RICHTEK RT9011_11

RT9011
Portable Power Management 300mA Dual LDO Regulator
General Description
Features
The RT9011 is a dual channel, low noise, and low dropout
regulator sourcing up to 300mA at each channel. The range
of output voltage is from 1.2V to 3.6V by operating from
2.5V to 5.5V input.
z
Wide Operating Voltage Ranges : 2.5V to 5.5V
z
Low-Noise for RF Application
No Noise Bypass Capacitor Required
Fast Response in Line/Load Transient
TTL-Logic-Controlled Shutdown Input
Low Temperature Coefficient
Dual LDO Outputs (300mA/300mA)
Ultra-low Quiescent Current 27μ
μA/LDO
High Output Accuracy 2%
Short Circuit Protection
Thermal Shutdown Protection
Current Limit Protection
Short Circuit Thermal Folded Back Protection
Tiny TSOT-23-6 and 6-Lead/8-Lead/10-Lead WDFN
Packages
RoHS Compliant and 100% Lead (Pb)-Free
The RT9011 offers 2% accuracy, extremely low dropout
voltage (240mV @ 300mA), and extremely low ground
current, only 27μA per LDO. The shutdown current is near
zero current which is suitable for battery-power devices.
Other features include current limiting, over temperature,
output short circuit protection.
z
z
z
z
z
z
z
z
z
The RT9011 is short circuit thermal folded back protected.
The IC lowers its OTP trip point from 165°C to 110°C when
output short circuit occurs (VOUT < 0.4V) providing
maximum safety to end users.
The RT9011 can operate stably with very small ceramic
output capacitors, reducing required board space and
component cost. The RT9011 is available in fixed output
voltages in the TSOT-23-6, WDFN-8L 2x2, WDFN-10L 3x3,
WDFN-8L 3x3 and WDFN-6L 1.6x1.6 packages.
z
z
z
z
Applications
z
z
z
Ordering Information
z
RT9011-
z
Package Type
J6 : TSOT-23-6
QW : WDFN-8L 2x2 (W-Type)
QWA : WDFN-10L 3x3 (W-Type)
QWB : WDFN-8L 3x3 (W-Type)
QWC : WDFN-6L 1.6x1.6 (W-Type)
Lead Plating System
P : Pb Free
G : Green (Halogen Free and Pb Free)
Note :
Output Voltage : VOUT1/VOUT2
VOUT2 > VOUT1 is Recommended
Richtek products are :
`
RoHS compliant and compatible with the current requirements of IPC/JEDEC J-STD-020.
`
Suitable for use in SnPb or Pb-free soldering processes.
DS9011-08 April 2011
z
CDMA/GSM Cellular Handsets
Battery-Powered Equipment
Laptop, Palmtops, Notebook Computers
Hand-Held Instruments
PCMCIA Cards
Portable Information Appliances
Marking Information
For marking information, contact our sales representative
directly or through a Richtek distributor located in your
area.
Available Voltage Version
Code
Voltage
Code
Voltage
Code
Voltage
A
3.5
D
G
1.85
1.8
B
1.3
C
1.2
E
H
2.1
2
F
J
1.5
2.5
K
N
2.6
2.85
L
P
2.7
3
M
Q
2.8
3.1
R
V
Y
3.2
2.9
1.9
S
W
3.3
1.6
T
X
2.65
3.15
www.richtek.com
1
RT9011
Pin Configurations
(TOP VIEW)
VOUT1 VIN EN1
5
2
VIN
EN1
EN2
NC
4
3
1
2
3
8
GND
9
4
VOUT1
VOUT2
6 NC
5 GND
7
VIN
EN1
EN2
NC
NC
1
2
3
4
5
GND
11
10
9
8
7
9
6
VOUT1
VOUT2
NC
NC
GND
VIN
EN1
EN2
NC
1
2
3
8
7
GND
4
6
9
5
VOUT1
NC
GND
VOUT2
VIN
EN1
EN2
6
1
2
3
GND
7
5
4
VOUT1
VOUT2
GND
VOUT2 GND EN2
TSOT-23-6
WDFN-8L 2x2
WDFN-10L 3x3
WDFN-8L 3x3
WDFN-6L 1.6x1.6
Typical Application Circuit
VIN
VIN
CIN
1uF
VOUT1
RT9011
COUT1
VOUT1
1uF
EN1
Chip Enable
VOUT2
EN2
COUT2
VOUT2
1uF
GND
Functional Pin Description
Pin No.
TSOT-23-6
WDFN-8L WDFN-10L WDFN-8L WDFN-6L Pin Name
2x2
3x3
3x3
1.6x1.6
Pin Function
5
1
1
1
1
VIN
Supply Input.
4
2
2
2
2
EN1
Chip Enable1 (Active High).
3
3
3
3
3
EN2
Chip Enable2 (Active High).
5,
6,
6,
4,
Exposed
Exposed
Exposed
Exposed GND
soldered to a large PCB and connected to
Pad (9)
Pad (11)
Pad (9)
Pad (7)
GND for maximum power dissipation.
1
7
9
5
5
VOUT2
Channel 2 Output Voltage.
6
8
10
8
6
VOUT1
Channel 1 Output Voltage.
--
4, 6
4, 5, 7, 8
4, 7
--
NC
No Internal Connection.
2
www.richtek.com
2
Common Ground. The exposed pad must be
DS9011-08 April 2011
RT9011
Function Block Diagram
EN1
Shutdown
and
Logic Control
0.2uA
VIN
-
VREF
MOS Driver
+
Error
Amplifier
VOUT1
Current-Limit
and
Thermal
Protection
GND
EN2
Shutdown
and
Logic Control
0.2uA
-
VREF
+
Error
Amplifier
MOS Driver
VOUT2
Current-Limit
and
Thermal
Protection
GND
DS9011-08 April 2011
www.richtek.com
3
RT9011
Absolute Maximum Ratings
(Note 1)
Supply Input Voltage -----------------------------------------------------------------------------------------------------Other I/O Pin Voltages --------------------------------------------------------------------------------------------------z Power Dissipation, PD @ TA = 25°C
TSOT-23-6 ------------------------------------------------------------------------------------------------------------------WDFN-8L 2x2 -------------------------------------------------------------------------------------------------------------WDFN-10L 3x3 ------------------------------------------------------------------------------------------------------------WDFN-8L 3x3 -------------------------------------------------------------------------------------------------------------WDFN-6L 1.6x1.6 --------------------------------------------------------------------------------------------------------z Package Thermal Resistance (Note 2)
TSOT-23-6, θJA ------------------------------------------------------------------------------------------------------------WDFN-8L 2x2, θJA --------------------------------------------------------------------------------------------------------WDFN-10L 3x3, θJA ------------------------------------------------------------------------------------------------------WDFN-8L 3x3, θJA --------------------------------------------------------------------------------------------------------WDFN-6L 1.6x1.6, θJA ---------------------------------------------------------------------------------------------------z Junction Temperature ----------------------------------------------------------------------------------------------------z Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------------z Storage Temperature Range -------------------------------------------------------------------------------------------z ESD Susceptibility (Note 3)
HBM (Human Body Mode) ---------------------------------------------------------------------------------------------MM (Machine Mode) -----------------------------------------------------------------------------------------------------z
z
Recommended Operating Conditions
z
z
z
z
−0.3V to 7V
−0.3V to 7V
0.455W
0.606W
0.926W
0.926W
0.571W
220°C/W
165°C/W
108°C/W
108°C/W
175°C/W
150°C
260°C
−65°C to 150°C
2kV
200V
(Note 4)
Supply Input Voltage ------------------------------------------------------------------------------------------------------ 2.5V to 5.5V
Enable Input Voltage ------------------------------------------------------------------------------------------------------ 0V to 5.5V
Junction Temperature Range -------------------------------------------------------------------------------------------- −40°C to 125°C
Ambient Temperature Range -------------------------------------------------------------------------------------------- −40°C to 85°C
Electrical Characteristics
(VIN = VOUT + 1V, VEN = VIN, CIN = COUT = 1μF, TA = −40°C to 85°C, unless otherwise specified.)
Parameter
Symbol
Input Voltage
Dropout Voltage
Test Conditions
VIN = 2.5V to 5.5V
(Note 5)
VDROP
IOUT = 300mA
Min
Typ
Max
Unit
2.5
--
5.5
V
--
240
330
mV
1.2
--
3.6
V
Output voltage range
VOUT
V OUT Accuracy
ΔV
IOUT = 1mA to 300mA
−3
--
+3
%
Line Regulation
ΔVLINE
VIN = (VOUT + 0.3V) to 5.5V or
VIN > 2.5V, whichever is larger
--
--
0.2
%/V
Load Regulation
ΔVLOAD 1mA < IOUT< 300mA
--
--
0.6
%
RLOAD = 1Ω
330
450
700
mA
Current Limit
Quiescent Current
IQ
VEN > 1.5V
--
58
80
μA
Shutdown Current
IQ_SD
VEN < 0.4V
--
--
1
μA
VIH
VIN = 2.5V to 5.5V, Power On
1.5
--
--
VIL
VIN = 2.5V to 5.5V, Shutdown
--
--
0.4
EN Threshold
V
To be continued
www.richtek.com
4
DS9011-08 April 2011
RT9011
Parameter
Symbol
Test Conditions
Output Voltage TC
V OUT Discharge Resistance in
Shutdown
(Note 6)
V IN = 5V, EN1 = EN2 = GND
Min
Typ
Max
Unit
--
100
--
ppm/°C
--
3
--
kΩ
EN Pull Low Current
IEN
--
0.2
--
μA
Thermal Shutdown
TSD
--
170
--
°C
Thermal Shutdown Hysteresis
ΔT SD
--
40
--
°C
f = 100Hz
--
70
--
f = 1kHz
--
70
--
f = 10kHz
--
70
--
f = 100kHz
--
54
--
f = 200kHz
--
45
--
f = 300kHz
--
38
--
C OUT1 = COUT2 = 10uF, 10Hz to
100kHz, IOUT1 = IOUT2 = 1mA
--
100
--
PSRR
VIN = VOUT + 1V, COUT = 2.2μF
ILOAD = 50mA
Output Voltage Noise
PSRR
dB
uVrms
Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. θJA is measured in the natural convection at TA = 25°C on a low effective single layer thermal conductivity test board of
JEDEC 51-3 thermal measurement standard.
Note 3. Devices are ESD sensitive. Handling precaution recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. The dropout voltage is defined as VIN -VOUT, which is measured when VOUT is VOUT(NORMAL) − 100mV.
Note 6. It is guaranteed by design.
DS9011-08 April 2011
www.richtek.com
5
RT9011
Typical Operating Characteristics
Output Voltage vs. Temperature
Output Voltage vs. Temperature
3.4
RT9011-GS, VOUT1
1.85
Output Voltage (V)
Output Voltage (V)
1.9
1.8
1.75
RT9011-GS, VOUT2
3.35
3.3
3.25
3.2
1.7
-50
-25
0
25
50
75
100
-50
125
-25
Temperature (°C)
50
75
100
125
Dropout Voltage vs. Load Current
350
RT9011-GS
VIN = VEN = 4.3V
CIN = COUT1 = COUT2 = 1uF/X7R
RT9011-GS, VOUT2
TJ = 125°C
300
Dropout Voltage (mV)
Quiescent Current (uA)
65
25
Temperature (°C)
Quiescent Current vs. Temperature
70
0
60
55
250
TJ = 25°C
200
150
TJ = -40°C
100
50
50
0
-50
-25
0
25
50
75
100
125
0
100
150
200
250
Load Current (mA)
Power-On
Line Transient Response
RT9011-FM
Both ILOAD = 10mA
300
RT9011-GS, Both ILOAD = 1mA
VIN = 3.8V to 4.8V
VIN 4.8
(V)
VEN
(5V/Div)
3.8
VOUT2
(10mV/Div)
VOUT1
(1V/Div)
VOUT2
(2V/Div)
POR
(5V/Div)
VOUT1
(10mV/Div)
Time (10μs/Div)
www.richtek.com
6
50
Temperature (°C)
Time (100μs/Div)
DS9011-08 April 2011
RT9011
Line Transient Response
Line Transient Response
RT9011-GS, Both ILOAD = 10mA
VIN = 3.8V to 4.8V
RT9011-GS, Both ILOAD = 50mA
VIN = 3.8V to 4.8V
VIN 4.8
(V)
VIN 4.8
(V)
VOUT2
(10mV/Div)
VOUT2
(10mV/Div)
VOUT1
(10mV/Div)
VOUT1
(10mV/Div)
3.8
3.8
Time (100μs/Div)
Time (100μs/Div)
Line Transient Response
Load Transient Response
RT9011-GS, Both ILOAD = 100mA
VIN = 3.8V to 4.8V
VIN 4.8
(V)
RT9011-GS, ILOAD = 10mA to 50mA
VIN = VEN = 4.3V
CIN = COUT1 = COUT2 = 1uF/X7R
IOUT
(50mA/Div)
3.8
VOUT2
(10mV/Div)
VOUT1
(20mV/Div)
VOUT1
(10mV/Div)
VOUT2
(20mV/Div)
Time (100μs/Div)
Time (250μs/Div)
Load Transient Response
Start Up
RT9011-GS, ILOAD = 10mA to 100mA
VIN = VEN = 4.3V
CIN = COUT1 = COUT2 = 1uF/X7R
IOUT
(100mA/Div)
RT9011-FM, VIN = 5V
IOUT1 = IOUT2 = 50mA
(5V/Div)
V EN
V OUT2
VOUT1
(20mV/Div)
V OUT1
VOUT2
(20mV/Div)
(1V/Div)
Time (250μs/Div)
DS9011-08 April 2011
Time (5μs/Div)
www.richtek.com
7
RT9011
PSRR
PSRR
EN Pin Shutdown Response
20
RT9011-FM, VIN = 5V
IOUT1 = IOUT2 = 50mA
IOUT = 50mA
0
V EN
PSRR(dB)
(5V/Div)
V OUT2
V OUT1
-20
-40
-60
(1V/Div)
-80
Time (50μs/Div)
10
100
1000
1k
10000
10k
100000
100k
1000000
1M
Frequency(Hz)
Noise
RT9011-GS, No LOAD
VIN = VEN = 4.5V(By battery)
150
CIN = COUT1 = COUT2 = 1uF/X7R
RT9011-GS, ILOAD = 50mA
VIN = VEN = 4.5V(By battery)
300
CIN = COUT1 = COUT2 = 1uF/X7R
100
200
Noise (μV/Div)
Noise (μV/Div)
Noise
50
0
-50
100
0
-100
-100
-200
-150
-300
Time (10ms/Div)
Time (10ms/Div)
EN1 Pin Response
EN2 Pin Response
VEN1
VEN2
VEN1
VEN1
(2V/Div)
VEN1
VEN2
(2V/Div)
VEN2
VEN2
(2V/Div)
V OUT2
(2V/Div)
V OUT1
V OUT1
(1V/Div)
Time (10ms/Div)
www.richtek.com
8
(1V/Div)
V OUT2
Time (10ms/Div)
DS9011-08 April 2011
RT9011
Applications Information
Like any low-dropout regulator, the external capacitors used
with the RT9011 must be carefully selected for regulator
stability and performance. Using a capacitor whose value
is > 1μF on the RT9011 input and the amount of capacitance
can be increased without limit. The input capacitor must
be located a distance of not more than 0.5 inch from the
input pin of the IC and returned to a clean analog ground.
Any good quality ceramic or tantalum can be used for this
capacitor. The capacitor with larger value and lower ESR
(equivalent series resistance) provides better PSRR and
line-transient response.
The output capacitor must meet both requirements for
minimum amount of capacitance and ESR in all LDOs
application. The RT9011 is designed specifically to work
with low ESR ceramic output capacitor in space-saving
and performance consideration. Using a ceramic capacitor
whose value is at least 1μF with ESR is > 20mΩ on the
RT9011 output ensures stability. The RT9011 still works
well with output capacitor of other types due to the wide
stable ESR range. Figure 1. shows the curves of allowable
ESR range as a function of load current for various output
capacitor values. Output capacitor of larger capacitance
can reduce noise and improve load transient response,
stability, and PSRR. The output capacitor should be located
not more than 0.5 inch from the VOUT pin of the RT9011
and returned to a clean analog ground.
Region of Stable COUT ESR vs. Load Current
Region
ESR (Ω)
(Ω)
OUT ESR
RegionofofStable
StableCCOUT
100
RT9011-FM, VIN = 5V
CIN = COUT1 = COUT2 = 1uF/X7R
Thermal Considerations
Thermal protection limits power dissipation in RT9011.
When the operation junction temperature exceeds 170°C,
the OTP circuit starts the thermal shutdown function and
turns the pass element off. The pass element turns on
again after the junction temperature cools by 40°C.
RT9011 lowers its OTP trip level from 170°C to 110°C
when output short circuit occurs (VOUT < 0.4V) as shown
in Figure 2. It limits IC case temperature under 100°C and
provides maximum safety to customer while output short
circuit occurring.
VOUT Short to GND
0.4V
VOUT
IOUT
TSD
170 °C
110 °C
OTP Trip Point
110 °C
IC Temperature
80 °C
Figure 2. Short Circuit Thermal Folded Back Protection
when Output Short Circuit Occurs (Patent)
For continuous operation, do not exceed absolute
maximum operation junction temperature 125°C. The
power dissipation definition in device is :
10
Unstable Range
1
PD = (VIN-VOUT) x IOUT + VIN x IQ
Stable Range
0.1
0.01
The maximum power dissipation depends on the thermal
resistance of IC package, PCB layout, the rate of
surroundings airflow and temperature difference between
junction to ambient. The maximum power dissipation can
be calculated by following formula :
Simulation Verify
0.001
0
50
100
150
200
Load Current (mA)
Figure 1. Stable Cout ESR Range
DS9011-08 April 2011
250
300
PD(MAX) = ( TJ(MAX) - TA ) /θJA
Where T J(MAX) is the maximum operation junction
temperature, TA is the ambient temperature and the θJA is
the junction to ambient thermal resistance.
www.richtek.com
9
RT9011
For recommended operating conditions specification of
RT9011, the maximum junction temperature is 125°C. The
junction to ambient thermal resistance ( θJA is layout
dependent ) for TSOT-23-6 is 220°C/W, WDFN-8L 2x2 is
165°C/W, WDFN-10L 3x3 is 108°C/W, WDFN-8L 3x3 is
108°C/W and WDFN-8L 1.6x1.6 is 175°C/W on the
standard JEDEC 51-3 single-layer thermal test board. The
maximum power dissipation at TA = 25°C can be calculated
by following formula :
PD(MAX) = ( 125°C − 25°C ) / (220°C/W) = 0.455W for
TSOT-23-6 packages
PD(MAX) = ( 125°C − 25°C ) / (165°C/W) = 0.606W for
WDFN-8L 2x2 packages
PD(MAX) = ( 125°C − 25°C ) / (108°C/W) = 0.926W for
WDFN-10L 3x3 packages
PD(MAX) = ( 125°C − 25°C ) / (108°C/W) = 0.926W for
WDFN-8L 3x3 packages
PD(MAX) = ( 125°C − 25°C ) / (175°C/W) = 0.571W for
WDFN-6L 1.6x1.6 packages
The maximum power dissipation depends on operating
ambient temperature for fixed T J(MAX) and thermal
resistance θJA. For RT9011 packages, the Figure 3 of derating curves allows the designer to see the effect of rising
ambient temperature on the maximum power allowed.
1
Single Layer PCB
Power Dissipation (W)
0.9
WDFN-8L 3x3
WDFN-10L 3x3
0.8
0.7
WDFN-8L 2x2
0.6
0.5
TSOT-23-6
0.4
0.3
WDFN-6L 1.6x1.6
0.2
0.1
0
0
25
50
75
100
125
Ambient Temperature (°C)
Figure 3. Derating Curves for RT9011 Packages
www.richtek.com
10
DS9011-08 April 2011
RT9011
Outline Dimension
H
D
L
C
B
b
A
A1
e
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
0.700
1.000
0.028
0.039
A1
0.000
0.100
0.000
0.004
B
1.397
1.803
0.055
0.071
b
0.300
0.559
0.012
0.022
C
2.591
3.000
0.102
0.118
D
2.692
3.099
0.106
0.122
e
0.838
1.041
0.033
0.041
H
0.080
0.254
0.003
0.010
L
0.300
0.610
0.012
0.024
TSOT-23-6 Surface Mount Package
DS9011-08 April 2011
www.richtek.com
11
RT9011
D2
D
L
E
E2
1
SEE DETAIL A
2
e
A
A1
1
2
1
b
DETAIL A
Pin #1 ID and Tie Bar Mark Options
A3
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
0.700
0.800
0.028
0.031
A1
0.000
0.050
0.000
0.002
A3
0.175
0.250
0.007
0.010
b
0.200
0.300
0.008
0.012
D
1.950
2.050
0.077
0.081
D2
1.000
1.250
0.039
0.049
E
1.950
2.050
0.077
0.081
E2
0.400
0.650
0.016
0.026
e
L
0.500
0.300
0.020
0.400
0.012
0.016
W-Type 8L DFN 2x2 Package
www.richtek.com
12
DS9011-08 April 2011
RT9011
D2
D
L
E
E2
1
SEE DETAIL A
2
e
A
A1
1
2
1
b
DETAIL A
Pin #1 ID and Tie Bar Mark Options
A3
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
0.700
0.800
0.028
0.031
A1
0.000
0.050
0.000
0.002
A3
0.175
0.250
0.007
0.010
b
0.180
0.300
0.007
0.012
D
2.950
3.050
0.116
0.120
D2
2.300
2.650
0.091
0.104
E
2.950
3.050
0.116
0.120
E2
1.500
1.750
0.059
0.069
e
L
0.500
0.350
0.020
0.450
0.014
0.018
W-Type 10L DFN 3x3 Package
DS9011-08 April 2011
www.richtek.com
13
RT9011
D2
D
L
E
E2
1
e
SEE DETAIL A
2
b
2
1
DETAIL A
Pin #1 ID and Tie Bar Mark Options
A
A1
1
A3
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
0.700
0.800
0.028
0.031
A1
0.000
0.050
0.000
0.002
A3
0.175
0.250
0.007
0.010
b
0.200
0.300
0.008
0.012
D
2.950
3.050
0.116
0.120
D2
2.100
2.350
0.083
0.093
E
2.950
3.050
0.116
0.120
E2
1.350
1.600
0.053
0.063
e
L
0.650
0.425
0.026
0.525
0.017
0.021
W-Type 8L DFN 3x3 Package
www.richtek.com
14
DS9011-08 April 2011
RT9011
D2
D
L
E
E2
1
e
2
b
A
A1
SEE DETAIL A
1
2
1
DETAIL A
Pin #1 ID and Tie Bar Mark Options
A3
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
0.700
0.800
0.028
0.031
A1
0.000
0.050
0.000
0.002
A3
0.175
0.250
0.007
0.010
b
0.200
0.300
0.008
0.012
D
1.550
1.650
0.061
0.065
D2
0.950
1.050
0.037
0.041
E
1.550
1.650
0.061
0.065
E2
0.550
0.650
0.022
0.026
e
L
0.500
0.190
0.020
0.290
0.007
0.011
W-Type 6L DFN 1.6x1.6 Package
Richtek Technology Corporation
Richtek Technology Corporation
Headquarter
Taipei Office (Marketing)
5F, No. 20, Taiyuen Street, Chupei City
5F, No. 95, Minchiuan Road, Hsintien City
Hsinchu, Taiwan, R.O.C.
Taipei County, Taiwan, R.O.C.
Tel: (8863)5526789 Fax: (8863)5526611
Tel: (8862)86672399 Fax: (8862)86672377
Email: [email protected]
Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit
design, specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be
guaranteed by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek.
DS9011-08 April 2011
www.richtek.com
15