CHR3394-QEG RoHS COMPLIANT 37-40GHz Integrated Down Converter GaAs Monolithic Microwave IC in SMD leadless package Description The CHR3394-QEG is a multifunction monolithic receiver, which integrates a balanced cold FET mixer, a LO chain with buffers associated to a time two multiplier, and a RF low noise amplifier. It is designed for a wide range of applications, from military to commercial communication systems. The circuit is manufactured with a pHEMT process, 0.15µm gate length, via holes through the substrate, air bridges and electron beam gate lithography. It is supplied in RoHS compliant SMD package. UMS R3394 YYWW Main Features ■ Broadband performances: 37-40GHz ■ 13dB Conversion gain ■ 15dBc Image Rejection ■ 1dBm IIP3 ■ 3.5dB Noise Figure for IF>0.1GHz ■ 0dBm LO input Power ■ DC bias: Vd=4V @ Id=250mA ■ 24L-QFN4x5 ■ MSL1 Conversion gain @ IF 2GHz (USB & LSB modes) 20 Conversion Gain (dB) 18 16 14 12 10 8 6 4 USB LSB 2 0 35 36 37 38 39 RF Frequency (GHz) 40 41 Main Characteristics Tamb.= +25°C Symbol Parameter FRF RF frequency range FLO LO frequency range FIF IF frequency range G Conversion gain Ref. : DSCHR3394-QEG1192 - 11 Jul 11 Min 37 17.5 DC Typ 13 1/14 Max 40 21.0 3.5 Unit GHz GHz GHz dB Specifications subject to change without notice United Monolithic Semiconductors S.A.S. Route Départementale 128 - BP46 - 91401 Orsay Cedex France Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 CHR3394-QEG 37-40GHz Integrated Down Converter Main Characteristics Tamb.= +25°C, VD = VD1 = +4V (1) Symbol Parameter FRF RF frequency range FLO LO frequency range FIF IF frequency range G Conversion gain (2) NF Noise Figure for IF>0.1GHz Im_rej Image rejection (2) PLO LO Input power IIP3 Input IP3 LO RL LO return loss RF RL RF return loss VGL LNA DC gate voltage VGX Multiplier DC gate voltage IDt Total Drain current (ID+ID1) (3) Min 37 17.5 DC Typ 13 3.5 15 0 1 -12 -6 -0.1 -0.9 250 Max 40 21.0 3.5 Unit GHz GHz GHz dB dB dBc dBm dBm dB dB V V mA These values are representative of on-board measurements. (1) VD: LO-chain drain bias voltage. VD1: LNA drain bias voltage. (2) An external combiner 90° is required on I/Q. (3) ID: LO-chain drain current, typically 125mA. ID1: LNA drain current, typically 125mA, should be tuned with VGL. (3) Electrostatic discharge sensitive device observe handling precautions! Ref. : DSCHR3394-QEG1192 - 11 Jul 11 2/14 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3394-QEG 37-40GHz Integrated Down Converter Absolute Maximum Ratings (1) Tamb.= +25°C Symbol Parameter VD, VD1 Drain bias voltages IDt Drain bias current VGL, VGX Gate bias voltages P_RF Maximum peak input power overdrive (2) P_LO Maximum LO input power Tj Junction temperature Ta Operating temperature range Tstg Storage temperature range Values 4.5V 340 -2 to +0.4 +15 +15 175 -40 to +85 -55 to +155 Unit V mA V dBm dBm °C °C °C (1) Operation of this device above anyone of these parameters may cause permanent damage. (2) Duration < 1s. Typical Bias Conditions Tamb.= +25°C Symbol Pad No VD1, VD 10, 11 ID1 10 VGL 9 VGX 12 Parameter DC drain voltages (LNA and LO-chain) LNA drain current controlled with VGL LNA DC gate voltage Multiplier DC gate voltage Ref. : DSCHR3394-QEG1192 - 11 Jul 11 3/14 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Values 4 125 -0.1 -0.9 Unit V mA V V Specifications subject to change without notice CHR3394-QEG 37-40GHz Integrated Down Converter Device thermal performances All the figures given in this section are obtained assuming that the QFN device is cooled down only by conduction through the package thermal pad (no convection mode considered). The temperature is monitored at the package back-side interface (Tcase) as shown below. The system maximum temperature must be adjusted in order to guarantee that Tcase remains below than the maximum value specified in the next table. So, the system PCB must be designed to comply with this requirement. A derating must be applied on the dissipated power if the Tcase temperature can not be maintained below than the maximum temperature specified (see the curve Pdiss. Max) in order to guarantee the nominal device life time (MTTF). DEVICE THERMAL SPECIFICATION : CHR3394-QEG Recommended max. junction temperature (Tj max) : 147 Junction temperature absolute maximum rating : 175 Max. continuous dissipated power @ Tcase= 85 °C : 1 (1) => Pdiss derating above Tcase = 85 °C : 16 Junction-Case thermal resistance (Rth J-C)(2) : <62 Min. package back side operating temperature(3) : -40 Max. package back side operating temperature(3) : 85 Min. storage temperature : -55 Max. storage temperature : 155 °C °C W mW/°C °C/W °C °C °C °C (1) Derating at junction temperature constant = Tj max (2) Rth J-C is calculated for a worst case where the hotter junction of the MMIC is considered. (3) Tcase=Package back side temperature measured under the die-attach-pad (see the drawing below). Tcase 1.2 1 0.6 0.4 0.2 Pdiss. Max. (W) Pdiss. Max. (W) 0.8 Example of QFN 16L 3x3 back-side view, temperature reference point (Tcase) location. 0 -50 -25 0 25 50 75 100 125 Tcase (°C) 5.8 Ref. : DSCHR3394-QEG1192 - 11 Jul 11 4/14 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3394-QEG 37-40GHz Integrated Down Converter Typical Board Measurements Tamb.= +25°C, VD = VD1 =+4V, VGL = -0.1V, VGX = -0.9V, P_LO = 0dBm (IDt = 250mA) These values are representative of onboard measurements as defined on the drawing in paragraph "Evaluation mother board". Data given in the package access planes. Conversion Gain versus RF & IF frequency (USB & LSB modes) 20 18 Conversion Gain (dB) 16 14 12 10 8 6 4 2 LSB- 2GHz USB- 2GHz LSB- 3.5GHz USB- 3.5GHz 0 35 36 37 38 39 40 41 RF Frequency (GHz) Noise figure versus RF frequency at IF 3GHz 10 9 8 Noise figure (dB) 7 6 5 4 3 2 USB 1 LSB 0 35 36 37 38 39 40 41 42 RF Frequency (GHz) Ref. : DSCHR3394-QEG1192 - 11 Jul 11 5/14 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3394-QEG 37-40GHz Integrated Down Converter Typical Board Measurements Tamb.= +25°C, VD = VD1 = +4V, VGL = -0.1V, VGX = -0.9V, P_LO = 0dBm (IDt = 250mA) Image rejection versus RF & IF frequency 44 40 36 Image rejection (dBc) 32 28 24 20 16 12 8 4 LSB- 2GHz USB- 2GHz LSB- 3.5GHz USB- 3.5GHz 0 35 36 37 38 39 40 41 RF Frequency (GHz) Return Losses (LO & RF) versus frequency 0 -2 -4 Return losses (dB) -6 -8 -10 -12 -14 -16 RF LO -18 -20 0 5 10 15 20 25 30 35 40 45 Frequency (GHz) Ref. : DSCHR3394-QEG1192 - 11 Jul 11 6/14 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3394-QEG 37-40GHz Integrated Down Converter Typical Board Measurements Tamb.= +25°C, VD = VD1 = +4V, VGL = -0.1V, VGX = -0.9V, P_LO = 0dBm (IDt = 250mA) Input IP3 vs RF frequency at IF 2GHz Input IP3 vs RF frequency at IF 3.5GHz 8 8 6 6 4 4 IIP3 (dBm) 10 IIP3 (dBm) 10 2 0 -2 2 0 -2 38GHz -4 39GHz 40GHz -4 -6 38.5GHz 39.5GHz 40.5GHz -6 -26 -24 -22 -20 -18 -16 Input Power DCL (dBm) -14 -12 -10 -26 IMD3 vs RF frequency at IF 2GHz 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 38GHz -26 -24 -22 39GHz 40GHz -20 -18 -16 Input Power DCL (dBm) Ref. : DSCHR3394-QEG1192 - 11 Jul 11 -14 -12 -24 -22 -20 -18 -16 Input Power DCL (dBm) -14 -12 -10 IMD3 vs RF frequency at IF 3.5GHz IMD3 (dBc) IMD3 (dBc) 37.5GHz -10 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 -26 7/14 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 -24 -22 37.5GHz 38.5GHz 39.5GHz 40.5GHz -20 -18 -16 Input Power DCL (dBm) -14 -12 -10 Specifications subject to change without notice CHR3394-QEG 37-40GHz Integrated Down Converter Typical Board Measurements Tamb = +25°C, Tcold = -40°C, Thot = +85°C VD = VD1 = +4V, VGL = -0.1V, VGX = -0.9V, P_LO = 0dBm Conversion Gain versus temperature at IF 2 GHz (USB mode) 24 22 Conversion gain (dB) 20 18 16 14 12 10 8 6 85°C 25°C -40°C 4 35 36 37 38 39 40 41 RF Frequency (GHz) Noise figure versus temperature at IF 2GHz (USB mode) 10 9 8 Noise Figure (dB) 7 6 5 4 3 2 1 85°C 25°C -40°C 0 35 36 37 38 39 40 41 42 RF Frequency (GHz) Ref. : DSCHR3394-QEG1192 - 11 Jul 11 8/14 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3394-QEG 37-40GHz Integrated Down Converter Typical Board Measurements Tamb = +25°C, Tcold = -40°C, Thot = +85°C VD = VD1 = +4V, VGL = -0.1V, VGX = -0.9V, P_LO = 0dBm Input IP3 versus temperature at 38GHz (IF 2GHz) 10 8 6 IIP3 (dBm) 4 2 0 -2 -4 85°C 25°C -40°C -6 -26 -24 -22 -20 -18 -16 -14 -12 -10 Input Power DCL (dBm) Ref. : DSCHR3394-QEG1192 - 11 Jul 11 9/14 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3394-QEG 37-40GHz Integrated Down Converter Package outline (1) Matt tin, Lead Free Units : From the standard : (Green) mm JEDEC MO-220 (VGGD) 25- GND 12345678- Nc Nc Nc Gnd(2) RF in Gnd(2) Nc Nc 910111213141516- VGL VD1 VD VGX Nc Nc Gnd(2) LO in 1718192021222324- Gnd(2) Nc Nc IF_I Gnd(2) IF_Q Nc Nc (1) The package outline drawing included to this data-sheet is given for indication. Refer to the application note AN0017 (http://www.ums-gaas.com) for exact package dimensions. (2) It is strongly recommended to ground all pins marked “Gnd” through the PCB board. Ensure that the PCB board is designed to provide the best possible ground to the package. Ref. : DSCHR3394-QEG1192 - 11 Jul 11 10/14 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice 37-40GHz Integrated Down Converter CHR3394-QEG Evaluation mother board ■ Compatible with the proposed footprint. ■ Based on typically Ro4003 / 8mils or equivalent. ■ Using a micro-strip to coplanar transition to access the package. ■ Recommended for the implementation of this product on a module board. ■ Decoupling capacitors of 10nF ±10% are recommended for all DC accesses. ■ See application note AN0017 for details. ■ Hybrid coupler 90° for 2-4GHz. IF_Q IF_I RF IN LO IN Ref. : DSCHR3394-QEG1192 - 11 Jul 11 11/14 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3394-QEG 37-40GHz Integrated Down Converter Notes Due to ESD protection circuits on RF and LO inputs, an external capacitance might be requested to isolate the product from external voltage that could be present on these accesses. NC NC IF_Q GND IF_I 24 23 22 21 20 19 18 3 17 GND GND 4 RF IN 5 16 15 LO IN 1 NC NC NC 2 NC X2 14 13 7 NC 6 GND NC GND NC NC 11 12 VD VGX VGL VD1 9 NC 10 8 ESD protections are also implemented on gate access. The DC connections do not include any decoupling capacitor in package, therefore it is mandatory to provide a good external DC decoupling (10nF) on the PC board, as close as possible to the package. Ref. : DSCHR3394-QEG1192 - 11 Jul 11 12/14 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3394-QEG 37-40GHz Integrated Down Converter DC Schematic LNA: 4V, 125mA VD1 1.9k 1.9k 16 26.5 34.5 16 15mA 10mA 53mA 43mA RF 90 150 530 550 1.5k 1.5k 2.5k VGL# -0.1V x4 LO chain: 4V, 125mA VD 25mA @Pin=0dBm 45mA 50mA 70 LO 2k 800 30 26 185 16 18 515 700 Mixer Gate 200 515 VGX=-0.9V x2 Ref. : DSCHR3394-QEG1192 - 11 Jul 11 13/14 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3394-QEG 37-40GHz Integrated Down Converter Recommended package footprint Refer to the application note AN0017 available at http://www.ums-gaas.com for package foot print recommendations. SMD mounting procedure For the mounting process standard techniques involving solder paste and a suitable reflow process can be used. For further details, see application note AN0017. Recommended environmental management Refer to the application note AN0019 available at http://www.ums-gaas.com for environmental data on UMS package products. Recommended ESD management Refer to the application note AN0020 available at http://www.ums-gaas.com for ESD sensitivity and handling recommendations for the UMS package products. Ordering Information QFN 4x5 RoHS compliant package: CHR3394-QEG/XY Stick: XY = 20 Tape & reel: XY = 21 Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use as critical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S. Ref. : DSCHR3394-QEG1192 - 11 Jul 11 14/14 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice