SN74AHCT1G08 www.ti.com SCLS315P – MARCH 1996 – REVISED MAY 2013 SINGLE 2-INPUT POSITIVE-AND GATE Check for Samples: SN74AHCT1G08 FEATURES 1 • • • Operating Range 4.5-V to 5.5-V Max tpd of 7.1 ns at 5-V Low Power Consumption, 10-μA Max ICC • • • DCK PACKAGE (TOP VIEW) DBV PACKAGE (TOP VIEW) A 1 B 2 GND 3 5 4 ±8-mA Output Drive at 5-V Inputs Are TTL-Voltage Compatible Latch-Up Performance Exceeds 250 mA Per JESD 17 A 1 B 2 GND 3 DRL PACKAGE (TOP VIEW) V CC 5 V CC A 1 B 2 GND 3 5 V CC 4 Y Y 4 Y See mechanical drawings for dimensions. DESCRIPTION The SN74AHCT1G08 is a single 2-input positive-AND gate. The device performs the Boolean function Y = A • B or Y = A + B in positive logic. FUNCTION TABLE INPUTS OUTPUT A B Y H H H L X L X L L LOGIC DIAGRAM (POSITIVE LOGIC) A B 1 2 4 Y 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1996–2013, Texas Instruments Incorporated SN74AHCT1G08 SCLS315P – MARCH 1996 – REVISED MAY 2013 www.ti.com ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE UNIT Supply voltage range, VCC –0.5 to 7 V Input voltage range, VI (2) –0.5 to 7 V Output voltage range, VO (2) –0.5 to VCC + 0.5 V Input clamp current, IIK (VI < 0) –20 mA Output clamp current, IOK (VO < 0 or VO > VCC) ±20 mA Continuous output current, IO (VO = 0 to VCC) ±25 mA Continuous current through VCC or GND ±50 mA Package thermal impedance, θJA (3) DBV package 206 DCK package 252 DRL package 142 Storage temperature range, Tstg (1) (2) (3) °C/W –65 to 150 °C Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. The package thermal impedance is calculated in accordance with JESD 51-7. RECOMMENDED OPERATING CONDITIONS (1) MIN MAX 4.5 5.5 UNIT VCC Supply voltage VIH High-level input voltage VIL Low-level Input voltage 0.8 V VI Input voltage 0 5.5 V VO Output voltage 0 VCC V IOH High-level output current –8 IOL Low-level output current 8 mA Δt/Δv Input Transition rise or fall rate 20 ns/V TA Operating free-air temperature 125 °C (1) 2 V 2 –40 V mA All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback Copyright © 1996–2013, Texas Instruments Incorporated Product Folder Links :SN74AHCT1G08 SN74AHCT1G08 www.ti.com SCLS315P – MARCH 1996 – REVISED MAY 2013 ELECTRICAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) Recommended PARAMETER VOH VOL II IOH = –50 µA VCC 4.5 V IOH = –8 mA IOL = 50 µA MIN TYP 4.4 4.5 VI = VCC or GND, ΔICC (1) Ci MIN 3.94 4.5 V IOL = 8 mA TA = –40°C to 85°C MAX VI = 5.5 V or GND ICC (1) TEST CONDITIONS TA = 25°C IO = 0 One input at 3.4 V, Other Inputs at VCC or GND VI = VCC or GND 4 MAX TA = –40°C to 125°C MIN 4.4 4.4 3.8 3.8 UNIT MAX V 0.1 0.1 0.1 0.36 0.44 0.44 ±0.1 ±1 ±1 µA 1 10 10 µA 1.35 1.5 1.5 µA 10 10 10 pF V This is the increase in supply current for each input at one of the specified TTL voltage levels, rather than 0 V or VCC. SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER tPLH tPHL tPLH tPHL FROM (INPUT) TO (OUTPUT) OUTPUT CAPACITANCE A or B Y CL = 15 pF A or B Y CL = 50 pF Recommended TA = –40°C to 85°C TA = 25°C MIN TA = –40°C to 125°C MAX MIN UNIT TYP MAX 5 6.2 1 7.1 1 MAX 7.5 5 6.2 1 7.1 1 7.5 5.5 7.9 1 9 1 10 5.5 7.9 1 9 1 10 ns ns OPERATING CHARACTERISTICS VCC = 5 V, TA = 25°C PARAMETER Cpd Power dissipation capacitance TEST CONDITIONS No load, f = 1 MHz TYP 18 UNIT pF Submit Documentation Feedback Copyright © 1996–2013, Texas Instruments Incorporated Product Folder Links :SN74AHCT1G08 3 SN74AHCT1G08 SCLS315P – MARCH 1996 – REVISED MAY 2013 www.ti.com PARAMETER MEASUREMENT INFORMATION From Output Under Test RL = 1 kΩ From Output Under Test Test Point VCC Open S1 TEST GND CL (see Note A) CL (see Note A) S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Drain Open VCC GND VCC LOAD CIRCUIT FOR 3-STATE AND OPEN-DRAIN OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS 3V 1.5 V Timing Input 0V tw 3V 1.5 V Input 1.5 V th tsu 3V 1.5 V Data Input 1.5 V 0V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION 3V 1.5 V Input 1.5 V 0V tPHL tPLH In-Phase Output 50% VCC Output Waveform 1 S1 at VCC (see Note B) 50% VCC VOH 50% VCC VOL 1.5 V 1.5 V 0V tPLZ tPZL ≈VCC 50% VCC Output Waveform 2 S1 at GND (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VOL + 0.3 V VOL tPHZ tPZH tPLH tPHL Out-of-Phase Output VOH 50% VCC VOL 3V Output Control 50% VCC VOH − 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns. D. The outputs are measured one at a time with one input transition per measurement. E. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 4 Submit Documentation Feedback Copyright © 1996–2013, Texas Instruments Incorporated Product Folder Links :SN74AHCT1G08 SN74AHCT1G08 www.ti.com SCLS315P – MARCH 1996 – REVISED MAY 2013 REVISION HISTORY Changes from Revision O (June 2005) to Revision P Page • Changed document format from Quicksilver to DocZone. .................................................................................................... 1 • Extended operating temperature range to 125°C ................................................................................................................. 2 Submit Documentation Feedback Copyright © 1996–2013, Texas Instruments Incorporated Product Folder Links :SN74AHCT1G08 5 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) 74AHCT1G08DBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 B08G 74AHCT1G08DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 B08G 74AHCT1G08DBVTE4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 B08G 74AHCT1G08DCKRE4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (BE3 ~ BEG ~ BEJ ~ BEL ~ BES) 74AHCT1G08DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (BE3 ~ BEG ~ BEJ ~ BEL ~ BES) 74AHCT1G08DCKTG4 ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (BE3 ~ BEG ~ BEL ~ BES) 74AHCT1G08DRLRG4 ACTIVE SOT DRL 5 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (BEB ~ BES) SN74AHCT1G08DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (B083 ~ B08G ~ B08J ~ B08L ~ B08S) SN74AHCT1G08DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (B083 ~ B08G ~ B08L ~ B08S) SN74AHCT1G08DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (BE3 ~ BEG ~ BEJ ~ BEL ~ BES) SN74AHCT1G08DCKT ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (BE3 ~ BEG ~ BEL ~ BES) SN74AHCT1G08DRLR ACTIVE SOT DRL 5 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (BEB ~ BES) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2015 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 13-Jul-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) 74AHCT1G08DBVRG4 SOT-23 DBV 5 3000 178.0 9.0 SN74AHCT1G08DBVR SOT-23 DBV 5 3000 180.0 SN74AHCT1G08DBVR SOT-23 DBV 5 3000 178.0 SN74AHCT1G08DBVR SOT-23 DBV 5 3000 SN74AHCT1G08DBVT SOT-23 DBV 5 W Pin1 (mm) Quadrant 3.23 3.17 1.37 4.0 8.0 Q3 9.2 3.17 3.23 1.37 4.0 8.0 Q3 9.2 3.3 3.2 1.55 4.0 8.0 Q3 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 250 180.0 9.2 3.17 3.23 1.37 4.0 8.0 Q3 SN74AHCT1G08DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 SN74AHCT1G08DCKR SC70 DCK 5 3000 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3 SN74AHCT1G08DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 SN74AHCT1G08DCKT SC70 DCK 5 250 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3 SN74AHCT1G08DCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 SN74AHCT1G08DCKT SC70 DCK 5 250 178.0 9.2 2.4 2.4 1.22 4.0 8.0 Q3 SN74AHCT1G08DRLR SOT DRL 5 4000 180.0 9.5 1.78 1.78 0.69 4.0 8.0 Q3 SN74AHCT1G08DRLR SOT DRL 5 4000 180.0 8.4 1.98 1.78 0.69 4.0 8.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 13-Jul-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) 74AHCT1G08DBVRG4 SOT-23 DBV 5 3000 180.0 180.0 18.0 SN74AHCT1G08DBVR SOT-23 DBV 5 3000 205.0 200.0 33.0 SN74AHCT1G08DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 SN74AHCT1G08DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 SN74AHCT1G08DBVT SOT-23 DBV 5 250 205.0 200.0 33.0 SN74AHCT1G08DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 SN74AHCT1G08DCKR SC70 DCK 5 3000 205.0 200.0 33.0 SN74AHCT1G08DCKR SC70 DCK 5 3000 180.0 180.0 18.0 SN74AHCT1G08DCKT SC70 DCK 5 250 205.0 200.0 33.0 SN74AHCT1G08DCKT SC70 DCK 5 250 180.0 180.0 18.0 SN74AHCT1G08DCKT SC70 DCK 5 250 180.0 180.0 18.0 SN74AHCT1G08DRLR SOT DRL 5 4000 184.0 184.0 19.0 SN74AHCT1G08DRLR SOT DRL 5 4000 202.0 201.0 28.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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