CHR3894-QEG 37-40GHz Integrated Down Converter GaAs Monolithic Microwave IC in SMD leadless package Description The CHR3894-QEG is a multifunction monolithic receiver, which integrates a balanced cold FET mixer, a LO chain with buffers associated to a time two multiplier, and a RF low noise amplifier including gain control. It is designed for a wide range of applications, from military to commercial communication systems. The circuit is manufactured with a pHEMT process, 0.15µm gate length, via holes through the substrate, air bridges and electron beam gate lithography. It is supplied in RoHS compliant SMD package. UMS R3894 YYWW Main Features ■ Broadband performances: 37-40GHz ■ 13dB Conversion gain ■ 15dBc Image Rejection ■ 2dBm IIP3 without attenuation (GC=-2V) ■ 8dB Gain Control range ■ 4dB Noise Figure for IF>0.1GHz ■ 0dBm LO input Power ■ DC bias: Vd=4V @ Id=250mA ■ 24L-QFN4x5 ■ MSL1 Conversion gain (USB mode) @ IF 2GHz 20 18 Conversion gain (dB) 16 14 12 10 8 6 4 2 -2V -0.4V -0.2V 0V +0.6V 0 35 36 37 38 39 RF Frequency (GHz) 40 41 Main Electrical Characteristics Tamb.= +25°C Symbol Parameter FRF RF frequency range FLO LO frequency range FIF IF frequency range G Conversion gain without attenuation Ref. : DSCHR3894-QEG2201 -19 jul 12 1/14 Min 37 17.5 DC 10 Typ Max 40 21.0 3.5 13 Unit GHz dB dB dBm Specifications subject to change without notice United Monolithic Semiconductors S.A.S. Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 CHR3894-QEG 37-40GHz Integrated Down Converter Electrical Characteristics Tamb.= +25°C, VD = VD1 = +4V (1) Symbol Parameter FRF RF frequency range FLO LO frequency range FIF IF frequency range G Conversion gain without attenuation (2) Gain control range G NF Noise Figure for IF>0.1GHz Im_rej Image rejection (2) PLO LO Input power IIP3 Input IP3 without attenuation IIP3 Input IP3 @ all attenuations LO RL LO return loss RF RL RF return loss VGL LNA DC gate voltage VGX Multiplier DC gate voltage GC Gain control DC voltage IDt Total Drain current (ID+ID1) (3) Min 37 17.5 DC 10 12 0 -2 Typ 13 8 4 15 0 2 0 -12 -7 -0.1 -0.9 -2 Max 40 21.0 3.5 4.5 +0.6 250 Unit GHz GHz GHz dB dB dB dBc dBm dBm dBm dB dB V V V mA These values are representative of onboard measurements as defined on the drawing in paragraph "Evaluation mother board". (1) VD: LO-chain drain bias voltage. VD1: LNA drain bias voltage. (2) An external combiner 90° is required on I / Q. (3) ID: LO-chain drain current, typically 125mA. (3) ID1: LNA drain current, typically 125mA, should be tuned with VGL. Note: The total current (IDt) is not affected by the gain control voltage (GC). Electrostatic discharge sensitive device observe handling precautions! Ref. : DSCHR3894-QEG2201 -19 jul 12 2/14 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 CHR3894-QEG 37-40GHz Integrated Down Converter Absolute Maximum Ratings (1) Tamb.= +25°C Symbol Parameter VD, VD1 Drain bias voltages IDt Drain bias current VGL, VGX Gate bias voltages GC Gain Control voltage P_RF Maximum peak input power overdrive (2) P_LO Maximum LO input power Tj Junction temperature (2) Ta Operating temperature range Tstg Storage temperature range (1) Operation of this device above anyone of these parameters damage. (2) Duration < 1s. Values Unit 4.5V V 340 mA -2 to +0.4 V -2.5 to +0.8 V +15 dBm +15 dBm 175 °C -40 to +85 °C -55 to +150 °C may cause permanent Typical Bias Conditions Tamb.= +25°C Symbol Pad No VD1, VD 10, 11 ID1 10 VGL 9 VGX 12 GC 8 Parameter DC drain voltages (LNA and LO-chain) LNA drain current controlled with VGL LNA DC gate voltage Multiplier DC gate voltage Gain control DC voltage Ref. : DSCHR3894-QEG2201 -19 jul 12 3/14 Values 4 125 -0.1 -0.9 -2 to 0.6 Unit V mA V V V Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 CHR3894-QEG 37-40GHz Integrated Down Converter Device thermal performances All the figures given in this section are obtained assuming that the QFN device is cooled down only by conduction through the package thermal pad (no convection mode considered). The temperature is monitored at the package back-side interface (Tcase) as shown below. The system maximum temperature must be adjusted in order to guarantee that Tcase remains below than the maximum value specified in the next table. So, the system PCB must be designed to comply with this requirement. A derating must be applied on the dissipated power if the Tcase temperature can not be maintained below than the maximum temperature specified (see the curve Pdiss. Max) in order to guarantee the nominal device life time (MTTF). DEVICE THERMAL SPECIFICATION : CHR3894-QEG Recommended max. junction temperature (Tj max) : 147 °C Junction temperature absolute maximum rating : 175 °C Max. continuous dissipated power @ Tcase= 85 °C : 0.51 W (1) => Pdiss derating above Tcase = 85 °C : 8 mW/°C Junction-Case thermal resistance (Rth J-C)(2) : <122 °C/W Min. package back side operating temperature(3) : -40 °C Max. package back side operating temperature(3) : 85 °C Min. storage temperature : -55 °C Max. storage temperature : 155 °C °C 150 (1) Derating at junction temperature constant = Tj max (2) Rth J-C is calculated for a worst case where the hotter junction of the MMIC is considered. (3) Tcase=Package back side temperature measured under the die-attach-pad (see the drawing below). Tcase 0.6 0.5 0.3 0.2 0.1 Pdiss. Max. (W) Pdiss. Max. (W) 0.4 Example of QFN 16L 3x3 back-side view, temperature reference point (Tcase) location. 0 -50 -25 0 25 50 75 100 125 Tcase (°C) 5.8 Ref. : DSCHR3894-QEG2201 -19 jul 12 4/14 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 CHR3894-QEG 37-40GHz Integrated Down Converter Typical Board Measurements Tamb.= +25°C, VD = VD1 =+4V, VGL = -0.1V, VGX = -0.9V, P_LO = 0dBm (IDt = 250mA) These values are representative of onboard measurements as defined on the drawing in paragraph "Evaluation mother board". Data given in the package access planes. Conversion Gain versus RF & IF frequency (USB & LSB modes) without attenuation: GC= -2V 20 18 Conversion Gain (dB) 16 14 12 10 8 6 4 LSB- 2GHz USB- 2GHz 2 LSB- 3.5GHz USB- 3.5GHz 0 35 36 37 38 39 40 41 RF Frequency (GHz) Conversion Gain versus RF frequency and gain control voltage (IF 2GHz, USB mode) 20 18 Conversion gain (dB) 16 14 12 10 8 6 4 2 -2V -0.4V -0.2V 0V +0.6V 0 35 36 37 38 39 40 41 RF Frequency (GHz) Ref. : DSCHR3894-QEG2201 -19 jul 12 5/14 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 CHR3894-QEG 37-40GHz Integrated Down Converter Typical Board Measurements Tamb.= +25°C, VD = VD1 = +4V, VGL = -0.1V, VGX = -0.9V, P_LO = 0dBm (IDt = 250mA) Noise figure versus RF frequency at IF 2GHz (USB & LSB modes) without attenuation: GC= -2V 10 9 8 Noise Figure (dB) 7 6 5 4 3 2 1 USB LSB 0 35 36 37 38 39 40 41 42 RF Frequency (GHz) Noise figure versus gain control range (IF 2GHz, USB mode) 10 9 8 Noise Figure (dB) 7 6 5 4 3 2 1 -2V -0.2V 0V +0.6V 0 35 36 Ref. : DSCHR3894-QEG2201 -19 jul 12 37 38 39 RF Frequency (GHz) 6/14 40 41 42 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 CHR3894-QEG 37-40GHz Integrated Down Converter Typical Board Measurements Tamb.= +25°C, VD = VD1 = +4V, VGL = -0.1V, VGX = -0.9V, P_LO = 0dBm (IDt = 250mA) Image rejection versus RF frequency at IF 2GHz (USB & LSB modes) without attenuation: GC= -2V 44 40 36 Image rejection (dBc) 32 28 24 20 16 12 8 USB LSB 4 0 35 36 37 38 39 40 41 RF Frequency (GHz) Return Losses (LO & RF) versus frequency and gain control voltage 0 -2 LO & RF Return losses (dB) -4 -6 -8 -10 -12 -14 -16 -18 RF @ GC=-2V RF @ GC=0.6V LO -20 0 5 10 15 20 25 30 35 40 45 Frequency (GHz) Ref. : DSCHR3894-QEG2201 -19 jul 12 7/14 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 CHR3894-QEG 37-40GHz Integrated Down Converter Typical Board Measurements Tamb.= +25°C, VD = VD1 = +4V, VGL = -0.1V, VGX = -0.9V, P_LO = 0dBm (IDt = 250mA) Input IP3 vs RF frequency at IF 3.5GHz without attenuation: GC= -2V IMD3 vs RF frequency at IF 3.5GHz without attenuation: GC= -2V 10 8 4 IMD3 (dBc) IIP3 (dBm) 6 2 0 -2 -4 37.5GHz 38.5GHz 39.5GHz 40.5GHz -6 -24 -22 -20 -18 -16 -14 -12 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 -10 -24 -22 -20 Input Power DCL (dBm) 38.5GHz 39.5GHz 40.5GHz -18 -16 -14 -12 -10 Input Power DCL (dBm) Input IP3 vs gain control at 38.5GHz Input IP3 vs temperature at 38.5GHz without attenuation: GC= -2V 10 10 8 8 6 6 4 4 IIP3 (dBm) IIP3 (dBm) 37.5GHz 2 0 -2 2 0 -2 -2V -4 -0.5V -0.4V 0V -16 -14 +0.6V -4 -6 85°C 25°C -40°C -18 -16 -14 -6 -24 -22 -20 -18 -12 -10 -24 -22 -20 Input Power DCL (dBm) Ref. : DSCHR3894-QEG2201 -19 jul 12 -12 -10 Input Power DCL (dBm) 8/14 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 CHR3894-QEG 37-40GHz Integrated Down Converter Typical Board Measurements Tamb = +25°C, Tcold = -40°C, Thot = +85°C VD = VD1 = +4V, VGL = -0.1V, VGX = -0.9V, P_LO = 0dBm Conversion Gain versus temperature at IF 2GHz (USB mode) without attenuation: GC= -2V 24 22 Conversion gain (dB) 20 18 16 14 12 10 8 6 85°C 25°C -40°C 38 39 4 35 36 37 40 41 RF Frequency (GHz) Noise figure versus temperature at IF 2GHz (USB mode) without attenuation: GC= -2V 10 9 8 Noise Figure (dB) 7 6 5 4 3 2 1 85°C 25°C -40°C 0 35 36 37 38 39 40 41 42 RF Frequency (GHz) Ref. : DSCHR3894-QEG2201 -19 jul 12 9/14 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 CHR3894-QEG 37-40GHz Integrated Down Converter Package outline (1) Matt tin, Lead Free Units : From the standard : (Green) mm JEDEC MO-220 (VGGD) 25- GND 12345678- Nc Nc Nc Gnd(2) RF in Gnd(2) Nc GC 910111213141516- VGL VD1 VD VGX Nc Nc Gnd(2) LO in 1718192021222324- Gnd(2) Nc Nc IF_I Gnd(2) IF_Q Nc Nc (1) The package outline drawing included to this data-sheet is given for indication. Refer to the application note AN0017 (http://www.ums-gaas.com) for exact package dimensions. (2) It is strongly recommended to ground all pins marked “Gnd” through the PCB board. Ensure that the PCB board is designed to provide the best possible ground to the package. Ref. : DSCHR3894-QEG2201 -19 jul 12 10/14 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 CHR3894-QEG 37-40GHz Integrated Down Converter Evaluation mother board ■ Compatible with the proposed footprint. ■ Based on typically Ro4003 / 8mils or equivalent. ■ Using a micro-strip to coplanar transition to access the package. ■ Recommended for the implementation of this product on a module board. ■ Decoupling capacitors of 10nF ±10% are recommended for all DC accesses. ■ See application note AN0017 for details. ■ Hybrid coupler 90° for 2-4GHz. IF_Q IF_I RF IN LO IN Ref. : DSCHR3894-QEG2201 -19 jul 12 11/14 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 CHR3894-QEG 37-40GHz Integrated Down Converter Notes Due to ESD protection circuits on RF input and output, an external capacitance might be requested to isolate the product from external voltage that could be present on the RF accesses. NC IF_Q GND IF_I 23 22 21 20 19 18 17 2 NC 3 5 16 15 4 RF IN X2 GND 14 13 6 7 NC 24 NC GND NC 1 NC NC NC GND LO IN GND NC NC 12 VGX VGL 11 VD 9 GC 10 VD1 8 ESD protections are also implemented on gate and control accesses. The DC connections do not include any decoupling capacitor in package, therefore it is mandatory to provide a good external DC decoupling (10nF) on the PC board, as close as possible to the package. Ref. : DSCHR3894-QEG2201 -19 jul 12 12/14 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 CHR3894-QEG 37-40GHz Integrated Down Converter DC Schematic LNA: 4V, 125mA VD1 1.9k 1.6k 15 34 15 27 53mA 43mA 15mA 10mA RF 90 150 444 576 1k 2k 1k 5k x4 GC 2k 1k VGL# -0.1V x4 LO chain: 4V, 125mA VD 25mA @Pin=0dBm 45mA 50mA 70 LO 2k 800 30 26 185 16 18 515 700 Mixer Gate 200 515 VGX=-0.9V x2 Ref. : DSCHR3894-QEG2201 -19 jul 12 13/14 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 CHR3894-QEG 37-40GHz Integrated Down Converter Recommended package footprint Refer to the application note AN0017 available at http://www.ums-gaas.com for package foot print recommendations. SMD mounting procedure For the mounting process standard techniques involving solder paste and a suitable reflow process can be used. For further details, see application note AN0017. Recommended environmental management UMS products are compliant with the regulation in particular with the directives RoHS N°2011/65 and REACh N°1907/2006. More environmental data are available in the application note AN0019 also available at http://www.ums-gaas.com. Recommended ESD management Refer to the application note AN0020 available at http://www.ums-gaas.com for ESD sensitivity and handling recommendations for the UMS package products. Ordering Information QFN 4x4 package: CHR3894-QEG/XY Stick: XY = 20 Tape & reel: XY = 21 Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use as critical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S. Ref. : DSCHR3894-QEG2201 -19 jul 12 14/14 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34