SCBS010A − NOVEMBER 1988 − REVISED NOVEMBER 1993 • • • • • DW OR NT PACKAGE (TOP VIEW) BiCMOS Design Substantially Reduces Standby Current Functionally Equivalent to ′ALS29864 and AMD Am29864A Power-Up High-Impedance State ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015 Package Options Include Plastic Small-Outline (DW) Packages and Standard Plastic 300-mil DIPs (NT) OEBA1 A1 A2 A3 A4 A5 A6 A7 A8 A9 OEBA2 GND description This 9-bit transceiver is designed for asynchronous communication between data buses. The control-function implementation allows for maximum flexibility in timing. 1 24 2 23 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13 VCC B1 B2 B3 B4 B5 B6 B7 B8 B9 OEAB2 OEAB1 The device allows data transmission from the A bus to the B bus or from the B bus to the A bus, depending upon the logic levels at the output-enable (OEBA and OEAB) inputs. The outputs are in the high-impedance state during power-up and power-down conditions. The outputs remain in the high-impedance state while the device is powered-down. The SN74BCT29864B is characterized for operation from 0°C to 70°C. FUNCTION TABLE INPUTS OEAB1 OEAB2 OEBA1 OEBA2 L L L L L L H X L L X H H X L L X H L L H X H X H X X H X H X H X H H X OPERATION Latch A and B A to B B to A Isolation Copyright 1993, Texas Instruments Incorporated !" # $%&" !# '%()$!" *!"&+ *%$"# $ " #'&$$!"# '& ",& "&# &-!# #"%&"# #"!*!* .!!"/+ *%$" '$&##0 *&# " &$&##!)/ $)%*& "&#"0 !)) '!!&"&#+ • DALLAS, TEXAS 75265 • HOUSTON, TEXAS 77251−1443 POST OFFICE BOX 655303 POST OFFICE BOX 1443 2−1 SCBS010A − NOVEMBER 1988 − REVISED NOVEMBER 1993 logic symbol† OEBA1 OEBA2 OEAB1 OEAB2 A1 logic diagram (positive logic) 1 & 11 EN1 13 & 14 2 OEAB1 OEAB2 A1 EN2 23 1 13 1 14 11 2 23 OEBA1 OEBA2 B1 B1 2 A2 A3 A4 A5 A6 A7 A8 A9 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 B2 To Eight Other Channels B3 B4 B5 B6 B7 B8 B9 † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡ Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input voltage range (I/O ports) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 5.5 V Input voltage range (excluding I/O ports) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Voltage range applied to any output in the high state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC Input clamp current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −30 mA Current into any output in the low state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA Operating free-air temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C ‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The negative voltage rating may be exceeded if the input current rating is observed. recommended operating conditions MIN NOM MAX 4.5 5 5.5 UNIT VCC VIH Supply voltage VIL IIK Low-level input voltage 0.8 V Input clamp current −18 mA IOH IOL High-level output current −24 mA 48 mA TA Operating free-air temperature 70 °C 2−2 High-level input voltage 2 Low-level output current 0 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • V V SCBS010A − NOVEMBER 1988 − REVISED NOVEMBER 1993 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK TEST CONDITIONS VCC = 4.5 V, II = − 18 mA IOH = − 15 mA VCC = 4.5 V VOH IOH = − 24 mA IOH = − 3 mA VCC = 4.75 V, VCC = 4.5 V VOL II MIN VCC = 5.5 V, IOL = 48 mA VI = 5.5 V IIH Control inputs A or B port‡ VCC = 5.5 V, VI = 2.7 V IIL Control inputs A or B port‡ VCC = 5.5 V, VI = 0.5 V IIO(off)§ IOS¶ VCC = 0, VCC = 5.5 V, VO = 2.7 V VO = 0 ICC VCC = 5.5 V Ci VCC = 5 V, VCC = 5 V, TYP† 2.4 3.3 2 3.1 MAX UNIT −1.2 V V 2.7 0.35 0.5 V 0.1 mA 20 20 µA A −0.2 −0.2 −75 0.1 mA −250 mA Outputs high 18 30 Outputs low 30 45 Outputs disabled 6.5 12 VI = 0.5 V or 2.5 V VI = 0.5 V or 2.5 V Cio † All typical values are at VCC = 5 V, TA = 25°C. ‡ For I/O ports, the parameters IIH and IIL include the off-state output current. § IO(off) = Power-off bus leakage current ¶ Not more than one output should be shorted at a time and duration of the short circuit should not exceed one second. mA mA 6 pF 8 pF switching characteristics (see Note 2) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL A or B B or A tPZH tPZL OEAB or OEBA A or B tPHZ tPLZ OEAB or OEBA A or B VCC = 4.5 V to 5.5 V, CL = 50 pF, R1 = 500 Ω, R2 = 500 Ω, TA = MIN to MAX# VCC = 5 V, CL = 50 pF, R1 = 500 Ω, R2 = 500 Ω, TA = 25°C MIN TYP MAX MIN MAX 1 3.5 5.3 1 6.1 0.5 2.3 4.6 0.5 4.8 2.3 5 7.2 2.3 8.4 4.3 7.3 10.6 4.3 12.5 2.3 4.6 7.6 2.3 8.4 2 4 7 2 8.2 UNIT ns ns ns # For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions. NOTE 2: Load circuits and voltage waveforms are shown in Section 1. • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • 2−3 SCBS010A − NOVEMBER 1988 − REVISED NOVEMBER 1993 2−4 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74BCT29864BNT ACTIVE PDIP NT 24 15 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74BCT29864BNTE4 ACTIVE PDIP NT 24 15 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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