AP4438CGM-HF Halogen-Free Product Advanced Power Electronics Corp. N-CHANNEL ENHANCEMENT MODE POWER MOSFET ▼ Lower Gate Charge D D ▼ Simple Drive Requirement D D ▼ Fast Switching Characteristic G ▼ RoHS Compliant & Halogen-Free SO-8 S S BVDSS 30V RDS(ON) 11.5mΩ ID 11.8A S D Description Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. G S The SO-8 package is widely preferred for commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters. Absolute Maximum Ratings Symbol Parameter VDS Drain-Source Voltage VGS Gate-Source Voltage ID@TA=25℃ ID@TA=70℃ Rating Units 30 V +20 V 3 11.8 A 3 9.4 A Continuous Drain Current Continuous Drain Current 1 IDM Pulsed Drain Current 40 A PD@TA=25℃ Total Power Dissipation 2.5 W TSTG Storage Temperature Range -55 to 150 ℃ TJ Operating Junction Temperature Range -55 to 150 ℃ Thermal Data Symbol Rthj-a Parameter Maximum Thermal Resistance, Junction-ambient Data and specifications subject to change without notice 3 Value Unit 50 ℃/W 1 201104121 AP4438CGM-HF Electrical Characteristics@Tj=25oC(unless otherwise specified) Symbol Parameter Test Conditions Min. Typ. Max. Units BVDSS Drain-Source Breakdown Voltage VGS=0V, ID=250uA 30 - - V RDS(ON) Static Drain-Source On-Resistance2 VGS=10V, ID=11A - 9 11.5 mΩ VGS=4.5V, ID=7A - 13.3 18 mΩ VGS(th) Gate Threshold Voltage VDS=VGS, ID=250uA 1 1.35 3 V gfs Forward Transconductance VDS=10V, ID=11A - 20 - S IDSS Drain-Source Leakage Current VDS=30V, VGS=0V - - 10 uA IGSS Gate-Source Leakage VGS=+20V, VDS=0V - - +100 nA Qg Total Gate Charge ID=11A - 10 16 nC Qgs Gate-Source Charge VDS=15V - 3 - nC Qgd Gate-Drain ("Miller") Charge VGS=4.5V - 4.5 - nC td(on) Turn-on Delay Time VDS=15V - 9 - ns tr Rise Time ID=1A - 5 - ns td(off) Turn-off Delay Time RG=3.3Ω - 21 - ns tf Fall Time VGS=10V - 4.5 - ns Ciss Input Capacitance VGS=0V - 1100 1760 pF Coss Output Capacitance VDS=15V - 140 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 100 - pF Rg Gate Resistance f=1.0MHz - 1.3 2.6 Ω Min. Typ. Source-Drain Diode Symbol Parameter 2 Test Conditions Max. Units VSD Forward On Voltage IS=2.1A, VGS=0V - - 1.2 V trr Reverse Recovery Time IS=11A, VGS=0V, - 17 - ns Qrr Reverse Recovery Charge dI/dt=100A/µs - 8 - nC Notes: 1.Pulse width limited by Max. junction temperature. 2.Pulse test 3.Surface mounted on 1 in2 copper pad of FR4 board, t <10sec ; 125 ℃/W when mounted on Min. copper pad. THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. 2 AP4438CGM-HF 60 60 10 V 7.0 V 6.0 V 5.0 V V G =4.0V ID , Drain Current (A) 50 40 o T A = 150 C 10 V 7.0 V 6.0 V 5.0 V V G =4.0V 50 ID , Drain Current (A) o T A = 25 C 30 20 40 30 20 10 10 0 0 0 1 2 3 4 5 0 6 1 2 3 4 5 6 V DS , Drain-to-Source Voltage (V) V DS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 16 1.9 ID=7A T A =25 ℃ I D = 11 A V G =10V Normalized RDS(ON) RDS(ON) (mΩ) 14 12 1.4 0.9 10 0.4 8 2 4 6 8 -50 10 0 50 100 150 T j , Junction Temperature ( o C) V GS , Gate-to-Source Voltage (V) Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature 2.0 12 I D =250uA T j =150 o C T j =25 o C 10 Normalized VGS(th) (V) 1.6 IS(A) 8 6 4 1.2 0.8 0.4 2 0.0 0 0 0.2 0.4 0.6 0.8 1 1.2 V SD , Source-to-Drain Voltage (V) Fig 5. Forward Characteristic of Reverse Diode 1.4 -50 0 50 100 150 T j , Junction Temperature ( o C) Fig 6. Gate Threshold Voltage v.s. Junction Temperature 3 AP4438CGM-HF 10 f=1.0MHz 1600 8 1200 C (pF) VGS , Gate to Source Voltage (V) I D = 11A V DS =15V 6 C iss 800 4 400 2 0 C oss C rss 0 0 4 8 12 16 20 1 5 Q G , Total Gate Charge (nC) 9 13 17 21 25 29 V DS , Drain-to-Source Voltage (V) Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics 100 1 Normalized Thermal Response (Rthja) Duty factor=0.5 Operation in this area limited by RDS(ON) ID (A) 10 100us 1ms 1 10ms 100ms 1s 0.1 T A =25 o C Single Pulse DC 0.01 0.2 0.1 0.1 0.05 0.02 0.01 PDM Single Pulse 0.01 t T Duty factor = t/T Peak Tj = PDM x Rthja + T a Rthja=125 oC/W 0.001 0.01 0.1 1 10 100 0.0001 0.001 0.01 V DS , Drain-to-Source Voltage (V) 0.1 1 10 100 1000 t , Pulse Width (s) Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance 50 V DS =5V VG ID , Drain Current (A) 40 QG 4.5V 30 QGS QGD 20 10 T j =150 o C T j =25 o C Charge Q 0 0 1 2 3 4 5 6 V GS , Gate-to-Source Voltage (V) Fig 11. Transfer Characteristics Fig 12. Gate Charge Waveform 4