INTEL 313955

Intel® 3000 and 3010 Chipset
Memory Controller Hub (MCH)
Thermal/Mechanical Design Guide
August 2006
Reference Number: 313955 Revision: 001
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Intel may make changes to specifications and product descriptions at any time, without notice.
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reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to them.
The Intel® 3000 and 3010 chipset, Dual-Core Intel® Xeon® processor 3000 sequence may contain design defects or errors known
as errata which may cause the product to deviate from published specifications. Current characterized errata are available on
request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
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Copyright © 2006, Intel Corporation. All rights reserved.
* Other brands and names may be claimed as the property of others.
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Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
Contents
1
Introduction .............................................................................................................. 7
1.1
Definition of Terms .............................................................................................. 7
1.2
Reference Documents .......................................................................................... 8
2
Packaging Technology ............................................................................................... 9
2.1
Package Mechanical Requirements ....................................................................... 11
3
Thermal Specifications ............................................................................................ 13
3.1
Thermal Design Power (TDP) .............................................................................. 13
3.2
Die Case Temperature ....................................................................................... 13
4
Thermal Simulation ................................................................................................. 15
5
Thermal Metrology .................................................................................................. 17
5.1
Die Temperature Measurements .......................................................................... 17
5.1.1 Zero Degree Angle Attach Methodology ..................................................... 17
5.2
Power Simulation Software ................................................................................. 19
6
Reference Thermal Solution..................................................................................... 21
6.1
Operating Environment ...................................................................................... 21
6.2
Heatsink Performance ........................................................................................ 21
6.3
Mechanical Design Envelope ............................................................................... 22
6.4
Board-Level Components Keepout Dimensions ...................................................... 23
6.5
Plastic Wave Soldering Heatsink Thermal Solution Assembly ................................... 23
6.5.1 Heatsink Orientation ............................................................................... 24
6.5.2 Extruded Heatsink Profiles ....................................................................... 25
6.5.3 Mechanical Interface Material ................................................................... 25
6.5.4 Thermal Interface Material....................................................................... 25
6.5.5 Heatsink Clips ........................................................................................ 26
6.5.6 Clip Retention Anchors ............................................................................ 26
6.6
Reliability Guidelines.......................................................................................... 27
A
Thermal Solution Component Suppliers ................................................................... 29
A.1
Plastic Wave Soldering Heatsink Thermal Solution ................................................. 29
B
Mechanical Drawings ............................................................................................... 31
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
3
Figures
2-1
2-2
2-3
5-1
5-2
5-3
6-1
6-2
6-3
6-4
6-5
6-6
B-1
B-2
B-3
B-4
B-5
B-6
B-7
MCH Package Dimensions (Top View) .................................................................... 9
MCH Package Dimensions (Side View) ..................................................................10
MCH Package Dimensions (Bottom View) ..............................................................10
Thermal Solution Decision Flowchart ....................................................................18
Zero Degree Angle Attach Heatsink Modifications ...................................................18
Zero Degree Angle Attach Methodology (Top View) ................................................19
Plastic Wave Soldering Heatsink Measured Thermal Performance versus
Approach Velocity ..............................................................................................21
Plastic Wave Soldering Heatsink Volumetric Envelope for the Chipset MCH.................22
Plastic Wave Soldering Heatsink Board Component Keepout ...................................23
Retention Mechanism Component Keepout Zones ..................................................24
Plastic Wave Soldering Heatsink Assembly ...........................................................25
Plastic Wave Soldering Heatsink Extrusion Profile ..................................................26
Plastic Wave Soldering Heatsink Assembly Drawing ................................................32
Plastic Wave Soldering Heatsink Drawing (1 of 2)...................................................33
Plastic Wave Soldering Heatsink Drawing (2 of 2)...................................................34
Plastic Wave Soldering Heatsink Ramp Clip Drawing (1 of 2)....................................35
Plastic Wave Soldering Heatsink Ramp Clip Drawing (2 of 2)....................................36
Plastic Wave Soldering Heatsink Wire Clip Drawing .................................................37
Plastic Wave Soldering Heatsink Solder-down Anchor Drawing .................................38
Tables
3-1
3-2
6-1
6-2
B-1
4
Intel 3000 Chipset MCH Thermal Specifications ......................................................13
Intel 3010 Chipset MCH Thermal Specifications ......................................................13
Chomerics* T-710 TIM Performance as a Function of Attach Pressure .......................26
Reliability Guidelines ..........................................................................................27
Mechanical Drawing List......................................................................................31
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
Revision History
Document
Number
Revision
Number
313955
-001
Description
•
Initial release of the document.
Date
August 2006
§
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
5
6
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
Introduction
1
Introduction
As the complexity of computer systems increases, so do the power dissipation
requirements. Care must be taken to ensure that the additional power is properly
dissipated. Typical methods to improve heat dissipation include selective use of
ducting, and/or passive heatsinks.
The goals of this document are to:
• Outline the thermal and mechanical operating limits and specifications for the
Intel® 3000 and 3010 chipsets memory controller hub (MCH).
• Describe a reference thermal solution that meets the specification of the Intel 3000
and 3010 chipsets MCH.
Properly designed thermal solutions provide adequate cooling to maintain the
Intel 3000 and 3010 chipsets MCH die temperatures at or below thermal specifications.
This is accomplished by providing a low local-ambient temperature, ensuring adequate
local airflow, and minimizing the die to local-ambient thermal resistance. By
maintaining the Intel 3000 and 3010 chipset MCH die temperature at or below the
specified limits, a system designer can ensure the proper functionality, performance,
and reliability of the chipset. Operation outside the functional limits can degrade
system performance and may cause permanent changes in the operating
characteristics of the component.
The simplest and most cost effective method to improve the inherent system cooling
characteristics is through careful chassis design and placement of fans, vents, and
ducts. When additional cooling is required, component thermal solutions may be
implemented in conjunction with system thermal solutions. The size of the fan or
heatsink can be varied to balance size and space constraints with acoustic noise.
This document addresses thermal design and specifications for the Intel 3000 and 3010
chipsets MCH components only. For thermal design information on other chipset
components, refer to the respective component datasheet. For the PXH, refer to the
Intel® 6700PXH 64-bit PCI Hub/6702PXH 64-bit PCI Hub (PXH/PXH-V)
Thermal/Mechanical Design Guidelines. For the ICH7, refer to the Intel® I/O Controller
Hub7 (ICH7) Thermal Design Guidelines.
Note:
Unless otherwise specified, the term “MCH” refers to the Intel 3000 and 3010 chipsets
MCH.
1.1
Definition of Terms
BGA
Ball grid array. A package type, defined by a resin-fiber
substrate, onto which a die is mounted, bonded and
encapsulated in molding compound. The primary electrical
interface is an array of solder balls attached to the substrate
opposite the die and molding compound.
BLT
Bond line thickness. Final settled thickness of the thermal
interface material after installation of heatsink.
MCH
Memory controller hub. The chipset component contains the
processor interface, the memory interface, the PCI Express*
interface and the DMI interface.
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
7
Introduction
1.2
ICH
I/O controller hub. The chipset component contains the MCH
interface, the SATA interface, the USB interface, the IDE
interface, the LPC interface etc.
PXH
Intel 6700PXH 64-bit PCI Hub. The chipset component performs
PCI bridging functions between the PCI Express interface and
the PCI Bus. It contains two PCI bus interfaces that can be
independently configured to operate in PCI (33 or 66 MHz) or
PCI-X* mode 1 (66, 100 or 133 MHz), for either 32 or 64 bit PCI
devices.
PXH-V
Intel 6702PXH 64-bit PCI Hub. The chipset component performs
PCI bridging functions between the PCI Express interface and
the PCI Bus. It contains one PCI bus interface that can be
configured to operate in PCI (33 or 66 MHz) or PCI-X mode 1
(66, 100 or 133 MHz).
Tcase_max
Maximum die or IHS temperature allowed. This temperature is
measured at the geometric center of the top of the package die
or IHS.
Tcase_min
Minimum die or IHS temperature allowed. This temperature is
measured at the geometric center of the top of the package die
or IHS.
TDP
Thermal design power. Thermal solutions should be designed to
dissipate this target power level. TDP is not the maximum
power that the chipset can dissipate.
Reference Documents
The reader of this specification should also be familiar with material and concepts
presented in the following documents:
Document Title
Document Number / Location
Intel® I/O Controller Hub 7 (ICH7) Thermal Design Guidelines
www.developer.intel.com
Intel® I/O Controller Hub 7 (ICH7) Family Datasheet
www.developer.intel.com
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Datasheet
www.developer.intel.com
Intel® Pentium® D Processor 900 Sequence and Intel® Pentium®
Processor Extreme Edition 955 , 965 Datasheet
www.developer.intel.com
Intel® Pentium® 4 Processor 6x1 Sequence Datasheet
www.developer.intel.com
Intel® Pentium® D Processor 800 Sequence Datasheet
www.developer.intel.com
Dual-Core Intel® Xeon® Processor 3000 Series Datasheet
www.developer.intel.com
Dual-Core Intel® Xeon® Processor 3000 Series Specification Update
www.developer.intel.com
BGA/OLGA Assembly Development Guide
Contact your Intel Field Sales
Representative
Various system thermal design suggestions
http://www.formfactors.org
§
8
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
Packaging Technology
2
Packaging Technology
The Intel 3000 and 3010 chipsets consists of three individual components: the MCH,
the ICH7 and the PXH. The Intel 3000 and 3010 chipsets MCH components use a
34 mm squared, 6-layer flip chip ball grid array (FC-BGA) package (see Figure 2-1,
Figure 2-2 and Figure 2-3). For information on the PXH package, refer to the
Intel® 6700PXH 64-bit PCI Hub/6702PXH 64-bit PCI Hub (PXH/PXH-V)
Thermal/Mechanical Design Guidelines. For information on the ICH7 package, refer to
the Intel® I/O Controller Hub7 (ICH7) Thermal Design Guidelines.
Figure 2-1.
MCH Package Dimensions (Top View)
Ø5.20mm
Capacitor Area,
Handling Exclusion
Zone
16.33
8.44
Die
Keepout
Area
2.0
10.13
17.15
MCH
Die
34.00
3.0
Handling Area
3.95
34.00
Note:
All Dimensions are in Millimeter.
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
9
Packaging Technology
Figure 2-2.
MCH Package Dimensions (Side View)
Substrate
2.355 ± 0.082 mm
1.92 ± 0.078 mm
0.84 ± 0.05 mm
Decoup
Cap
Die
0.7 mm Max
0.20 See note 4.
0.20
–C–
Seating Plane
0.435 ± 0.025 mm
See note 3
See note 1.
Notes:
1. Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)
2. All dimensions and tolerances conform to ANSI Y14.5M-1994
3. BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm
4. Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave
(bowl shaped) orientation after reflow
Figure 2-3.
MCH Package Dimensions (Bottom View)
Notes:
1.
All dimensions are in millimeters.
2.
All dimensions and tolerances conform to ANSI Y14.5M-1994.
10
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
Packaging Technology
2.1
Package Mechanical Requirements
The Intel 3000 and 3010 chipsets MCH package has an exposed bare die which is
capable of sustaining a maximum static normal load of 10-lbf. The package is NOT
capable of sustaining a dynamic or static compressive load applied to any edge of the
bare die. These mechanical load limits must not be exceeded during heatsink
installation, mechanical stress testing, standard shipping conditions and/or any other
use condition.
Notes:
1. The heatsink attach solutions must not include continuous stress onto the chipset
package with the exception of a uniform load to maintain the heatsink-to-package
thermal interface.
2. These specifications apply to uniform compressive loading in a direction
perpendicular to the bare die top surface.
3. These specifications are based on limited testing for design characterization.
Loading limits are for the package only.
§
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
11
Packaging Technology
12
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
Thermal Specifications
3
Thermal Specifications
3.1
Thermal Design Power (TDP)
Analysis indicates that real applications are unlikely to cause the MCH component to
consume maximum power dissipation for sustained time periods. Therefore, in order to
arrive at a more realistic power level for thermal design purposes, Intel characterizes
power consumption based on known platform benchmark applications. The resulting
power consumption is referred to as the Thermal Design Power (TDP). TDP is the
target power level that the thermal solutions should be designed to. TDP is not the
maximum power that the chipset can dissipate.
For TDP specifications, see Table 3-1 and Table 3-1 for the Intel 3000 and 3010
chipsets MCH. FC-BGA packages have poor heat transfer capability into the board and
have minimal thermal capability without a thermal solution. Intel recommends that
system designers plan for a heatsink when using the Intel 3000 and 3010 chipsets.
3.2
Die Case Temperature
To ensure proper operation and reliability of the Intel 3000 and 3010 chipsets MCH, the
die temperatures must be at or between the maximum/minimum operating
temperature ranges as specified in Table 3-1 and Table 3-2. System and/or component
level thermal solutions are required to maintain these temperature specifications. Refer
to Chapter 5 for guidelines on accurately measuring package die temperatures.
Table 3-1.
Intel 3000 Chipset MCH Thermal Specifications
Parameter
Value
Tcase_max
105 °C
Tcase_min
5 °C
TDPdual
TDPdual
Note:
Table 3-2.
Notes
channel
10.6 W
DDR2-533
channel
12.7 W
DDR2-667
These specifications are based on post silicon power measurement.
Intel 3010 Chipset MCH Thermal Specifications
Parameter
Value
Tcase_max
105 °C
Tcase_min
Note:
TDPdual
TDPdual
Notes
5 °C
channel
11.5 W
DDR2-533
channel
13.6 W
DDR2-667
These specifications are based on silicon characterization; however, they may be updated as further
data becomes available.
§
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
13
Thermal Specifications
14
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
Thermal Simulation
4
Thermal Simulation
Intel provides thermal simulation models of the Intel 3000 and 3010 chipsets MCH and
associated user's guides to aid system designers in simulating, analyzing, and
optimizing their thermal solutions in an integrated, system-level environment. The
models are for use with the commercially available Computational Fluid Dynamics
(CFD)-based thermal analysis tool FLOTHERM* (version 5.1 or higher) by Flomerics,
Inc. Contact your Intel field sales representative to order the thermal models and
user's guides.
§
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
15
Thermal Simulation
16
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
Thermal Metrology
5
Thermal Metrology
The system designer must make temperature measurements to accurately determine
the thermal performance of the system. Intel has established guidelines for proper
techniques to measure the MCH die temperatures. Section 5.1 provides guidelines on
how to accurately measure the MCH die temperatures. Section 5.2 contains information
on running an application program that will emulate anticipated maximum thermal
design power. The flowchart in Figure 5-1 offers useful guidelines for thermal
performance and evaluation.
5.1
Die Temperature Measurements
To ensure functionality and reliability, the Tcase of the MCH must be maintained at or
between the maximum/minimum operating range of the temperature specification as
noted in Table 3-1 and Table 3-2. The surface temperature at the geometric center of
the die corresponds to Tcase. Measuring Tcase requires special care to ensure an
accurate temperature measurement.
Temperature differences between the temperature of a surface and the surrounding
local ambient air can introduce errors in the measurements. The measurement errors
could be due to a poor thermal contact between the thermocouple junction and the
surface of the package, heat loss by radiation and/or convection, conduction through
thermocouple leads, and/or contact between the thermocouple cement and the
heatsink base (if a heatsink is used). For maximize measurement accuracy, only the 0°
thermocouple attach approach is recommended.
5.1.1
Zero Degree Angle Attach Methodology
1. Mill a 3.3 mm (0.13 in.) diameter and 1.5 mm (0.06 in.) deep hole centered on the
bottom of the heatsink base.
2. Mill a 1.3 mm (0.05 in.) wide and 0.5 mm (0.02 in.) deep slot from the centered
hole to one edge of the heatsink. The slot should be parallel to the heatsink fins
(see Figure 5-25-2).
3. Attach thermal interface material (TIM) to the bottom of the heatsink base.
4. Cut out portions of the TIM to make room for the thermocouple wire and bead. The
cutouts should match the slot and hole milled into the heatsink base.
5. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to
the center of the top surface of the die using a high thermal conductivity cement.
During this step, ensure no contact is present between the thermocouple cement
and the heatsink base because any contact will affect the thermocouple reading. It
is critical that the thermocouple bead makes contact with the die (see
Figure 5-3).
6. Attach heatsink assembly to the MCH and route thermocouple wires out through
the milled slot.
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
17
Thermal Metrology
Figure 5-1.
Thermal Solution Decision Flowchart
Start
Attach device
to board
using normal
reflow
process.
Figure 5-2.
Run the Power
program and
monitor the
device die
temperature.
Select
Heatsink
Heatsink
Required
Tdie >
Specification?
No
End
Yes
Zero Degree Angle Attach Heatsink Modifications
Note:
18
Attach
thermocouples
using recommended
metrology. Setup
the system in the
desired
configuration.
Not to scale.
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
Thermal Metrology
Figure 5-3.
Zero Degree Angle Attach Methodology (Top View)
Die
Thermocouple
Wire
Cement +
Thermocouple Bead
Substrate
001321
Note:
5.2
Not to scale.
Power Simulation Software
The power simulation software is a utility designed to dissipate the thermal design
power on a Intel 3000 and 3010 chipsets MCH when used in conjunction with the
Dual-Core Intel® Xeon® processor 3000 series (1066 MHz). The combination of the
above mentioned processor(s) and the higher bandwidth capability of the Intel 3000
and 3010 chipsets enable higher levels of system performance. To assess the thermal
performance of the chipset MCH thermal solution under “worst-case realistic
application” conditions, Intel is developing a software utility that operates the chipset
at near worst-case thermal power dissipation.
The power simulation software being developed should only be used to test thermal
solutions at or near the thermal design power. Figure 5-1 shows a decision flowchart for
determining thermal solution needs. Real world applications may exceed the thermal
design power limit for transient time periods. For power supply current requirements
under these transient conditions, please refer to each component's datasheet for the
ICC (Max Power Supply Current) specification. Contact your Intel field sales
representative to order the power utility and user's guides.
§
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
19
Thermal Metrology
20
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
Reference Thermal Solution
6
Reference Thermal Solution
Intel has developed a reference thermal solution to meet the cooling needs of the
Intel 3000 and 3010 chipsets MCH under operating environments and specifications
defined in this document. This chapter describes the overall requirements for the
Plastic Wave Soldering Heatsink (PWSH) reference thermal solution including criticalto-function dimensions, operating environment, and validation criteria. Other chipset
components may or may not need attached thermal solutions, depending on your
specific system local-ambient operating conditions. For information on the PXH/PXH-V,
refer to thermal specification in the Intel® 6700PXH 64-bit PCI Hub/6702PXH 64-bit
PCI Hub (PXH/PXH-V) Thermal/Mechanical Design Guidelines. For information on the
ICH7, refer to thermal specification in the Intel® I/O Controller Hub 7 (ICH7) Thermal
Design Guidelines.
6.1
Operating Environment
The reference thermal solution was designed assuming a maximum local-ambient
temperature of 55 °C. The minimum recommended airflow velocity through the crosssection of the heatsink fins is 350 linear feet per minute (lfm) for 1U system and
450 linear feet per minute (lfm) for 2U+ system. The approaching airflow temperature
is assumed to be equal to the local-ambient temperature. The thermal designer must
carefully select the location to measure airflow to obtain an accurate estimate. These
local-ambient conditions are based on a 35 °C external-ambient temperature at sea
level. (External-ambient refers to the environment external to the system.)
6.2
Heatsink Performance
Figure 6-1 depicts the measured thermal performance of the reference thermal solution
versus approach air velocity. Since this data was measured at sea level, a correction
factor would be required to estimate thermal performance at other altitudes.
Figure 6-1.
Plastic Wave Soldering Heatsink Measured Thermal Performance versus
Approach Velocity
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
21
Reference Thermal Solution
Heatsink test result is based on End of Life TIM performance, for worst case Heatsink
performance with End of Life TIM, need to add +1.0C/W offset to Psi_ca.
6.3
Mechanical Design Envelope
While each design may have unique mechanical volume and height restrictions or
implementation requirements, the height, width, and depth constraints typically placed
on the Intel 3000 and 3010 chipsets MCH thermal solution are shown in Figure 6-2.
When using heatsinks that extend beyond the chipset MCH reference heatsink envelope
shown in Figure 6-2, any motherboard components placed between the heatsink and
motherboard cannot exceed 2.19 mm (0.09 in.) in height.
Figure 6-2.
Plastic Wave Soldering Heatsink Volumetric Envelope for the Chipset MCH
Ramp
Retainer
Heatsink Fin
Heatsink Base
TIM
Die
FCBGA + Solder
Balls
Motherboard
60.6 mm
48.0 mm
26.79 mm
TN
B
Heatsink Fin
Max 2.2 mm
Component
Height
No
component
this Area
135O
47.0 mm
22
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
Reference Thermal Solution
6.4
Board-Level Components Keepout Dimensions
The location of hole patterns and keepout zones for the reference thermal solution are
shown in Figure 6-3 and Figure 6-4.
6.5
Plastic Wave Soldering Heatsink Thermal Solution
Assembly
The reference thermal solution for the chipset MCH is a passive extruded heatsink with
thermal interface. It is attached using a clip with each end hooked through an anchor
soldered to the board. Figure 6-5 shows the reference thermal solution assembly and
associated components.
Full mechanical drawings of the thermal solution assembly and the heatsink clip are
provided in Appendix B. Appendix A contains vendor information for each thermal
solution component.
Figure 6-3.
Plastic Wave Soldering Heatsink Board Component Keepout
60.6 mm
48.0 mm
26.79 mm
TN
B
Heatsink Fin
Max 2.2 mm
Component
Height
No
component
this Area
135O
47.0 mm
Air Flow
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
23
Reference Thermal Solution
Figure 6-4.
Retention Mechanism Component Keepout Zones
4 x 8.76 mm
Max 1.27mm
Component
Height
No Components
this Area
8 x Ø0.97 mm Plated Thru Hole
8 x Ø1.42 mm Trace Keepout
6.5.1
Heatsink Orientation
Since this solution is based on a unidirectional heatsink, mean airflow direction must be
aligned with the direction of the heatsink fins.
24
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
Reference Thermal Solution
Figure 6-5.
Plastic Wave Soldering Heatsink Assembly
6.5.2
Extruded Heatsink Profiles
The reference thermal solution uses an extruded heatsink for cooling the chipset MCH.
Figure 6-6 shows the heatsink profile. Appendix A lists a supplier for this extruded
heatsink. Other heatsinks with similar dimensions and increased thermal performance
may be available. Full mechanical drawing of this heatsink is provided in Appendix B.
6.5.3
Mechanical Interface Material
There is no mechanical interface material associated with this reference solution.
6.5.4
Thermal Interface Material
A TIM provides improved conductivity between the die and heatsink. The reference
thermal solution uses Chomerics T-710, 0.127 mm (0.005 in.) thick, 15 mm x 15 mm
(0.60 in. x 0.60 in.) square.
Note:
Unflowed or “dry” Chomerics T-710 has a material thickness of 0.005 inch. The flowed
or “wet” Chomerics T-710 has a material thickness of ~0.0025 inch after it reaches its
phase change temperature.
6.5.4.1
Effect of Pressure on TIM Performance
As mechanical pressure increases on the TIM, the thermal resistance of the TIM
decreases. This phenomenon is due to the decrease of the bond line thickness (BLT).
BLT is the final settled thickness of the thermal interface material after installation of
heatsink. The effect of pressure on the thermal resistance of the Chomerics T-710 TIM
is shown in Table 6-1. The heatsink clip provides enough pressure for the TIM to
achieve a thermal conductivity of 0.17 °C inch2/W.
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
25
Reference Thermal Solution
Table 6-1.
6.5.5
Chomerics* T-710 TIM Performance as a Function of Attach Pressure
Pressure (psi)
Thermal Resistance (°C × in2)/W
5
0.37
10
0.30
20
0.21
30
0.17
Heatsink Clips
The retention mechanism in this reference solution includes two different types of clips,
one is ramp clip and the other is wire clip. Each end of the wire clip is attached to the
ramp clip which in turn attaches themselves to anchors to fasten the overall heatsink
assembly to the motherboard. See Appendix B for a mechanical drawing of the clip.
Figure 6-6.
Plastic Wave Soldering Heatsink Extrusion Profile
6.5.6
Clip Retention Anchors
For Intel 3000 and 3010 chipset-based platforms that have very limited board space, a
clip retention anchor has been developed to minimize the impact of clip retention on
the board. It is based on a standard two-pin jumper and is soldered to the board like
any common through-hole header. A new anchor design is available with 45° bent leads
to increase the anchor attach reliability over time. See Appendix A for the part number
and supplier information.
26
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
Reference Thermal Solution
6.6
Reliability Guidelines
Each motherboard, heatsink and attach combination may vary the mechanical loading
of the component. Based on the end user environment, the user should define the
appropriate reliability test criteria and carefully evaluate the completed assembly prior
to use in high volume. Some general recommendations are shown in Table B-1.
Table 6-2.
Reliability Guidelines
Test
(1)
Requirement
Pass/Fail Criteria
(2)
Mechanical Shock
50 g, board level, 11 msec,
3 shocks/axis
Visual Check and Electrical
Functional Test
Random Vibration
7.3 g, board level, 45 min/axis,
50 Hz to 2000 Hz
Visual Check and Electrical
Functional Test
Temperature Life
85 °C, 2000 hours total, checkpoints at 168,
500, 1000, and 2000 hours
Visual Check
Thermal Cycling
–5 °C to +70 °C, 500 cycles
Visual Check
Humidity
85% relative humidity, 55 °C, 1000 hours
Visual Check
Notes:
1.
It is recommended that the above tests be performed on a sample size of at least twelve assemblies from
three lots of material.
2.
Additional pass/fail criteria may be added at the discretion of the user.
§
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
27
Reference Thermal Solution
28
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
Thermal Solution Component Suppliers
A
Thermal Solution Component
Suppliers
A.1
Plastic Wave Soldering Heatsink Thermal Solution
Intel Part
Number
Supplier
(Part Number)
Heatsink Assembly
includes:
• Unidirectional Pin-Fin
Heatsink
• Thermal Interface
Material
• Ramp Clip
• Wire Clip
C92237-001
CCI
Undirectional Pin-Fin
Heatsink
(42.30 x 42.30 x 29.0 mm)
C92139-001
Part
Contact Information
Monica Chih (Taiwan)
866-2-29952666, x131
[email protected]
Harry Lin (CCI/ACK-USA)
714-739-5797
[email protected]
CCI
Monica Chih (Taiwan)
866-2-29952666, x131
[email protected]
Harry Lin (CCI/ACK-USA)
714-739-5797
[email protected]
Thermal Interface
(T710)
Heatsink Ramp Clip
-
Chomerics
C92140-001
CCI
Todd Sousa (USA)
360-606-8171
[email protected]
Monica Chih (Taiwan)
866-2-29952666, x131
[email protected]
Harry Lin (CCI/ACK-USA)
714-739-5797
[email protected]
Heatsink Wire Clip
C85373-001
CCI
Monica Chih (Taiwan)
866-2-29952666, x131
[email protected]
Harry Lin (CCI/ACK-USA)
714-739-5797
[email protected]
Solder-Down Anchor
Note:
C85376-001
Wieson
Rick Lin
Deputy Manager/Project Sales
Department
Add.: 7F, No. 276, Section 1, Tatung
Road, Hsichih City, Taipei Hsien,
Taiwan
Tel: 886-2-2647-1896 ext. 6342
Mobile: 886-955644008
Email: [email protected]
Website: www.wieson.com
The enabled components may not be currently available from all suppliers. Contact the supplier directly
to verify time of component availability.
§
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
29
Thermal Solution Component Suppliers
30
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
Mechanical Drawings
B
Mechanical Drawings
Table B-1 Mechanical Drawing List lists the mechanical drawings included in this
appendix.
Table B-1.
Mechanical Drawing List
Drawing Description
Figure Number
Plastic Wave Soldering Heatsink Assembly Drawing
Figure B-1
Plastic Wave Soldering Heatsink Drawing (1 of 2)
Figure B-2
Plastic Wave Soldering Heatsink Drawing (2 of 2)
Figure B-3
Plastic Wave Soldering Heatsink Ramp Clip Drawing (1 of 2)
Figure B-4
Plastic Wave Soldering Heatsink Ramp Clip Drawing (2 of 2)
Figure B-5
Plastic Wave Soldering Heatsink Wire Clip Drawing
Figure B-6
Plastic Wave Soldering Heatsink Solder-down Anchor Drawing
Figure B-7
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
31
Mechanical Drawings
Figure B-1.
32
Plastic Wave Soldering Heatsink Assembly Drawing
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
Mechanical Drawings
Figure B-2.
Plastic Wave Soldering Heatsink Drawing (1 of 2)
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
33
Mechanical Drawings
Figure B-3.
34
Plastic Wave Soldering Heatsink Drawing (2 of 2)
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
Mechanical Drawings
Figure B-4.
Plastic Wave Soldering Heatsink Ramp Clip Drawing (1 of 2)
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
35
Mechanical Drawings
Figure B-5.
36
Plastic Wave Soldering Heatsink Ramp Clip Drawing (2 of 2)
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
Mechanical Drawings
Figure B-6.
Plastic Wave Soldering Heatsink Wire Clip Drawing
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide
37
Mechanical Drawings
Figure B-7.
Plastic Wave Soldering Heatsink Solder-down Anchor Drawing
§
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Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Guide