Hardware User Manual CM-BF537 V3.x Contact Bluetechnix Mechatronische Systeme GmbH Waidhausenstraße 3/19 A-1140 Vienna AUSTRIA/EUROPE [email protected] http://www.bluetechnix.com Document No.: 100-1221-3.9 Date: 2012-05-24 CM-BF537_HUM_V3.2.docx 1 Table of Contents Blackfin® Core Modules ............................................................................................................................................................................ 5 Blackfin® Development Boards ............................................................................................................................................................. 7 1 2 3 Introduction ....................................................................................................................................................................................... 8 1.1 Overview .................................................................................................................................................................................... 8 1.2 Key Features ............................................................................................................................................................................. 9 1.3 Applications.............................................................................................................................................................................. 9 General Description ......................................................................................................................................................................10 2.1 Functional Description .......................................................................................................................................................10 2.2 Boot Mode...............................................................................................................................................................................10 2.3 Memory Map ..........................................................................................................................................................................11 2.3.1 Core Module Memory ...............................................................................................................................................11 2.3.2 Externally Addressable Memory (on connector) ............................................................................................12 Specifications...................................................................................................................................................................................13 3.1 4 5 3.1.1 Operating Conditions ...............................................................................................................................................13 3.1.2 Maximum Ratings.......................................................................................................................................................13 3.1.3 ESD Sensitivity .............................................................................................................................................................14 Connector Description .................................................................................................................................................................15 4.1 Connector X1 .........................................................................................................................................................................15 4.2 Connector X2 .........................................................................................................................................................................16 Application Information ..............................................................................................................................................................18 5.1 Supply Voltage Decoupling .............................................................................................................................................18 5.2 Reset circuit ............................................................................................................................................................................18 5.3 Application Example Schematics ...................................................................................................................................19 5.3.1 6 7 Electrical Specifications......................................................................................................................................................13 RJ45 schematic ............................................................................................................................................................19 5.4 Sample Schematic ................................................................................................................................................................19 5.5 Stand-alone Ethernet based MPEG webcam .............................................................................................................20 Mechanical Outline .......................................................................................................................................................................22 6.1 Top View ..................................................................................................................................................................................22 6.2 Bottom View ...........................................................................................................................................................................22 6.3 Side View .................................................................................................................................................................................23 6.4 Footprint ..................................................................................................................................................................................24 6.5 Connectors ..............................................................................................................................................................................24 Support ..............................................................................................................................................................................................25 7.1 General Support....................................................................................................................................................................25 CM-BF537_HUM_V3.2.docx 2 7.2 Board Support Packages ...................................................................................................................................................25 7.3 Blackfin® Software Support ..............................................................................................................................................25 7.3.1 BLACKSheep® OS ........................................................................................................................................................25 7.3.2 LabVIEW .........................................................................................................................................................................25 7.3.3 uClinux ............................................................................................................................................................................25 Blackfin® Design Services ...................................................................................................................................................25 7.4 7.4.1 8 Upcoming Products and Software Releases ....................................................................................................25 Ordering Information ...................................................................................................................................................................26 8.1 9 Predefined mounting options for CM-BF537 ............................................................................................................26 Dependability ..................................................................................................................................................................................27 9.1 10 MTBF ..........................................................................................................................................................................................27 Product History ..........................................................................................................................................................................28 10.1 Version Information.............................................................................................................................................................28 10.1.1 CM-BF537-C-C-Q25S32F4 (CM-BF537E) ............................................................................................................28 10.1.2 CM-BF537-C-I-Q25S32F4 (CM-BF537E-I) ...........................................................................................................28 10.1.3 CM-BF537-C-C-Q25S64F4 (CM-BF537E-64SD) ................................................................................................28 10.2 Anomalies................................................................................................................................................................................29 11 Document Revision History ...................................................................................................................................................30 12 List of Abbreviations ................................................................................................................................................................31 A List of Figures and Tables............................................................................................................................................................32 CM-BF537_HUM_V3.2.docx 3 © Bluetechnix Mechatronische Systeme GmbH 2012 All Rights Reserved. The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights of technical change reserved. We hereby disclaim any warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Bluetechnix makes and you receive no warranties or conditions, express, implied, statutory or in any communication with you. Bluetechnix specifically disclaims any implied warranty of merchantability or fitness for a particular purpose. Bluetechnix takes no liability for any damages and errors causing of the usage of this board. The user of this board is responsible by himself for the functionality of his application. He is allowed to use the board only if he has the qualification. More information is found in the General Terms and Conditions (AGB). Information For further information on technology, delivery terms and conditions and prices please contact Bluetechnix (http://www.bluetechnix.com). Warning Due to technical requirements components may contain dangerous substances. CM-BF537_HUM_V3.2.docx 4 Blackfin® Core Modules TCM-BF518-C-C-Q25S32F2 (TCM-BF518) The Tiny Core Module TCM-BF518 is powered by Analog Devices' single core ADSP-BF518 processor; up to 400MHz, 32MB SDRAM, up to 8MB flash. The 2x60 pin expansion connectors are backwards compatible with other Core Modules. ACM-BF525C-C-C-Q25S64F4N1024 The Core Module ACM-BF525C is optimized for audio applications and performance. It is based on the high performance ADSPBF525Cfrom Analog Devices. It addresses 64MByte SDRAM via its 16bit wide SDRAM bus, has an onboard NOR-flash of 4MByte and a NAND-flash with 1024MByte. CM-BF527-C-C-Q50S32F8 (CM-BF527) The Core Module CM-BF527 is powered by Analog Devices' single core ADSP-BF527 processor; key features are USB OTG 2.0 and Ethernet. The 2x60 pin expansion connectors are backwards compatible with other Core Modules. CM-BF533-C-C-Q25S32F2 (CM-BF533) The Core Module CM-BF533 is powered by Analog Devices' single core ADSP-BF533 processor; up to 600MHz, 32MB SDRAM, 2MB flash, 2x60 pin expansion connectors at a size of 36.5x31.5mm. TCM-BF537-C-I-Q25S32F8 (TCM-BF537) The Tiny Core Module TCM-BF537 is powered by Analog Devices' single core ADSP-BF537 processor; up to 500MHz, 32MB SDRAM, 8MB flash, a size of 28x28mm, 2x60 pin expansion connectors, Ball Grid Array or Border Pads for reflow soldering, industrial temperature range -40°C to +85°C. CM-BF537-C-C-Q25S32F4 (CM-BF537E) The Core Module CM-BF537 is powered by Analog Devices' single core ADSP-BF537 processor; up to 600MHz, 32MB SDRAM, 4MB flash, integrated TP10/100 Ethernet physical transceiver, 2x60 pin expansion connectors at a size of 36.5x31.5mm. CM-BF537-C-C-Q30S32F4-U (CM-BF537U) The Core Module CM-BF537 is powered by Analog Devices' single core ADSP-BF537 processor; up to 600MHz, 32MB SDRAM, 4MB flash, integrated USB 2.0 Device, 2x60 pin expansion connectors at a size of 36.5x31.5mm. CM-BF548-C-C-Q25S64F8 (CM-BF548) The Core Module CM-BF548 is characterized by its numerous peripheral interfaces, its performance in combination with its high speed memory interface (DDR). Key features are 533MHz, 64MB DDR SD-RAM (266MHz), and 8MB flash. CM-BF561-C-C-Q25S64F8 (CM-BF561) The Core Module CM-BF561 is powered by Analog Devices' dual core ADSP-BF561 processor; up to 2x 600MHz, 64MB SDRAM, 8MB flash, 2x60 pin expansion connectors at a size of 36.5x31.5mm. eCM-BF561-C-C-Q25S128F32 (eCM-BF561) The Core Module CM-BF561 is powered by Analog Devices' dual core ADSP-BF561 processor; up to 2x 600MHz, 128MB SDRAM, 8MB flash, 2x100 pin expansion connectors and a size of 44x33mm. CM-BF537_HUM_V3.2.docx 5 Core Module naming information The idea is to put more Core Module specific technical information into the product name. New Core Module names will have following technical information covered in their names. • Product Family, • CPU-Type, • Connection-Type, • Operating Temperature Range, • Crystal Frequency [MHz], • RAM [MB], • Flash [MB], • External Controllers • o Special and/or o Former name That expands of course the name but allows the customer to get the most important Core Module specific information at the first sight. Have a look at the example below to get an idea of the new Core Module names. Example CM-BF537-C-C-Q25S32F4 (CM-BF537E) CM - BF537 - C - C - Q25 S32 F4 - - (CM-BF537E) Product Family Former name CM = Core Module Special SBC = Single Board Computer Custom Core Modules or specials CPU-Type uC = uclinux Equals the name of CPU Extra controllers mounted Connection-Type E = Ethernet A = BGA U = USB B = Border pad Flash [MB] C = Connector F = NOR Flash [MB] S = SSpecial N = NAND Flash [MB] Operating Temperature Range RAM A = Automotive (-40° to +125°) S = SDRAM [MB] C = Commercial (0° to +70°) I = Industry (-40° to +85°) Crystal Frequency Notation: QXX[MHz] CM-BF537_HUM_V3.2.docx 6 Blackfin® Development Boards ADEV-BF52xC Feature rich, low cost embedded audio development platform which supports Audio Core Modules (ACM). The form factor of the ADEV-BF52xC allows easy integration of the board into OEM products. Dedicated interfaces such as USB2.0, Line In/Out, headphone out and an onboard silicon microphone turn the ADEV-BF52xC into a fullfeatured development platform for most embedded audio applications in commercial areas. DEV-BF5xxDA-Lite Get ready to program and debug Bluetechnix Core Modules with this tiny development platform including an USBBased Debug Agent. The DEV-BF5xxDA-Lite is a low cost starter development system including a VDSP++ Evaluation Software License. DEV-BF548-Lite Low-cost development board with a socket for Bluetechnix’ CM-BF548 Core Module. Additional interfaces are available, e.g. an SD-Card, USB and Ethernet. DEV-BF548DA-Lite Get ready to program and debug Bluetechnix CM-BF548 Core Module with this tiny development platform including an USB-Based Debug Agent. The DEV-BF548DA-Lite is a low-cost starter development system including a VDSP++ Evaluation Software License. eDEV-BF5xx Feature rich, low cost rapid development platform which provides all interfaces on dedicated connectors and has all Core Module pins routed to solder pads which easily can be accessed by the developers. The eDEV-BF5xx supports the latest debugging interface from Analog Devices - ADI-SADA (Analog Devices Stand Alone Debug Agent). EVAL-BF5xx Tiny, low cost embedded platform which supports Bluetechnix powerful Blackfin® based Core Modules. The form factor (75x75mm) of the EVAL-BF5xx allows easy integration of the board into OEM products. Dedicated interfaces such as USB2.0, SD-card slot, CAN interface connectors and of course Ethernet, turn the EVAL-BF5xx into a fullfeatured evaluation platform for most embedded applications. Extender boards Extender boards (EXT-BF5xx) are expanding the development and evaluation boards by several interfaces and functionalities. Targeted application areas are: audio/video processing, security and surveillance, Ethernet access, positioning, automation and control, experimental development and measuring. Note! Bluetechnix is offering tailored board developments as well. CM-BF537_HUM_V3.2.docx 7 1 Introduction The Core-Module CM-BF537 is characterized by its field of application, performance and configuration possibility. The module integrates processor, RAM, flash, external peripheral controllers and power supply at a size of 31.5x36.5mm! It is based at the high performance ADSP-BF537 from Analog Devices. The Core-Module is designed for commercial and industrial usage (depending on temperature range). It addresses up to 64MByte SDRAM via its 16bit wide SDRAM bus, has an onboard NOR-flash of 4MByte and offers a CAN interface. In addition there is an extra Ethernet physical transceiver (10/100Mbit) onboard. 1.1 Overview The current hardware version (see Version Information) of Core Module CM-BF537-C-C-Q25S32F4 (CM-BF537E) consists of the following components. Parts of mounting options of CM-BF537 are listed in addition. 60 Pin Expansion Connector B Dynamic Core Voltage Control Low Voltage Reset ADSP BF537 up to 600 MHz Up to 64MByte SDRam Up to 8MByte Flash Ethernet Physical 60 Pin Expansion Connector A Figure 1-1: Main components of the CM-BF537 Core Module • Analog Devices Blackfin Processor BF537 o Industrial version (see chapter 8.1) ADSP-BF537SBBCZ-5A (-40° - 85°C) o • SDRAM o 32MByte SDRAM Version (see chapter 8.1) SDRAM Clock up to 133MHz MT48LC16M16A2BG-7 (16Mx16, 256Mbit at 3.3 V) o • Commercial version (see chapter 8.1) ADSP-BF537SKBCZ-6AV (0° - 70°C) 64MByte SDRAM Version(see chapter 8.1) SDRAM Clock up to 143MHz IS42S16320B-7BL (8M x16x4, 512Mbit at 3.3 V) 4 MByte of Addressable Flash o PF48F2000P0ZBQ0 (4Mx16 32Mbit at 3.3 V; default only 4MByte addressable) CM-BF537_HUM_V3.2.docx 8 o Additional flash memory can be connected through the expansion board as parallel flash using asynchronous chip select lines or as an SPI flash. • Ethernet Physical Transceiver o Micrel KSZ8041NLI • Low Voltage Reset Circuit o Resets module if power supply goes below 2.93 V for at least 140 ms • Dynamic Core Voltage Control o Core voltage is adjustable by setting software registers on the Blackfin processor o Core voltage range: 0.8 – 1.32V • Expansion Connector A o Data Bus o Address Bus o Control Signals o Power Supply o Ethernet Pins • Expansion Connector B o SPORT0 o JTAG o UART0/UART1 o CAN o TWI (I²C compatible) o SPI o PPI (Parallel Port Interface) o GPIO’s 1.2 Key Features • • • • 1.3 The CM-BF537 is very compact and measures only 36.5x31.5mm Allows quick prototyping of product that comes very close to the final design Reduces development costs, faster time to market Very cost effective for small and medium volumes Applications • • • • • • • • • • • • Robotics Video security Video surveillance Industrial distributed control Industrial factory automation Remote monitoring devices Point-of-sale terminals VoIP Biometrics/security Instrumentation Medical appliances Consumer appliances CM-BF537_HUM_V3.2.docx 9 2 General Description 2.1 Functional Description Mem. Control, Boot Mode, JTAG, Ethernet Dynamic Core Voltage Control Low Voltage Reset Clock Clock-out 16 Bit Data Bus ADSP BF537 up to 600MHz Up to 64MByte SDRam 4MByte Flash Data & Address Bus 3V3 Power , Reset Ethernet Physical 20 Bit Address Bus PPI, SPORT0, UART1, UART2, SPI, TWI, CAN, GPIO Figure 2-1: Detailed block diagram Figure 2-1 shows a detailed block diagram of the CM-BF537. Other than the SDRAM control pins the CM-BF537 has all other pins of the Blackfin processor on its two main 60 pin connectors. A special feature of the Core Module CM-BF537 is the on-board physical Ethernet transceiver from Micrel (KSZ8041NLI). Dynamic voltage control allows reducing power consumption to a minimum adjusting the core voltage and the clock frequency dynamically in accordance to the required processing power. A low voltage reset circuit guarantees a power on reset and resets the system when the input voltage drops below 2.93V. 2.2 Boot Mode By default the boot mode = 000 (BMODE2 = low, BMODE1 = low, BMODE0 = low). All BMODE pins have internal pull down resistors. Connect BMODE0 to Vcc and leave BMODE1, BMODE2 pins open for boot mode 001 equals to 8 or 16 bit PROM/FLASH boot mode, this is the default boot mode of BLACKSheep® OS. See Blackfin Datasheets or Eval/DevBoard manuals for more details. CM-BF537_HUM_V3.2.docx 10 2.3 2.3.1 Memory Map Core Module Memory Memory Type FLASH Bank0 (PF4 Flag low) FLASH Bank1 (PF4 Flag high) FLASH Bank2 (PF5 Flag low)* FLASH Bank3 (PF5 Flag high)* SD-RAM32 Start Address 0x20000000 End Address 0x201FFFFF Size 2MB 0x20000000 0x201FFFFF 2MB 0x20000000 0x201FFFFF 2MB 0x20000000 0x201FFFFF 2MB 0x00000000 0x01FFFFFF 32MB SD-RAM64 0x00000000 0x1FFFFFFF 64MB Comment 1/8 of 16MB Micron Flash, PF48F3000P0ZBQ 1/8 of 16MB Micron Flash, PF48F3000P0ZBQ 1/8 of 16MB Micron Flash, PF48F3000P0ZBQ 1/8 of 16MB Micron Flash, PF48F3000P0ZBQ 16Bit Bus, Micron MT48LC16M16A2FG 16Bit Bus, ISSI IS42S16320B-7BL Table 2-1: Memory map The maximum amount of addressable memory by a single asynchronous memory bank is 2MByte. In order to be able to use more than 2MByte on a single bank 2 GPIOs are used to select which 2MB section of flash is active in the memory window of the Blackfin processor. This frees up the remaining banks for the user. The maximum amount of memory addressable by the processor is 8MByte. *) PF5 is routed by default to the connector of the Core Module. Nevertheless this pin can be used to select bank2/3 of the flash memory. To realize this, the 0Ω resistor R18 must be removed and a 0Ω resistor R19 must be soldered to the Core Module. In this case PF5 is routed to the flash memory instead to the connector! Figure 2-2: Assembly drawing top view CM-BF537_HUM_V3.2.docx 11 2.3.2 Externally Addressable Memory (on connector) The Blackfins External Bus Interface (EBI) allows connecting devices via an asynchronous memory interface. AMS Line nAMS2 nAMS3 Start Address 0x20200000 0x20300000 End Address 0x202FFFFF 0x203FFFFF Max. Size 1MB 1MB Table 2-2: Externally addressable memory CM-BF537_HUM_V3.2.docx 12 3 Specifications 3.1 Electrical Specifications 3.1.1 Operating Conditions Symbol VIN I3V33) VOH VOL IIH IOZ IDEEPSLEEP ISLEEP IIDLE ITYP IHIBERNATE1) IRTC fCCLK 2) Parameter Input supply voltage 3.3V current High level output voltage Low level output voltage IO input current Three state leakage current VIN current in deep sleep mode VIN current in sleep mode VIN current in idle mode VIN current in with core running at 400 MHz VIN current in hibernate state at 400 MHz VRTC current Core clock frequency Min 3.0 2.8 - Typical 3.3 350 16 19.5 24 138 20 - Max 3.6 0.5 10 10 70 600 Unit V mA V V µA µA mA mA mA mA mA µA MHz Table 3-1: Electrical characteristics 1) VDDINT=1.10V @ TJ=25°C 2) Commercial grade 3) Average load @ 25°C ambient temperature 3.1.2 Maximum Ratings Stressing the device above the rating listed in the absolute maximum ratings table may cause permanent damage to the device. These are stress ratings only. Operation of the device at these or any other conditions greater than those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Symbol VIO VIN IOH /IOL TAMB TSTO TSLD φAMB Parameter Input or output voltage Input supply voltage Current per pin Ambient temperature Storage temperature Solder temperature for 10 seconds Relative ambient humidity Min -0.5 3.0 0 -40 -55 Max 3.6 5.5 10 85 150 260 90 Unit V V mA °C °C °C % Table 3-2: Absolute maximum ratings CM-BF537_HUM_V3.2.docx 13 3.1.3 ESD Sensitivity ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken to avoid performance degradation or loss of functionality. CM-BF537_HUM_V3.2.docx 14 4 Connector Description 4.1 Connector X1 Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 Signal Name RSCLK0 / TACLK2 DR0PRI / TACLK4 TSCLK0 / TACLK1 DT0PRI / SSEL2 CLKBUF SDA PF4 / TMR5 / SSEL6: MO1* NC: MO2, MO3* PF5 / TMR4 / SSEL5: MO1, MO2* NC: MO3* Vin 3V3 Vin 3V3 PG0 / PPI1D0 PG2 / PPI1D2 PG4 / PPI1D4 PG6 / PPI1D6 PG8 / PPI1D8 / DR1SEC PG10 / PPI1D10 / RSCLK1 PG12 / PPI1D12 / DR1PRI PG14 / PPI1D14 / TFS1 PPI1SY3 / PF7 / TMR2 PPI1SY1 / PF9 / TMR0 PPI1SY1 / PF9 / TMR0 PF3 / Rx1 / TMR6 / TACI6 PF1 / DMAR1 / TACI1 / Rx0 PF11 / MOSI PF13 / SCK BMODE0 GND TCK TDI TRST EMU TMS TDO BMODE2 N.C. BMODE1 PF12 / MISO PF0 / DMAR0 / Tx0 PF14 / SPI_SS PF2 / Tx1 / TMR7 PPI1Clk / PF15 / TMRCLK PPI1Sy2 / PF8 / TMR1 PG15 / PPI1D15 / DT1PRI PG13 / PPI1D13 / TSCLK1 PG11 / PPI1D11 / RFS1 CM-BF537_HUM_V3.2.docx Type I/O I I/O O O I/O I/O Function 25MHz buffered clock output I/O PWR PWR I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I - 10k pull down PWR I - 10k pull up I - 10k pull up I - 4k7 pull down O I - 10k pull up O I - 10k pull down I - 10k pull down I/O I/O I/O I/O I/O I/O I/O I/O I/O 3V3 +-10% 500mA peak for supply 3V3 +-10% 500mA peak for supply NC 15 Pin No. 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 Signal Name PG9 / PPI1D9 / DT1SEC PG7 / PPI1D7 PG5 / PPI1D5 PG3 / PPI1D3 PG1 / PPI1D1 GND GND PF5 / TMR4 / SSEL5: MO1, MO2* NC: MO3* PF6 / TMR3 / SSEL4 PF10 / SSEL1 SCL DT0SEC / SSEL7 / CANTx TFS0 / SSEL3 DR0SEC / TACI0 / RFS0 / TACLK3 Type I/O I/O I/O I/O I/O PWR PWR I/O Function I/O I/O I/O O I/O I I/O Table 4-1: Connector description X1 * For mount option details see chapter 8.1. Note 1: Pin 8 and 53 as well as pin 20 and 21 are identical. Note 2: Please mind the mounted pull up and pull down resistors on the Core Module. 4.2 Connector X2 Pin No. 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 Signal Name A1 A3 A5 A7 A9 A11 A13 A15 A17 A19 ABE1/SDQM1 LED_ACT GND RX+ RXADRY BG CLK_OUT GND AMS3 AWE NMI D0 D2 D4 CM-BF537_HUM_V3.2.docx Type O O O O O O O O O O O O I – 47R pull up to 3V3 I – 47R pull up to 3V3 I - 10k pull up O O PWR O O I - 10k pull up I/O I/O I/O Function Address Bus Address Bus Address Bus Address Bus Address Bus Address Bus Address Bus Address Bus Address Bus Address Bus Indicates Ethernet activity AGND use as GND for Ethernet Ethernet receive + Ethernet receive - CLKOUT Pin of Blackfin Data Bus Data Bus Data Bus 16 Pin No. 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 Signal Name D6 D8 D10 D12 D14 D15 D13 D11 D9 D7 D5 D3 D1 RESET AOE ARE AMS2 VDD-RTC BGH BR VA33 Type I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I – see chapter 5.2 O O O PWR O I - 10k pull up PWR 107 108 109 110 TXTX+ NC LED_SPEED O - 47R pull up to 3V3 O - 47R pull up to 3V3 111 112 113 114 115 116 117 118 119 120 ABE0/SDQM0 A18 A16 A14 A12 A10 A8 A6 A4 A2 O O O O O O O O O O O Function Data Bus Data Bus Data Bus Data Bus Data Bus Data Bus Data Bus Data Bus Data Bus Data Bus Data Bus Data Bus Data Bus Ethernet transformer reference Ethernet transmit Ethernet transmit + voltage Full duplex LED, High = Full duplex active, Low = inactive Address Bus Address Bus Address Bus Address Bus Address Bus Address Bus Address Bus Address Bus Address Bus Table 4-2: Connector description X2 Note: Please mind the mounted pull up and pull down resistors on the Core Module. CM-BF537_HUM_V3.2.docx 17 5 Application Information 5.1 Supply Voltage Decoupling For a better stability we recommend to add a 100nF capacitor for each power supply pin and a 47uF tantalum capacitor to the VIN voltage rail next to the module. 5.2 Reset circuit The reset of the flash and the processor are connected to a power monitoring IC. The output can be used as power on reset for external devices, see Figure 5-1. Figure 5-1: Schematic of reset circuit on the Core Module CM-BF537_HUM_V3.2.docx 18 5.3 5.3.1 Application Example Schematics RJ45 schematic Figure 5-2: Schematic for RJ45 Connection Designator X1 C1 R8, R9 V1, V2 Value Type RJLBC-060TC1 10uF 220R USBLC6-2P6 Description RJ45 with transformer 1:1 Capacitor Resistor TSV-Diode Quantity 1 1 2 2 Table 5-1: Parts List RJ45 5.4 Sample Schematic In this minimum configuration the CM-BF537 is used as a high performance network connected processor module. CM-BF537_HUM_V3.2.docx 19 Figure 5-3: Configuration with Ethernet and JTAG Connector Designator C1, C2, C4 C3, C5 CM1 X1 X2 X3 R3 R8, R9 S1 U1 Value 1uF 10uF Type DC-8 RJLBC-060TC1 4k7 220R ADP3338 Description Capacitor Capacitor CM-BF537 Power connector DC-8 RJ45 with transformer Header, 7-Pin, dual row Resistor Resistor Switch Low dropout regulator Quantity 3 1 1 1 1 1 1 2 1 1 Table 5-2: Bill of Material of sample circuit 5.5 Stand-alone Ethernet based MPEG webcam The CM-BF537 module can be used as a stand-alone module for a camera system requiring only power supply and the direct attachment of a compatible video camera. An extender board including a camera is available at Bluetechnix (EXT-BF5xx-CAM). CM-BF537_HUM_V3.2.docx 20 Figure 5-4: Stand-alone Ethernet based MPEG webcam Designator C3, C4, C5, C6, C8 C7, C9 Cam1 CM1 DS1 X1 X2 R1,R3 R7, R8, R9 S1, S2 U1 Value 1uF 10uF Type ADP3338 Description Capacitor Capacitor Camera module CM-BF537 SMD LED Power connector DC-8 RJ45 with transformer Resistor Resistor Switch Low dropout regulator Quantity 6 1 1 1 1 1 1 3 2 1 1 XC6204B252MR XC6204B182MR XC6204 high speed LDO XC6204 high speed LDO 1 1 OV7660FSx green DC-8 HFJ11-2250E 10k 220R U2 U3 Table 5-3: Bill of Materials of a Stand-alone Ethernet based MPEG Webcam Have a look at our DEV-BF5xxDA-lite schematics, which can be found at http://www.bluetechnix.com/goto/dev-bf5xxda-lite to get application examples. CM-BF537_HUM_V3.2.docx 21 6 Mechanical Outline 6.1 Top View Figure 6-1 shows the bottom view of the CM-BF537. All dimensions are given in millimeters. Figure 6-1: Mechanical outline (top view) 6.2 Bottom View Figure 6-2 shows the bottom view of the CM-BF537. All dimensions are given in millimeters. CM-BF537_HUM_V3.2.docx 22 Figure 6-2: Mechanical outline and Bottom Connectors (Top View) 6.3 Side View Figure 6-3 shows the side view of the CM-BF537. All dimensions are given in millimeters. 31.0 36.0 2.0 1.1 2.45 24.5 5.7 5.7 Figure 6-3: Side view with mounted connectors The total minimum mounting height including receptacle at the motherboard is 6.1mm. CM-BF537_HUM_V3.2.docx 23 6.4 Footprint h1 Hole1 Hole2 Hole1 Hole2 h2 Figure 6-4: Recommended footprint for the Core Module (top view) The footprint of the CM-BF537 is available on request. The used connectors can be found in Table 6-1. For detailed dimensions of the connectors please see the datasheet from the manufacturer’s website. 6.5 Connectors The Core Module features a Hirose 0.6mm pitch connectors. The base board has to use the complementary connector. Board Core Module Base board Designator X1, X2 X1, X2 Manufacturer Hirose Hirose Manufacturer Part No. FX8-60P-SV FX8-60S-SV Table 6-1: Core Module connector types CM-BF537_HUM_V3.2.docx 24 7 Support 7.1 General Support General support for products can be found at Bluetechnix’ support site https://support.bluetechnix.at/wiki 7.2 Board Support Packages Board support packages and software only https://support.bluetechnix.at/software/ 7.3 7.3.1 downloads are for registered customers Blackfin® Software Support BLACKSheep® OS BLACKSheep® OS stands for a powerfully and multithreaded real-time operating system (RTOS) originally designed for digital signal processing application development on Analog Devices Blackfin® embedded processors. This highperformance OS is based on the reliable and stable real-time VDK kernel from Analog Devices that comes with VDSP++ IDE. Of course BLACKSheep® OS is fully supported by all Bluetechnix Core-Modules and development hardware. 7.3.2 LabVIEW You can get LabVIEW embedded AG http://www.schmid-engineering.ch. 7.3.3 support for Bluetechnix Core Modules by Schmid-Engineering uClinux You can get uClinux support (boot loader and uClinux) for Bluetechnix Core Modules at http://blackfin.uClinux.org. 7.4 Blackfin® Design Services Based on more than seven years of experience with Blackfin, Bluetechnix offers development assistance as well as custom design services and software development. 7.4.1 Upcoming Products and Software Releases Keep up to date with all at http://www.bluetechnix.com. CM-BF537_HUM_V3.2.docx product changes, releases and software updates of Bluetechnix 25 8 Ordering Information CM - BF537 - C - C/I - Q25 S32/64 F4 - - (CM-BF537E) Product Family Former name CM = Core Module Special SBC = Single Board Computer Custom Core Modules or specials CPU-Type uC = uclinux Equals the name of CPU Extra controllers mounted Connection-Type E = Ethernet A = BGA U = USB B = Border pad Flash [MB] C = Connector F = NOR Flash [MB] S = Special N = NAND Flash [MB] Operating Temperature Range RAM A = Automotive S = SDRAM [MB] C = Commercial I = Industry Crystal Frequency Notation: QXX[MHz] 8.1 Predefined mounting options for CM-BF537 Article Number 100-1221-3 100-1229-3 100-1273-3 Name CM-BF537-C-C-Q25S32F4 (CM-BF537E) CM-BF537-C-I-Q25S32F4 (CM-BF537E-I) CM-BF537-C-C-Q25S64F4 (CM-BF537E-64SD) Temperature Range Commercial Industrial Commercial Table 8-1: Ordering information NOTE: Custom Core Modules are available on request! Please contact Bluetechnix ([email protected]) if you are interested in custom Core Modules. The mount options of the Core Module CM-BF537 are shown in Table 8-2. Mount Option MO1 MO2 MO3 Flash 2MB 4MB 8MB Comment PF4 available on pin 7 on connector X1 default PF5 not available on connector X1 Table 8-2: Mount options CM-BF537_HUM_V3.2.docx 26 9 Dependability 9.1 MTBF Please keep in mind that a part stress analysis would be the only way to obtain significant failure rate results, because MTBF numbers just represent a statistical approximation of how long a set of devices should last before failure. Nevertheless, we can calculate an MTBF of the Core Module using the bill of material. We take all the components into account. The PCB and solder connections are excluded from this estimation. For test conditions we assume an ambient temperature of 30°C of all Core Module components except the Blackfin® processor (80°C) and the memories (70°C). We use the MTBF Calculator from ALD (http://www.aldservice.com/) and use the reliability prediction MIL-217F2 Part Stress standard. This method resulted in a MTBF of 439232 hours for the CM-BF537E. CM-BF537_HUM_V3.2.docx 27 10 Product History 10.1 Version Information 10.1.1 CM-BF537-C-C-Q25S32F4 (CM-BF537E) Version 3.0.1 3.0.2 3.0.3 3.2.1 Component Type Processor ADSP-BF537KBCZ-6AV (Rev 0.3) RAM MT48LC16M16A2BG-75IT:D Flash PF48F2000P0ZBQ0 ETH-Physical KSZ8041 Processor ADSP-BF537KBCZ-6AV (Rev 0.3) RAM IS42S16160D-7BL Flash PF48F2000P0ZBQ0 ETH-Physical KSZ8041 Processor ADSP-BF537KBCZ-6AV (Rev 0.3) RAM IS42S16160D-7BL Flash PF48F3000P0ZBQ0A ETH-Physical KSZ8041 Processor ADSP-BF537KBCZ-6AV (Rev 0.3) MT48LC16M16A2BG-75IT:D RAM PF48F3000P0ZBQE Flash KSZ8041 ETH-Physical Table 10-1: Overview CM-BF537-C-C-Q25S32F4 product changes 10.1.2 CM-BF537-C-I-Q25S32F4 (CM-BF537E-I) Version 3.0.1 3.0.2 3.2.1 Component Type Processor ADSP-BF537BBCZ-5A (Rev 0.2) RAM MT48LC16M16A2BG-75IT:D Flash PF48F2000P0ZBQ0 ETH-Physical KSZ8041 Processor ADSP-BF537BBCZ-5A (Rev 0.3) MT48LC16M16A2BG-75IT:D RAM Flash PF48F2000P0ZBQ0 ETH-Physical KSZ8041 Processor ADSP-BF537BBCZ-5A (Rev 0.3) RAM MT48LC16M16A2BG-75IT:D Flash PF48F3000P0ZBQE ETH-Physical KSZ8041 Table 10-2: Overview CM-BF537-C-I-Q25S32F4 product changes 10.1.3 CM-BF537-C-C-Q25S64F4 (CM-BF537E-64SD) Version 3.2.1 Component Processor RAM Flash Type ADSP-BF537KBCZ-6AV (Rev 0.3) IS42S16320B-7BL PF48F3000P0ZBQE KSZ8041 Table 10-3: Overview CM-BF537-C-C-Q25S64F4 product changes CM-BF537_HUM_V3.2.docx 28 10.2 Anomalies Version 3.2 3.0 Date 2011 04 27 2010 10 12 CM-BF537_HUM_V3.2.docx Description No anomalies reported yet. No anomalies reported yet. Table 10-4: Overview product anomalies 29 11 Document Revision History Version 9 8 Date 2012 05 24 2012 02 07 7 6 5 4 2011 11 14 2011 10 18 2011 09 06 2011 04 27 3 2 1 2010-02-02 2009-11-05 2009-08-31 CM-BF537_HUM_V3.2.docx Document Revision Description of Pin 78 and Pin 5 of Core Module corrected Dependability added Memory table update, description for PF5 added Pin out and connector description corrected Table 3-1: Electrical characteristics update Pin out and connector description corrected Updated HUM to current design. Added industrial version and 64MByte version to this HUM. Redesign of Manual Picture 3-7, 6-1, 6-2, Table 6-1, 6-2 updated First release V1.0 of the document copied from CM-BF537 V1.2 and updated to Revision 3.0 Table 11-1: Revision history 30 12 List of Abbreviations Abbreviation ADI AI AMS AO CM DC DSP eCM EBI ESD GPIO I I²C I/O ISM LDO MTBF NC NFC O OS PPI PWR RTOS RFU SADA SD SoC SPI SPM SPORT TFT TISM TSC UART USB USBOTG ZIF Description Analog Devices Inc. Analog Input Asynchronous Memory Select Analog Output Core Module Direct Current Digital Signal Processor Enhanced Core Module External Bus Interface Electrostatic Discharge General Purpose Input Output Input Inter-Integrated Circuit Input/Output Image Sensor Module Low Drop-Out regulator Mean Time Between Failure Not Connected NAND Flash Controller Output Operating System Parallel Peripheral Interface Power Real-Time Operating System Reserved for Future Use Stand Alone Debug Agent Secure Digital System on Chip Serial Peripheral Interface Speech Processing Module Serial Port Thin-Film Transistor Tiny Image Sensor Module Touch Screen Controller Universal Asynchronous Receiver Transmitter Universal Serial Bus USB On The Go Zero Insertion Force Table 12-1: List of abbreviations CM-BF537_HUM_V3.2.docx 31 A List of Figures and Tables Figures Figure 1-1: Main components of the CM-BF537 Core Module ...............................................................................................................8 Figure 2-1: Detailed block diagram................................................................................................................................................................ 10 Figure 2-2: Assenbly drowing top view ........................................................................................................................................................ 11 Figure 5-1: Schematic of reset circuit on the Core Module .................................................................................................................. 18 Figure 5-2: Schematic for RJ45 Connection ................................................................................................................................................ 19 Figure 5-3: Configuration with Ethernet and JTAG Connector ........................................................................................................... 20 Figure 5-4: Stand-alone Ethernet based MPEG webcam....................................................................................................................... 21 Figure 6-1: Mechanical outline (top view) ................................................................................................................................................... 22 Figure 6-2: Mechanical outline and Bottom Connectors (Top View) ................................................................................................ 23 Figure 6-3: Side view with mounted connectors ...................................................................................................................................... 23 Figure 6-4: Recommended footprint for the Core Module (top view) ............................................................................................. 24 Tables Table 2-1: Memory map...................................................................................................................................................................................... 11 Table 2-2: Externally addressable memory ................................................................................................................................................. 12 Table 3-1: Electrical characteristics ................................................................................................................................................................ 13 Table 3-2: Absolute maximum ratings.......................................................................................................................................................... 13 Table 4-1: Connector description X1 ............................................................................................................................................................. 16 Table 4-2: Connector description X2 ............................................................................................................................................................. 17 Table 5-1: Parts List RJ45 .................................................................................................................................................................................... 19 Table 5-2: Bill of Material of sample circuit ................................................................................................................................................. 20 Table 5-3: Bill of Materials of a Stand-alone Ethernet based MPEG Webcam ............................................................................... 21 Table 6-1: Core Module connector types..................................................................................................................................................... 24 Table 8-1: Ordering information ..................................................................................................................................................................... 26 Table 8-2: Mount options................................................................................................................................................................................... 26 Table 10-1: Overview CM-BF537-C-C-Q25S32F4 product changes................................................................................................... 28 Table 10-2: Overview CM-BF537-C-I-Q25S32F4 product changes .................................................................................................... 28 Table 10-3: Overview CM-BF537-C-C-Q25S64F4 product changes................................................................................................... 28 Table 10-4: Overview product anomalies .................................................................................................................................................... 29 Table 11-1: Revision history .............................................................................................................................................................................. 30 Table 12-1: List of abbreviations ..................................................................................................................................................................... 31 CM-BF537_HUM_V3.2.docx 32