DSR0.3A THRU DSR0.3M Surface Mount Standard Rectifiers Reverse Voltage - 50 to 1000 Volts Forward Current - 0.3 Ampere Features Low profile space Ideal for automated placement Glass passivated chip junctions Low forward voltage drop Low leakage current High forward surge capability High temperature soldering： 260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC SOD-123FL 1.8± 0.1 １．０±0.2 Cathode Band Top View 1.3± 0.15 0.10-0.30 2.8±0.1 0.6±0.25 Mechanical Date Case: JEDEC SOD-123FL molded plastic body over glass passivated chip Terminals: Solder plated, solderable per J-STD-002B and JESD22-B102D Polarity: Laser band denotes cathode end Weight: 0.017gram 3.7±0.2 Dimensions in millimeters MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25 C ambient temperature unless otherwise specified. Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%. SYMBOLS Maximum repetitive peak reverse voltage VRRM Maximum RMS voltage VRMS Maximum DC blocking voltage VDC Maximum average forward rectified current I(AV) at TA=65 C (NOTE 1) Peak forward surge current IFSM 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) TL=25 C VF Maximum instantaneous forward voltage at 0.3A Maximum DC reverse current TA=25 C IR at rated DC blocking voltage TA=100 C Typical junction capacitance (NOTE 2) CJ Typical thermal resistance (NOTE 3) RθJA Operating junction and storage temperature range TJ,TSTG S03A S03B S03D S03G S03J S03K S03M UNITS 50 35 50 100 70 100 200 140 200 400 280 400 600 420 600 800 560 800 1000 700 1000 VOLTS VOLTS VOLTS 0.3 Amp 15.0 Amps 1.1 Volts 5.0 50.0 µA 4 220 -55 to +150 pF K/W C Note1: Mounted on FR-4 P.C.B. With 0.9x1.5 mm copper pad areas (≈35 μm thick) MDD ELECTRONIC RATINGS AND CHARACTERISTIC CURVES DSR0.3A THRU DSR0.3M Characteristic Curves (TA=25 ℃ unless otherwise noted) MDD ELECTRONIC