SCBS795 − DECEMBER 2003
D Controlled Baseline
D
D
D
D
D Member of the Texas Instruments
− One Assembly/Test Site, One Fabrication
Site
Enhanced Diminishing Manufacturing
Sources (DMS) Support
Enhanced Product-Change Notification
Qualification Pedigree†
State-of-the-Art Advanced BiCMOS
Technology (ABT) Design for 3.3-V
Operation and Low Static-Power
Dissipation
† Component qualification in accordance with JEDEC and industry
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life. Such qualification
testing should not be viewed as justifying use of this component
beyond specified performance and environmental limits.
GKE PACKAGE
(TOP VIEW)
1
2
3
4
5
Widebus+ Family
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
Ioff and Power-Up 3-State Support Hot
Insertion
Supports Mixed-Mode Signal Operation on
All Ports (5-V Input and Output Voltages
With 3.3-V VCC )
Bus Hold on Data Inputs Eliminates the
Need for External Pullup/Pulldown
Resistors
Supports Unregulated Battery Operation
Down To 2.7 V
D
D
D
D
D
terminal assignments
6
1
2
3
4
5
6
A
A
1Q2
1Q1
1OE
1CLK
1D1
1D2
B
B
1Q4
1Q3
GND
GND
1D3
1D4
C
C
1Q6
1Q5
1D6
D
1Q8
1Q7
1VCC
GND
1D5
D
1VCC
GND
1D7
1D8
E
2Q2
2Q1
GND
GND
2D1
2D2
F
2Q4
2Q3
2D4
2Q6
2Q5
1VCC
GND
2D3
G
1VCC
GND
2D5
2D6
H
2Q7
2Q8
2OE
2CLK
2D8
2D7
E
F
G
H
J
3Q2
3Q1
3OE
3CLK
3D1
3D2
K
3Q4
3Q3
GND
GND
3D3
3D4
K
L
3Q6
3Q5
3D6
M
3Q8
3Q7
2VCC
GND
3D5
L
2VCC
GND
3D7
3D8
M
N
4Q2
4Q1
GND
GND
4D1
4D2
N
P
4Q4
4Q3
4Q6
4Q5
2VCC
GND
4D4
R
2VCC
GND
4D3
P
4D5
4D6
R
T
4Q7
4Q8
4OE
4CLK
4D8
4D7
J
T
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus+ is a trademark of Texas Instruments.
Copyright 2003, Texas Instruments Incorporated
!"# $ %&'# "$ (&)*%"# +"#'
+&%#$ %! # $('%%"#$ (' #,' #'!$ '-"$ $#&!'#$
$#"+"+ .""#/ +&%# (%'$$0 +'$ # '%'$$"*/ %*&+'
#'$#0 "** (""!'#'$
POST OFFICE BOX 655303
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1
SCBS795 − DECEMBER 2003
description/ordering information
The SN74LVTH32374 is a 32-bit edge-triggered D-type flip-flop designed for low-voltage (3.3-V) VCC operation,
but with the capability to provide a TTL interface to a 5-V system environment. This device is particularly suitable
for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.
This device can be used as four 8-bit flip-flops, two 16-bit flip-flops, or one 32-bit flip-flop. On the positive
transition of the clock (CLK), the Q outputs of the flip-flop take on the logic levels set up at the data (D) inputs.
A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high
or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive
the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines
without interface or pullup components.
OE does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while
the outputs are in the high-impedance state.
When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor;
the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry
disables the outputs, preventing damaging current backflow through the device when it is powered down. The
power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,
which prevents driver conflict.
Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors
with the bus-hold circuitry is not recommended.
ORDERING INFORMATION
TA
ORDERABLE
PART NUMBER
PACKAGE†
TOP-SIDE
MARKING
−40°C to 85°C LFBGA − GKE
Tape and reel
CLVTH32374IGKEREP
L374EP
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
FUNCTION TABLE
(each 8-bit flip-flop)
INPUTS
2
OE
CLK
D
OUTPUT
Q
L
↑
H
H
L
↑
L
L
L
H or L
X
Q0
H
X
X
Z
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCBS795 − DECEMBER 2003
logic diagram (positive logic)
1OE
1CLK
A3
2OE
A4
2CLK
C1
1D1
A5
A2
1D
H3
H4
C1
1Q1
2D1
E5
To Seven Other Channels
3OE
3CLK
4OE
J4
J5
4CLK
1D
1D
2Q1
To Seven Other Channels
J3
C1
3D1
E2
J2
T3
T4
C1
3Q1
To Seven Other Channels
4D1
N5
1D
N2
4Q1
To Seven Other Channels
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SCBS795 − DECEMBER 2003
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high-impedance
or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high state, VO (see Note 1) . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Current into any output in the low state, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Current into any output in the high state, IO (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 mA
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Package thermal impedance, θJA (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40°C/W
Storage temperature range, Tstg (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. This current flows only when the output is in the high state and VO > VCC.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
4. Long-term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction
of overall device life. See Figure 1 for additional information on thermal derating.
0.0001
1/Time to Failure − Hours
125°C (16 kHours, 1.84 Years)
115°C (40 kHours, 4.57 Years)
0.00001
105°C (104 kHours, 11.94 Years)
100°C (172 kHours, 19.65 Years)
0.000001
1/TJ − Constant Device Junction Temperature
Figure 1. Estimated Wirebond Life
Based on Elevated-Temperature Kirkendall-Voiding Failure Mode
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCBS795 − DECEMBER 2003
recommended operating conditions (see Note 5)
MIN
MAX
2.7
3.6
UNIT
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
Input voltage
5.5
V
IOH
IOL
High-level output current
−32
mA
∆t/∆v
Input transition rise or fall rate
∆t/∆VCC
TA
Power-up ramp rate
200
Operating free-air temperature
−40
High-level input voltage
2
V
0.8
Low-level output current
Outputs enabled
V
V
64
mA
10
ns/V
µs/V
85
°C
NOTE 5: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SCBS795 − DECEMBER 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
TEST CONDITIONS
II(hold)
V
IOH = −8 mA
IOH = −32 mA
IOL = 100 µA
IOL = 24 mA
0.2
VCC = 2.7 V
IOL = 16 mA
IOL = 32 mA
0.4
IOL = 64 mA
VI = 5.5 V
0.55
Control inputs
Data inputs
VCC = 3.6 V
VCC = 0,
IOZH
IOZL
UNIT
−1.2
VCC = 2.7 V,
VCC = 3 V,
VCC = 0 or 3.6 V,
VCC = 3.6 V,
Data inputs
MAX
II = −18 mA
IOH = −100 µA
VCC = 3 V
Ioff
TYP†
VCC = 2.7 V,
VCC = 2.7 V to 3.6 V,
VOL
II
MIN
VCC−0.2
2.4
V
2
0.5
V
0.5
10
VI = VCC or GND
VI = VCC
±1
VI = 0
VI or VO = 0 to 4.5 V
−5
VCC = 3 V
VI = 0.8 V
VI = 2 V
VCC = 3.6 V,‡
VCC = 3.6 V,
VI = 0 to 3.6 V
VO = 3 V
VCC = 3.6 V,
VO = 0.5 V
1
±100
µA
A
µA
75
µA
−75
±500
5
µA
−5
µA
IOZPU
VCC = 0 to 1.5 V, VO = 0.5 V to 3 V, OE = don’t care
±100
µA
IOZPD
VCC = 1.5 V to 0, VO = 0.5 V to 3 V, OE = don’t care
±100
µA
ICC
VCC = 3.6 V, IO = 0,
VI = VCC or GND
Outputs high
0.38
Outputs low
10
Outputs disabled
∆ICC§
VCC = 3 V to 3.6 V, One input at VCC − 0.6 V,
Other inputs at VCC or GND
Ci
VI = 3 V or 0
VO = 3 V or 0
Co
mA
0.38
0.2
3
mA
pF
9
pF
† All typical values are at VCC = 3.3 V, TA = 25°C.
‡ This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another.
§ This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
timing requirements over recommended operating free-air temperature range (unless otherwise
noted) (see Figure 2)
VCC = 3.3
± 0.3 V
MIN
6
fclock
tw
Clock frequency
tsu
th
Setup time, data before CLK↑
High or low
Hold time, data after CLK↑
High or low
MAX
VCC = 2.7 V
MIN
160
Pulse duration, CLK high or low
3
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
MAX
160
MHz
3
ns
1.8
2
ns
0.8
0.1
ns
SCBS795 − DECEMBER 2003
switching characteristics over recommended operating free-air temperature range (unless
otherwise noted) (see Figure 2)
PARAMETER
fmax
tPLH
tPHL
tPZH
tPZL
tPHZ
tPLZ
FROM
(INPUT)
TO
(OUTPUT)
VCC = 3.3 V
± 0.3 V
VCC = 2.7 V
TYP†
MAX
1.9
3
4.5
5.2
2.1
2.9
4
4.2
1.5
2.8
4.5
5.4
1.5
2.8
4.4
5
2.4
3.5
5
5.4
2
3.2
4.6
4.8
MIN
160
CLK
Q
OE
Q
OE
Q
tsk(o)
† All typical values are at VCC = 3.3 V, TA = 25°C.
POST OFFICE BOX 655303
UNIT
MAX
160
0.5
• DALLAS, TEXAS 75265
MIN
MHz
ns
ns
ns
ns
7
SCBS795 − DECEMBER 2003
PARAMETER MEASUREMENT INFORMATION
6V
S1
500 Ω
From Output
Under Test
GND
CL = 50 pF
(see Note A)
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
6V
GND
Open
500 Ω
2.7 V
Timing Input
LOAD CIRCUIT
1.5 V
0V
tw
tsu
2.7 V
Input
1.5 V
1.5 V
th
2.7 V
1.5 V
Data Input
1.5 V
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
2.7 V
1.5 V
Input
1.5 V
0V
tPLH
tPHL
VOH
1.5 V
Output
1.5 V
VOL
tPHL
1.5 V
1.5 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
1.5 V
0V
tPZL
tPLZ
3V
1.5 V
tPZH
VOH
Output
Output
Waveform 1
S1 at 6 V
(see Note B)
tPLH
1.5 V
2.7 V
Output
Control
Output
Waveform 2
S1 at GND
(see Note B)
VOL + 0.3 V
VOL
tPHZ
1.5 V
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
Figure 2. Load Circuit and Voltage Waveforms
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
CLVTH32374IGKEREP
ACTIVE
LFBGA
GKE
96
1000
TBD
SNPB
Level-3-220C-168 HR
V62/04722-01XA
ACTIVE
LFBGA
GKE
96
1000
TBD
SNPB
Level-3-220C-168 HR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74LVTH32374-EP :
• Catalog: SN74LVTH32374
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jul-2011
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
CLVTH32374IGKEREP
Package Package Pins
Type Drawing
LFBGA
GKE
96
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
1000
330.0
24.4
Pack Materials-Page 1
5.7
B0
(mm)
K0
(mm)
P1
(mm)
13.7
2.0
8.0
W
Pin1
(mm) Quadrant
24.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jul-2011
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CLVTH32374IGKEREP
LFBGA
GKE
96
1000
333.2
345.9
31.8
Pack Materials-Page 2
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