AN30180A VIN = 2.5V to 5.5V 1.2A Synchronous DC-DC Step Down Regulator FEATURES z z z z z z z z z DESCRIPTION Wide output voltage range : 1.15V to 2.80V Input voltage range : 2.5V to 5.5V Up to 1200mA Output Current Load transient response is fast Output current limit control of 1.8A to prevent Excessive current flows High efficiency over a wide load current area by DCM (discontinuous conductive mode) operation at light loads, CCM (continuous conductive mode) operation in heavy loads those two modes can be automatically switched Switching frequency of 2.6MHz during CCM. 100% duty operation when input voltage goes down to output voltage. 9 pin Wafer level chip size package (WLCSP Type) Size : 1.46 × 1.46 mm ( 0.5 mm pitch) AN30180A is a synchronous DC-DC Step Down Regulator and employs the hysteretic control system. By this system, when load current charges suddenly, it responds at high speed and minimizes the changes of output voltage. Since it is possible to use capacitors with small capacitance and it is unnecessary to add external parts for system phase compensation, this IC realizes downsizing of set and reducing in the number of external parts. APPLICATIONS High Current Distributed Power Systems such as power amplifier in cellular phone etc. SIMPLIFIED APPLICATION EFFICIENCY CURVE 100 90 80 Efficiency[%] 70 CNT1 CNT2 VIN PVIN 4.7 μF x 2 FB 1.0 μH AVIN AN30180A VOUT LX 60 50 40 VIN=2.50V VIN=3.70V VIN=5.50V 30 20 4.7 μF 10 0 EN 1 AGND 10 100 1000 Load Current[mA] PGND Condition : VIN=2.5V , 3.7V , 5.5V, Vout=1.15V , Cout=4.7μF , Lout=1.0μH Notes) This application circuit is an example. The operation of mass production set is not guaranteed. You should perform enough evaluation and verification on the design of mass production set. You are fully responsible for the incorporation of the above application circuit and information in the design of your equipment. Publication date: October 2012 1 Ver. AEB AN30180A ABSOLUTE MAXIMUM RATINGS Parameter Symbol Rating Unit Notes Supply voltage VIN 6.0 V *1 *3 Operating free-air temperature Topr – 30 to + 85 °C *2 Operating junction temperature Tj – 40 to + 150 °C *2 Storage temperature Tstg – 55 to + 150 °C *2 Input Voltage Range FB,EN,CTL1,CTL2 – 0.3 to (VIN + 0.3) V *1 *3 LX – 0.3 to (VIN + 0.3) V *1 *3 HBM (Human Body Model) 2 kV - Output Voltage Range ESD Notes) Do not apply external currents and voltages to any pin not specifically mentioned. This product may sustain permanent damage if subjected to conditions higher than the above stated absolute maximum rating. This rating is the maximum rating and device operating at this range is not guaranteeable as it is higher than our stated recommended operating range. When subjected under the absolute maximum rating for a long time, the reliability of the product may be affected. *1:The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. *2:Except for the power dissipation, operating ambient temperature, and storage temperature, all ratings are for Ta = 25°C. *3:VIN is voltage for AVIN, PVIN. AVIN = PVIN,(VIN + 0.3) V must not be exceeded 6 V. POWER DISSIPATION RATING PACKAGE θJA 9pin Wafer level chip size package 436 °C /W (WLCSP Type) PD(Ta=25°C) PD(Ta=85°C) Notes 0.286 W 0.148 W *1 Note). For the actual usage, please refer to the PD-Ta characteristics diagram in the package specification, follow the power supply voltage, load and ambient temperature conditions to ensure that there is enough margin and the thermal design does not exceed the allowable value. *1:Glass Epoxy Substrate(4 Layers) [Glass-Epoxy: 50 X 50 X 0.8t(mm)] Die Pad Exposed , Soldered. CAUTION Although this has limited built-in ESD protection circuit, but permanent damage may occur on it. Therefore, proper ESD precautions are recommended to avoid electrostatic damage to the MOS gates 2 Ver. AEB AN30180A RECOMMENDED OPERATING CONDITIONS Parameter Symbol Min. Typ. Max. Unit Notes VIN 2.5 3.7 5.5 V *1 *2 FB – 0.3 — VIN + 0.3 V *3 EN – 0.3 — VIN + 0.3 V *3 CNT1 – 0.3 — VIN + 0.3 V *3 CNT2 – 0.3 — VIN + 0.3 V *3 LX – 0.3 — VIN + 0.3 V *3 Supply voltage range Input Voltage Range Output Voltage Range Note) Do not apply external currents and voltages to any pin not specifically mentioned. Voltage values, unless otherwise specified, are with respect to GND. GND is voltage for AGND, PGND. AGND = PGND Vin is voltage for AVIN, PVIN. AVIN = PVIN *1 : Please set the rising time of power input pin to the following range. In addition, please input the voltage with the rising time which has margin enough in consideration of the variation in external parts. *2 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. *3 : (VIN + 0.3) V must not be exceeded 6 V. 0V 100 μs < Tr < 1.5 ms (Tr is the rise time from 0 V to the setup voltage of VIN.) 3 Ver. AEB AN30180A ELECTRICAL CHARACTERISTICS Cout = 4.7 μF (Murata), Lout = 1.0 μH (FDK) , VOUT Setting = 1.15 V , VIN = AVIN = PVIN = 3.7 V, Ta = 25 °C ± 2 °C unless otherwise noted. Limits Parameter Symbol Conditions Min Typ Max Unit Notes [Current Consumption] (DCDC step down regulator) Current Consumption IINQ IOUT = 0A,VOUT = 1.15 V, — 40 80 μA — OFF Current Consumption ISTB EN = L — 0 1 μA — [DCDC Characteristics] (DCDC step down regulator) Output Voltage Setting 1 VOUT1 CNT1 = L , CNT2 = L IOUT = 600 mA 1.115 1.150 1.185 V — Output Voltage Setting 2 VOUT2 CNT1 = H , CNT2 = L IOUT = 600 mA 1.260 1.300 1.340 V — Output Voltage Setting 3 VOUT3 CNT1 = L , CNT2 = H IOUT = 600 mA 1.745 1.800 1.855 V — Output Voltage Setting 4 VOUT4 CNT1 = H , CNT2 = H IOUT = 600 mA 2.715 2.800 2.885 V — Line Regulation VIN = 2.5 V to 5.5 V, REGIN VOUT = 1.15 V IOUT = 600m A — 0.25 0.75 %/V — Load Regulation REGLD — 3.3 5.8 % — Pch-MOS ON Resistance RONP — 0.2 0.4 Ω — Nch-MOS ON Resistance RONN — 0.2 0.4 Ω — VOUT = 1.15 V, IOUT = 10 μA to 1200 mA FSW IOUT = 600 mA ( CCM ) 2.0 2.6 3.2 MHz — Rising Time TSTU Load resistance = 12 Ω Settling time to reach 90 % of setting voltage from EN rising edge — — 120 μs — Output discharge resistance RDIS EN = L — 10 20 Ω — SW Frequency 4 Ver. AEB AN30180A ELECRTRICAL CHARACTERISTICS (Continued) Cout = 4.7 μF (Murata), Lout = 1.0 μH (FDK) , VOUT Setting = 1.15V , VIN = AVIN = PVIN = 3.7 V, Ta = 25 °C ± 2 °C unless otherwise noted. Limits Parameter Symbol Conditions Min Typ Max Unit Notes [Logic Pin Characteristics] (DCDC step down regulator) EN Control Voltage L VENTL — — 0.3 V — EN Control Voltage H VENTH 1.5 — — V — –1 0 1 μA — EN Leak Current IENL VIN = VEN = 5.5 V CNT1 Control Voltage L VCNT1 L — — 0.3 V — CNT1 Control Voltage H VCNT1 H VIN – 0.3 — — V — CNT1 Leak Current ICNT1L VIN = VCNT1 = 5.5 V –1 0 1 μA — CNT2 Control Voltage L VCNT2 L — — 0.3 V — CNT2 Control Voltage H VCNT2 H VIN – 0.3 — — V — CNT2 Leak Current ICNT2L VIN = VCNT2 = 5.5 V –1 0 1 μA — 2.3 2.4 2.5 V — 25 75 125 mV — [Under Voltage Lock out] (DCDC step down regulator) UVLO Detection Voltage VUON UVLO Hysteresis Voltage VUHY VIN rising to Start Operation 5 Ver. AEB AN30180A ELECRTRICAL CHARACTERISTICS (Continued) Cout = 4.7 μF (Murata), Lout = 1.0 μH (FDK) , VOUT Setting = 1.15V , VIN = AVIN = PVIN = 3.7 V, Ta = 25 °C ± 2 °C unless otherwise noted. Reference values Parameter Symbol Conditions Min Typ Max Unit Notes [DCDC] (DCDC step down regulator) Output current limit ILMT at VOUT drops from 1.15 V to 1.035 V CNT1 = L , CNT2 = L — 1.8 — A *1 LX leak current ILXL VIN = 5.5 V,SHUTDOWN, VLX = 0 V or 5.5 V — 0 — μA *1 Efficiency 1 EF1 VOUT = 1.3 V, IOUT = 200mA — 82 — % *1 Output ripple voltage 1 VRPL1 VOUT = 1.15 V, IOUT=600mA — 5 — mV[p-p] *1 Output ripple voltage 2 VRPL2 VOUT = 1.15 V, IOUT = 10 μA — 20 — mV[p-p] *1 Output voltage fluctuation during load increase VLSU C = 4.7 μF, VOUT = 1.15 V, IOUT = 10 μA to 400 mA , Δ t = 1 μs — 25 — mV *1 Output voltage fluctuation during load decrease VLSD C = 4.7 μF, VOUT = 1.15 V, IOUT = 400 mA to 10 μA, Δ t = 1 μs — 50 — mV *1 Stabilization time when increased load current TLSU VOUT = 1.15 V, IOUT = 10 μA to 400 mA, Δ t = 1 μs — 5 — μs *1 *1 : Typical Value checked by design. 6 Ver. AEB AN30180A PIN CONFIGURATION Top View A1 A2 A3 B1 B2 B3 C1 C2 C3 PIN FUNCTION Pin No. Pin name Type Power supply Description A1 AVIN A2 FB A3 AGND Ground B1 PVIN Power supply B2 EN Input ON / OFF Control pin B3 CNT2 Input Output voltage control 2 pin C1 LX Output LX Terminal Output C2 PGND Ground Power Ground C3 CNT1 Input Input Power supply pin Feed Back voltage pin Ground pin Power supply pin for internal Power MOS Output voltage control 1 pin Notes) Concerning detail about pin description, please refer to OPERATION and APPLICATION INFORMATION section. 7 Ver. AEB AN30180A FUNCTIONAL BLOCK DIAGRAM PVIN AVIN ENC EN B1 A1 B2 ON/OFF 1.24V BGR UVLO VREG 2.4V OSP OCP A2 FB C3 C1 CNT1 CNT2 DAC Control Logic B3 Timer LX Driver Generator A3 AGND C2 PGND Notes) This block diagram is for explaining functions. Part of the block diagram may be omitted, or it may be simplified. 8 Ver. AEB AN30180A TYPICAL CHARACTERISTICS CURVES (1) Output ripple voltage VIN = 3.7 V, Vout = 1.15 V , Cout = 4.7 μF , Lout = 1.0 μH Iout = 1200 mA Iout = 600 mA LX LX Vout Vout (2) Load transient response VIN = 3.7 V ,Vout = 1.15 V , Cout = 4.7 μF , Lout = 1.0 μH Iout = 400 mA to 10 μA, Δ t = 1 μsec Iout = 10 μA to 400 mA, Δ t = 1 μsec LX LX Vout Vout Iout Iout 9 Ver. AEB AN30180A TYPICAL CHARACTERISTICS CURVES (Continued) (3) Efficiency VIN = 2.5 V or 3.7 V or 5.5 V , Vout = 1.15 V , Cout = 4.7 μF , Lout = 1.0 μH 100 90 80 Efficiency[%] 70 60 50 40 VIN=2.50V VIN=3.70V VIN=5.50V 30 20 10 0 1 10 100 1000 Load Current[mA] (4) Load regulation VIN = 2.5 V or 3.7 V or 5.5 V , Vout = 1.15 V , Cout = 4.7 μF , Lout = 1.0 μH 1.4 VIN=2.50V VIN=3.70V VIN=5.50V 1.35 Output Voltage [V] 1.3 1.25 1.2 1.15 1.1 1.05 1 0 200 400 600 800 1000 1200 Load Current [mA] 10 Ver. AEB AN30180A OPERATION 1. Pin Setting Pin Voltage Pin No. B2 Description Remarks ON/OFF Control For DC-DC Low High OFF ON Pin No. C3 B3 Pin name CNT1 CNT2 Low Low 1.15 V High Low 1.30 V Low High 1.80 V High High 2.80 V Output Voltage Pin Voltage (*1) 11 Ver. AEB AN30180A OPERATION (Continued) Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed. 2. Protection 1. Power ON / OFF sequence Output Over-Current Protection (OCP) function and Short-Circuit Protection (OSP) function VIN EN BGR UVLO Ground short protection hysteresis 25 μs DCDC_ON SS VOUT Output Voltage [V] (1) The Over-Current Protection is activated at about 1.8 A (Typ.). During the OCP, the output voltage continues to drop at the specified current. (2) The Short-Circuit Protection function is implemented when the output voltage decreases and the VFB pin reaches to about 70 % of the output voltage setting. (3) The OSP operates intermittently at 2ms-ON, 16ms-OFF intervals. Over Current Protection (typ:1.8 A) 1.3 to 2.3 A (1) (2) (3) Intermittent operation area about 150 mA (1)(2) (3) (4) (5) (Ground short protection detection - about 70 % of Vout ) Pendency characteristics Output current [A] Figure : OCP and OSP Operation (1) When the EN pin is set to “High” after the VIN settles, the BGR start-up. (2) When the BGR exceeds its threshold value, the UVLO is released and the SS(SOFT START) sequence is enabled. During soft start the current limit of DC-DC Step Down Regulator is set to be lower than Normal current limit for preventing rush current. Internal circuit power supply is turned on and wait for the time determined by internal timer. (3) DCDC_ON is turned on then DC-DC Step Down Regulator is enabled. VOUT is risen up to reaches the set voltage. (4) After a Soft start timer current limit is set to be Normal current limit. (5) When the EN pin is set to “Low”, the BGR and UVLO stop operation. The VOUT pin voltage starts to drop by output discharge resister and load resistance. (1) IOUT DCDC_ON SS OSP VOUT (2) (2) 2 ms 2 ms 16 ms 16 ms (3) 12 Ver. AEB AN30180A APPLICATIONS INFORMATION 1. Application circuit VIN CNT1 CNT2 PVIN Cin1 FB AVIN Cin2 VOUT AN30180A LX Lout Cout EN AGND PGND 2. Recommended component Reference Designator QTY Value Manufacturer Part Number Note Cin1 1 4.7 μF Murata GRM21BB31E475KA75B — Cin2 1 4.7 μF Murata GRM21BB31E475KA75B — Cout 1 4.7 μF Murata GRM21BB31E475KA75B — Lout 1 1.0 μH FDK MIPSZ2012D1R0 — 3. Evaluation board layout Figure Top Layer with silk screen ( Top View ) with Evaluation board Figure Bottom Layer with silk screen ( Bottom View ) with Evaluation board Notes) This application circuit and layout is an example. The operation of mass production set is not guaranteed. You should perform enough evaluation and verification on the design of mass production set. You are fully responsible for the incorporation of the above application circuit and information in the design of your equipment. 13 Ver. AEB AN30180A PACKAGE INFORMATION (Reference Data) Outline Drawing Package Code : UBGA009-W-1515AEL Unit:mm Body Material : Br/Sb Free Epoxy Resin Reroute Material : Cu Bump : SnAgCu 14 Ver. AEB AN30180A IMPORTANT NOTICE 1.The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. 2.When using the LSI for new models, verify the safety including the long-term reliability for each product. 3.When the application system is designed by using this LSI, be sure to confirm notes in this book. Be sure to read the notes to descriptions and the usage notes in the book. 4.The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information de-scribed in this book. 5.This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 6.This LSI is intended to be used for general electronic equipment. Consult our sales staff in advance for information on the following applications: Special applications in which exceptional quality and reliability are required, or if the failure or malfunction of this LSI may directly jeopardize life or harm the human body. Any applications other than the standard applications intended. (1) Space appliance (such as artificial satellite, and rocket) (2) Traffic control equipment (such as for automobile, airplane, train, and ship) (3) Medical equipment for life support (4) Submarine transponder (5) Control equipment for power plant (6) Disaster prevention and security device (7) Weapon (8) Others : Applications of which reliability equivalent to (1) to (7) is required It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the LSI described in this book for any special application, unless our company agrees to your using the LSI in this book for any special application. 7.This LSI is neither designed nor intended for use in automotive applications or environments unless the specific product is designated by our company as compliant with the ISO/TS 16949 requirements. Our company shall not be held responsible for any damage incurred by you or any third party as a result of or in connection with your using the LSI in automotive application, unless our company agrees to your using the LSI in this book for such application. 8.If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. 9. Please use this product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Our company shall not be held responsible for any damage incurred as a result of your using the LSI not complying with the applicable laws and regulations. 15 Ver. AEB AN30180A USAGE NOTES 1. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. 2. Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. 3. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-board), it might smoke or ignite. 4. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. In addition, refer to the Pin Description for the pin configuration. 5. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to problems such as a solder-bridge between the pins of the semiconductor device. Also, perform a full technical verification on the assembly quality, because the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the LSI during transportation. 6. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pin-VCC short (Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin short (load short) . And, safety measures such as an installation of fuses are recommended because the extent of the abovementioned damage and smoke emission will depend on the current capability of the power supply. 7. The protection circuit is for maintaining safety against abnormal operation. Therefore, the protection circuit should not work during normal operation. Especially for the thermal protection circuit, if the area of safe operation or the absolute maximum rating is momentarily exceeded due to output pin to VCC short (Power supply fault), or output pin to GND short (Ground fault), the LSI might be damaged before the thermal protection circuit could operate. 8. Unless specified in the product specifications, make sure that negative voltage or excessive voltage are not applied to the pins because the device might be damaged, which could happen due to negative voltage or excessive voltage generated during the ON and OFF timing when the inductive load of a motor coil or actuator coils of optical pick-up is being driven. 9. The product which has specified ASO (Area of Safe Operation) should be operated in ASO 10. Verify the risks which might be caused by the malfunctions of external components. 11. Connect the metallic plates on the back side of the LSI with their respective potentials (AGND, PVIN, LX). The thermal resistance and the electrical characteristics are guaranteed only when the metallic plates are connected with their respective potentials. 16 Ver. AEB Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202