDR RB1 +/- SERIAL TO PARALLEL RA1 +/- SERIAL TO PARALLEL LVDS INPUT 35 3 TTL OUTPUT Port1 TTL OUTPUT Port2 Hsync Vsync DE RECEIVER CLOCK OUT (8 to 150MHz) PLL /PDWN MODE[2:0] DK R/F O/E MAP Copyright©2012 THine Electronics, Inc. 1/23 THine Electronics, Inc. THC63LVD1024_Rev.2.4_E 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 PGND PVCC VCC CONT12 CONT11 DE VSYNC HSYNC B19 B18 GND VCC B17 B16 B15 B14 B13 B12 B11 GND VCC B10 G19 G18 G17 G16 G15 GND VCC G14 G13 G12 G11 G10 R19 R18 Pin Out 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 TSSOP144 Exposed PAD Top View 145GND(Exposed PAD) R17 GND VCC R16 R15 R14 R13 R12 R11 R10 CGND CVCC CLKOUT GND GND VCC CONT22 CONT21 GND VCC B29 B28 B27 B26 B25 GND VCC B24 B23 B22 B21 B20 G29 GND VCC G28 PGND PVCC Reserved /PDWN MODE0 MODE1 DK R/F OE MODE2 MAP VCC GND R20 R21 R22 R23 R24 R25 R26 VCC GND R27 R28 R29 G20 G21 VCC VCC GND G22 G23 G24 G25 G26 G27 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 LGND RA1RA1+ RB1RB1+ LVCC LGND RC1RC1+ RCLKRCLK+ LVCC LGND RD1RD1+ RE1RE1+ LVCC LGND RA2RA2+ RB2RB2+ LVCC LGND RC2RC2+ LGND LGND LVCC LGND RD2RD2+ RE2RE2+ LGND Copyright©2012 THine Electronics, Inc. 2/23 THine Electronics, Inc. THC63LVD1024_Rev.2.4_E Pin Description Pin Name Pin # Type RA1+, RA1- 111, 110 LVDS IN RB1+, RB1- 113, 112 LVDS IN RC1+, RC1- 117, 116 LVDS IN RD1+, RD1- 123, 122 LVDS IN RE1+, RE1- 125, 124 LVDS IN RCLK+, RCLK- 119, 118 LVDS IN RA2+, RA2- 129, 128 LVDS IN RB2+, RB2- 131, 130 LVDS IN RC2+, RC2- 135, 134 LVDS IN RD2+, RD2- 141, 140 LVDS IN RE2+, RE2- 143, 142 LVDS IN R19 ~ R10 74 - 72, 69 - 63 OUT G19 ~ G10 86 - 82, 79 - 75 OUT B19 ~ B10 R29 ~ R20 G29 ~ G20 100, 99, 96-90, 87 25-23, 20-14 40, 37 - 31, 27, 26 B29 ~ B20 52 - 48, 45 - 41 CONT11,CONT12 104, 105 CONT21,CONT22 55, 56 DE Description The 1st Link. The 1st pixel input data when Dual Link. LVDS Clock Input. The 2nd Link. These pins are disabled when Single Link. The 1st Pixel Data Outputs. OUT OUT OUT The 2nd Pixel Data Outputs. OUT OUT User defined data output 103 OUT Data Enable Output. VSYNC 102 OUT Vsync Output. HSYNC 101 OUT Hsync Output. CLKOUT 60 OUT Clock Output. Power down and Output Control.(Table1) /PDWN 4 IN H: Normal operation L: Power down Pixel Data Mode. MODE1, MODE0 6, 5 Copyright©2012 THine Electronics, Inc. IN MODE1 H H L L 3/23 MODE0 H L H L Mode Single Link (Single-in/Single-out) Single Link (Single-in/Dual-out) Dual Link (Dual-in/Single-out) Dual Link (Dual-in/Dual-out) THine Electronics, Inc. THC63LVD1024_Rev.2.4_E Pin Description (Continued) Pin Name Pin # Type Description Output Clock Delay Timing Select. tDOUT=Output Data Cycle MODE[1:0 ] DK L DK 7 LL HH HL IN LH R/F 8 IN OE 9 IN Offset [nsec] 0 M t DOUT – 6 -------------28 H t DOUT 6 --------------28 L 0 M t DOUT – 7 -------------28 H t DOUT 7 -------------28 Output Clock Triggering Edge Select. H: Rising edge, L: Falling edge. Output Enable.(Table1) H: Output enable, L: Output disable DDR function enable. The use of this function depends on the setting of MODE<1:0>. MODE<1:0>=LH(Dual-in/Single-out Mode) MODE2 10 IN H: DDR (Double Edge Output) function enable. L: DDR (Double Edge Output) function disable. MODE<1:0>=Other Must be tied to GND LVDS mapping table select. See Fig9,10 and Table2 - 9. MAP 11 IN H: Mapping Mode1 L: Mapping Mode2 Reserved 3 IN Must be tied to VCC. VCC 12, 21, 28, 29, 38, 46, 53, 57, 70, 80, 88, 97, 106 Power Power Supply Pins for TTL outputs and digital circuitry. Ground Ground Pins for TTL outputs and digital circuitry. Power Power Supply Pins for LVDS inputs. Ground Ground Pins for LVDS inputs. 13, 22, 30, 39, GND LVCC 47, 54, 58, 59, 71, 81, 89, 98,145 114, 120, 126, 132, 138 109, 115, 121, LGND 127, 133, 136, 137, 139, 144 PVCC 2, 107 Power Power Supply Pin for PLL circuitry. PGND 1, 108 Ground Ground Pin for PLL circuitry. CVCC 61 Power Power Supply Pins for TTL output of CLKOUT. CGND 62 Ground Ground Pins for TTL output of CLKOUT Copyright©2012 THine Electronics, Inc. 4/23 THine Electronics, Inc. THC63LVD1024_Rev.2.4_E Pin Description (Continued) Table 1. Output Control PD OE Data Outputs (Rxn) CLKOUT L L Hi-Z Hi-Z L H All Low Fixed Low H L Hi-Z Hi-Z H H Data Out CLK Out Absolute Maximum Ratings Supply Voltage (VCC) -0.3V ~ +4.0V CMOS/TTL Input Voltage -0.3V ~ (VCC + 0.3V) CMOS/TTL Output Voltage -0.3V ~ (VCC + 0.3V) LVDS Receiver Input Voltage -0.3V ~ (VCC + 0.3V) Output Current -30mA ~ 30mA Junction Temperature +125 °C Storage Temperature Range -55 °C ~ +125 °C Reflow Peak Temperature / Time +260 °C / 10sec. Maximum Power Dissipation @+25 °C 4.4W Copyright©2012 THine Electronics, Inc. 5/23 THine Electronics, Inc. THC63LVD1024_Rev.2.4_E Recommended Operating Conditions CLK Parameter Min. Typ Max Units All Supply Voltage 3.0 3.3 3.6 V Operating Ambient Temperature 0 70 °C MODE<1:0>=LL LVDS Input 8 135 MHz Dual-in/Dual-out Output 8 135 MHz Single Edge Output LVDS Input 20 75 MHz MODE<1:0>=LH (MODE2=L) Output 40 150 MHz Dual-in/Single-out Double Edge Output LVDS Input 20 75 MHz (MODE2=H) Output 20 75 MHz MODE<1:0>=HL LVDS Input 8 135 MHz Single-in/Dual-out Output 4 67.5 MHz MODE<1:0>=HH LVDS Input 8 135 MHz Single-in/Single-out Output 8 135 MHz Differential CLKIN High Time (tRCIH) (Fig1) t RCIP 2 ----------------7 t RCIP 5 ----------------7 nsec Differential CLKIN Low Time (tRCIL) (Fig1) t RCIP 2 ----------------7 t RCIP 5 ----------------7 nsec Frequency tRCIH tRCIL Vdiff = 0V Vdiff = 0V Vdiff = 0V RCLK+ (Differential) tRCIP Fig1. Differential CLKIN Copyright©2012 THine Electronics, Inc. 6/23 THine Electronics, Inc. THC63LVD1024_Rev.2.4_E Electrical Characteristics CMOS/TTL DC Specifications VCC=VCC=PVCC=LVCC Symbol Parameter Conditions VIH High Level Input Voltage /PDWN, MODE[2:0] VIL Low Level Input Voltage R/F, OE, MAP Pin VIH3 High Level Input Voltage VIM3 Middle Level Input Voltage VIL3 Low Level Input Voltage VOH High Level Output Voltage IOH= -8mA VOL Low Level Output Voltage IOL= 8mA 3-Level Inputs (DK Pin) Min. Typ Max Units 2.0 VCC V GND 0.8 V 0.8VCC VCC V 0.6VCC 0.4VCC V GND 0.2VCC V 2.4 V 0.4 V ± 10 μA ± 10 μA /PDWN, MODE[2:0] IIL Input Leakage Current R/F, OE, MAP Pin 0V ≤ V IN ≤ V CC 3-Level Inputs IIL3 3-Level Input Leakage Current (DK Pin) 0V ≤ V IN ≤ V CC LVDS Receiver DC Specifications VCC=VCC=PVCC=LVCC Symbol Parameter Conditions VTH Differential Input High Threshold VIC= 1.2V VTL Differential Input Low Threshold VIC= 1.2V IILD Differential Input Leakage Current VIN= 2.4V / 0V Copyright©2012 THine Electronics, Inc. 7/23 Min. Typ. Max. Units 100 mV -100 mV 30 μA THine Electronics, Inc. THC63LVD1024_Rev.2.4_E Electrical Characteristics (Continued) Supply Current VCC=VCC=PVCC=LVCC Symbol Parameter Receiver IRCCW Supply Current (Worst Case Pattern) Fig2. Condition Typ. Max. Units CLKOUT=65MHz MODE<1:0>=HH 201 mA CLKOUT=85MHz Single-in/Single-out 248 mA CLKOUT=135MHz MODE2=L 364 mA CLKOUT=32.5MHz MODE<1:0>=HL 138 mA CLKOUT=42.5MHz Single-in/ 164 mA CLKOUT=67.5MHz Dual-out 233 mA CLKOUT=65MHz MODE<1:0>=LH 146 mA CLKOUT=85MHz Dual-in/Single-out 165 mA MODE2=L 210 mA CLKOUT=150MHz DDR Output Off 223 mA CLKOUT=32.5MHz MODE<1:0>=LH 147 mA CLKOUT=42.5MHz Dual-in/Single-out 165 mA CLKOUT=67.5MHz MODE2=H 205 mA DDR Output On 217 mA 366 mA 453 mA 671 mA 50 μA CLKOUT=135MHz CL=8pF CLKOUT=75MHz CLKIN=65MHz MODE<1:0>=LL CLKIN=85MHz Dual-in/Dual-out CLKIN=135MHz Receiver IRCCS Power Down /PDWN = L Supply Current Checker Pattern CLKOUT Rxn, Gxn, Bxn x = 1,2 n = 0~9 HSYNC,VSYNC DE CONT11,12 CONT21,22 Fig2. Test Pattern Copyright©2012 THine Electronics, Inc. 8/23 THine Electronics, Inc. THC63LVD1024_Rev.2.4_E Electrical Characteristics (Continued) Output load limitation Output load is limited so that Junction temperature is not over 125 °C calculating formula Tj = Ta + θja * P P = VCC * (IOUTDT + IOUTCK + ICORE) IOUTDT = 1/2 * FCLK * VCC * CLOAD * n IOUTCK = FCLK * VCC * CLOAD Tj : Junction temperature Ta : Ambient temperature θja : Package thermal resistance = 22 [ °C /W] ICORE: Supply Current except all output buffers = 520mA IOUTDT: Supply Current only output buffers of data output. (R1,G1,B1,R2,G2,B2,HSYNC,VSYNC,DE,CONT11,CONT12,CONT21,CONT22) IOUTCK: Supply Current only output buffer of CLKOUT. FCLK : CLKOUT Frequency n : 67 (Number of data output pin) Load Limitation 15 14 Output Load[pF] 13 12 11 10 9 8 100 105 110 115 120 125 130 135 Frequency[MHz] Copyright©2012 THine Electronics, Inc. 9/23 THine Electronics, Inc. THC63LVD1024_Rev.2.4_E Switching Characteristics VCC=VCC=PVCC=LVCC Symbol Parameter Min. Typ. Max. Units tRCP CLKOUT Period (Fig4) 6.67 T 250 ns tRCH tRCL CLKOUT High Time (Fig4) CLKOUT Low Time (Fig4) T --2 ns T --2 ns tDOUT TTL Data OUT Period (Fig5,6) 6.67 tRS TTL Data Setup to CLKOUT(Fig5,6) 0.45tDOUT -0.45 ns tRH TTL Data Hold to CLKOUT(Fig5,6) 0.45tDOUT -0.45 ns tTLH tTHL tSK tRIP1 TTL Low to High Transition Time (Fig 3) TTL High to Low Transition Time (Fig 3) T 250 ns 0.7 1.0 ns 0.7 1.0 ns tRCIP=65MHz -650 0 650 ps Receiver Skew Margin tRCIP=85MHz -450 0 450 ps (Fig7) tRCIP=108MHz -250 0 250 ps tRCIP=135MHz -170 0 170 ps -tSK 0 +tSK ns Input Data Position0 (Fig7) tRIP0 Input Data Position1 (Fig7) t RCIP -------------- – t SK 7 t RCIP -------------7 t RCIP -------------- + t SK 7 ns tRIP6 Input Data Position2 (Fig7) t RCIP - – t SK 2 ------------7 t RCIP 2 ------------7 t RCIP - + t SK 2 ------------7 ns tRIP5 Input Data Position3 (Fig7) t RCIP 3 ------------- – t SK 7 t RCIP 3 ------------7 t RCIP 3 ------------- + t SK 7 ns tRIP4 Input Data Position4 (Fig7) t RCIP 4 ------------- – t SK 7 t RCIP 4 ------------7 t RCIP 4 ------------- + t SK 7 ns tRIP3 Input Data Position5 (Fig7) t RCIP - – t SK 5 ------------7 t RCIP 5 ------------7 t RCIP - + t SK 5 ------------7 ns tRIP2 Input Data Position6 (Fig7) t RCIP 6 ------------- – t SK 7 t RCIP 6 ------------7 t RCIP 6 ------------- + t SK 7 ns tRPLL Phase Lock Loop Set (Fig8) 10.0 ms 89.7 94 ns 7.4 125.0 ns tRCD tRCIP RCLK +/- to CLK OUT Delay (Fig9) MODE<1:0>=LL DK=L, 75MHz CLKIN Period (Fig7) tDEINT MODE<1:0>=HL tDEH tDEL (Single IN/ Dual OUT Mode) Only tRCIP*(2n) DE input period (Fig9-1) 4tRCIP DE input High time (Fig9-1) 2tRCIP ns DE input Low time (Fig9-1) 2tRCIP ns Copyright©2012 THine Electronics, Inc. 10/23 n= integer ns THine Electronics, Inc. THC63LVD1024_Rev.2.4_E AC Timing Diagrams TTL Output 80% 80% CL=8pF 20% 20% TTL Output Load tTHL tTLH Fig3. CMOS/TTL Output Load and Transition Time tRCP CLKOUT tRCH VCC/2 tRCL VCC/2 VCC/2 VCC/2 Fig4. CLKOUT Period and High/Low Time tRCP R/F=L CLKOUT DK=L VCC/2 VCC/2 VCC/2 R/F=H R/F=H CLKOUT DK=M VCC/2 R/F=L t DOUT 6 -------------------28 t DOUT or 7 ------------------28 R/F=L CLKOUT DK=H VCC/2 R/F=H t DOUT 6 -------------------28 Rxn, Gxn, Bxn x = 1,2 n = 0~9 HSYNC,VSYNC DE CONT11,12 CONT21,22 t DOUT or 7 ------------------- tRS 28 tRH VCC/2 VCC/2 tDOUT Fig5. CLKOUT Position and Setup/Hold Timing Copyright©2012 THine Electronics, Inc. 11/23 THine Electronics, Inc. THC63LVD1024_Rev.2.4_E AC Timing Diagrams (Continued) tRCP R/F=L CLKOUT DK=L VCC/2 VCC/2 VCC/2 R/F=H R/F=L CLKOUT DK=M VCC/2 VCC/2 R/F=H t DOUT 7 -------------------28 t DOUT 7 -------------------28 R/F=L CLKOUT DK=H VCC/2 VCC/2 VCC/2 R/F=H t DOUT 7 -------------------28 t DOUT 7 -------------------28 R1n, G1n, B1n n = 0~9 HSYNC,VSYNC DE CONT11,12 tRS VCC/2 tRH 1st Pixel Data tRS tRH 2nd Pixel Data VCC/2 tDOUT VCC/2 tDOUT Fig6. CLKOUT Position and Setup/Hold Timing for Double Edge Output Mode MODE<1:0>=LH, MODE2=H tRCIP Vdiff = 0V Vdiff = 0V RCLK+ (Differential) Ryx+/x=1,2 y= A, B, C, D, E Ryx3’ Ryx2’ Ryx1’ Ryx0’ Ryx6 Ryx5 Ryx4 Previous Cycle Ryx3 Ryx2 Ryx1 Current Cycle Ryx0 Ryx6’’ Next Cycle tRIP1 tRIP0 tRIP6 tRIP5 tRIP4 tRIP3 tRIP2 Fig7. LVDS Input Data Position Copyright©2012 THine Electronics, Inc. 12/23 THine Electronics, Inc. THC63LVD1024_Rev.2.4_E AC Timing Diagrams (Continued) RCLK+/- 2.0V /PDWN tRPLL CLKOUT VCC/2 Fig8. PLL Lock Loop Set Time RCLK+ Vdiff = 0V Ryx+/x=1,2 y= A, B, C, D, E Note: 1) Vdiff = (RCLK+) - (RCLK-) Current Data tRCD CLKOUT VCC/2 R/F=L R1n, G1n, B1n n = 0~9 HSYNC,VSYNC DE CONT11,12 Current Data Fig9. RCLK +/- to CLK OUT Delay RCLK+ DE DE DE DE DE DE RC1+ tDEH tDEL tDEINT Fig9-1. Single IN / Dual OUT mode RC1(DE) input timing Copyright©2012 THine Electronics, Inc. 13/23 THine Electronics, Inc. THC63LVD1024_Rev.2.4_E Output Data Mapping Table2. Output Color Data naming rule X Y Z Description X=R Red Color Data X=G Green Color Data X=B Blue Color Data Y= None Single Pixel Y=O Dual Pixel Y=E Z=0-9 1st Pixel Data 2nd Pixel Data Bit number 0: LSB (Least Significant Bit) 9: MSB (Most Significant Bit) Table3. TTL/CMOS Output Data Mapping (Single-out mode, MODE0=H) Data Signals 30-bit 24-bit Receiver Output Pin Names 18-bit R0 30-bit 24-bit 18-bit R10 R1 R11 R2 R0 R12 R12 R3 R1 R13 R13 R4 R2 R0 R14 R14 R14 R5 R3 R1 R15 R15 R15 R6 R4 R2 R16 R16 R16 R7 R5 R3 R17 R17 R17 R8 R6 R4 R18 R18 R18 R9 R7 R5 R19 R19 R19 G0 G10 G1 G11 G2 G0 G12 G12 G3 G1 G4 G2 G0 G13 G13 G14 G14 G14 G5 G3 G1 G15 G15 G15 G6 G4 G2 G16 G16 G16 G7 G8 G5 G3 G17 G17 G17 G6 G4 G18 G18 G18 G9 G7 G5 G19 G19 G19 B0 B10 B1 B11 B2 B0 B12 B12 B3 B1 B13 B13 B4 B2 B0 B14 B14 B14 B5 B3 B1 B15 B15 B15 B6 B4 B2 B16 B16 B16 B7 B5 B3 B17 B17 B17 B8 B6 B4 B18 B18 B18 B9 B7 B5 B19 B19 B19 Copyright©2012 THine Electronics, Inc. 14/23 THine Electronics, Inc. THC63LVD1024_Rev.2.4_E Output Data Mapping (Continued) Table4. TTL/CMOS Output Data Mapping (Dual-out mode, MODE0=L) 1st Pixel Data Data Signals 30-bit 24-bit 2nd Pixel Data Receiver Output Pin Names 18-bit 30-bit 24-bit 18-bit Receiver Output Pin Names Data Signals 30-bit 24-bit 18-bit 30-bit RE0 R10 RO0 R20 RE1 R11 RO1 R22 24-bit 18-bit RE2 RE0 R12 R12 RO2 RO0 R22 R22 RE3 RE1 R13 R13 RO3 RO1 R23 R23 RE4 RE2 RE0 R14 R14 R14 RO4 RO2 RO0 R24 R24 R24 RE5 RE3 RE1 R15 R15 R15 RO5 RO3 RO1 R25 R25 R25 RE6 RE4 RE2 R16 R16 R16 RO6 RO4 RO2 R26 R26 R26 RE7 RE5 RE3 R17 R17 R17 RO7 RO5 RO3 R27 R27 R27 RE8 RE6 RE4 R18 R18 R18 RO8 RO6 RO4 R28 R28 R28 RE9 RE7 RE5 R19 R19 R19 RO9 RO7 RO5 R29 R29 R29 GE0 G10 GO0 G20 GE1 G11 GO1 G22 GE2 GE0 G12 G12 GO2 GO0 G22 G22 GE3 GE1 G13 G13 GO3 GO1 G23 G23 GE4 GE2 GE0 G14 G14 G14 GO4 GO2 GO0 G24 G24 G24 GE5 GE3 GE1 G15 G15 G15 GO5 GO3 GO1 G25 G25 G25 GE6 GE4 GE2 G16 G16 G16 GO6 GO4 GO2 G26 G26 G26 GE7 GE5 GE3 G17 G17 G17 GO7 GO5 GO3 G27 G27 G27 GE8 GE6 GE4 G18 G18 G18 GO8 GO6 GO4 G28 G28 G28 GE9 GE7 GE5 G19 G19 G19 GO9 GO7 GO5 G29 G29 G29 BE0 B10 BO0 B20 BE1 B11 BO1 B22 BE2 BE0 B12 B12 BO2 BO0 B22 B22 BE3 BE1 B13 B13 BO3 BO1 B23 B23 BE4 BE2 BE0 B14 B14 B14 BO4 BO2 BO0 B24 B24 B24 BE5 BE3 BE1 B15 B15 B15 BO5 BO3 BO1 B25 B25 B25 BE6 BE4 BE2 B16 B16 B16 BO6 BO4 BO2 B26 B26 B26 BE7 BE5 BE3 B17 B17 B17 BO7 BO5 BO3 B27 B27 B27 BE8 BE6 BE4 B18 B18 B18 BO8 BO6 BO4 B28 B28 B28 BE9 BE7 BE5 B19 B19 B19 BO9 BO7 BO5 B29 B29 B29 Copyright©2012 THine Electronics, Inc. 15/23 THine Electronics, Inc. THC63LVD1024_Rev.2.4_E LVDS Input Data Mapping Previous Cycle (2nd Pixel Data) Current Cycle (1st Pixel Data) RCLK+ Rx1+/Rx11(n-1) Rx10(n-1) Rx16(n) x= A, B, C, D, E Rx15(n) Current Cycle (1st Pixel Data) Rx14(n) Rx13(n) Rx12(n) Rx11(n) Rx10(n) Rx16(n+1) Next Cycle (2nd Pixel Data) RCLK+ Rx1+/Rx11(n) x= A, B, C, D, E Rx10(n) Rx16(n+1) Rx15(n+1) Rx14(n+1) Rx13(n+1) Rx12(n+1) Rx11(n+1) Rx10(n+1) Rx16(n+2) Fig10. LVDS Inputs Mapped to TTL Data Outputs MODE1= H (Single-in Mode) Previous Cycle Current Cycle RCLK+ Rx1+/Rx11(n-1) Rx10(n-1) Rx16(n) x= A, B, C, D, E Rx15(n) Rx14(n) Rx13(n) Rx12(n) Rx11(n) Rx10(n) Rx16(n+1) Rx2+/x= A, B, C, D, E Rx21(n-1) Rx20(n-1) Rx26(n) Rx25(n) Rx24(n) Rx23(n) Rx22(n) Rx21(n) Rx20(n) Rx26(n+1) Fig11. LVDS Inputs Mapped to TTL Data Outputs MODE1= L (Dual-in Mode) Copyright©2012 THine Electronics, Inc. 16/23 THine Electronics, Inc. THC63LVD1024_Rev.2.4_E LVDS Input Data Mapping (Continued) Table5. LVDS Input Data Mapping (Single-in/Single-out, MODE<1:0>=HH) LVDS Mapping Mode1 Input Data (Output Pin Name) Mapping Mode2 (Output Pin Name) RA10 R14 R12 RA11 R15 R13 RA12 R16 R14 RA13 R17 R15 RA14 R18 R16 RA15 R19 R17 RA16 G14 G12 RB10 G15 G13 RB11 G16 G14 RB12 G17 G15 RB13 G18 G16 RB14 G19 G17 RB15 B14 B12 RB16 B15 B13 RC10 B16 B14 RC11 B17 B15 RC12 B18 B16 RC13 B19 B17 RC14 HSYNC HSYNC RC15 VSYNC VSYNC RC16 DE DE RD10 R12 R18 RD11 R13 R19 RD12 G12 G18 RD13 G13 G19 RD14 B12 B18 RD15 B13 B19 RD16 CONT11 CONT11 RE10 R10 R10 RE11 R11 R11 RE12 G10 G10 RE13 G11 G11 RE14 B10 B10 RE15 B11 B11 RE16 CONT12 CONT12 Copyright©2012 THine Electronics, Inc. 17/23 THine Electronics, Inc. THC63LVD1024_Rev.2.4_E LVDS Input Data Mapping (Continued) Table6. LVDS Input Data Mapping (Single-in/Dual-out, MODE<1:0>=HL) 1st Pixel Data LVDS 2nd Pixel Data Mapping Mode1 Mapping Mode2 (Output Pin Name) (Input Pin Name) RA10(n) R14 R12 RA11(n) R15 RA12(n) LVDS Mapping Mode1 Mapping Mode2 (Output Pin Name) (Output Pin Name) RA10(n+1) R24 R22 R13 RA11(n+1) R25 R23 R16 R14 RA12(n+1) R26 R24 RA13(n) R17 R15 RA13(n+1) R27 R25 RA14(n) R18 R16 RA14(n+1) R28 R26 RA15(n) R19 R17 RA15(n+1) R29 R27 RA16(n) G14 G12 RA16(n+1) G24 G22 Input Data (1st Pixel Data) Input Data (1st Pixel Data) RB10(n) G15 G13 RB10(n+1) G25 G23 RB11(n) G16 G14 RB11(n+1) G26 G24 RB12(n) G17 G15 RB12(n+1) G27 G25 RB13(n) G18 G16 RB13(n+1) G28 G26 RB14(n) G19 G17 RB14(n+1) G29 G27 RB15(n) B14 B12 RB15(n+1) B24 B22 RB16(n) B15 B13 RB16(n+1) B25 B23 RC10(n) B16 B14 RC10(n+1) B26 B24 RC11(n) B17 B15 RC11(n+1) B27 B25 RC12(n) B18 B16 RC12(n+1) B28 B26 RC13(n) B19 B17 RC13(n+1) B29 B27 RC14(n) HSYNC HSYNC RC14(n+1) HSYNC HSYNC RC15(n) VSYNC VSYNC RC15(n+1) VSYNC VSYNC RC16(n) DE DE RC16(n+1) DE DE RD10(n) R12 R18 RD10(n+1) R22 R28 RD11(n) R13 R19 RD11(n+1) R23 R29 RD12(n) G12 G18 RD12(n+1) G22 G28 RD13(n) G13 G19 RD13(n+1) G23 G29 RD14(n) B12 B18 RD14(n+1) B22 B28 RD15(n) B13 B19 RD15(n+1) B23 B29 RD16(n) CONT11 CONT11 RD16(n+1) CONT21 CONT21 RE10(n) R10 R10 RE10(n+1) R20 R20 RE11(n) R11 R11 RE11(n+1) R21 R21 RE12(n) G10 G10 RE12(n+1) G20 G20 RE13(n) G11 G11 RE13(n+1) G21 G21 RE14(n) B10 B10 RE14(n+1) B20 B20 RE15(n) B11 B11 RE15(n+1) B21 B21 RE16(n) CONT12 CONT12 RE16(n+1) CONT22 CONT22 Copyright©2012 THine Electronics, Inc. 18/23 THine Electronics, Inc. THC63LVD1024_Rev.2.4_E LVDS Input Data Mapping (Continued) Table7. LVDS Input Data Mapping (Dual-in/Single-out DDR On or Off, MODE<1:0>=LH, MODE2=H or L) 1st Pixel Data LVDS Input Data (1st Pixel Data) Mapping Mode1 (Output Pin Name) 2nd Pixel Data Mapping Mode2 (Output Pin Name) LVDS Input Data (2nd Pixel Data) Mapping Mode1 (Output Pin Name) Mapping Mode2 (Output Pin Name) RA10 R14(n) R12(n) RA20 R14(n+1) R12(n+1) RA11 R15(n) R13(n) RA21 R15(n+1) R13(n+1) RA12 R16(n) R14(n) RA22 R16(n+1) R14(n+1) RA13 R17(n) R15(n) RA23 R17(n+1) R15(n+1) RA14 R18(n) R16(n) RA24 R18(n+1) R16(n+1) RA15 R19(n) R17(n) RA25 R19(n+1) R17(n+1) RA16 G14(n) G12(n) RA26 G14(n+1) G12(n+1) RB10 G15(n) G13(n) RB20 G15(n+1) G13(n+1) RB11 G16(n) G14(n) RB21 G16(n+1) G14(n+1) RB12 G17(n) G15(n) RB22 G17(n+1) G15(n+1) RB13 G18(n) G16(n) RB23 G18(n+1) G16(n+1) RB14 G19(n) G17(n) RB24 G19(n+1) G17(n+1) RB15 B14(n) B12(n) RB25 B14(n+1) B12(n+1) RB16 B15(n) B13(n) RB26 B15(n+1) B13(n+1) RC10 B16(n) B14(n) RC20 B16(n+1) B14(n+1) RC11 B17(n) B15(n) RC21 B17(n+1) B15(n+1) RC12 B18(n) B16(n) RC22 B18(n+1) B16(n+1) RC13 B19(n) B17(n) RC23 B19(n+1) B17(n+1) RC14 HSYNC(n) HSYNC(n) RC24 HSYNC(n+1) HSYNC(n+1) RC15 VSYNC(n) VSYNC(n) RC25 VSYNC(n+1) VSYNC(n+1) RC16 DE(n) DE(n) RC26 DE(n+1) DE(n+1) RD10 R12(n) R18(n) RD20 R12(n+1) R18(n+1) RD11 R13(n) R19(n) RD21 R13(n+1) R19(n+1) RD12 G12(n) G18(n) RD22 G12(n+1) G18(n+1) RD13 G13(n) G19(n) RD23 G13(n+1) G19(n+1) RD14 B12(n) B18(n) RD24 B12(n+1) B18(n+1) RD15 B13(n) B19(n) RD25 B13(n+1) B19(n+1) RD16 CONT11(n) CONT11(n) RD26 CONT11(n+1) CONT11(n+1) RE10 R10(n) R10(n) RE20 R10(n+1) R10(n+1) RE11 R11(n) R11(n) RE21 R11(n+1) R11(n+1) RE12 G10(n) G10(n) RE22 G10(n+1) G10(n+1) RE13 G11(n) G11(n) RE23 G11(n+1) G11(n+1) RE14 B10(n) B10(n) RE24 B10(n+1) B10(n+1) RE15 B11(n) B11(n) RE25 B11(n+1) B11(n+1) RE16 CONT12(n) CONT12(n) RE26 CONT12(n+1) CONT12(n+1) Copyright©2012 THine Electronics, Inc. 19/23 THine Electronics, Inc. THC63LVD1024_Rev.2.4_E LVDS Input Data Mapping (Continued) Table8. LVDS Input Data Mapping (Dual-in/Dual-out, MODE<1:0>=LL) 1st Pixel Data LVDS Mapping Mode1 2nd Pixel Data (Output Pin Name) Mapping Mode2 (Output Pin Name) RA10 R14 R12 RA11 R15 RA12 LVDS Mapping Mode1 (Output Pin Name) Mapping Mode2 (Output Pin Name) RA20 R24 R22 R13 RA21 R25 R23 R16 R14 RA22 R26 R24 RA13 R17 R15 RA23 R27 R25 RA14 R18 R16 RA24 R28 R26 RA15 R19 R17 RA25 R29 R27 RA16 G14 G12 RA26 G24 G22 RB10 G15 G13 RB20 G25 G23 RB11 G16 G14 RB21 G26 G24 RB12 G17 G15 RB22 G27 G25 RB13 G18 G16 RB23 G28 G26 RB14 G19 G17 RB24 G29 G27 RB15 B14 B12 RB25 B24 B22 RB16 B15 B13 RB26 B25 B23 RC10 B16 B14 RC20 B26 B24 Input Data (1st Pixel Data) Input Data (2nd Pixel Data) RC11 B17 B15 RC21 B27 B25 RC12 B18 B16 RC22 B28 B26 RC13 B19 B17 RC23 B29 B27 RC14 HSYNC HSYNC RC24 RC15 VSYNC VSYNC RC25 RC16 DE DE RC26 RD10 R12 R18 RD20 R22 R28 RD11 R13 R19 RD21 R23 R29 RD12 G12 G18 RD22 G22 G28 RD13 G13 G19 RD23 G23 G29 RD14 B12 B18 RD24 B22 B28 RD15 B13 B19 RD25 B23 B29 RD16 CONT11 CONT11 RD26 CONT21 CONT21 RE10 R10 R10 RE20 R20 R20 RE11 R11 R11 RE21 R21 R21 RE12 G10 G10 RE22 G20 G20 RE13 G11 G11 RE23 G21 G21 RE14 B10 B10 RE24 B20 B20 RE15 B11 B11 RE25 B21 B21 RE16 CONT12 CONT12 RE26 CONT22 CONT22 Copyright©2012 THine Electronics, Inc. 20/23 N/A THine Electronics, Inc. THC63LVD1024_Rev.2.4_E Note 1)Power On Sequence Power on LVDS-Tx after THC63LVD1024. 2)Cable Connection and Disconnection Don't connect and disconnect the LVDS cable, when the power is supplied to the system. 3)GND Connection Connect the each GND of the PCB which LVDS-Tx and THC63LVD1024 on it. It is better for EMI reduction to place GND cable as close to LVDS cable as possible. 4)Multi Drop Connection Multi drop connection is not recommended. TCLK+ LVDS-Tx THC63LVD1024 TCLK- THC63LVD1024 5)Asynchronous use Asynchronous use such as following system is not recommended. CLKOUT CLKOUT TCLK+ LVDS-Tx DATA TCLK- THC63LVD1024 ! IC CLKOUT TCLK+ LVDS-Tx DATA TCLK- THC63LVD1024 DATA IC DATA . TCLK+ TCLK- CLKOUT THC63LVD1024 ! IC TCLK+ TCLK- Copyright©2012 THine Electronics, Inc. THC63LVD1024 21/23 DATA IC DATA THine Electronics, Inc. THC63LVD1024_Rev.2.4_E Package 22.00 BSC. 1.40~1.60 20.00 BSC. 1.40 +/-0.05 0.05~0.15 73 108 72 22.00 BSC. 20.00 BSC. 109 1.00 REF THC63LVD1024 37 144 0.09~0.20 36 1 0.20 +0.07/-0.03 0.08 M 0.50 BSC. 1 PIN INDEX TOP VIEW S SEATING PLANE 0°~7° 0.10 S 7.20 1 36 37 109 72 7.20 144 108 73 EXPOSED PAD BOTTOM VIEW 11°~13° 0.08 R MIN 0.08~0.20R 11°~13° GAGE PLANE 0.25mm 0.20 MIN 0.60 +/-0.15 Unit:mm Exposed PAD is GND and must be soldered to PCB. Copyright©2012 THine Electronics, Inc. 22/23 THine Electronics, Inc. THC63LVD1024_Rev.2.4_E Notices and Requests 1. The product specifications described in this material are subject to change without prior notice. 2. The circuit diagrams described in this material are examples of the application which may not always apply to the customer's design. We are not responsible for possible errors and omissions in this material. Please note if errors or omissions should be found in this material, we may not be able to correct them immediately. 3. This material contains our copy right, know-how or other proprietary. Copying or disclosing to third parties the contents of this material without our prior permission is prohibited. 4. Note that if infringement of any third party's industrial ownership should occur by using this product, we will be exempted from the responsibility unless it directly relates to the production process or functions of the product. 5. This product is presumed to be used for general electric equipment, not for the applications which require very high reliability (including medical equipment directly concerning people's life, aerospace equipment, or nuclear control equipment). Also, when using this product for the equipment concerned with the control and safety of the transportation means, the traffic signal equipment, or various Types of safety equipment, please do it after applying appropriate measures to the product. 6. Despite our utmost efforts to improve the quality and reliability of the product, faults will occur with a certain small probability, which is inevitable to a semi-conductor product. Therefore, you are encouraged to have sufficiently redundant or error preventive design applied to the use of the product so as not to have our product cause any social or public damage. 7. Please note that this product is not designed to be radiation-proof. 8. Customers are asked, if required, to judge by themselves if this product falls under the category of strategic goods under the Foreign Exchange and Foreign Trade Control Law. THine Electronics, Inc. E-mail: [email protected] Copyright©2012 THine Electronics, Inc. 23/23 THine Electronics, Inc.