GN3X series

GN3A thru GN3M
Surface Mount Glass Passivated Rectifiers
Reverse Voltage 50 to 1000 Volts Forward Current 3.0 Amperes
Features
‹ Plastic package has Underwriters Laboratory Flammability
Classification 94V-0
‹ For surface mounted applications
‹ Low profile package
‹ Built-in strain relief, ideal for automated placement
‹ Glass passivated chip junction
Mechanical Data
‹ Case: JEDEC DO-214AB (SMC) molded plastic body over
glass passivated chip
‹ Terminals: Solder plated, solderable per MIL-STD-750, Method
2026
High temperature soldering:
o
260 C/10 seconds at terminals
‹ Polarity: Color band denotes cathode end
‹ Weight: 0.009 ounce, 0.25 gram
Maximum Ratings and Electrical Characteristics
Ratings at 25oC ambient temperature unless otherwise specified.
Parameter
Symbols
GN3A
GN3B
GN3D
GN3G
GN3J
GN3K
GN3M
Units
Maximum repetitive peak reverse voltage
VRRM
50
100
200
400
600
800
1000
Volts
Maximum RMS voltage
VRMS
35
70
140
280
420
560
700
Volts
Maximum DC blocking voltage
V DC
50
100
200
400
600
800
1000
Volts
Maximum average forward rectified current at
TL=103oC (1)
IF(AV)
3.0
Amps
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method) TL=75oC
IFSM
100.0
Amps
Maximum instantaneous forward voltage at 2.5A
VF
1.15
Volts
IR
10.0
250
uA
trr
1.0
uS
pF
Maximum DC reverse current
at rated DC blocking voltage
@TA=25oC
@TA=125oC
Typical reverse recovery time at
IF=0.5A, IR=1.0A, Irr=0.25A
Typical junction capacitance at 4.0V, 1MHz
CJ
60
Typical thermal resistance (NOTE 1)
RθJA
RθJL
47
13
Operating junction temperature range
TJ
-55 to +150
o
C
TSTG
-55 to +150
o
C
Storage temperature range
Notes:
1. Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.3 x 0.3" (8.0 x 8.0mm) copper pad areas
41
o
C/W
RATINGS AND CHARACTERISTIC CURVES
42