gnox

GNOA thru GNOM
Surface Mount Glass Passivated Rectifiers
Reverse Voltage 50 to 1000 Volts Forward Current 1.5 Amperes
Features
‹ Plastic package has Underwriters Laboratory Flammability
Classification 94V-0
‹ For surface mounted applications
‹ Low profile package
‹ Built-in strain relief, ideal for automated placement
‹ Glass passivated chip junction
‹ High temperature soldering:
250oC/10 seconds at terminals
Mechanical Data
‹ Case: JEDEC DO-214AA (SMB) molded plastic body over
glass passivated chip
‹ Terminals: Solder plated, solderable per MIL-STD-750, Method
2026
‹ Polarity: Color band denotes cathode end
‹ Weight: 0.003 ounce, 0.093 gram
Maximum Ratings and Electrical Characteristics
Ratings at 25oC ambient temperature unless otherwise specified.
Parameter
Symbols
GNOA
GNOB
GNOD
GNOG
GNOJ
GNOK
GNOM
Units
Maximum repetitive peak reverse voltage
VRRM
50
100
200
400
600
800
1000
Volts
Maximum RMS voltage
VRMS
35
70
140
280
420
560
700
Volts
Maximum DC blocking voltage
V DC
50
100
200
400
600
800
1000
Volts
o
Maximum average forward rectified current at TL=100 C
IF(AV)
1.5
Amps
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method) TL=100oC
IFSM
50.0
Amps
Maximum instantaneous forward voltage at 1.5A
VF
1.15
Volts
IR
1.0
125
uA
trr
1.0
uS
pF
Maximum DC reverse current
at rated DC blocking voltage
@TA=25oC
@TA=125oC
Typical reverse recovery time at
IF=0.5A, IR=1.0A, Irr=0.25A
Typical junction capacitance at 4.0V, 1MHz
CJ
30
Typical thermal resistance (NOTE 1)
RθJA
RθJL
53
16
Operating junction temperature range
TJ
-55 to +150
o
C
-55 to +150
o
C
Storage temperature range
Notes:
TSTG
1. Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.3 x 0.3" (8.0 x 8.0mm) copper pad areas
27
o
C/W
RATINGS AND CHARACTERISTIC CURVES
28