AP9410GM-HF Halogen-Free Product Advanced Power Electronics Corp. N-CHANNEL ENHANCEMENT MODE POWER MOSFET ▼ Simple Drive Requirement ▼ Low On-resistance ▼ Fast Switching BVDSS RDS(ON) ID D D D D 30V 6mΩ 18A G SO-8 S S S D Description Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. G S The SO-8 package is widely preferred for all commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters. Absolute Maximum Ratings Symbol Parameter VDS Drain-Source Voltage VGS Gate-Source Voltage ID@TA=25℃ ID@TA=70℃ Rating Units 30 V +12 V 3 18 A 3 15 A Continuous Drain Current Continuous Drain Current 1 IDM Pulsed Drain Current 80 A PD@TA=25℃ Total Power Dissipation 2.5 W TSTG Storage Temperature Range -55 to 150 ℃ TJ Operating Junction Temperature Range -55 to 150 ℃ Thermal Data Symbol Rthj-a Parameter Maximum Thermal Resistance, Junction-ambient Data and specifications subject to change without notice 3 Value Unit 50 ℃/W 1 201009212 AP9410GM-HF Electrical Characteristics@Tj=25oC(unless otherwise specified) Symbol BVDSS RDS(ON) Parameter Test Conditions Drain-Source Breakdown Voltage Static Drain-Source On-Resistance 2 Min. Typ. Max. Units VGS=0V, ID=250uA 30 - - V VGS=10V, ID=18A - - 5 mΩ VGS=4.5V, ID=12A - - 6 mΩ VGS=2.5V, ID=6A - - 8 mΩ VGS(th) Gate Threshold Voltage VDS=VGS, ID=250uA - - 1.2 V gfs Forward Transconductance VDS=10V, ID=12A - 47 - S IDSS Drain-Source Leakage Current VDS=30V, VGS=0V - - 1 uA Drain-Source Leakage Current (Tj=70 C) VDS=24V, VGS=0V - - 25 uA Gate-Source Leakage VGS=+12V, VDS=0V - - +100 nA ID=18A - 59 95 nC o IGSS 2 Qg Total Gate Charge Qgs Gate-Source Charge VDS=24V - 10 - nC Qgd Gate-Drain ("Miller") Charge VGS=4.5V - 23 - nC VDS=15V - 16 - ns 2 td(on) Turn-on Delay Time tr Rise Time ID=1A - 12 - ns td(off) Turn-off Delay Time RG=3.3Ω,VGS=10V - 96 - ns tf Fall Time RD=15Ω - 30 - ns Ciss Input Capacitance VGS=0V - 5080 8100 pF Coss Output Capacitance VDS=25V - 660 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 400 - pF Min. Typ. IS=18A, VGS=0V - - 1.2 V Source-Drain Diode Symbol VSD Parameter 2 Forward On Voltage 2 Test Conditions Max. Units trr Reverse Recovery Time IS=18A, VGS=0V, - 43 - ns Qrr Reverse Recovery Charge dI/dt=100A/µs - 39 - nC Notes: 1.Pulse width limited by Max. junction temperature. 2.Pulse test 3.Surface mounted on 1 in2 copper pad of FR4 board ; 125 ℃/W when mounted on min. copper pad. THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. 2 AP9410GM-HF 140 270 10V 6.0V 5.0V 4.5V T A =25 C 240 ID , Drain Current (A) 210 o 180 150 120 V G =2.5V 90 T A =150 C 120 ID , Drain Current (A) o 10V 6.0V 5.0V 4.5V 100 V G =2.5V 80 60 40 60 20 30 0 0 0.0 1.0 2.0 3.0 0 0.5 1 1.5 2 V DS , Drain-to-Source Voltage (V) V DS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 11 1.8 I D =18A T A =25 o C Normalized RDS(ON) 9 RDS(ON) (mΩ) I D =18A V G =10V 1.6 7 1.4 1.2 1 5 0.8 0.6 3 0 2 4 6 8 -50 10 0 50 100 150 T j , Junction Temperature ( o C) V GS , Gate-to-Source Voltage (V) Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature 18 2 16 14 1.5 10 T j =150 o C VGS(th) (V) IS(A) 12 T j =25 o C 1 8 6 0.5 4 2 0 0 0 0.2 0.4 0.6 0.8 1 V SD , Source-to-Drain Voltage (V) Fig 5. Forward Characteristic of Reverse Diode 1.2 -50 0 50 100 150 T j , Junction Temperature ( o C) Fig 6. Gate Threshold Voltage v.s. Junction Temperature 3 AP9410GM-HF f=1.0MHz 12 10000 C iss V DS =15V V DS =20V V DS =24V 8 C (pF) VGS , Gate to Source Voltage (V) I D = 18 A 10 6 1000 C oss C rss 4 2 100 0 0 40 80 120 1 160 5 9 Q G , Total Gate Charge (nC) Fig 7. Gate Charge Characteristics 17 21 25 29 Fig 8. Typical Capacitance Characteristics 1 100 100us 1ms 10 10ms 1 100ms 1s 0.1 o T A =25 C Single Pulse DC Duty factor =0.5 Normalized Thermal Response (Rthja) Operation in this area limited by RDS(ON) ID (A) 13 V DS , Drain-to-Source Voltage (V) 0.2 0.1 0.1 0.05 0.02 PDM 0.01 t 0.01 T Single pulse Duty factor = t/T Peak Tj = PDM x Rthja + T a Rthia=125 ℃/W 0.001 0.01 0.01 0.1 1 10 100 0.0001 0.001 0.01 V DS , Drain-to-Source Voltage (V) Fig 9. Maximum Safe Operating Area 0.1 1 10 100 1000 t , Pulse Width (s) Fig 10. Effective Transient Thermal Impedance VG VDS 90% QG 4.5V QGS QGD 10% VGS td(on) tr td(off) tf Fig 11. Switching Time Waveform Charge Q Fig 12. Gate Charge Waveform 4