SCBS776 − NOVEMBER 2003
D Controlled Baseline
D
D
D
D
D
D
D
D Bus Hold on Data Inputs Eliminates the
− One Assembly/Test Site, One Fabrication
Site
Enhanced Diminishing Manufacturing
Sources (DMS) Support
Enhanced Product-Change Notification
Qualification Pedigree†
Supports Mixed-Mode Signal Operation
(5-V Input and Output Voltages With
3.3-V VCC )
Supports Unregulated Battery Operation
Down To 2.7 V
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
Ioff and Power-Up 3-State Support Hot
Insertion
† Component qualification in accordance with JEDEC and industry
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life. Such qualification
testing should not be viewed as justifying use of this component
beyond specified performance and environmental limits.
D
D
Need for External Pullup/Pulldown
Resistors
Latch-Up Performance Exceeds 500 mA Per
JESD 17
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
PW PACKAGE
(TOP VIEW)
CLKAB
SAB
OEAB
A1
A2
A3
A4
A5
A6
A7
A8
GND
1
24
2
23
3
22
4
21
5
20
6
19
7
18
8
17
9
16
10
15
11
14
12
13
VCC
CLKBA
SBA
OEBA
B1
B2
B3
B4
B5
B6
B7
B8
description/ordering information
This bus transceiver and register is designed specifically for low-voltage (3.3-V) VCC operation, but with the
capability to provide a TTL interface to a 5-V system environment.
The SN74LVTH652 consists of bus-transceiver circuits, D-type flip-flops, and control circuitry arranged for
multiplexed transmission of data directly from the data bus or from the internal storage registers.
Output-enable (OEAB and OEBA) inputs are provided to control the transceiver functions. Select-control (SAB
and SBA) inputs are provided to select whether real-time or stored data is transferred. The circuitry used for
select control eliminates the typical decoding glitch that occurs in a multiplexer during the transition between
real-time and stored data. A low input selects real-time data and a high input selects stored data. Figure 1
illustrates the four fundamental bus-management functions that can be performed with the SN74LVTH652
device.
ORDERING INFORMATION
TA
PACKAGE‡
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
−40°C to 85°C
TSSOP − PW
Tape and reel
SN74LVTH652IPWREP
LH652EP
‡ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
!"# $ %&'# "$ (&)*%"# +"#'
+&%#$ %! # $('%%"#$ (' #,' #'!$ '-"$ $#&!'#$
$#"+"+ .""#/ +&%# (%'$$0 +'$ # '%'$$"*/ %*&+'
#'$#0 "** (""!'#'$
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCBS776 − NOVEMBER 2003
description/ordering information (continued)
Data on the A or B data bus, or both, can be stored in the internal D-type flip-flops by low-to-high transitions at
the appropriate clock (CLKAB or CLKBA) inputs, regardless of the select- or enable-control pins. When SAB
and SBA are in the real-time transfer mode, it is possible to store data without using the internal D-type flip-flops
by simultaneously enabling OEAB and OEBA. In this configuration, each output reinforces its input; therefore,
when all other data sources to the two sets of bus lines are at high impedance, each set of bus lines remains
at its last state.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. Use of pullup
or pulldown resistors with the bus-hold circuitry is not recommended.
When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor
and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by
the current-sinking/current-sourcing capability of the driver.
This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry
disables the outputs, preventing damaging current backflow through the device when it is powered down. The
power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,
which prevents driver conflict.
FUNCTION TABLE
DATA I/O†
INPUTS
OPERATION OR FUNCTION
OEAB
OEBA
CLKAB
CLKBA
SAB
SBA
A1−A8
B1−B8
L
H
H or L
H or L
X
X
Input
Input
Isolation
L
H
↑
↑
X
X
Input
H
↑
H or L
X
Input
H
H
↑
↑
X
X‡
Input
Unspecified‡
Store A and B data
X
X
Input
Output
Store A in both registers
L
X
H or L
↑
X
Unspecified‡
Input
Hold A, store B
L
L
↑
↑
X
X
X‡
Output
Input
Store B in both registers
L
L
X
X
X
L
Output
Input
Real-time B data to A bus
L
L
X
H or L
X
H
Output
Input
Stored B data to A bus
H
H
X
X
L
X
Input
Output
Real-time A data to B bus
H
H
H or L
X
H
X
Input
Output
Stored A data to B bus
Output
Stored A data to B bus and
stored B data to A bus
H
L
H or L
H or L
H
H
Output
Store A, hold B
† The data-output functions can be enabled or disabled by a variety of level combinations at OEAB or OEBA. Data-input functions always are
enabled; i.e., data at the bus terminals is stored on every low-to-high transition of the clock inputs.
‡ Select control = L; clocks can occur simultaneously.
Select control = H; clocks must be staggered to load both registers.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
21
OEAB OEBA
L
L
1
23
2
CLKAB CLKBA SAB
X
X
X
BUS B
BUS A
BUS A
BUS B
SCBS776 − NOVEMBER 2003
22
SBA
L
3
21
OEAB OEBA
H
H
21
OEBA
H
X
H
23
2
1
CLKAB CLKBA SAB
↑
X
↑
X
↑
↑
X
X
X
2
SAB
L
22
SBA
X
BUS B
BUS A
BUS A
3
OEAB
X
L
L
23
CLKBA
X
REAL-TIME TRANSFER
BUS A TO BUS B
BUS B
REAL-TIME TRANSFER
BUS B TO BUS A
1
CLKAB
X
22
3
21
1
23
2
22
SBA
OEAB
H
OEBA
L
CLKAB
CLKBA
SAB
SBA
H or L
H or L
H
H
X
X
X
TRANSFER STORED DATA
TO A AND/OR B
STORAGE FROM
A, B, OR A AND B
Figure 1. Bus-Management Functions
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SCBS776 − NOVEMBER 2003
logic diagram (positive logic)
OEBA
OEAB
CLKBA
SBA
CLKAB
SAB
21
3
23
22
1
2
One of Eight Channels
1D
C1
A1
4
20
1D
C1
To Seven Other Channels
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
B1
SCBS776 − NOVEMBER 2003
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high-impedance
or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high state, VO (see Note 1) . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Current into any output in the low state, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Current into any output in the high state, IO (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 mA
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Package thermal impedance, θJA (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. This current flows only when the output is in the high state and VO > VCC.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 4)
MIN
MAX
2.7
3.6
UNIT
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
0.8
V
Input voltage
5.5
V
IOH
IOL
High-level output current
−32
mA
Low-level output current
64
mA
∆t /∆v
Input transition rise or fall rate
10
ns/V
∆t/∆VCC
TA
Power-up ramp rate
200
Operating free-air temperature
−40
High-level input voltage
2
Outputs enabled
V
V
µs/V
85
°C
NOTE 4: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SCBS776 − NOVEMBER 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP†
MAX
UNIT
−1.2
V
VIK
VCC = 2.7 V,
VCC = 2.7 V to 3.6 V,
II = −18 mA
IOH = −100 µA
VOH
VCC = 2.7 V,
VCC = 3 V,
IOH = −8 mA
IOH = −32 mA
IOL = 100 µA
IOL = 24 mA
0.2
VCC = 2.7 V
IOL = 16 mA
IOL = 32 mA
0.4
VOL
VCC = 3 V
Control inputs
Ioff
II(hold)
A or B ports
V
2
0.5
VCC = 3.6 V,
VCC = 0 or 3.6 V,
0.55
±1
VI = 5.5 V
VI = 5.5 V
10
VCC = 3.6 V
VI = VCC
VI = 0
1
VCC = 0,
VI or VO = 0 to 4.5 V
VI = 0.8 V
VCC = 3 V
20
IOZPU
IOZPD
VCC = 0 to 1.5 V, VO = 0.5 to 3 V, OE/OE = don’t care
VCC = 1.5 V to 0, VO = 0.5 to 3 V, OE/OE = don’t care
ICC
VCC = 3.6 V, IO = 0, VI = VCC or GND
µA
75
µA
−75
±500
Outputs high
±100
µA
±100
µA
0.19
Outputs low
5
Outputs disabled
mA
0.19
∆ICC¶
VCC = 3 V to 3.6 V, One input at VCC − 0.6 V, Other inputs at VCC or GND
Ci
VI = 3 V or 0
VO = 3 V or 0
Cio
µA
−5
±100
VI = 2 V
VI = 0 to 3.6 V
VCC = 3.6 V§
V
0.5
IOL = 64 mA
VI = VCC or GND
II
A or B ports‡
VCC−0.2
2.4
0.2
4
mA
pF
9
pF
† All typical values are at VCC = 3.3 V, TA = 25°C.
‡ Unused terminals at VCC or GND
§ This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another.
¶ This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
timing requirements over recommended operating free-air temperature range (unless otherwise
noted) (see Figure 2)
VCC = 3.3 V
± 0.3 V
MIN
fclock
tw
6
Clock frequency
MAX
VCC = 2.7 V
MIN
150
Pulse duration, CLK high or low
tsu
Setup time,
A or B before CLKAB↑ or CLKBA↑
th
Hold time, A or B after CLKAB↑ or CLKBA↑
POST OFFICE BOX 655303
150
3.3
3.3
Data high
1.2
1.5
Data low
1.6
2.2
0.8
0.8
• DALLAS, TEXAS 75265
UNIT
MAX
MHz
ns
ns
ns
SCBS776 − NOVEMBER 2003
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 2)
PARAMETER
fmax
tPLH
tPHL
tPLH
tPHL
tPLH
tPHL
tPZH
tPZL
tPHZ
tPLZ
tPZH
tPZL
tPHZ
FROM
(INPUT)
TO
(OUTPUT)
VCC = 3.3 V
± 0.3 V
MIN
TYP†
VCC = 2.7 V
MAX
150
CLKBA or CLKAB
A or B
A or B
B or A
SBA or SAB‡
A or B
OEBA
A
OEBA
A
OEAB
B
• DALLAS, TEXAS 75265
UNIT
MAX
150
MHz
1.8
3.1
4.7
5.6
1.8
3.1
4.7
5.6
1.3
2.3
3.5
4.1
1.3
2.4
3.5
4.1
1.5
3.1
4.9
6
1.5
3.4
4.9
6
1.1
2.9
5.2
6.5
1.1
3.1
5.2
6.5
2.3
3.5
5.5
6.1
2.3
3.7
5.5
5.9
1.3
3
4.7
5.7
1.3
3.3
4.7
5.7
1.5
3.6
5.6
OEAB
B
tPLZ
1.5
3.7
5.6
† All typical values are at VCC = 3.3 V, TA = 25°C.
‡ These parameters are measured with the internal output state of the storage register opposite that of the bus input.
POST OFFICE BOX 655303
MIN
6.7
6.3
ns
ns
ns
ns
ns
ns
ns
7
SCBS776 − NOVEMBER 2003
PARAMETER MEASUREMENT INFORMATION
6V
S1
500 Ω
From Output
Under Test
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
6V
GND
2.7 V
LOAD CIRCUIT
1.5 V
Timing Input
0V
tw
tsu
2.7 V
Input
1.5 V
1.5 V
th
2.7 V
1.5 V
Data Input
1.5 V
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
2.7 V
1.5 V
Input
1.5 V
0V
tPHL
tPLH
VOH
1.5 V
Output
1.5 V
VOL
tPLH
tPHL
VOH
Output
1.5 V
1.5 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
2.7 V
Output
Control
Output
Waveform 1
S1 at 6 V
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
1.5 V
1.5 V
0V
tPLZ
tPZL
3V
1.5 V
VOL + 0.3 V
VOL
tPHZ
tPZH
1.5 V
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
Figure 2. Load Circuit and Voltage Waveforms
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LVTH652IPWREP
ACTIVE
TSSOP
PW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
V62/04681-01XE
ACTIVE
TSSOP
PW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74LVTH652-EP :
• Catalog: SN74LVTH652
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jul-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
SN74LVTH652IPWREP
Package Package Pins
Type Drawing
TSSOP
PW
24
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
2000
330.0
16.4
Pack Materials-Page 1
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
6.95
8.3
1.6
8.0
W
Pin1
(mm) Quadrant
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jul-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LVTH652IPWREP
TSSOP
PW
24
2000
346.0
346.0
33.0
Pack Materials-Page 2
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