SCBS077A − SEPTEMBER 1991 − REVISED NOVEMBER 1993
•
•
•
DW OR NT PACKAGE
(TOP VIEW)
State-of-the-Art BiCMOS Design
Significantly Reduces ICCZ
ESD Protection Exceeds 2000 V Per
MIL-STD-883C, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
Package Options Include Plastic
Small-Outline (DW) Packages and Standard
Plastic 300-mil DIPs (NT)
OE
1D
2D
3D
4D
5D
6D
7D
8D
9D
CLR
GND
description
The SN74BCT29844 features 3-state outputs
designed specifically for driving highly capacitive
or relatively low-impedance loads. It is particularly
suitable for implementing wider buffer registers,
I/O ports, bidirectional bus drivers with parity, and
working registers.
1
24
2
23
3
22
4
21
5
20
6
19
7
18
8
17
9
16
10
15
11
14
12
13
VCC
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
9Q
PRE
LE
The nine latches are transparent D-type latches. When the latch-enable (LE) input is high, the Q outputs are
complementary to the inverting data (D) inputs.
A buffered output-enable (OE) input can be used to place the nine outputs in either a normal logic state (high
or low level) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus
lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without
need for interface or pull-up components.
The output enable (OE) does not affect the internal operation of the flip-flops. Old data can be retained or new
data can be entered while the outputs are in the high-impedance state.
The SN74BCT29844 is characterized for operation from 0°C to 70°C.
FUNCTION TABLE
INPUTS
PRE
CLR
OE
LE
D
OUTPUT
Q
L
X
L
X
X
H
H
L
L
X
X
L
H
H
L
H
L
H
H
H
L
H
H
L
H
H
L
L
X
Q0
X
X
H
X
X
Z
Copyright 1993, Texas Instruments Incorporated
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#'$#1 "** (""!'#'$,
• DALLAS, TEXAS 75265
• HOUSTON, TEXAS 77251−1443
POST OFFICE BOX 655303
POST OFFICE BOX 1443
1
SCBS077A − SEPTEMBER 1991 − REVISED NOVEMBER 1993
logic symbol†
OE
PRE
CLR
LE
1D
2D
3D
4D
5D
6D
7D
8D
9D
1
14
11
13
2
logic diagram (positive logic)
EN
OE
S2
PRE
1
14
R
1D
3
11
CLR
C1
23
2
22
21
4
5
20
6
19
7
18
8
17
9
16
10
15
13
LE
1Q
S
2Q
3Q
1D
23
C1
2
1Q
1D
4Q
R
5Q
6Q
7Q
8Q
9Q
To Eight Other Channels
† This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 0.5 V to 7 V
Voltage range applied to any output in the disabled or power-off state, VO . . . . . . . . . . . . . . . . . − 0.5 V to 7 V
Voltage range applied to any output in the high state, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 0.5 V to VCC
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −30 mA
Current into any output in the low state, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA
Operating free-air temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 65°C to 150°C
‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only, and
functional operation of the device at these or any other conditions beyond those indicated in the “recommended operating conditions” section of
this specification is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
recommended operating conditions
MIN
NOM
MAX
4.5
5
5.5
UNIT
VCC
VIH
Supply voltage
VIL
IIK
Low-level input voltage
0.8
V
Input clamp current
−18
mA
IOH
IOL
High-level output current
−24
mA
48
mA
TA
Operating free-air temperature
70
°C
2
High-level input voltage
2
Low-level output current
0
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
V
V
SCBS077A − SEPTEMBER 1991 − REVISED NOVEMBER 1993
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VIK
VCC = 4.5 V,
VOH
VCC = 4.5 V
VOL
VCC = 4.75 V,
VCC = 4.5 V,
II
IIH
VCC = 5.5 V,
VCC = 5.5 V,
IIL
IOS‡
VCC = 5.5 V,
VCC = 5.5 V,
IOZH
IOZL
VCC = 5.5 V,
VCC = 5.5 V,
ICCL
ICCH
VCC = 5.5 V,
VCC = 5.5 V,
ICCZ
Ci
VCC = 5.5 V,
VCC = 5 V,
MIN
II = −18 mA
IOH = − 15 mA
TYP†
MAX
UNIT
−1.2
V
2.4
IOH = − 24 mA
IOH = − 3 mA
V
2
2.7
IOL = 48 mA
VI = 7 V
0.42
0.55
0.1
VI = 2.7 V
VI = 0.5 V
−10
VO = 0
VO = 2.7 V
−75
V
mA
−75
µA
−0.2
mA
−275
mA
20
µA
−20
µA
3
7
mA
Outputs open
24
35
mA
Outputs open
3
7
mA
VO = 0.5 V
Outputs open
VI = 2.5 V or 0.5 V
VCC = 5 V,
VO = 2.5 V or 0.5 V
† All typical values are at VCC = 5 V, TA = 25°C.
‡ Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
Co
5
pF
8
pF
timing requirements over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted)
VCC = 5 V,
TA = 25°C
MIN
tw
Pulse duration
PRE low
4
4
CLR low
4
4
LE high
4
4
2.5
2.5
PRE or CLR inactive
2
2
High
2
2
Low
3
3
High or low
tsu
Setup time, data before LE↓
th
Hold time, data after LE↓
MIN
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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•
MAX
UNIT
MAX
ns
ns
ns
3
SCBS077A − SEPTEMBER 1991 − REVISED NOVEMBER 1993
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 50 pF (unless otherwise noted) (see Note 2)
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
D
Q
tPLH
tPHL
LE
Q
tPLH
tPHL
PRE
Q
tPLH
tPHL
CLR
Q
tPZH
tPZL
OE
Q
tPHZ
tPLZ
OE
Q
PARAMETER
VCC = 5 V,
TA = 25°C
•
7.3
1.8
9
7
2.2
7.8
MAX
1.8
5
2.2
5
2.1
5
7
2.1
8.2
2.7
4.5
6.9
2.7
7.5
1.5
4.5
6.7
1.5
8
2.2
4.5
6.2
2.2
6.4
2.1
4.7
6.5
2.1
7.3
2.4
5.3
7.7
2.4
8.9
2.1
5.2
7.6
2.1
9.3
4.7
8.1
10.6
4.7
12.2
2.1
4.3
5.8
2.1
6.6
1.5
4.3
6
1.5
6.8
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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•
MAX
TYP
NOTE 2: Load circuits and voltage waveforms are shown in Section 1.
4
MIN
MIN
UNIT
ns
ns
ns
ns
ns
ns
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74BCT29844DW
OBSOLETE
SOIC
DW
24
TBD
Call TI
Call TI
SN74BCT29844NT
OBSOLETE
PDIP
NT
24
TBD
Call TI
Call TI
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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