AP2615GY-HF Halogen-Free Product Advanced Power Electronics Corp. P-CHANNEL ENHANCEMENT MODE POWER MOSFET ▼ Fast Switching Characteristic D ▼ Lower Gate Charge ▼ Small Footprint & Low Profile Package ▼ RoHS Compliant & Halogen-Free BVDSS -30V RDS(ON) 52mΩ ID G -5A S S D Description D AP2615 series are from Advanced Power innovated design and silicon process technology to achieve the lowest possible on-resistance and fast switching performance. It provides the designer with an extreme efficient device for use in a wide range of power applications. The SOT-26 package is widely used for all commercial-industrial applications. SOT-26 D D G Absolute Maximum Ratings Parameter Symbol VDS Drain-Source Voltage VGS Gate-Source Voltage ID@TA=25℃ ID@TA=70℃ Rating Units -30 V + 20 V 3 -5 A 3 -4.2 A -20 A 2 W Continuous Drain Current Continuous Drain Current 1 IDM Pulsed Drain Current PD@TA=25℃ Total Power Dissipation TSTG Storage Temperature Range -55 to 150 ℃ TJ Operating Junction Temperature Range -55 to 150 ℃ Thermal Data Symbol Rthj-a Parameter Maximum Thermal Resistance, Junction-ambient Data and specifications subject to change without notice 3 Value Unit 62.5 ℃/W 1 201210232 AP2615GY-HF Electrical Characteristics@Tj=25oC(unless otherwise specified) Symbol BVDSS RDS(ON) Parameter Test Conditions Drain-Source Breakdown Voltage Static Drain-Source On-Resistance Min. Typ. -30 - - V VGS=-10V, ID=-4A - 40 52 mΩ VGS=-4.5V, ID=-3A - 60 87 mΩ VGS=0V, ID=-250uA 2 Max. Units VGS(th) Gate Threshold Voltage VDS=VGS, ID=-250uA -1 - -2.4 V gfs Forward Transconductance VDS=-10V, ID=-4A - 8 - S IDSS Drain-Source Leakage Current VDS=-24V, VGS=0V - - -10 uA IGSS Gate-Source Leakage VGS=+20V, VDS=0V - - +100 nA Qg Total Gate Charge ID=-4A - 5.7 9.1 nC Qgs Gate-Source Charge VDS=-15V - 1.5 - nC Qgd Gate-Drain ("Miller") Charge VGS=-4.5V - 2.8 - nC td(on) Turn-on Delay Time VDS=-15V - 6 - ns tr Rise Time ID=-1A - 8 - ns td(off) Turn-off Delay Time RG=3.3Ω - 20 - ns tf Fall Time VGS=-10V - 12 - ns Ciss Input Capacitance VGS=0V - 480 770 pF Coss Output Capacitance VDS=-15V - 100 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 90 - pF Min. Typ. - - Source-Drain Diode Symbol VSD Parameter 2 Forward On Voltage Test Conditions IS=-1.7A, VGS=0V Max. Units -1.2 V trr Reverse Recovery Time IS=-4A, VGS=0V, - 18 - ns Qrr Reverse Recovery Charge dI/dt=100A/µs - 10 - nC Notes: 1.Pulse width limited by Max. junction temperature. 2.Pulse test 3.Surface mounted on 1 in2 copper pad of FR4 board ; 156℃/W when mounted on min. copper pad. THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. 2 AP2615GY-HF 20 20 -10V -7.0V -6.0V -5.0V V G = -4.0V -ID , Drain Current (A) 16 16 12 8 65mΩ 12 8 4 4 0 0 0 1 2 3 4 5 0 6 1 2 3 4 5 6 -V DS , Drain-to-Source Voltage (V) -V DS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 70 1.8 I D =-3A I D =-4.2A T A =25 o C o T A =25 C I D = -4A V GS = -10V Normalized RDS(ON) 1.6 60 RDS(ON) (mΩ ) -10V -7.0V -6.0V -5.0V V G = -4.0V TA=150oC -ID , Drain Current (A) T A =25 o C 50 1.4 1.2 1 40 0.8 0.6 30 2 4 6 8 -50 10 0 50 100 150 T j , Junction Temperature ( o C) -V GS , Gate-to-Source Voltage (V) Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature 8 2 I D = -250uA 1.6 Normalized -VGS(th) -IS(A) 6 4 T j =150 o C T j =25 o C 1.2 0.8 2 0.4 2.01E+08 0 0 0 0.2 0.4 0.6 0.8 1 1.2 -V SD , Source-to-Drain Voltage (V) Fig 5. Forward Characteristic of Reverse Diode 1.4 -50 0 50 100 T j , Junction Temperature ( 150 o C) Fig 6. Gate Threshold Voltage v.s. Junction Temperature 3 AP2615GY-HF f=1.0MHz 800 I D = -4A V DS = -15V 8 600 65mΩ C (pF) -VGS , Gate to Source Voltage (V) 10 6 C iss 400 4 200 2 C oss C rss 0 0 0 2 4 6 8 10 1 12 5 Q G , Total Gate Charge (nC) 9 13 17 21 25 29 -V DS , Drain-to-Source Voltage (V) Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics 100 1 10 -ID (A) Operation in this area limited by RDS(ON) 100us 1ms 1 10ms 100ms 1s 0.1 o T A =25 C Single Pulse DC Normalized Thermal Response (Rthja) Duty factor=0.5 0.2 0.1 0.1 0.05 PDM 0.02 t 0.01 T 0.01 Duty factor = t/T Peak Tj = PDM x Rthja + T a Single Pulse Rthja = 156℃/W 0.001 0.01 0.01 0.1 1 10 0.0001 100 0.001 0.01 -V DS , Drain-to-Source Voltage (V) 0.1 1 10 100 1000 t , Pulse Width (s) Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance 8 20 V DS =-5V -ID , Drain Current (A) -ID , Drain Current (A) 16 12 8 T j =150 o C 6 4 2 4 o T j =25 C T j = -40 o C 0 0 0 1 2 3 4 5 -V GS , Gate-to-Source Voltage (V) Fig 11. Transfer Characteristics 6 25 50 75 100 125 150 T A , Ambient Temperature ( o C ) Fig 12. Maximum Continuous Drain Current v.s. Ambient Temperature 4