Freescale Semiconductor Data Sheet: Advance Information Document Number: MMA955xL Rev. 1, 10/2011 An Energy Efficient Solution by Freescale Intelligent Motion-Sensing Platform MMA955xL The MMA955xL device is a member of Freescale’s Xtrinsic family of intelligent sensor platforms. This device incorporates dedicated accelerometer MEMS transducers, signal conditioning, data conversion, and a 32-bit programmable microcontroller. Top and bottom view This unique blend transforms Freescale’s MMA955xL into an intelligent, highprecision, motion-sensing platform able to manage multiple sensor inputs. This device can make system-level decisions required for sophisticated applications such as gesture recognition, pedometer functionality, tilt compensation and calibration, and activity monitoring. The MMA955xL device is programmed and configured with the CodeWarrior Development Studio for Microcontrollers software, version 10.1 or later. This standard integrated design environment enables customers to quickly implement custom algorithms and features to exactly match their application needs. 16-pin LGA 3 mm x 3 mm x 1 mm Case 2094-01 Using the master I2C port, the MMA955xL device can manage secondary sensors, such as pressure sensors, magnetometers, or gyroscopes. This allows sensor initialization, calibration, data compensation, and computation functions to be off-loaded from the system application processor. The MMA955xL device also acts as an intelligent sensing hub and a highly configurable decision engine. Total system power consumption is significantly reduced because the application processor stays powered down until absolutely needed. VDDA VSSA 1 BKGD-MS /RGPIO9 RESETB 3 2 4 13 RGPIO7/AN1/ TPMCH1 12 RGPIO6/AN0 TPMCH0 11 RGPIO5/PDB_A/ INT_O 10 VSS 5 7 8 RGPIO3/SDA1/SSB 9 RGPIO4/INT 6 SDA0/RGPIO1/SDI SCL0/RGPIO0 SCLK VSS This document contains information on a new product. Specifications and information herein are subject to change without notice. © 2011 Freescale Semiconductor, Inc. All rights reserved. RGPIO8/PDB_B 16 15 14 VDD RGPIO2/SCL1/SDO Hardware Features • Three accelerometer operating ranges: – ±2g suits most hand gestures (orientation detection and tit control) and freefall. For tap detection, ±4g and ±8g are supported. – ±4g covers most regular human dynamics (walking and jogging) – ±8g detects most abrupt activities (gaming) • Integrated temperature sensor • One slave SPI or I2C interface operating at up to 2 Mbps, dedicated to communication with host processor. Default value of the I2C, 7-bit address is 0x4C. (This can be customized by firmware.) • One master I2C interface operating at up to 400 kbps that can be used to communicate with external sensors • Eight selectable output data rates (ODR), from 488 Hz to 3.8 Hz • 10, 12, 14, and 16-bit trimmed ADC data formats available • 1.8V supply voltage • 32-bit ColdFire V1 CPU with MAC unit • Extensive set of power-management features and low-power modes • Integrated ADC can be used to convert external analog signals • Single-Wire, Background-Debug Mode (BDM) pin interface • 16-KB flash memory • 2-KB Random Access Memory • ROM-based flash controller and slave-port, command-line interpreter • Two-channel timer with input capture, output capture, or edge-aligned PWM • Programmable delay block for scheduling events relative to start of frame • A 16-bit, modulo timer for scheduling periodic events • Minimal external component requirements • RoHS compliant (-40 to +85ºC), 16-pin, 3 x 3 x 1-mm LGA package Top view Pin connections Software Features This device can be programmed to provide any of the following: • Orientation detection (portrait/landscape) • High-g/Low-g threshold detection • Pulse detection (single, double and directional tap) • Tilt detection • Auto wake/sleep • Embedded, smart FIFO • Power management • Pedometer A selection of the software features are included in the factory-programmed firmware for some devices. Users may add their own features with user firmware.The power and flexibility of the embedded ColdFire V1 MCU core has new and unprecedented capabilities. Table 1. Ordering information Part number Firmware Temperature range Package description Shipping MMA9550LT Motion -40°C to +85°C LGA-16 Tray MMA9550LR1 Motion -40°C to +85°C LGA-16 Tape and reel MMA9551LT Gesture -40°C to +85°C LGA-16 Tray MMA9551LR1 Gesture -40°C to +85°C LGA-16 Tape and reel MMA9553LR1 Pedometer -40°C to +85°C LGA-16 Tape and reel MMA 9559LR1 Foundation -40°C to +85°C LGA-16 Tape and reel MMA955xL 2 Sensors Freescale Semiconductor, Inc. Contents 1 2 3 4 5 6 Variations of MMA955xL Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Typical Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.1. . Functional Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.2. . Packaging Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.2.1 Package diagrams. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.2.2 Sensing Direction and Output Response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.2.3 Pin Functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.3. . Pin Function Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.4. . System Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.4.1 Power Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.4.2 Layout Recommendations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.4.3 MMA955xL Platform as an Intelligent Slave . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.4.4 MMA955xL Platform as a Sensor Hub . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.1. . Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.2. . Pin Groups . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.3. . Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.4. . Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.5. . Electrostatic Discharge (ESD) and Latch-up Protection Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.6. . General DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.7. . Supply Current Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 4.8. . Accelerometer Transducer Mechanical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 4.9. . Temperature Sensor Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4.10. ADC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4.11. ADC Sample Rates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4.12. AC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 4.13. General Timing Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 4.14. I2C Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 4.14.1 Slave I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 4.14.2 Master I2C Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 4.15. Slave SPI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 4.16. Flash Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Related Documentation The MMA955xL device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the Freescale homepage at: 2. 3. In the Keyword search box at the top of the page, enter the device number MMA955xL. In the Refine Your Result pane on the left, click on the Documentation link. http://www.freescale.com/ MMA955xL 3 Sensors Freescale Semiconductor, Inc. 1 Variations of MMA955xL Device Freescale offers a variety of firmware versions for the MMA955xL devices. The different versions of the device are identified by the fourth digit in the part number (for example MMA9559). Information and specifications provided in this data sheet are independent of the Freescale firmware versions. The following table lists some of the variations among the MMA955xL-platform devices. Table 2. Features of product-line devices Feature - Device MMA9550L MMA9551L MMA9553 MMA9559L Motion sensing Gesture sensing Pedometer High flexibility User flash available 6.5 KB 4.5 KB 1.5K 14 KB User RAM available 576 bytes 452 bytes 200 bytes 1664 bytes Key elements Digital resolution (bits) G measurement ranges 10,12,14,16 bits 10,12,14,16 bits 10,12,14,16 bits 10,12,14,16 bits 2g, 4g, 8g 2g, 4g, 8g 2g, 4g, 8g 2g, 4g, 8g Real-time and preemptive scheduling Yes Yes Yes No Event management No No No Yes • Normal mode Yes Yes Yes No • Legacy mode Yes Yes Yes No • Streaming mode Yes Yes Yes No • 100-Hz BW anti-aliasing Yes Yes Yes No • 50-Hz BW anti-aliasing Yes Yes Yes No • g-mode-dependent resolution Yes Yes Yes Yes • Absolute value Yes Yes Yes No • Low-pass filter Yes Yes Yes No • High-pass filter Yes Yes Yes No • Data-ready interrupt Yes Yes Yes Yes • High g/Low g No Yes No No • Tilt No Yes No No • Portrait/Landscape No Yes No No • Programmable orientation No Yes No No • Tap/Double-tap No Yes No No • Freefall No Yes No No • Motion No Yes No No Slave Port Command Interpreter Front-end processing Gesture applications MMA955xL 4 Sensors Freescale Semiconductor, Inc. Table 2. Features of product-line devices (Continued) Feature - Device MMA9550L MMA9551L MMA9553 MMA9559L • Data FIFO Yes Yes Yes No • Event queue Yes Yes Yes No • Inter-process FIFO No No No Yes • Run and Stop on idle Yes Yes Yes Yes • Run and No stop Yes Yes Yes Yes • Stop NC Yes Yes Yes Yes • Auto-Wake / Auto-Sleep / Doze Yes Yes Yes No Yes Yes • Step count No No Yes No • Distance No No Yes No • Adaptive distance No No Yes No • Activity monitor No No Yes No Data-storage modules Power-control module Data-management daemons Yes Pedometer applications The only difference between the various device configurations is the firmware content that is loaded into the flash memory at the factory. The user still can add custom software using the remaining portion of flash memory. The MMA9550, MMA95501, and MMA95503 devices can function immediately as they are. They have an internal command interpreter and applications scheduler and can interact directly with the users’ host system. The MMA9559 device provides the most flexibility and is for users who need to design their own control loop and system. The device needs to be programmed with custom user code. MMA955xL Sensors Freescale Semiconductor, Inc. 5 2 Typical Applications This low-power, intelligent sensor platform is optimized for use in portable and mobile consumer products such as: • Mobile phones/PMP/PDA/digital cameras – Orientation detection (portrait/landscape) – Image stability – Tilt control enabled with higher resolution – Gesture recognition – Tap to control – Auto wake/sleep for low power consumption • Smartbooks/ereaders/netbooks/laptops – Anti-theft – Freefall detection for hard-disk drives – Orientation detection – Tap detection • Pedometers • Gaming and toys • Activity monitoring in medical applications • Security – Anti-theft – Shock detection – Tilt • Fleet monitoring, tracking – Dead reckoning – System auto-wake on movement – Detection – Shock recording – Anti-theft • Power tools and small appliances – Tilt – Safety shut-off MMA955xL 6 Sensors Freescale Semiconductor, Inc. 3 General Description 3.1 Functional Overview The MMA955xL device consists of a 3-axis, MEMS accelerometer and a mixed-signal ASIC with an integrated, 32-bit CPU. The mixed-signal ASIC can be utilized to measure and condition the outputs of the MEMS accelerometer, internal temperature sensor, or a differential analog signal from an external device. These measured values can be read via the slave I2C or SPI port or utilized internally within the MMA955xL platform. INT_ O 2 I C slave INTC RESET BDM BKGD SIM SPI slave INT DBG X axis Y axis Z axis 512 KB x 32 RAM VDD VSS VSS SDA0/RGPIO1/SDI RGPIO2/SCL1/SDO Temp Sensor C to V ADC 4 KB x 32 Flash SCL0/RGPIC0/SCLK Analog Front End (AFE) V1 ColdFire Core with MAC 1 KB x 32 ROM SCLK SDI SDO SSB AN0 AN1 RGPIO3/SDA1/SSB RGPIO CLKGEN Control and mailbox SCL0 SDA0 RGPIO4/INT RGPIO5/PDB_A/INT_O RGPIO6/AN0/TPMCH0 2 I C Master SCL1 SCL0 RGPIO7/AN1/TPMCH1 RGPIO8/PDB_B Programmable delay block PDB_A PDB_B BKGD/MS/RPGPIO9 Two-channel, 16-bit TPMCH0 Timer / PWM module TPMCH1 VDDA 16-bit Modulo timer module VSSA Figure 1. Platform block diagram(1) 1. Preliminary data for memory sizes. A block level view of is shown in the preceding figure and can be summarized at a high level as an analog/mixed-mode subsystem associated with a digital engine: • The analog sub-system is composed of: – A 3-axis transducer that is an entirely passive block including the MEMS structures. – An Analog Front End (AFE) with the following: • A capacitance-to-voltage converter (C to V) • An analog-to-digital converter • A temperature sensor • The digital sub-system is composed of: – The 32-bit, ColdFire V1 CPU with a Background-Debug Module (BDM) – Memory: RAM, ROM, and flash – Rapid GPIO (RGPIO) port-control logic – Timer functions include: • Modulo timer module (MTIM16) • Programmable Delay Timer (PDB) MMA955xL Sensors Freescale Semiconductor, Inc. 7 – – – – • General-Purpose Timer/PWM Module (TPM) I2C master interface I2C or SPI slave interface System Integration Module (SIM) Clock-Generation Module The slave interfaces (either SPI or I2C) operate independently of the CPU subsystem. They can be accessed at any time, including while the device is in low-power, deep-sleep mode. 3.2 Packaging Information The package pinout definition for this device is designed as a super set of functions found typically on Freescale’s ColdFire V1 CPU offering, as well as other competitive devices. All pins on the device are utilized and many are multiplexed. The following sections describe the pinout. Users can select from multiple pin functions via the SIM pin, mux-control registers. VDDA RGPIO8/PDB_B Package diagrams VSSA 3.2.1 Z 16 15 14 VDD 1 13 RGPIO7/AN1/TPMCH1 BKGD-MS/RGPIO9 2 12 RGPIO6/AN0/TPMCH0 RESETB 3 11 RGPIO5/PDB_A/INT_O SCL0/RGPIO0/SCLK 4 10 VSS VSS 5 6 7 8 SDA0/RGPIO1/SDI RGPIO2/SCL1/SDO RGPIO3/SDA1/SSB 9 RGPIO4/INT 1 X Y (TOP VIEW) Direction of the detectable accelerations Figure 2. Device pinout (top view) and package frame convention MMA955xL 8 Sensors Freescale Semiconductor, Inc. Pin 16 Pin 1 ID Pin 1 Package pad size 0.24mm x 0.35 mm Figure 3. Package bottom view PCB land extension From the edge of the package PCB land pad PCB pad distance to package edge Package size (Measurements in mm) Figure 4. Package overlaid on PCB footprint diagram (top view) MMA955xL Sensors Freescale Semiconductor, Inc. 9 PCB land pad size 0.65 mm x 0.25 mm Solder mask opening 0.777 mm x 1.377 mm (PCB land + 0.0637 mm larger all around. Remove slivers between pads.) Stencil opening 0.62 mm x 0.22 mm (PCB land - 0.015 mm smaller all around) Figure 5. Recommended PCB footprint MMA955xL 10 Sensors Freescale Semiconductor, Inc. 3.2.2 Sensing Direction and Output Response The following figure shows the device’s default sensing direction when measuring gravity in a static manner. Also included are the standard abbreviations or names for the six different orientation modes: portrait up/down, landscape left/right and back/front. Top View PU Pin 1 Gravity Side View LL LR Xout @ 0g Yout @ -1g Zout @ 0g BACK Xout @ 0g Yout @ 0g Zout @ -1g PD Xout @ -1g Yout @ 0g Zout @ 0g Xout @ 1g Yout @ 0g Zout @ 0g FRONT Xout @ 0g Yout @ 0g Zout @ 1g Xout @ 0g Yout @ 1g Zout @ 0g Figure 6. Sensing direction and output response 3.2.3 Pin Functions The following table summarizes functional options for each pin on this device. Table 3. Pin functions Pin # Pin Function #1(1) 2 BKGD/MS SCL0 RGPIO0 Description Digital power supply Background-debug / Mode select / RGPIO9 RESETB(2) Active-low reset SCLK VSS 5 Serial clock for slave I2C / RGPIO0 / Serial clock for slave SPI Digital ground 6 SDA0 RGPIO1 SDI Serial data for slave I2C / RGPIO1 / SPI serial data input 7 RGPIO2 SCL1 SDO RGPIO2 / Serial clock for master I2C / SPI serial data output 8(3) RGPIO3 SDA1 SSB RGPIO3 / Serial data for master I2C / SPI slave select 9 RGPIO4 10 INT RGPIO4 / Interrupt input RESERVED (Connect to VSS) (Must be grounded externally.) 11 RGPIO5 PDB_A INT_O 12 RGPIO6 AN0 TPMCH0 RGPIO6 / ADC Input 0 / TPM Channel 0 13 RGPIO7 AN1 TPMCH1 RGPIO7 / ADC Input 1 / TPM Channel 1 VDDA Analog power RGPIO8 PDB_B RGPIO8 / PDB_B 14 15 16 1. 2. 3. Pin Function #3 RGPIO9 3 4 Pin Function #2 VDD 1 VSSA RGPIO5 / PDB_A / INT_O slave-port interrupt output Analog ground Pin function #1 represents the reset state of the hardware. Pin functions can be changed via the SIM pin, mux-control registers in Freescale or user firmware. RESETB is an open-drain, bidirectional pin. Reset must be pulled high at startup. After startup, Reset may be asserted to reset the device. RGPIO3/SDA1/SSB = Low at startup selects SPI. High at startup selects I2C. This is a function of the application boot code, not of the hardware. MMA955xL Sensors Freescale Semiconductor, Inc. 11 3.3 Pin Function Descriptions This section provides a brief description of the various pin functions available on the MMA955xL platform. Ten of the device pins are multiplexed with Rapid GPIO (RGPIO) functions. The “Pin Function #1” column in Table 3 on page 11 lists which function is active when the hardware exits the reset state. Freescale or user firmware can use the pin mux-control registers in the System Integration Module (SIM) to change pin assignments for each pin after reset. For detailed information about these registers, see the MMA955xL Three-Axis Accelerometer Reference Manual (MMA955xLRM). VDD and VSS: Digital power and ground. VDD is nominally 1.8V. VDDA and VSSA: Analog power and ground. VDDA is nominally 1.8V. To optimize performance, the VDDA line can be filtered to remove any digital noise that can be present on the 1.8V supply. (See Figure 5 and Figure 6 on page 17.) RESETB: The RESETB pin is an open-drain, bidirectional pin with an internal, weak, pullup resistor. At start up, it is configured as an input pin, but also can be programmed to become bidirectional. Using this feature, the MMA955xL device can reset external devices for any purpose other than power-on reset. Reset must be pulled high at startup. After startup, Reset may be asserted to reset the device. The total external capacitance to ground has to be limited when using RESETB-pin, output-drive capability. For more details, see the “System Integration Module” chapter of the MMA955xL Three-Axis Accelerometer Reference Manual (MMA955xLRM). Slave I2C port: SDA0 and SCL0: These are the slave-I2C data and clock signals, respectively. The MMA955xL device can be controlled via the serial port or via the slave SPI interface. Master I2C: SDA1 and SCL1: These are the master-I2C clock and data signals, respectively. Analog-to-Digital Conversion: AN0, AN1: The on-chip ADC can be used to perform a differential, analog-to-digital conversion based on the voltage present across pins AN0(-) and AN1(+). Conversions for these pins are at the same Output Data Rate (ODR) as the MEMS transducer signals. Input levels are limited to 1.8V differential. Rapid General Purpose I/O: RGPIO[9:0]: The ColdFire V1 CPU has a feature called Rapid GPIO (RGPIO). This is a 16-bit, input/output port with single-cycle write, set, clear, and toggle functions available to the CPU. The MMA955xL device brings out the lower 10 bits of that port as pins of the device. Interrupts: INT: This input pin can be used to wake the CPU from a deep-sleep mode. It can be programmed to trigger on either rising or falling edge, or high or low level. This pin operates as a Level-7 (high-priority) interrupt. Debug/Mode Control: BKGD/MS: At start up, this pin operates as mode select. If this pin is pulled high during start up, the CPU will boot normally and run code. If this pin is pulled low during start up, the CPU will boot into active Background-Debug Mode (BDM). In BDM, this pin operates as a bidirectional, single-wire, background-debug port. It can be used by development tools for downloading code into on-chip RAM and flash and to debug that code. Timer: PDB_A and PDB_B: These are the two outputs of the programmable delay block. Slave SPI Interface: SCLK, SDI, SDO and SSB: These pins control the slave SPI clock, data in, data out, and slave-select signals, respectively. The MMA955xL platform can be controlled via this serial port or via the slave-I2C interface. SBB has a special function at startup that selects the Slave interface mode. Low at startup selects SPI and high selects I2C. INT_O: The slave-port output interrupt pin. This pin can be used to flag the host when a response to a command is available to read on the slave port. TPMCH0 and TPMCH1: The I/O pin associated with 16-bit, TPM channel 0 and 1. 3.4 System Connections 3.4.1 Power Sequencing An internal circuit powered by VDDA provides the device with a power-on-reset signal. In order for this signal to be properly recognized, it is important that VDD is powered up before or simultaneously with VDDA. The voltage potential between VDD and VDDA must not be allowed to exceed the value specified in Table 7 on page 17. 3.4.2 • • • • Layout Recommendations Provide a low-impedance path from the board power supply to each power pin (VDD and VDDA) on the device and from the board ground to each ground pin (VSS and VSSA). Place 0.01 to 0.1-µF capacitors as close as possible to the package supply pins to meet he minimum bypass requirement. The recommended bypass configuration is to place one bypass capacitor on each of the VDD/VSS pairs. VDDA/VSSA. ceramic and tantalum capacitors tend to provide better tolerances. Ensure that capacitor leads and associated printed-circuit traces that connect to the chip VDD and VSS (GND) pins are as short as possible. Bypass the power and ground with a capacitor of approximately 1 µF and a number of 0.1-µF ceramic capacitors. MMA955xL 12 Sensors Freescale Semiconductor, Inc. • Minimize PCB trace lengths for high-frequency signals. This is especially critical in systems with higher capacitive loads that could create higher transient currents in the VDD and VSS circuits. Take special care to minimize noise levels on the VDDA and VSSA pins. Use separate power planes for VDD and VDDA and separate ground planes for VSS and VSSA. Connect the separate analog and digital power and ground planes as close as possible to power supply outputs. If both analog circuit and digital circuits are powered by the same power supply, it is advisable to connect a small inductor or ferrite bead in series with both the VDDA and VSSA traces. Physically separate the analog components from noisy digital components by ground planes. Do not place an analog trace in parallel with digital traces. It is also desirable to place an analog ground trace around an analog signal trace to isolate it from digital traces. Provide an interface to the BKGD/MS pin if in-circuit debug capability is desired. Ensure that resistors RP1 and RP2, in the following figure, match the requirements stated in the I2C standard. For the shown configuration, the value of 4.7 kΩ would be appropriate. • • • • • 3.4.3 MMA955xL Platform as an Intelligent Slave I2C pullup resistors, a ferrite bead, and a few bypass capacitors are all that are required to attach this device to a host platform. The basic configurations are shown in the following two figures. In addition, the RGPIO pins can be programmed to generate interrupts to a host platform in response to the occurrence of real-time application events. In this case, the pins should be routed to the external interrupt pins of the CPU. Quiet VDDA for best performance 3 1.8V 4 4.7KΩ R2 4.7KΩ I2C_CLK 15 14 VDDA IO6/AN0 12 IO5/PDB_A/INT_O 11 VSS 10 BKGD/MS/IO9 RESETB SCL0/IO0/SCLK VSS 6 5 R3 13 IO3/SDA1/SBB 2 C1 1μF IO7/AN1 8 4.7KΩ VDD IO2/SCL1/SDO 1 7 R1 IO8/PDB_B VSSA 1.8V C3 0.1μF SDA0/IO1/SDI C4 1μF U1 MMA955X C2 0.1μF 16 1.8V L1 1.8V 10μF BEAD 1 2 IO4/INT R4 INT_OUT 9 1.8V I2C_DATA 4.7KΩ Figure 7. Platform as an I2C slave MMA955xL Sensors Freescale Semiconductor, Inc. 13 Quiet VDDA for best performance 3 4 SPI_CLK SPI_DI (MOSI) SPI_DO (MISO) 14 VDDA 15 BKGD/MS/IO9 IO6/AN0 RESETB IO5/PDB_A/INT_O SCL0/IO0/SCLK VSS 6 5 IO7/AN1 VSS IO3/SDA1/SBB 2 C1 1μF IO4/INT 13 12 11 INT_OUT 10 9 8 4.7KΩ VDD IO2/SCL1/SDO 1 7 R1 IO8/PDB_B VSSA C3 0.1μF SDA0/IO1/SDI 1.8V C4 1μF U1 MMA955X C2 0.1μF 16 1.8V L1 1.8V 10μH BEAD 1 2 R4 SPI_EN 10KΩ Figure 8. Platform as an SPI slave MMA955xL 14 Sensors Freescale Semiconductor, Inc. 3.4.4 MMA955xL Platform as a Sensor Hub The MMA955xL device includes a powerful, 32-bit ColdFire V1 CPU; a second, I2C bus; and one, external analog input. These features can all be monitored using the on-chip ADC. The combination of low power consumption and powerful features mean that the MMA955xL platform can effectively operate as a power controller for handheld units such as cell phones, PDAs, and games. The host platform can put itself to sleep with confidence that the MMA955xL device will issue a wake request should any external event require its attention. The following figure illustrates the MMA955xL device being used in this configuration. Observe how all that is required is a few bypass capacitors, a ferrite bead, and some pullup resistors for the I2C buses. Quiet VDDA for best performance L1 1.8V 10μF BEAD 1 2 1.8V 1.8V R3 4.7KΩ R2 4.7KΩ I2C_CLK I2C_DATA RESETB 14 IO5/PDB_A/INT_O SCL0/IO0/SCLK VSS IO3/SDA1/SBB 5 IO6/AN0 BKGD/MS/IO9 IO2/SCL1/SDO 4 IO7/AN1 VSS IO4/INT Differential Analog Sensor 13 12 11 INT_OUT 10 9 INT_IN 1.8V 8 3 RESETB VDD 7 2 SDA0/IO1/SDI 1 4.7KΩ 6 R1 C1 1μF VDDA 1.8V 15 C2 0.1μF IO8/PDB_B U1 MMA955X 16 C3 0.1μF VSSA C4 1μF R3 4.7KΩ R4 4.7KΩ I2C_DATA I2C_CLK I2C Digital Sensors Figure 9. Platform as sensor hub MMA955xL Sensors Freescale Semiconductor, Inc. 15 4 Mechanical and Electrical Specifications This section contains electrical specification tables and reference timing diagrams for the MMA955xL device, including detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications. 4.1 Definitions Cross-axis sensitivity The proportionality constant that relates a variation of accelerometer output to cross acceleration. This sensitivity varies with the direction of cross acceleration and is primarily due to misalignment. Full range The algebraic difference between the upper and lower values of the input range. Refer to the input/ output characteristics. Hardware compensated Sensor modules on this device include hardware-correction factors for gain and offset errors that are calibrated during factory test using a least-squares fit of the raw sensor data. Linearity error The deviation of the sensor output from a least-squares linear fit of the input/output data. Nonlinearity The systematic deviation from the straight line that defines the nominal input/output relationship. Pin group the clustering of device pins into a number of logical pin groupings to simplify and standardize electrical data sheet parameters. Pin groups are defined in Section 4.2, “Pin Groups”. Software compensated Freescale’s advanced non-linear calibration functions that—with the first-order hardware gain and offset calibration features—improve sensor performance. Warm-up time The time from the initial application of power for a sensor to reach its specified performance under the documented operating conditions. 4.2 Pin Groups The following pin groups are used throughout the remainder of this section. Group 1 RESETB Group 2 RESERVED Group 3 RGPIO[9:0] 4.3 Absolute Maximum Ratings Absolute maximum ratings are stress ratings only and operation at these maximums is not guaranteed. Stress beyond the limits specified can affect device reliability or cause permanent damage to the device. For functional operating conditions, refer to the remaining tables in this section. This device contains circuitry to protect against damage due to high static voltage or electrical fields. It is advised, however, that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (for instance, either VSS or VDD). Table 4. Absolute maximum ratings Rating Symbol Minimum Maximum Unit Digital supply voltage VDD -0.3 2.0 V Analog supply voltage VDDA -0.3 2.0 V Voltage difference, VDD to VDDA VDD - VDDA -0.1 0.1 V Voltage difference, VSS to VSSA VSS - VSSA -0.1 0.1 V VIn -0.3 VDD + 0.3 V Input voltage IC -20 20 mA VOUTOD -0.3 VDD + 0.3 V Storage temperature Tstg -40 125 °C Mechanical shock SH 5k g Input/Output pin-clamp current Output voltage range (Open-Drain Mode) MMA955xL 16 Sensors Freescale Semiconductor, Inc. 4.4 Operating Conditions Table 5. Nominal operating conditions Rating Symbol Condition(s) Min Typ Max Unit Digital supply voltage VDD 1.71 1.8 1.89 V Analog supply voltage VDDA 1.71 1.8 1.89 V Voltage difference, VDD to VDDA VDD - VDDA -0.1 0.1 V Voltage difference, VSS to VSSA VSS - VSSA -0.1 0.1 V Input voltage high VIH 0.7*VDD VDD+0.1 V Input voltage low VIL VSS - 0.3 Operating temperature TA -40 4.5 25 0.3*VDD V 85 °C Electrostatic Discharge (ESD) and Latch-up Protection Characteristics Table 6. ESD and latch-up protection characteristics Rating Symbol Min Max Unit Human Body Model (HBM) VHBM ±2000 — V Machine Model (MM) VMM ±200 — V Charge Device Model (CDM) VCDM ±500 — V ILAT ±100 — mA Latch-up current at 85°C 4.6 General DC Characteristics Table 7. DC characteristics(1) Symbol Condition(s)(2) Min Typ Max Unit Output voltage high • Low-drive strength • High-drive strength VOH Pin Groups 1 and 3 ILOAD = -2 mA ILOAD = -3 mA VDD - 0.5 — — V Output voltage low • Low-drive strength • High-drive strength VOL Pin Groups 1 and 3 ILOAD = 2 mA ILOAD = 3 mA — — 0.5 V Output-low current Max total IOL for all ports IOLT 24 mA Output-high current Max total IOH for all ports IOHT 24 mA Input-leakage current |IIN| Pin Group 2 Vin = VDD or VSS — 0.1 1 µA Hi-Z (off-state) leakage current |IOZ| Pin Group 3 input resistors disabled Vin = VDD or VSS — 0.1 1 µA Pullup resistor RPU when enabled 17.5 52.5 KΩ Power-on-reset voltage VPOR 1.50 V VPOR-hys 100 mV CIN 7 pF COUT 7 pF Characteristic Power-on-reset hysteresis Input-pin capacitance Output-pin capacitance 1.All conditions at nominal supply: VDD = VDDA = 1.8V. 2.Pin groups are defined in “Pin Groups” on page 16. MMA955xL Sensors Freescale Semiconductor, Inc. 17 4.7 Supply Current Characteristics Table 8. Supply current characteristics(1) Characteristic Supply current in STOPNC mode Supply current in STOPSC mode Supply current in RUN mode(2) 1. 2. Symbol Condition(s) Min Typ Max Unit IDD-SNC Internal clocks disabled 2 µA IDD-SSC Internal clock in slow-speed mode 15 µA IDD-R Internal clock in fast mode 3.1 mA All conditions at nominal supply: VDD = VDDA = 1.8V. Total current with the analog section active, 16 bits ADC resolution selected, MAC unit used and all peripheral clocks enabled. 4.8 Accelerometer Transducer Mechanical Characteristics Table 9. Accelerometer characteristics Characteristic Symbol AFR Full range ASENS Sensitivity/resolution Condition(s) Min Typ Max 2g ±1.8 ±2 ±2.2 4g ±3.6 ±4 ±4.4 8g ±7.2 ±8 ±8.8 2g 0.061 4g 0.122 8g 0.244 Unit g mg/LSB 2g Zero-g level offset accuracy (Pre-board mount) OFFPBM -100 +100 mg 8g Non-linearity Best fit straight line ANL TCSA Sensitivity change vs.temperature Zero-g level change vs. temperature 4g (1) 2g ±0.25 4g ±0.5 8g ±1 2g ±0.17 %/°C ±1.9 mg/°C TCOff % AFR 2g Zero-g Level offset accuracy (Post-board mount) Output data bandwidth Output noise Cross-axis sensitivity 1. OFFBM 4g -100 +100 mg 8g BW Noise ODR/2 Hz 2g, ODR = 488 Hz 100 µg/sqrt(Hz) 8g, ODR = 488 Hz 120 µg/sqrt(Hz) -5 5 % Relative to 25°C. MMA955xL 18 Sensors Freescale Semiconductor, Inc. 4.9 Temperature Sensor Characteristics Table 10. Temperature sensor characteristics(1) Characteristic Symbol Condition(s) Min Typ Max Unit 85 °C Full range TFR Sensitivity TSENS 0.00252 °C/LSB TNL ±1 °C Non-linearity 1. -40 All conditions at nominal supply: VDD = VDDA = 1.8V. 4.10 ADC Characteristics Table 11. ADC characteristics(1) Characteristic Symbol Condition(s) Min Input voltage VAI Voltage at AN0 or AN1 0.2 Differential input voltage VADI AN1 - AN0 -0.9 Full-scale range VFS Programmable resolution RES Conversion time @ 14-bits resolution (Three-sample frame) INL Differential non-linearity DNL Input leakage Effective number of bits 1. Max Unit 1.1 V 0.9 V 1.8 10 tc Integral non-linearity Typ Full Scale 14 16 Bits 207 µs ±15 LSB ±2 LSB ±2 IIA ENOB V 13.5 µA Bits All conditions at nominal supply: VDD = VDDA = 1.8V and RES = 14, unless otherwise noted. 4.11 ADC Sample Rates The MMA955xL platform supports the following sample rates: • 488.28 frames per second (fps) • 244.17 fps • 122.07 fps • 61.04 fps • 30.52 fps • 15.26 fps • 7.63 fps • 3.81 fps MMA955xL Sensors Freescale Semiconductor, Inc. 19 4.12 AC Electrical Characteristics Tests are conducted using the input levels specified in Table 5 on page 17. Unless otherwise specified, propagation delays are measured from the 50-percent to 50-percent point. Rise and fall times are measured between the 10-percent and 90-percent points, as shown in the following figure. Low VIH Input Signal High 90% 50% 10% Midpoint1 VIL Fall Time Rise Time Note: The midpoint is VIL + (VIH – VIL)/2. Figure 10. Input signal measurement references The subsequent figure shows the definitions of the following signal states: • Active state, when a bus or signal is driven and enters a low-impedance state • Three-stated, when a bus or signal is placed in a high-impedance state • Data Valid state, when a signal level has reached VOL or VOH • Data Invalid state, when a signal level is in transition between VOL and VOH Data1 Valid Data1 Valid Data3 Valid Data2 Data1 Data3 Data 3-stated Data Invalid State Data Active Data Active Figure 11. Signal states 4.13 General Timing Control Table 12. General timing characteristics(1) Characteristic Symbol Condition(s) Min Typ VDD rise time Trvdd 10% to 90% POR release delay(2) TPOR Power-up Warm-up time TWU From STOPNC 7 FOPH FOPL tCYCH tCYCL Full Speed Clock Slow Clock Full Speed Clock Slow Clock 8 62.5 125 16 Frequency of operation System clock period 0.35 Max Unit 1 ms 1.5 ms sample periods MHz KHz ns μs 128 Full/Slow clock ratio Oscillator frequency absolute accuracy @ 25°C Full Speed Clock -5 +5 % Oscillator frequency variation over temperature (-40°C to 85°C vs. ambient) Slow Clock -6 +6 % Minimum RESET assertion duration 1. 2. 3. tRA 4T(3) All conditions at nominal supply: VDD = VDDA = 1.8 V This is the time measured from VDD = VPOR until the internal reset signal is released. In the formulas, T = 1 system clock cycle. In full speed mode, T is nominally 125 ns. In slow speed mode, T is nominally 16 μs. MMA955xL 20 Sensors Freescale Semiconductor, Inc. I2C Timing 4.14 This device includes a slave I2C module that can be used to control the sensor and can be active 100 percent of the time. It also includes a master/slave I2C module that should be used only during CPU run mode (ΦD). SDA tf tf tSU; DAT tr tLOW tHD; STA tr tSP tBUF SCL tSU; STA tHD; STA S tHD; DAT tSU; STO SR tHIGH P S Figure 12. I2C standard and fast-mode timing 4.14.1 Slave I2C Table 13. I2C Speed Ranges Max Baud Rate (fSCL) Mode Minimum Minimum SCL Low Minimum SCL High Min Data setup Time (tLOW) (tHIGH) (tSU; DAT) Bit Time Min/Max Data Hold Time (tHD; DAT) Standard 100 KHz 10 μs 4.7 μs 4 μs 250 ns 0 μs/3.45 μs(1) Fast 400 KHz 2.5 μs 1.3 μs 0.6 μs 100 ns 0 μs/0.9 μs(1) 1 MHz 1 μs 500 ns 260 ns 50 ns 0 μs/0.45 μs(1) 2.0 MHz 0.5 μs 200 ns 200 ns 10 ns(2) 0 ns/70 ns (100 pf)(2) Fast + High-speed supported 1. 2. The maximum tHD; DAT must be at least a transmission time less than tVD;DAT or tVD;ACK. For details, see the I2C standard. Timing met with IFE = 0, DS = 1, and SE = 1. See the “Port Controls” chapter in the MMA955xL Three-Axis Accelerometer Reference Manual (MMA955xLRM). 4.14.2 Master I2C Timing The master I2C module should only be used when the system clock is running at full rate. Do not attempt to use the master I2C module across frames in which a portion of the time is spent in low-speed mode. Table 14. Master I2C timing Characteristic Symbol Standard Mode Fast Mode Unit Min Max Min Max fSCL 0 100 0 400 kHz tHD; STA 4.0 — 0.6 — μs LOW period of the SCL clock tLOW 4.7 — 1.3 — μs HIGH period of the SCL clock tHIGH 4.0 — 0.6 — μs SCL clock frequency Hold time (repeated) START condition. After this period, the first clock pulse is generated. Setup time for a repeated START condition tSU; STA 4.7 — 0.6 — μs Data hold time for I2C-bus devices tHD; DAT 0(1) 3.45(2) 0(1) 0.9(2) μs Data setup time tSU; DAT 250(3) — 100(3) (4) — ns Setup time for STOP condition tSU; STO 4.0 — 0.6 — µs Bus-free time between STOP and START condition tBUF 4.7 — 1.3 — µs Pulse width of spikes that must be suppressed by the input filter tSP N/A N/A 0 50 ns 1. 2. 3. 4. The master mode I2C deasserts ACK of an address byte simultaneously with the falling edge of SCL. If no slaves acknowledge this address byte, a negative hold time can result, depending on the edge rates of the SDA and SCL lines. The maximum tHD; DAT must be met only if the device does not stretch the LOW period (tLOW) of the SCL signal. Setup time in slave-transmitter mode is one IPBus clock period, if the TX FIFO is empty. A fast-mode I2C bus device can be used in a Standard mode I2C bus system, but the requirement tSU; DAT ≥ 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line trmax + tSU; DAT = 1000 + 250 = 1250 ns (according to the Standard-mode I2C bus specification) before the SCL line is released. MMA955xL Sensors Freescale Semiconductor, Inc. 21 4.15 Slave SPI Timing The following table describes the timing requirements for the SPI system. The “#” column refers to the numbered time period in Figure 13. Table 15. Slave SPI timing # Function Symbol Min Max Unit fop 0 FOPH/4 Hz SCLK period tSCLK 4 — tCYCH — Operating frequency 1 2 Enable lead time tLead 0.5 — tCYCH 3 Enable lag time tLag 0.5 — tCYCH 4 Clock (SCLK) high or low time tWSCLK 200 — ns 5 Data setup time (inputs) tSU 15 — ns 6 Data-hold time (inputs) tHI 25 — ns 7 Access time ta — 25 ns 8 SDO-disable time tdis — 25 ns 9 Data valid (after SCLK edge) tv — 25 ns 10 Data-hold time (outputs) tHO 0 — ns 11 Rise time Input Output tRI tRO — — 25 25 ns ns 12 Fall time Input Output tFI tFO — — 25 25 ns ns SS (INPUT) 1 11 12 3 SCLK (INPUT) 2 4 4 8 7 SDO (OUTPUT) SLAVE 5 SDI (INPUT) 9 MSB OUT BIT 6 . . . 1 < 10 10 SLAVE LSB OUT SEE NOTE 6 MSB IN BIT 6 . . . 1 LSB IN NOTE: 1. Not defined but normally MSB of character just received. Figure 13. SPI slave timing MMA955xL 22 Sensors Freescale Semiconductor, Inc. 4.16 Flash Parameters The MMA955xL platform has 16 KB of internal flash memory. There are ROM functions that allow erase and programming of that memory. Chip supply voltage of 1.8V is sufficient for the flash programming voltage. The size of the available flash memory varies between the different devices in the MMA955xL product family, as shown in the following figure. MMA 9550L MMA9551L MMA9553L MMA9559L Motion-sensing platform Gesture-sensing platform Pedometer platform High-flexibility platform 14.5 KB(1) 11.5 KB 9.5 KB 2 KB User firmware Gesture firmware Pedometer firmware Factory firmware Base firmware Foundation firmware 1. Estimated value. Figure 14. Flash memory map for devices The smallest block of memory that can be written is 4 bytes and those 4 bytes must be aligned on a 4-byte boundary. The largest block of memory that can be programmed is 128 bytes and the block must start at a 128-byte boundary. Flash programming blocks must start on a 4-byte boundary and cannot cross a 128-byte page boundary. Table 16. Flash parameters Parameter Word depth Row size 4096 128 bytes Page erase size (Erase block size) 4 rows = 512 bytes Maximum page programming size 1 row = 128 bytes Minimum word programming size 4 bytes Memory organization Endurance Data retention 5 Value 4096 x 32 bits = 16 KB total 20,000 cycles minimum > 100 years, at room temperature Package Information The MMA955xL platform uses a 16-lead LGA package, case number 2094. Use the following link for the latest diagram of the package: http://www.freescale.com/files/shared/doc/package_info/98ASA00287D.pdf MMA955xL Sensors Freescale Semiconductor, Inc. 23 6 Revision History Revision number Revision date 0 06/2011 Initial release of document. 1 10/2011 • • • • Description of changes Removed MMA9552L device from product family and added the MMA9559L device. Added a features table and a package land diagram figure. Modified block diagram Inserted flash memory map figure MMA955xL 24 Sensors Freescale Semiconductor, Inc. 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Freescale, the Freescale logo, and the Energy Efficient Solutions logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Xtrinsic is a trademark of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc. All rights reserved. RoHS-compliant and/or Pb-free versions of Freescale products have the functionality and electrical characteristics of their non-RoHS-compliant and/or non-Pb-free counterparts. For further information, see http:/www.freescale.com or contact your Freescale sales representative. For information on Freescale’s Environmental Products program, go to http://www.freescale.com/epp. MMA955xL Rev. 1 10/2011