AVAGO 6N136

6N135/6, HCNW135/6
HCPL-2502/0500/0501
Single Channel, High Speed Optocouplers
Data Sheet
Lead (Pb) Free
RoHS 6 fully
compliant
RoHS 6 fully compliant options available;
-xxxE denotes a lead-free product
Description
Features
These diode-transistor opto­coup­lers use an insulating
layer between a LED and an integrated photodetector to
provide elec­trical in­su­lation between input and out­put.
Separate connections for the photodiode bias and output-transistor collector increase the speed up to a hundred times that of a conven­tional phototransistor coupler
by reduc­ing the base-collector capacitance.
• High speed: 1 Mb/s
These single channel optocoup­lers are available in
8-Pin DIP­, SO-8 and Widebody package configurations.
The 6N135, HCPL-0500, and HCNW135 are for use in TTL/
CMOS, TTL/LSTTL or wide bandwidth analog applications.
Current transfer ratio (CTR) for these devices is 7% minimum at IF = 16 mA.
The 6N136, HCPL-2502, HCPL-0501, and HCNW136 are
designed for high speed TTL/TTL applications. A standard
16 mA TTL sink current through the input LED will provide enough output current for 1 TTL load and a 5.6 kΩ
pull-up resistor. CTR for these devices is 19% minimum at
IF = 16 mA.
Functional Diagram
NC 1
• Available in 8-Pin DIP, SO-8, widebody packages
• Open collector output
• Safety approval
UL Recognized – 3750 Vrms for 1 minute (5000 Vrms
for 1 minute for HCNW and Option 020 devices)
per UL1577
CSA Approved
IEC/EN/DIN EN 60747-5-2 Approved
– VIORM = 560 V peak for SO8 devices
– VIORM = 630 V peak for DIP 300mil devices
– VIORM = 1414 V peak for DIP 400mil (widebody)
devices
• Dual channel version available (253X/053X/0534)
Applications
• High voltage insulation
• Video signal isolation
• Line receivers
• Feedback element in switched mode power supplies
8 VCC
ANODE 2
7 VB
CATHODE 3
6 VO
NC 4
• TTL compatible
TRUTH TABLE
(POSITIVE LOGIC)
LED
VO
ON
LOW
OFF
HIGH
5 GND
• High speed logic ground isolation
– TTL/TTL, TTL/CMOS, TTL/LSTTL
• Replaces pulse transformers
• Replaces slow phototransistor isolators
• Analog signal ground isolation
A 0.1 µF bypass capacitor must be connected between pins 5 and 8.
CAUTION: It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.
Schematic
ANODE
8
IO
6
VCC
IF
2
+
VF
CATHODE
ICC
-
VO
3
5
SHIELD
7
VB
GND
IB
Selection Guide
Minimum CMR Current
dV/dt
VCM
Transfer
(V/µs)
(V)
Ratio (%)
1,000
10
7
19
15
8-Pin DIP (300 Mil)
Single
Dual
Channel
Channel
Package
Package*
6N135
HCPL-2530
Widebody
(400 Mil)
Single
Channel
Package
HCPL-0500
HCPL-0530
HCNW135
6N136
HCPL-2531
HCPL-0501
HCPL-2502
HCPL-0531
HCNW136
*Technical data for these products are on separate Avago publications.
2
Small-Outline
SO-8
Single
Dual
Channel
Channel
Package
Package*
Ordering Information
6N135, 6N136, HCPL-2502, HCPL-0500, HCPL-0501 are UL Recognized with 3750 Vrms for 1 minute per UL1577.
HCNW135, HCNW136 are UL Recognized with 5000 Vrms for 1 minute per UL1577. All devices above listed are approved
under CSA Component Acceptance Notice #5, File CA 88324.
Option
Part number
6N135
6N136
HCPL-2502
HCPL-0500
HCPL-0501
HCNW135
HCNW136
RoHS
Compliant
Non RoHS
Compliant
-000E
No option
-300E
#300
X
X
-500E
#500
X
X
-020E
#020
-320E
#320
-520E
#520
-060E
#060
-360E
#360
X
X
-560E
#560
X
X
-000E
No option
-500E
#500
-060E
#060
-560E
#560
-000E
No option
-300E
#300
-500E
#500
Package
Surface
Mount
Gull
Wing
Tape
& Reel
UL 5000
Vrms/ 1
Minute rating
IEC/EN/DIN
EN 607475-2
Quantity
50 per tube
300mil
DIP-8
X
X
X
X
50 per tube
X
X
1000 per reel
X
50 per tube
X
50 per tube
X
1000 per reel
X
X
50 per tube
X
50 per tube
X
1000 per reel
100 per tube
SO-8
400mil
Widebody
DIP-8
X
X
X
X
X
X
X
X
X
X
X
1500 per reel
X
100 per tube
X
1500 per reel
X
X
42 per tube
X
X
42 per tube
X
X
750 per reel
To order, choose a part number from the part number column and combine with the desired option from the option
column to form an order entry.
Example 1:
HCPL-2502-560E to order product of 300mil DIP Gull Wing Surface Mount package in Tape and Reel packaging with
IEC/EN/DIN EN 60747-5-2 Safety Approval in RoHS compliant.
Example 2:
HCPL-2502 to order product of 300mil DIP package in tube packaging and non RoHS compliant.
Option datasheets are available. Contact your Avago sales representative or authorized distributor for information.
Remarks: The notation ‘#XXX’ is used for existing products, while (new) products launched since 15th July 2001 and RoHS
compliant option will use ‘-XXXE‘.
3
Package Outline Drawings
8-Pin DIP Package (6N135/6, HCPL-2502)
7.62 ± 0.25
(0.300 ± 0.010)
9.65 ± 0.25
(0.380 ± 0.010)
8
TYPE NUMBER
7
6
5
6.35 ± 0.25
(0.250 ± 0.010)
OPTION CODE*
DATE CODE
A XXXXZ
YYWW RU
1
2
3
UL
RECOGNITION
4
1.78 (0.070) MAX.
1.19 (0.047) MAX.
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
5° TYP.
3.56 ± 0.13
(0.140 ± 0.005)
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
DIMENSIONS IN MILLIMETERS AND (INCHES).
0.65 (0.025) MAX.
1.080 ± 0.320
(0.043 ± 0.013)
*MARKING CODE LETTER FOR OPTION NUMBERS
"L" = OPTION 020
"V" = OPTION 060
OPTION NUMBERS 300 AND 500 NOT MARKED.
2.54 ± 0.25
(0.100 ± 0.010)
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
8-Pin DIP Package with Gull Wing Surface Mount Option 300 (6N135/6)
LAND PATTERN RECOMMENDATION
9.65 ± 0.25
(0.380 ± 0.010)
8
7
6
1.016 (0.040)
5
6.350 ± 0.25
(0.250 ± 0.010)
1
2
3
10.9 (0.430)
4
1.27 (0.050)
1.19
(0.047)
MAX.
1.780
(0.070)
MAX.
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
3.56 ± 0.13
(0.140 ± 0.005)
1.080 ± 0.320
(0.043 ± 0.013)
0.635 ± 0.130
2.54
(0.025 ± 0.005)
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.635 ± 0.25
(0.025 ± 0.010)
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
4
2.0 (0.080)
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
12° NOM.
Small Outline SO-8 Package (HCPL-0500/1)
LAND PATTERN RECOMMENDATION
8
7
6
5
5.994 ± 0.203
(0.236 ± 0.008)
XXX
YWW
3.937 ± 0.127
(0.155 ± 0.005)
7.49 (0.295)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
PIN ONE 1
2
3
4
1.9 (0.075)
0.406 ± 0.076
(0.016 ± 0.003)
1.270 BSC
(0.050)
0.64 (0.025)
* 5.080 ± 0.127
(0.200 ± 0.005)
7°
3.175 ± 0.127
(0.125 ± 0.005)
45° X
0.432
(0.017)
0 ~ 7°
1.524
(0.060)
* TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
0.228 ± 0.025
(0.009 ± 0.001)
0.203 ± 0.102
(0.008 ± 0.004)
0.305 MIN.
(0.012)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
8-Pin Widebody DIP Package (HCNW135/6)
11.00 MAX.
(0.433)
11.23 ± 0.15
(0.442 ± 0.006)
8
7
6
5
TYPE NUMBER
A
HCNWXXXX
9.00 ± 0.15
(0.354 ± 0.006)
DATE CODE
YYWW
1
2
3
4
10.16 (0.400)
TYP.
1.55
(0.061)
MAX.
7 TYP.
5.10 MAX.
(0.201)
3.10 (0.122)
3.90 (0.154)
+ 0.076
0.254 - 0.0051
+ 0.003)
(0.010 - 0.002)
0.51 (0.021) MIN.
2.54 (0.100)
TYP.
1.8 ± 0.15
(0.071 ± 0.006)
0.40 (0.016)
0.56 (0.022)
DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
5
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW135/6)
11.23 ± 0.15
(0.442 ± 0.006)
8
7
LAND PATTERN RECOMMENDATION
6
5
9.00 ± 0.15
(0.354 ± 0.006)
1
2
3
13.56
(0.534)
4
2.29
(0.09)
1.3
(0.051)
12.30 ± 0.30
(0.484 ± 0.012)
1.55
(0.061)
MAX.
11.00 MAX.
(0.433)
4.00 MAX.
(0.158)
1.80 ± 0.15
(0.071 ± 0.006)
0.75 ± 0.25
(0.030 ± 0.010)
2.54
(0.100)
BSC
1.00 ± 0.15
(0.039 ± 0.006)
+ 0.076
0.254 - 0.0051
+ 0.003)
(0.010 - 0.002)
DIMENSIONS IN MILLIMETERS (INCHES).
7 NOM.
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
Solder Reflow Temperature Profile
300
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.
200
PEAK
TEMP.
245 °C
PEAK
TEMP.
240 °C
TEMPERATURE (°C)
2.5 C ± 0.5 °C/SEC.
30
SEC.
160 °C
150 °C
140 °C
PEAK
TEMP.
230 °C
SOLDERING
TIME
200 °C
30
SEC.
3 °C + 1 °C/–0.5 °C
100
PREHEATING TIME
150 °C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
TIME (SECONDS)
NOTE: NON-HALIDE FLUX SHOULD BE USED.
6
200
250
Recommended Pb-Free IR Profile
tp
Tp
TEMPERATURE
TL
Tsmax
* 260 +0/-5 °C
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
15 SEC.
217 °C
150 - 200 °C
RAMP-UP
3 °C/SEC. MAX.
RAMP-DOWN
6 °C/SEC. MAX.
NOTES:
THE TIME FROM 25 °C to PEAK
TEMPERATURE = 8 MINUTES MAX.
Tsmax = 200 °C, Tsmin = 150 °C
Tsmin
ts
PREHEAT
60 to 180 SEC.
25
tL
NON-HALIDE FLUX SHOULD BE USED.
60 to 150 SEC.
* RECOMMENDED PEAK TEMPERATURE FOR
WIDEBODY 400mils PACKAGE IS 245 °C
t 25 °C to PEAK
TIME
Regulatory Information
The devices contained in this data sheet have been approved by the following organizations:
UL
Recognized under UL 1577, Component Recognition
Program, File E55361.
CSA
Approved under CSA Component Acceptance Notice #5,
File CA 88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01
(HCNW and Option 060 only)
Insulation and Safety Related Specifications
Parameter
Symbol
8-Pin DIP
(300 Mil)
SO-8
Value
Value
Widebody
(400 Mil)
Value
Units Conditions
Minimum External
L(101)
7.1
4.9
9.6
mm
Air Gap (External
Clearance)
Measured from input terminals
to output terminals, shortest
distance through air.
Minimum External
L(102)
7.4
4.8
10.0
mm
Tracking (External
Creepage)
Measured from input terminals
to output terminals, shortest
distance path along body.
Minimum Internal
0.08
0.08
1.0
mm
Plastic Gap
(Internal Clearance)
Through insulation distance,
conductor to conductor, usually
the direct distance between the
photoemitter and photodetector
inside the optocoupler cavity.
Minimum Internal
NA
NA
4.0
mm
Tracking (Internal
Creepage)
Measured from input terminals
to output terminals, along
internal cavity.
Tracking Resistance
(Comparative
Tracking Index)
DIN IEC 112/VDE 0303 Part 1
CTI
200
200
200
Volts
Isolation Group
IIIa
IIIa
IIIa
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
7
Material Group
(DIN VDE 0110, 1/89, Table 1)
IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics (OPTION 060 ONLY)
Description
Symbol
Characteristic
8 Pin DIP
SO-8
Installation classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage ≤300 V rms
I-IV
for rated mains voltage ≤450 V rms
I-III
I-III
Climatic Classification
55/100/21
55/100/21
Pollution Degree (DIN VDE 0110/1.89)
2
2
Maximum Working Insulation Voltage
Units
VIORM
630
560
V peak
Input to Output Test Voltage, Method b*
VIORM x 1.875 = VPR, 100% Production Test with tm = 1 sec,
Partial Discharge < 5 pC
VPR
1181
1050
V peak
Input to Output Test Voltage, Method a*
VIORM x 1.5 = VPR, Type and sample test,
tm = 60 sec, Partial Discharge < 5 pC
VPR
945
840
V peak
VIOTM
6000
4000
V peak
TS
IS,INPUT
PS,OUTPUT
175
230
600
175
150
600
°C
mA
mW
RS
≥ 109
≥ 109 Ω
Highest Allowable Overvoltage*
(Transient Overvoltage, tini = 10 sec)
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Figure 9, Thermal Derating curve.)
Case Temperature
Input Current
Output Power
Insulation Resistance at TS, VIO = 500 V
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section IEC/EN/DIN EN 60747-5-2, for a
detailed description.
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application.
IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics (HCNW135/6 ONLY)
Description
Symbol
Installation classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage ≤600 V rms
Characteristic
Units
I-IV
for rated mains voltage ≤1000 V rms
I-III
Climatic Classification
55/85/21
Pollution Degree (DIN VDE 0110/1.89)
Maximum Working Insulation Voltage
2
VIORM
1414
V peak
Input to Output Test Voltage, Method b*
VIORM x 1.875 = VPR, 100% Production Test with tm = 1 sec,
Partial Discharge < 5 pC
VPR
2652
V peak
Input to Output Test Voltage, Method a*
VIORM x 1.5 = VPR, Type and sample test,
tm = 60 sec, Partial Discharge < 5 pC
VPR
2121
V peak
VIOTM
8000
V peak
TS
IS,INPUT
PS,OUTPUT
150
400
700
°C
mA
mW
R S
≥ 109
Ω
Highest Allowable Overvoltage*
(Transient Overvoltage, tini = 10 sec)
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Figure 9, Thermal Derating curve.)
Case Temperature
Input Current
Output Power
Insulation Resistance at TS, VIO = 500 V
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section IEC/EN/DIN EN 60747-5-2, for a
detailed description.
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application.
8
Absolute Maximum Ratings
Parameter
Storage Temperature*
Symbol
Device
TS
Min.
Max.
Units
-55
125
°C
°C
Operating Temperature*
TA
8-Pin DIP
SO-8
-55
100
Widebody
-55
85
Average Forward Input Current*
IF(AVG)
25
Note
mA
1
Peak Forward Input Current*
IF(PEAK)
(50% duty cycle, 1 ms pulse width)
8-Pin DIP
SO-8
50
mA
2
(50% duty cycle, 1 ms pulse width)
Widebody
40
Peak Transient Input Current*
IF(TRANS)
(≤1 µs pulse width, 300 pps)
8-Pin DIP
SO-8
1
Widebody
0.1
Reverse LED Input Voltage* (Pin 3-2)
VR
8-Pin DIP
SO-8
5
Widebody
3
Input Power Dissipation*
PIN
8-Pin DIP
SO-8
45
Widebody
40
A
V
mW
Average Output Current* (Pin 6)
IO(AVG)
8
mA
Peak Output Current*
IO(PEAK)
16
mA
Emitter-Base Reverse Voltage* (Pin 5-7)
VEBR
5
V
Supply Voltage (Pin 8-5)
VCC
-0.5
30
V
Output Voltage (Pin 6-5)
VO
-0.5
20
V
Supply Voltage* (Pin 8-5)
VCC
-0.5
15
V
Output Voltage* (Pin 6-5)
VO
-0.5
15
V
Base Current* (Pin 7)
IB
5
mA
Output Power Dissipation*
PO
100
mW
260
260
°C
°C
Lead Solder Temperature*
(Through-Hole Parts Only)
1.6 mm below seating plane, 10 seconds TLS
up to seating plane, 10 seconds
8-Pin DIP
Widebody
Reflow Temperature Profile
TRP
SO-8 and
Option 300
*Data has been registered with JEDEC for the 6N135/6N136.
9
See Package Outline Drawings
section
3
4
Electrical Specifications (DC)
Over recommended temperature (TA = 0°C to 70°C) unless otherwise specified. See note 13.
Parameter
Current
Transfer Ratio
Logic Low
Output Voltage
Symbol
Device
Min.
Typ.**
Max.
Units
CTR*
6N135
HCPL-0500
HCNW135
HCPL-2502
7
5
18
19
50
%
15
15
19
15
25
24
25
0.1
0.1
0.4
0.5
0.1
0.1
0.4
0.5
µA
µA
VOL
6N136
HCPL-0501
HCNW136
6N135
HCPL-0500
HCNW135
6N136
HCPL-2502
HCPL-0501
HCNW136
TA = 25°C
VO = 0.4 V
VO = 0.5 V
22
TA = 25°C
50
TA = 25°C
VO = 0.4 V
VO = 0.5 V
VO = 0.4 V
VO = 0.5 V
Logic High
Output Current
IOH*
0.003
0.01
Logic Low
Supply Current
Logic High
Supply Current
ICCL
50
0.5
1
50
200
ICCH*
0.02
1
Input Forward
VF*
Voltage
Input Reverse
Breakdown
Voltage
BVR*
Temperature
Coefficient of
Forward Voltage
Input
Capacitance
∆VF/
∆TA
Transistor DC
Current Gain
hFE
CIN
*For JEDEC registered parts.
**All typicals at TA = 25°C.
10
8-Pin DIP
SO-8
Widebody
8-Pin DIP
SO-8
Widebody
1.5
1.45
1.35
5
1.68
2
1.7
1.8
1.85
1.95
V
µA
V
8-Pin DIP
SO-8
Widebody
-1.6
8-Pin DIP
SO-8
Widebody
8-Pin DIP
SO-8
Widebody
60
TA = 25°C
IO = 1.1 mA
IO = 0.8 mA
TA = 25°C
IO = 3.0 mA
IO = 2.4 mA
TA = 25°C
TA = 25°C
VO = VCC = 5.5 V
VO = VCC = 15 V
VO = VCC = 15 V
IF = 16 mA, VO = Open,
VCC = 15 V
TA = 25°C
IF = 0 mA,
VO = Open,
VCC = 15 V
TA = 25°C
IF = 16 mA
TA = 25°C
V
3
Test Conditions
IF = 16 mA
IR = 10 µA
IR = 100
µA
mV/°C IF = 16 mA
-1.9
90
150
130
180
160
pF
f = 1 MHz, VF = 0 V
VO = 5 V, IO = 3 mA
VO = 0.4 V, IB = 20 µA
VO = 0.4 V, IB = 20 µA
VO = 5 V, IO = 3 mA
IF = 16 mA,
VCC = 4.5 V
Fig.
Note
1, 2,
4
5, 11
IF = 16 mA,
VCC = 4.5 V
IF = 0 mA
7
13
13
3
Switching Specifications (AC)
Over recommended temperature (TA = 0°C to 70°C), VCC = 5 V, IF = 16 mA unless otherwise specified.
Parameter
Sym.
Propagation
tPHL*
Delay Time to
Logic Low at
Output
Device
Min. Typ.** Max.
6N135
0.2
HCPL-0500
HCNW135
Units Test Conditions
1.5
µs TA = 25°C
RL = 4.1 kΩ
2.0
6N136
0.2
0.8
TA = 25°C
HCPL-2502
HCPL-0501
HCNW136
1.0
Fig.
Note
5, 6,
11
8, 9
RL = 1.9 kΩ
Propagation
tPLH*
6N135
1.3
1.5
µs TA = 25°C
RL = 4.1 kΩ
5, 6,
8, 9
Delay Time to
HCPL-0500
2.0
11
Logic High at
HCNW135
Output
6N136
0.6
0.8
TA = 25°C
RL = 1.9 kΩ
HCPL-2502
HCPL-0501
HCNW136
1.0
Common Mode
|CMH|
6N135
1
kV/µs RL = 4.1 kΩ
IF = 0 mA, TA = 25°C,
12
7, 8,
Transient Im
HCPL-0500
1
VCM = 10 Vp-p
9
munity at Logic
HCNW135
CL = 15 pF
High Level
6N136
1
RL = 1.9 kΩ
Output
HCPL-2502
1
HCPL-0501
Common Mode
|CML|
6N135
1
kV/µs RL = 4.1 kΩ
IF = 16 mA, TA = 25°C,
12
7, 8,
Transient Im
HCPL-0500
1
VCM = 10 Vp-p
9
munity at Logic
HCNW135
CL = 15 pF
Low Level
6N136
1
RL = 1.9 kΩ
Output
HCPL-2502
1
HCPL-0501
Bandwidth
BW
6N135/6
9
MHz See Test Circuit
8, 10
10
HCPL-2502
HCPL-0500/1
*For JEDEC registered parts.
**All typicals at TA = 25°C.
11
HCNW135/6
11
Package Characteristics
Over recommended temperature (TA = 0°C to 70°C) unless otherwise specified.
Parameter
Sym.
Device
Min.
Typ.*
Max.
Units
Input-Output
VISO
8-Pin DIP
3750
V rms
Momentary
SO-8
Widebody 5000
Withstand
Voltage**
Test Conditions
Fig.
RH < 50%,
t = 1 min.,
TA = 25°C
8-Pin DIP
5000
(Option 020)
Note
6, 14
6, 15
6, 12,
15
II-O
8-Pin DIP
1
µA
45% RH, t = 5 s,
VI-O = 3 kVdc,
TA = 25°C
6, 16
Input-Output
RI-O
Resistance
8-Pin DIP
SO-8
1012
VI-O = 500 Vdc
6
Widebody
1013
1012
Ω
10 11
Input-Output
CI-O
Capacitance
8-Pin DIP
SO-8
0.6
Widebody
0.5
pF
TA = 25°C
TA = 100°C
f = 1 MHz
6
0.6
*All typicals at TA = 25°C.
**The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous
voltage rating. For the continuous voltage rating refer to the IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics Table (if applicable), your
equipment level safety specification or Avago Application Note 1074 entitled “Optocoupler Input-Output Endurance Voltage,” publication number
5963-2203E.
Notes:
1. Derate linearly above 70°C free-air temperature at a rate of 0.8 mA/°C (8-Pin DIP).
Derate linearly above 85°C free-air temperature at a rate of 0.5 mA/°C (SO-8).
2. Derate linearly above 70°C free-air temperature at a rate of 1.6 mA/°C (8-Pin DIP).
Derate linearly above 85°C free-air temperature at a rate of 1.0 mA/°C (SO-8).
3. Derate linearly above 70°C free-air temperature at a rate of 0.9 mW/°C (8-Pin DIP).
Derate linearly above 85°C free-air temperature at a rate of 1.1 mW/°C (SO-8).
4. Derate linearly above 70°C free-air temperature at a rate of 2.0 mW/°C (8-Pin DIP).
Derate linearly above 85°C free-air temperature at a rate of 2.3 mW/°C (SO-8).
5. CURRENT TRANSFER RATIO in percent is defined as the ratio of output collector current, IO, to the forward LED input current, IF, times 100.
6. Device considered a two-terminal device: Pins 1, 2, 3, and 4 shorted together and Pins 5, 6, 7, and 8 shorted together.
7. Common mode transient immunity in a Logic High level is the maximum tolerable (positive) dVCM/dt on the leading edge of the common
mode pulse signal, VCM, to assure that the output will remain in a Logic High state (i.e., VO > 2.0 V). Common mode transient immunity in a
Logic Low level is the maximum tolerable (negative) dVCM /dt on the trailing edge of the common mode pulse signal, VCM, to assure that the
output will remain in a Logic Low state (i.e., VO < 0.8 V).
8. The 1.9 kΩ load represents 1 TTL unit load of 1.6 mA and the 5.6 kΩ pull-up resistor.
9. The 4.1 kΩ load represents 1 LSTTL unit load of 0.36 mA and 6.1 kΩ pull-up resistor.
10. The frequency at which the ac output voltage is 3 dB below its mid-frequency value.
11. The JEDEC registration for the 6N136 specifies a minimum CTR of 15%. Avago guarantees a minimum CTR of 19%.
12. See Option 020 data sheet for more information.
13. Use of a 0.1 µf bypass capacitor connected between pins 5 and 8 is recommended.
14. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 4500 V rms for 1 second (leakage
detection current limit, II-O ≤ 5 µA). This test is performed before the 100% Production test shown in the IEC/EN/DIN EN 60747-5-2 Insulation
Related Characteristics Table if applicable.
15. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 6000 V rms for 1 second (leakage
detection current limit, II-O ≤ 5 µA). This test is performed before the 100% Production test shown in the IEC/EN/DIN EN 60747-5-2 Insulation
Related Characteristics Table if applicable.
16. This rating is equally validated by an equivalent ac proof test.
12
T = 25 C
10 VA = 5.0 V
CC
35 mA
30 mA
25 mA
5
20 mA
15 mA
10 mA
0
IF = 5 mA
0
10
WIDEBODY
16
40 mA
IO Ð OUTPUT CURRENT Ð mA
IO Ð OUTPUT CURRENT - mA
8 PIN DIP, SO-8
40 mA
12
35 mA
30 mA
25 mA
8
20 mA
15 mA
4
10 mA
IF = 5 mA
0
20
TA = 25 C
VCC = 5.0 V
0
10
VO - OUTPUT VOLTAGE - V
20
VO - OUTPUT VOLTAGE - V
8 PIN DIP, SO-8
1.5
6N135, HCPL-0500
6N136, HCPL-2502
HCPL-0501
1.0
0.5
0.1
NORMALIZED
I F = 16 mA
VO = 0.4 V
VCC = 5 V
TA = 25 C
0
1
10
100
NORMALIZED CURRENT TRANSFER RATIO
NORMALIZED CURRENT TRANSFER RATIO
Figure 1. DC and pulsed transfer characteristics.
WIDEBODY
1.5
HCNW135/6
1.0
0.5
0
NORMALIZED
IF = 16 mA
VO = 0.4 V
VCC = 4.5 V
TA = 25  C
0
1
IF - INPUT CURRENT - mA
10
100
IF - INPUT CURRENT - mA
Figure 2. Current transfer ratio vs. input current.
8 PIN DIP, SO-8
100
IF
TA = 25 C
+
VF
-
10
1.0
1000
0.1
0.01
0.001
1.1
1.2
1.3
1.4
1.5
VF - FORWARD VOLTAGE - VOLTS
Figure 3. Input current vs. forward voltage.
13
IF - FORWARD CURRENT - mA
IF - FORWARD CURRENT - mA
1000
1.6
WIDEBODY
TA = 25 C
100
10
1.0
IF
0.1
+
VF
-
0.01
0.001
1.2
1.3
1.4
1.5
1.6
1.7
1.8
VF - FORWARD VOLTAGE - VOLTS
8 PIN DIP, SO-8
1.0
0.9
0.8
0.7
NORMALIZED
IF = 16 mA
VO = 0.4 V
VCC = 5 V
TA = 25° C
6N135, HCPL-0500
6N136, HCPL-2502,
HCPL-0501
0.6
-60 -40 -20
0
20
40
80 100
60
NORMALIZED CURRENT TRANSFER RATIO
NORMALIZED CURRENT TRANSFER RATIO
1.1
WIDEBODY
1.1
1.0
HCNW135/6
0.9
0.8
0.7
NORMALIZED
IF = 16 mA
VO = 0.4 V
VCC = 5 V
TA = 25° C
0.6
0.5
0.4
-60 -40 -20
TA - TEMPERATURE - ° C
0
40
20
80 100
60
TA - TEMPERATURE - ° C
Figure 4. Current transfer ratio vs. temperature.
1500
8 PIN DIP, SO-8
IF = 16 mA, VCC = 5.0 V
6N135, HCPL-0500 (RL = 4.1 kΩ)
6N136, HCPL-0501, HCPL-2502
(RL = 1.9 kΩ)
1000
tPLH
tPHL
500
0
-60
20
-20
60
WIDEBODY
1000
tp - PROPAGATION DELAY - ns
tp - PROPAGATION DELAY - ns
2000
IF = 16 mA, VCC = 5.0 V
HCNW135 (RL = 4.1 kΩ)
HCNW136 (RL = 1.9 kΩ)
800
600
t PLH
400
200
0
-60 -40 -20
100
t PHL
0
20
40
60
80 100
TA - TEMPERATURE - ° C
TA - TEMPERATURE - ° C
Figure 5. Propagation delay vs. temperature.
2.0
1.0
0.8
0.6
8 PIN DIP, SO-8
I F = 10 mA
I F = 16 mA
VCC = 5.0 V
TA = 25° C
tPLH
0.4
t PHL
0.2
0.1
1
2
3
4
5
6 7 8 9 10
RL - LOAD RESISTANCE - (kΩ)
Figure 6. Propagation delay time vs. load resistance.
14
WIDEBODY
10.0
tP - PROPAGATION DELAY - µs
tP - PROPAGATION DELAY - µs
3.0
I F = 10 mA
I t = 16 mA
6.0
4.0 VCC = 5.0 V
TA = 25° C
t PLH
1.0
0.6
t PHL
0.4
0.2
0.1
1
2
4
10
40
RL - LOAD RESISTANCE - (kΩ)
100
IF = 0
VO = VCC = 5.0 V
10+3
+2
10
10+1
100
10 -1
10 -2
-75
-50
-25
0
+25 +50 +75 +100
IOH - LOGIC HIGH OUTPUT CURRENT - nA
IOH - LOGIC HIGH OUTPUT CURRENT - nA
8 PIN DIP, SO-8
10+4
WIDEBODY
+3
10
IF = 0
VO = VCC = 15 V
+2
10
+1
10
0
10
-60 -40 -20
0
20
40
60
80 100
TA - TEMPERATURE -  C
TA - TEMPERATURE -  C
8 PIN DIP, SO-8
0.30
IO
I F - SMALL SIGNAL CURRENT TRANSFER RATIO
IO
I F - SMALL SIGNAL CURRENT TRANSFER RATIO
Figure 7. Logic high output current vs. temperature.
WIDEBODY
0.50
TA = 25 C, RL = 100 , VCC = 5 V
TA = 25 C, RL = 100 , VCC = 5 V
0.40
0.20
0.30
0.20
0.10
0.10
0
0
4
8
12
16
20
25
IF - QUIESCENT INPUT CURRENT - mA
0
0
4
8
12
16
20
25
IF - QUIESCENT INPUT CURRENT - mA
8-PIN DIP/S0-8
800
PS (mW)
IS (mA) For 8-PIN DIP
IS (mA) For S0-8
700
600
500
400
300
200
100
0
0
25
50
75 100 125 150 175 200
TS - CASE TEMPERATURE -  C
OUTPUT POWER - PS, INPUT CURRENT - IS
OUTPUT POWER - PS, INPUT CURRENT - IS
Figure 8. Small-signal current transfer ratio vs. quiescent input current.
HCNW135/6
1000
PS (mW)
900
IS (mA)
800
700
600
500
400
300
200
100
0
0
25
50
75
100 125 150 175
TS - CASE TEMPERATURE -  C
Figure 9. Thermal derating curve, dependence of safety limiting value with case temperature per IEC/EN/DIN EN 60747-5-2.
15
NORMALIZED RESPONSE - dB
+5
6N135/6, HCPL-0500/1, HCPL-2502
TA = 25C
6N135/6, HCPL-0500/1, HCPL-2502
+12 V
1
0.1 µF
0
2
47 µF
VFF
-10
100 
1 K
51 
-15
1N4150
1.0
10
Q1
3
5
TRIM FOR
UNITY GAIN
Figure 10. Frequency response.
Q 1 , Q 2 , Q 3 : 2N3904
TYPICAL LINEARITY = ± 3% AT V IN = 1 V p-p
TYPICAL SNR = 50dB
TYPICAL R T = 375 
TYPICAL VO dc = 3.8 V
TYPICAL I F = 9 mA
100
HCNW135/6
HCNW135/6
470
�
100 
RT
22 
VO
Q2
0.1 µF
4
0.1 µF
Q3
6
f - FREQUENCY - MHz
16
15 K
7
1.2 K
9.1 K
-5
-20
0.1
+12 V
8
2.1 K
(1 M 12 pF
TEST INPUT)
IF
PULSE
GEN.
ZO = 50 
t r = 5 ns
0
5V
VO
1.5 V
10% DUTY CYCLE
1/f < 100 µS
1.5 V
VOL
1
8
2
7
3
6
+5 V
RL
0.1µF
I F MONITOR
4
5
Figure 11. Switching test circuit.
IF
1
8
2
7
3
6
+5 V
B
VCM
0V
10%
90% 90%
VO
tf
5V
SWITCH AT B: I F = 16 mA
VO
0.1 µF
SWITCH AT A: I F = 0 mA
VO
RL
A
10%
tr
VFF
4
5
VOL
VCM
+
-
PULSE GEN.
Figure 12. Test circuit for transient immunity and typical waveforms.
For product information and a complete list of distributors, please go to our website:
VO
CL = 1.5 µF
RM
t PLH
t PHL
IF
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved. Obsoletes AV01-0550EN
AV02-0171EN - January 29, 2010