GN1A thru GN1M Surface Mount Glass Passivated Rectifiers Reverse Voltage 50 to 1000 Volts Forward Current 1.0 Ampere Features Plastic package has Underwriters Laboratory Flammability Classification 94V-0 For surface mounted applications Low profile package Built-in strain relief, ideal for automated placement Glass passivated chip junction High temperature soldering: 250oC/10 seconds at terminals Mechanical Data Case: JEDEC DO-214AC (SMA) molded plastic over glass passivated chip Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Weight: 0.002 ounce, 0.064 gram Maximum Ratings and Electrical Characteristics Ratings at 25oC ambient temperature unless otherwise specified. Parameter Symbols GN1A GN1B GN1D GN1G Maximum repetitive peak reverse voltage VRRM 50 100 200 Maximum RMS voltage VRMS 35 70 140 50 100 200 Maximum DC blocking voltage V DC Maximum average forward rectified current (see fig.1) IF(AV) Peak forward surge current 8.3ms single half sine-wave superimposed on rated load(JEDEC Method) TL=110oC IFSM Maximum instantaneous forward voltage at 1.0A VF Maximum DC reverse current at rated DC blocking voltage @TA=25oC @TA=125oC Typical reverse recovery time at IF=0.5A, IR=1.0A, Irr=0.25A Typical junction capacitance at 4.0V, 1MHz GN1J GN1K GN1M 400 600 800 1000 Volts 280 420 560 700 Volts 400 600 800 1000 Volts 1.0 40.0 Amp 30.0 1.10 1.0 IR Volts uA 50 1.0 trr CJ uS 12 pF Typical thermal resistance (NOTE 1) 75 85 RθJL 27 30 Operating junction temperature range TJ Notes: Amps 5.0 RθJA Storage temperature range Units TSTG C/W -55 to +150 o C -55 to +150 o C 1. Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.2 x 0.2" (5.0 x 5.0mm) copper pad areas 19 o RATINGS AND CHARACTERISTIC CURVES 20