GN3A thru GN3M Surface Mount Glass Passivated Rectifiers Reverse Voltage 50 to 1000 Volts Forward Current 3.0 Amperes Features Plastic package has Underwriters Laboratory Flammability Classification 94V-0 For surface mounted applications Low profile package Built-in strain relief, ideal for automated placement Glass passivated chip junction Mechanical Data Case: JEDEC DO-214AB (SMC) molded plastic body over glass passivated chip Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 High temperature soldering: o 260 C/10 seconds at terminals Polarity: Color band denotes cathode end Weight: 0.009 ounce, 0.25 gram Maximum Ratings and Electrical Characteristics Ratings at 25oC ambient temperature unless otherwise specified. Parameter Symbols GN3A GN3B GN3D GN3G GN3J GN3K GN3M Units Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 800 1000 Volts Maximum RMS voltage VRMS 35 70 140 280 420 560 700 Volts Maximum DC blocking voltage V DC 50 100 200 400 600 800 1000 Volts Maximum average forward rectified current at TL=103oC (1) IF(AV) 3.0 Amps Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) TL=75oC IFSM 100.0 Amps Maximum instantaneous forward voltage at 2.5A VF 1.15 Volts IR 10.0 250 uA trr 1.0 uS pF Maximum DC reverse current at rated DC blocking voltage @TA=25oC @TA=125oC Typical reverse recovery time at IF=0.5A, IR=1.0A, Irr=0.25A Typical junction capacitance at 4.0V, 1MHz CJ 60 Typical thermal resistance (NOTE 1) RθJA RθJL 47 13 Operating junction temperature range TJ -55 to +150 o C TSTG -55 to +150 o C Storage temperature range Notes: 1. Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.3 x 0.3" (8.0 x 8.0mm) copper pad areas 41 o C/W RATINGS AND CHARACTERISTIC CURVES 42