TI BQ76PL536

bq76PL536
www.ti.com
SLUSA08A – DECEMBER 2009 – REVISED JULY 2010
3 to 6 Series Cell Lithium-Ion Battery Monitor and Secondary Protection IC for EV and
HEV Applications
Check for Samples: bq76PL536
FEATURES
APPLICATIONS
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1
2
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3 to 6 Series Cell Support, All Chemistries
Hot-Pluggable
High-Speed SPI for Data Communications
Stackable Vertical Interface
No Isolation Components Required Between
ICs
Industrial Temperature Range, –40°C to 85°C
High-Accuracy Analog-to-Digital Converter
(ADC):
– ±3 mV Typical accuracy
– 14-Bit Resolution, 6-µs Conversion Time
– Nine ADC Inputs: 6 Cell Voltages, 1 Six-Cell
Brick Voltage, 2 Temperatures, 1
General-Purpose Input
– Dedicated Pins for Synchronizing
Measurements
Configuration Data Stored in ECC-OTP
Registers
Built-In Comparators (Secondary Protector)
for:
– Over- and Undervoltage Protection
– Overtemperature Protection
– Programmable Thresholds and Delay Times
– Dedicated Fault Output Signals for OV, UV,
OT
Cell Balancing Control Outputs With Safety
Timeout
– Balance Current Set by External
Components
Supply Voltage Range from 6 V to 30 V
Continuous and 36 V Peak
Low Power:
– Typical 12-µA Sleep, 45-µA Idle
Integrated Precision 5-V, 3-mA LDO
Uninterruptible Power Systems (UPS)
E-Bike and E-Scooter
Large-Format Battery Systems
Electric and Hybrid Electric Vehicles
DESCRIPTION
The bq76PL536 is a stackable three to six series cell
lithium-ion battery pack protector and analog front
end
(AFE)
that
incorporates
a
precision
analog-to-digital converter (ADC); independent cell
voltage and temperature protection; cell balancing,
and a precision 5-V regulator to power user circuitry.
The bq76PL536 integrates a voltage translation and
precision analog-to-digital converter system to
measure battery cell voltages with high accuracy and
speed.
The bq76PL536 provides full protection (secondary
protection) for overvoltage, undervoltage, and
overtemperature conditions. When safety thresholds
are exceeded, the bq76PL536 sets the FAULT
output. No external components are needed to
configure or enable the protection features.
Cell voltage and temperature protection functions are
independent of the ADC system. Programmable
protection thresholds and detection delay times are
stored in Error Check/Correct (ECC) OTP EPROM,
which increases the flexibility and reliability of the
battery management system.
The bq76PL536 is intended to be used with a host
controller to maximize the functionality of the battery
management system. However, the protection
functions do not require a host controller.
The bq76PL536 can be stacked vertically to monitor
up to 192 cells without additional isolation
components between ICs. A high-speed serial
peripheral interface (SPI) bus operates between each
bq76PL536 to provide reliable communications
through a high-voltage battery cell stack.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009–2010, Texas Instruments Incorporated
bq76PL536
SLUSA08A – DECEMBER 2009 – REVISED JULY 2010
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
DESCRIPTION (CONTINUED)
The host microcontroller controls cell balancing of individual cells by setting the registers (via SPI) which control
the appropriate CBx outputs. These outputs can be turned off via the same control, or automatically by the
internal programmable safety timer. The balancing bypass current is set via an external series resistor and FET.
TYPICAL IMPLEMENTATION
PACK+
CONTROL (North)
SPI
FAULT
ALERT
CONV
DRDY
TO NEXT DEVICE
SPI
(North)
CELL_6
bq76PL536
HO S T I NT ERF ACE
(n o t u sed )
GPIO
CBx (6)
CELL_1
CONTROL (North)
SPI
(South)
SPI
ALERT
FAULT
DRDY
CONV
CONTROL (South)
REG50
AUX
••• CELL_2-5 •••
GPAI
SPI
(North)
CELL_6
GPIO
bq76PL536
AUX
••• CELL_2-5 •••
GPAI
DRDY
FAULT
ALERT
SPI
HO S T I NT ERF ACE
HOST
INTERFACE
CONV
CBx (6)
CELL_1
South Interface
(not used on bottom device)
PACK-
Figure 1. Simplified System Connection
PIN DETAILS
PIN FUNCTIONS
PIN
NO.
(1)
2
NAME
TYPE (1)
DESCRIPTION
1
VC6
AI
Sense voltage input terminal for the positive terminal of the sixth cell
2
CB6
O
Cell-balance control output
3
VC5
AI
Sense voltage input terminal for the positive terminal of the fifth cell
4
CB5
O
Cell-balance control output
5
VC4
AI
Sense voltage input terminal for the positive terminal of the fourth cell
6
CB4
O
Cell-balance control output
Key: I = digital input, AI = analog input, O = digital output, OD = open-drain output, T = 3-state output, P = power.
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PIN
NO.
NAME
SLUSA08A – DECEMBER 2009 – REVISED JULY 2010
TYPE (1)
DESCRIPTION
7
VC3
AI
Sense voltage input terminal for the positive terminal of the third cell
8
CB3
O
Cell-balance control output
9
VC2
AI
Sense voltage input terminal for the positive terminal of the second cell
10
CB2
O
Cell-balance control output
11
VC1
AI
Sense voltage input terminal for positive terminal of the first cell
12
CB1
O
Cell-balance control output
13
VC0
AI
Sense-voltage input terminal for negative terminal of first cell (VSS)
14
VSS1
P
VSS
15
AGND
AI
Internal analog VREF (–)
16
VREF
P
Internal analog voltage reference (+), requires 10-µF, low-ESR ceramic capacitor to AGND for stability
17
LDOA
P
Internal analog 5-V LDO bypass connection, requires 2.2-µF ceramic capacitor for stability
18
LDOD1
P
Internal digital 5-V LDO bypass connection 1, requires 2.2-µF ceramic capacitor for stability. This pin is tied
internally to LDOD2. This pin should be tied to LDOD2 externally.
19
TS1–
AI
Differential temperature sensor input
20
TS1+
AI
Differential temperature sensor input
21
CONV_S
I
22
DRDY_S
OD
Current-mode output indicating conversion data is ready to the next lower bq76PL536
23
ALERT_S
OD
Current-mode output indicating a system status change to the next lower bq76PL536
24
FAULT_S
OD
Current-mode output
25
VSS2
P
VSS
26
SCLK_S
I
Current-mode input SPI clock from the next-lower bq76PL536
27
SDO_S
OD
Current-mode output for SPI data to the next-lower bq76PL536
28
SDI_S
I
Current-mode input for SPI data from the next-lower bq76PL536
29
CS_S
I
Current-mode input SPI chip-select (slave-select) from the next-lower bq76PL536
30
NC
–
No connection
31
AUX
O
Switched 1-mA limited output from REG50
32
REG50
P
5-V user LDO output, requires 2.2-µF ceramic capacitor for stability
33
VSS3
P
VSS
34
VSS4
P
VSS
35
VSS5
P
VSS
36
CONV_H
I
Host-to-device interface – initiates a synchronous conversion. Pin has 250-nA internal sink to VSS.
37
DRDY_H
O
Host-to-device interface – conversion complete, data-ready indication
38
ALERT_H
O
Host-to-device interface – ALERT condition detected in this or higher (North) device
39
FAULT_H
O
Host-to-device interface – FAULT condition detected in this or higher (North) device
40
SCLK_H
I
Host-to-device interface – SPI clock from host
41
SDO_H
O
Host-to-device interface – data from device to host (host MISO signal), 3-state pin, 250-nA internal pullup
42
SDI_H
I
Host-to-device interface – data from host to device (host MOSI signal)
43
CS_H
I
Host-to-device interface – active-low chip select from host. Internal 100-kΩ pullup resistor
44
HSEL
I
Host interface enable, 0 = enable, 1 = disable
45
GPIO
IOD
46
LDOD2
P
Internal digital 5-V LDO bypass connection 2, requires 2.2-µF ceramic capacitor for stability. This pin is tied
internally to LDOD1. This pin should be tied to LDOD1 externally.
47
GPAI–
AI
General-purpose (differential) analog input, connect to VSS if unused.
48
GPAI+
AI
General-purpose (differential) analog input, connect to VSS if unused.
49
VSS6
P
VSS
50
TEST
I
Factory Test pin. Connect to VSS in user circuitry. This pin includes ~100K internal pull-down
51
NC
–
No connect
52
CS_N
OD
Input from the adjacent lower bq76PL536 to initiate a conversion
Digital open-drain I/O. A 10 kΩ–2-MΩ pullup is recommended.
Current-mode output used to select the next-higher bq76PL536 for SPI communication
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bq76PL536
SLUSA08A – DECEMBER 2009 – REVISED JULY 2010
PIN
NO.
NAME
www.ti.com
TYPE (1)
DESCRIPTION
53
SDI_N
OD
Current-mode output for SPI data to the next-higher bq76PL536
54
SDO_N
I
Current-mode input for SPI data from the next-lower bq76PL536
55
SCLK_N
OD
56
FAULT_N
I
Current-mode input indicating a system status change from the next-higher bq76PL536
57
ALERT_N
I
Current-mode input indicating a system status change from the next-higher bq76PL536
58
DRDY_N
I
Current-mode input indicating conversion data is ready from next-higher bq76PL536
59
CONV_N
OD
Current-mode output to the next-higher bq76PL536 to initiate a conversion
60
TS2–
AI
Differential temperature sensor input
61
TS2+
AI
Differential temperature sensor input
62
NC
–
No connect
63
BAT1
P
Power-supply voltage, connect to most positive cell +, tie to BAT2 on PCB
64
BAT2
P
Power-supply voltage, connect to most positive cell +, tie to BAT1 on PCB
65
TAB
–
Tab on bottom of PowerPAD™ package, this must be soldered to similar-size copper area on PCB,
connected to VSS, to meet stated specifications herein. Provides heat-sinking to part.
Current-mode output SPI clock to the next-higher bq76PL536
VSS
TEST
NC51
CS_N
SDI_N
SDO_N
SCLK_N
ALERT_N
FAULT_N
DRDY_N
TS2–
CONV_N
TS2+
NC62
BAT
BAT
PINOUT DIAGRAM
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
VC6
1
48
GPAI+
CB6
2
47
GPAI–
VC5
3
46
LDOD2
CB5
4
45
GPIO
VC4
5
44
HSEL
CB4
6
43
CS_H
VC3
7
42
SDI_H
CB3
8
bq76PL536
41
SDO_H
VC2
9
LQFP-64
40
SCLK_H
CB2
10
39
FAULT _H
VC1
11
38
ALERT_H
CB1
12
37
DRDY_H
VC0
13
36
CONV_H
VSS
14
35
VSS
AGND
15
34
VSS
VREF
16
33
VSS
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REG50
AUX
NC30
CS_S
SDI_S
SDO_S
SCLK_S
VSS
FAULT_S
ALERT_S
DRDY_S
CONV_S
TS1-
TS1+
LDOA
4
LDOD1
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s) :bq76PL536
bq76PL536
www.ti.com
SLUSA08A – DECEMBER 2009 – REVISED JULY 2010
ORDERING INFORMATION
(1)
TA
PACKAGE
PART NO.
–40°C To 85°C
64 TQFP PowerPAD
package
bq76PL536PAP (1)
The bq76PL536 can be ordered in tape and reel as
bq76PL536PAPR (quantity 1000) or bq76PL536PAPT (quantity
250).
LDOD
LDO-A
LDO-D
VBAT
LDOA
REG50
AUX
FUNCTIONAL BLOCK DIAGRAM
bq76PL536
CONV_N
TS2+
OT1
1.25V REF2
DRDY_N
FAULT _N
LEVELSHIFTED
NORTH
COMM’s
INTERFACE
ALERT_N
CS_N
SCLK_N
TS2-
5V LDO
(User Circuitry)
TS1+
OT2
TS1THERMAL
SHUTDOWN
OV
VC6
UV
SDI_N
CB6
EPROM
OV
SDO_N
VC5
SHADOW RAM
CONV_H
UV
DRDY_H
SDI_H
DIGITAL
CONTROL
LOGIC
SDO_H
CONV_S
2.5V
DRDY_S
FAULT _S
ALERT_S
CS_S
SCLK_S
VREF
LEVELSHIFTED
SOUTH
COMM’s
INTERFACE
+
-
CELL BALANCING
14 bit
ADC
LEVEL SHIFT & MUX
SCLK_H
ULTRA-PRECISION
BANDGAP
CS_H
HOST
INTERFACE
FAULT _H
ALERT_H
CB5
OV
UV
OV
UV
OV
VC4
CB4
VC3
CB3
VC2
UV
CB2
OV
VC1
UV
CB1
SDI_S
OSC
SDO_S
VC0
VSS
VSS
GPAI–
GPAI+
AGND
VREF
GPIO
REF2
Figure 2. bq76PL536 Block Diagram
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bq76PL536
SLUSA08A – DECEMBER 2009 – REVISED JULY 2010
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ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
(2)
VALUE
UNIT
Supply voltage range, VMAX
BAT1
–0.3 to 36
V
BAT voltage to any other pin
BAT to any pin
–0.3 to 36
V
VC1–VC6
–0.3 to 36
VC0
–0.3 to 2
VCn to VCn-1, n=1 to 6
Input voltage range, VIN
0 to 36
TS1+, TS1–, TS2+, TS2–
–0.3 V to 6
–0.3 to 6
GPIO
–0.3 to VREG50 + 0.3
DRDY_N, SDO_N, FAULT_N, ALERT_N
–0.3 to 36
CONV_S, SDI_S, SCLK_S, CS_S
–2 to 1
CONV_N, SDI_N, SCLK_N, CS_N
–0.3 to 36
DRDY_S, SDO_S, FAULT_S, ALERT_S
Output voltage range, VO
–0.3 to 5
GPIO
–0.3 to VREG50 + 0.3
CB1…CB6 (CBREF = 0x00)
–0.3 to 36
REG50, AUX
–0.3 to 6
Junction temperature
Storage temperature range, TSTG
(1)
(2)
V
GPAI
V
150
°C
–65 to 150
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only; functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to VS of this device except VCn–VC(n+1), where n = 1 to 6 cell voltage.
RECOMMENDED OPERATING CONDITIONS
Typical values stated where TA = 25ºC and BAT = 20 V, Min/Max values stated where TA = –40˚C to 85ºC and BAT = 7.2 V to
30 V (unless otherwise noted)
MIN
VBAT
VI
Supply voltage
Input voltage range
BAT
NOM
MAX
7.2
27
VCn–VC(n – 1) (1)
1
4.5
GPAI
0
2.5
GPIO
0
VREG50
VC(n –
1)
VCn
CBn (1)
TS1+, TS1–, TS2+, TS2–
0
DRDY_N, SDO_N, FAULT_N, ALERT_N
UNIT
V
V
VREG50/2
BAT + 1
CONV_S, SDI_S, SCLK_S, CS_S
–1
CONV_N, SDI_N, SCLK_N, CS_N
BAT – 1
VO
Output voltage range
CREG50
External capacitor
REG50 pin
2.2
CVREF
External capacitor
VREF pin
9.2
15
µF
CLDO
External capacitor
LDOx pin
2.2
3.3
µF
TOPR
Operating temperature (2)
–40
85
°C
(1)
(2)
6
DRDY_S, SDO_S, FAULT_S, ALERT_S
V
1
µF
10
n = 1 to 6
Device specifications stated within this range.
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SLUSA08A – DECEMBER 2009 – REVISED JULY 2010
ELECTRICAL CHARACTERISTICS
SUPPLY CURRENT
Typical values stated where TA = 25°C and BAT = 20 V, Min/Max values stated where TA = –40°C to 85°C and BAT = 7.2 V
to 27 V (unless otherwise noted)
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
12
20
µA
ICCSLEEP
Supply current
No load at REG50, SCLK_N, SDI_N, SDO_N, FAULT_N,
CONV_N, DRDY_S, ALERT_N, TSx, AUX, or CBx;
CB_CTRL = 0; CBT_CONTROL = 0;
CONV_H = 0 (not converting), IO_CTRL[SLEEP] = 1
ICCPROTECT
Supply current
No load at REG50, SCLK_N, SDI_N, SDO_N, FAULT_N,
CONV_N, DRDY_S, ALERT_N, TSx, AUX, or CBx;
CB_CTRL = 0; CBT_CONTROL = 0;
CONV_H = 0 (not converting), IO_CTRL[SLEEP] = 0
45
60
µA
ICCBALANCE
Supply current
No load at REG50, SCLK_N, SDI_N, SDO_N, FAULT_N,
CONV_N, DRDY_S, ALERT_N, TSx, or AUX;
No DC load at CBx; CB_CTRL ≠ 0; CBT_CONTROL ≠0;
CONV_H = 0 (not converting) , IO_CTRL[SLEEP] = 0
46
60
µA
ICCCONVERT
Supply current
No load at REG50, SCLK_N, SDI_N, SDO_N, FAULT_N,
CONV_N, DRDY_S, ALERT_N, TSx or CBx; CONV_S = 1
(conversion active) , IO_CTRL[SLEEP] = 0
10.5
15
mA
ICCTSD
Supply current
Thermal shutdown activated; ALERT_STATUS[TSD] = 1;
Device die temperature ≥ 100°C
1.6
2.2
mA
REG50, INTEGRATED 5-V LDO
Typical values stated where TA = 25°C and BAT = 20 V, Min/Max values stated where TA = –40°C to 85°C and BAT = 7.2 V
to 27 V (unless otherwise noted)
PARAMETER
TEST CONDITION
VREG50
Output voltage
IREG50OUT ≤ 0.5 mA, C = 2.2 mF to 22 mF
ΔVREG50LINE
Line regulation
6 V ≤ BAT ≤ 27 V, IREG50OUT = 2 mA
ΔVREG50LOAD
Load regulation
IREG50MAX
Current limit
IAUXMAX
Current limit
RAUX
AUX output
MIN
TYP
MAX
4.9
5
5.1
V
10
25
mV
0.2 mA ≤ IREG50OUT ≤ 2 mA
15
0.2 mA ≤ IREG50OUT ≤ 5 mA
25
12
25
I = 1 mA, max. capacitance = VREG50
Capacitor: CVAUX ≤ CVREG50 / 10
UNIT
mV
35
mA
5
mA
50
Ω
LEVEL SHIFT INTERFACE
Typical values stated where TA = 25°C and BAT = 20 V, Min/Max values stated where TA = –40°C to 85°C and BAT = 7.2 V
to 27 V (unless otherwise noted)
TEST CONDITION
MIN
TYP
MAX
UNIT
INTX1
North 1 transmitter current
PARAMETER
SCLK_N, CS_N, SDI_N, CONV_N
–755
–840
–1020
µA
INTX0
North 0 transmitter current
SCLK_N, CS_N, SDI_N, CONV_N
–1
µA
ISRX
South 1 receiver current
SCLK_S, CS_S, SDI_S, CONV_S
525
620
665
µA
ISTX1
South 1 transmitter current
SDO_S, ALERT_N, FAULT_S, DRDY_S
925
1040
1200
µA
ISTX1
South 0 transmitter current
SDO_S, ALERT_S, FAULT_S, DRDY_S
1
µA
INRX
North 1 receiver current
SDO_N, ALERT_N, FAULT_N, DRDY_N
–350
–420
–580
µA
CIN
Input capacitance (1)
(1)
15
pF
Specified by design, not tested in production.
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HOST INTERFACE
Typical values stated where TA = 25°C and BAT = 20 V, Min/Max values stated where TA = –40°C to 85°C and BAT = 7.2 V
to 27 V (unless otherwise noted)
PARAMETER
TEST CONDITION
VOH
Logic-level output voltage, high; SDO_H, FAULT_H,
ALERT_H, DRDY
CL = 20 pF, IOH < 5 mA (1)
VOL
Logic-level output voltage, low; SDO_H, FAULT_H,
ALERT_H, DRDY
CL = 20 pF, IOL < 5 mA
VIH
Logic-level input voltage, high; SCLK_H, SDI_H, CS_H,
CONV
VIL
Logic-level input voltage, low; SCLK_H, SDI_H, CS_H,
CONV
CIN
Input capacitance (2) SCLK_H, SDI_H, CS_H, CONV
ILKG
(1)
(2)
Input leakage current
(2)
MIN
TYP
MAX
UNIT
4.5
VLDOD
V
VSS
0.5
V
2
5.2
V
VSS
0.8
V
5
pF
SCLK_H, SDI_H, CS_H, CONV
1
µA
Total simultaneous current drawn from all pins is limited by LDOD current to ≤10 mA.
Specified by design, not tested in production.
GENERAL PURPOSE INPUT/OUTPUT (GPIO)
Typical values stated where TA = 25°C and BAT = 20 V, Min/Max values stated where TA = –40°C to 85°C and BAT = 7.2 V
to 27 V (unless otherwise noted)
PARAMETER
TEST CONDITION
MIN
Vin ≤ VREG50
VIH
Logic-level input voltage, high
VIL
Logic-level input voltage, low
VOH
Output high-voltage pullup voltage
Supplied by external ~100K resistor
VOL
Logic-level output voltage, low
IOL = 1mA
CIN
Input capacitance(1)
ILKG
Input leakage current
TYP
MAX
2
UNIT
V
0.8
V
VREG50
V
0.3
V
5
pF
1
µA
CELL BALANCING CONTROL OUTPUT (CBx)
Typical values stated where TA = 25°C and BAT = 20 V, Min/Max values stated where TA = –40°C to 85°C and BAT = 7.2 V
to 27 V (unless otherwise noted)
PARAMETER
CBz
Output impedance
VRANGE
Output V
TEST CONDITIONS
1 V < VCELL < 5 V
MIN
TYP
MAX
UNIT
80
100
120
kΩ
VCn
V
VCn-1
ANALOG-TO-DIGITAL CONVERTER
ADC Common Specifications
Typical values stated where TA = 25°C and BAT = 20 V, Min/Max values stated where TA = –40°C to 85°C and BAT = 7.2 V
to 27 V (unless otherwise noted)
PARAMETER
TEST CONDITION
tCONV_START
CONV high to conversion start (1),
tCONV
Conversion time per selected channel (4), (3)
ADC_CONTROL[ADC_ON] = 1
FUNCTION_CONFG[ADCTx]=00
ILKG
Input leakage current
Not converting
(1)
(2)
(3)
(4)
8
(2) (3)
ADC_CONTROL[ADC_ON] = 1
,
MIN
TYP
MAX
5.4
6
6.6
ADC_CONTROL[ADC_ON] = 0
500
5.4
UNIT
µs
µs
6
6.6
µs
<10
100
nA
If ADC_CONTROL[ADC_ON] = 0, add 500 µs to conversion time to allow ADC subsystem to stabilize. This is self-timed by the part.
Additional 50 ms (POR) required before first conversion after a) initial cell connection; or b) VBAT falls below VPOR
ADC specifications valid when device is programmed for 6-µs conversion time per channel, FUNC_CONFIG[ADCT1:0] = 01b.
Plus TCONV_START, i.e., if device is programmed for six channel conversions, total time is approximately 6 × 6 + 6 = 42 µs.
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VCn (Cell) Inputs
Typical values stated where TA = 25°C and BAT = 20V, Min/Max values stated where TA = –40˚C to 85°C and BAT = 7.2 V to
27 V (unless otherwise noted), FUNCTION_CONFIG[]=01xxxx00b for all test conditions (6-µs conversion time selected).
PARAMETER
TEST CONDITIONS
Input voltage range (1)
VIN
MIN
VCn - VCn-1, where n = 1 to 6
(2)
TYP
Voltage resolution
VACC
Voltage accuracy, measured value,
VIN = VCn to VCn-1
0.5 V < VIN < 2.5 V
RIN
Effective input resistance
Converting
2
Converting
40
CIN
Input capacitance
EN
Noise (4)
(1)
(2)
(3)
(4)
14 bits
UNIT
6
VRES
V
~378
2.5 V ≤ VIN ≤ 5 V
(3)
MAX
0
µV
–0.25%
±0.1%
0.25%
–0.2%
±0.1%
0.2%
VIN = 3 V
MΩ
pF
<250
µVRMS
0 V may not lie within the range of measured values due to offset voltage limit and device calibration.
See text for specific conversion formula.
ADC is factory trimmed at the conversion speed of ~6 µs/channel (FUNC_CONFIG[ADCT1:0] = 01b). Use of a different
conversion-speed setting may affect measurement accuracy.
Specified by design, not measured in production
VBAT (VBRICK) Measurement
Typical values stated where TA = 25°C and BAT = 20 V, Min/Max values stated where TA = –40˚C to 85°C and BAT = 7.2 V
to 27 V (unless otherwise noted), FUNCTION_CONFIG[] = 01xxxx00b for all test conditions
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
VIN
Input voltage range (1), BATn to VSS
FUNCTION_CONFIG[] = 0101xx00b
VRES
Voltage resolution (2)
14 bits
VACC
Voltage accuracy, (3) VIN = BAT – VSS
CIN
Input capacitance (4)
Converting
40
pF
RIN
Effective input resistance
Converting
50
kΩ
EN
Noise (4)
(1)
(2)
(3)
(4)
0
30
V
~1.831
mV
6 V < VIN < 18V
–0.6%
±0.3%
0.6%
18 V ≤ VIN ≤ 27 V
–0.4%
±0.2%
0.4%
<1.5
mVRMS
0 V may not lie within the range of measured values due to offset voltage limit and device calibration.
See text for specific conversion formula.
ADC is factory trimmed at the conversion speed of ~6 µs/channel (FUNC_CONFIG[ADCT1:0] = 01b). Use of a different
conversion-speed setting may affect measurement accuracy.
Specified by design, not measured in production
GPAI Measurement
Typical values stated where TA = 25°C and BAT = 20 V, Min/Max values stated where TA = –40˚C to 85°C and BAT = 7.2 V
to 27 V (unless otherwise noted), FUNCTION_CONFIG[] = 0101xx00b for all test conditions
PARAMETER
(1)
TEST CONDITION
VIN
Input voltage range,
VRES
Voltage resolution (2)
GPAI+ to GPAI–
14 bits
VACC
Voltage accuracy, (3) VIN = GPAI+ – GPAI–
0.25 V ≤ VIN ≤ 2.5 V
(4)
CIN
Input capacitance
RIN
Effective input resistance
EN
Noise (4)
(1)
(2)
(3)
(4)
MIN
TYP
0
MAX
UNIT
2.5
V
~153
–0.2%
±0.1%
µV
0.2%
Converting
40
pF
Converting
50
KΩ
<150
µVRMS
0 V may not lie within the range of measured values due to offset voltage limit and device calibration.
See text for specific conversion formula.
ADC is factory trimmed at the conversion speed of ~6 µs/channel (FUNC_CONFIG[ADCT1:0] = 01b). Use of a different
conversion-speed setting may affect measurement accuracy.
Specified by design, not measured in production
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TSn Measurement
Typical values stated where TA = 25°C and BAT = 20V, Min/Max values stated where TA = –40˚C to 85°C and BAT = 7.2V to
27V (unless otherwise noted), FUNCTION_CONFIG[]=01xxxx00b for all Test Conditions
PARAMETER
TEST CONDITION
VIN
Input voltage range, (1) TSn+ TSn–
VRES
Voltage resolution, (2)
14 bits, REG50 = 5 V,
(Resolution ≈ VREG50/215)
VACC
Ratio accuracy, % of input (2)
0.25 V ≤ VIN ≤ 2.5 V
(3)
CIN
Input capacitance
RIN
Effective input resistance (3)
EN
Noise (3)
(1)
(2)
(3)
MIN
TYP
0
MAX
2.5
~153
–0.25%
±0.1%
UNIT
V
µV
0.25%
Converting
40
pF
Converting
50
kΩ
<150
µVRMS
0 V may not lie within the range of measured values due to offset voltage limit and device calibration.
See text for specific conversion formula.
Specified by design, not measured in production
THERMAL SHUTDOWN
PARAMETER
THYS
(1)
TEST CONDITIONS
Shutdown threshold (1)
TSD
Recovery hysteresis
BAT = 20 V
MIN
TYP
MAX
UNIT
125
142
156
°C
8
25
°C
(1)
Specified by design, not measured in production.
UNDERVOLTAGE LOCKOUT (UVLO) and POWER-ON RESET (POR)
Typical values stated where TA = 25°C and BAT = 20 V, Min/Max values stated where TA = –40˚C to 85°C and BAT = 7.2 V
to 27 V (unless otherwise noted)
PARAMETER
TEST CONDITION
VUVLO
Negative-going threshold
VUVLO_HSY
Hysteresis
UVLODELAY
Delay to locked-out condition
VPOR
Negative-going threshold
VPOR_HSY
Hysteresis
PORDELAY
Delay to disabled condition
V ≤ VPOR MIN
tRST
Reset delay time
V ≥ VPOR + VPOR_HSY
10
MIN
NOM
MAX
5.6
V
375
500
mV
5
250
V ≤ VUVLO MIN
15
4
250
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5
500
56
V
750
mV
70
ms
15
40
UNIT
µs
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BATTERY PROTECTION THRESHOLDS
Typical values stated where TA = 25°C and BAT = 20 V, Min/Max values stated where TA = –40˚C to 85°C and BAT = 7.2 V
to 27 V (unless otherwise noted)
PARAMETER
TEST CONDITION
MIN
NOM
MAX
UNIT
VOVR
OV detection threshold range (1)
ΔVOVS
OV detection threshold program step
50
VOVH
OV detection hysteresis
50
VOVA1
OV detection threshold accuracy
3.3 ≤ VOV_SET ≤ 4.5
–50
0
50
mV
VOVA2
OV detection threshold accuracy
VOV_SET < 3.3 or VOV_SET > 4.5
–70
0
70
mV
3300
mV
2
(1)
5
V
mV
mV
VUVR
UV detection threshold range
ΔVUVS
UV detection threshold program step
100
mV
VUVH
UV detection hysteresis
100
mV
VUVA
UV detection threshold accuracy
VOTR
OT detection threshold range (2)
ΔVOTS
OT detection threshold program step (2)
VOTA
OT detection threshold accuracy
ΔVOTH
OT reset hysteresis
(1)
(2)
(3)
700
–100
VREG50 = 5 V
0
2
See
(2)
100
1
T = 40°C to 90°C
T = 40°C to 90°C
8%
(3)
mV
V
V
0.04
0.05
12%
15%
V
COV and CUV thresholds must be set such that COV – CUV ≥ 300 mV
Using recommended components. Consult Table 2 in text for voltage levels used.
See Table 2 for trip points.
BATTERY PROTECTION DELAY TIMES
Typical values stated where TA = 25°C and BAT = 20 V, Min/Max values stated where TA = –40˚C to 85°C and BAT = 7.2 V
to 27 V (unless otherwise noted)
PARAMETER
tOV
OV detection delay-time range
ΔtOV
OV detection delay-time step
tUV
UV detection delay-time range
TEST CONDITION
MIN
MAX
UNIT
3200
ms
COVT [µs/ms] = 0
100
µs
COVT [µs/ms] = 1
100
ms
0
CUVT[7] (µs/ms) = 0
3200
100
ΔtUV
UV detection delay-time step
tOT
OT detection delay-time range
ΔtOT
OT detection delay-ime step
tacr
OV, UV, and OT detection delay-time
accuracy (1)
CUVT, (COVT) ≥ 500µs
t(DETECT)
Protection comparator detection time
VOT or VOV or VUV threshold exceeded by
10 mV
(1)
NOM
0
CUVT[7] (µs/ms) = 1
µs
100
ms
0
2550
10
–12%
ms
ms
ms
0%
10%
100
µs
Under double or multiple fault conditions (of a single type), the second or greater fault may have its delay time shortened by up to the
step time for the fault. I.e. the second and subsequent COV faults occurring within the delay time period for the first fault may have their
delay time shortened by up to 100 µs.
OTP EPROM PROGRAMMING CHARACTERISTICS
Typical values stated where TA = 25°C and BAT = 20 V, Min/Max values stated where TA = –40˚C to 85°C and BAT = 7.2 V
to 27 V (unless otherwise noted)
PARAMETER
VPROG
Programming voltage
tPROG
Programming time
IPROG
Programming current
(1)
TEST CONDITION
VBAT ≥ 20V
MIN
NOM
MAX
6.3
7
7.7
V
2200
ms
20
mA
1500 (1)
10
UNIT
The write pulse is self-timed internally. VPROG should be applied for this time at a minimum.
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AC TIMING CHARACTERISTICS
SPI DATA INTERFACE
Typical values stated where TA = 25°C and BAT = 20 V, Min/Max values stated where TA = –40˚C to 85°C and BAT = 7.2 V
to 27 V (unless otherwise noted)
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
10
250
1000
kHz
fSCLK
SCLK frequency (1)1
SCLKDC
SCLK_H duty cycle, t(HIGH) / t(SCLK) or t(LOW) / t(SCLK)
tCS,LEAD
CS_H lead time, CS_N low to clock
tCS,LAG
CS_H lag time. Last clock to CS_N high
tCS,DLY
CS_H high to CS_H low (inter-packet delay requirement)
tACC
CS_H access time (2): CS_H low to SDO_H data out
125
250
ns
tDIS
CS_H disable time (2): CS_H high to SDO_H high
impedance
2.5
2.7
µs
tSU,SDI
SDI_H input-data setup time
15
ns
tHD,SDI
SDI_H input-data hold time
10
ns
tVALID,SDO
SDO_H output-data valid time
SCLK_H edge to SDO_H valid
(1)
(2)
40%
60%
50
ns
10
ns
3
µs
CL ≤ 20 pF
75
110
ns
Maximum SCLK frequency is limited by the number of bq76PL536 devices in the vertical stack. The maximum listed here may not be
realizable in systems due to delays and limits imposed by other components including wiring, connectors, PCB material and routing, etc.
See text for details.
Time listed is for single device.
t CS, LEAD
t CS,LAG
CS
t(SCLK )
t CS _ DLY
SCLK
t(HIGH)
t(LOW)
tSU,SDI
tHD,SDI
SDI
tACC
tVALID, SDO
tDIS
SDO
Figure 3. SPI Host Interface Timing
Vertical Communications Bus
Typical values stated where TA = 25ºC and BAT = 20 V, Min/Max values stated where TA = –40˚C to 85ºC and BAT = 7.2 V to
27 V
PARAMETER
tH_DELAY
12
TEST CONDITIONS
SCLK_H to SCLK_N, CS_H to
CS_N, SDI_H to SDI_N, SDO_N to
SDO_H delay times
MIN
TYP
MAX
5
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UNIT
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Vertical Communications Bus (continued)
Typical values stated where TA = 25ºC and BAT = 20 V, Min/Max values stated where TA = –40˚C to 85ºC and BAT = 7.2 V to
27 V
PARAMETER
tLS_DELAY
TEST CONDITIONS
MIN
SCLK_S to SCLK_N, CS_S to
CS_N, SDI_S to SDI_N, SDO_N to
SDO_S delay time
TYP
MAX
UNIT
30
ns
ANALOG-TO-DIGITAL CONVERSION (ADC)
General Features
The integrated 14-bit (unsigned) high-speed successive approximation register (SAR) analog-to-digital converter
uses an integrated band-gap reference voltage (VREF) for the cell and brick measurements. The ADC has a
front-end multiplexer for nine inputs – six cells, two temperature sensors, and one general-purpose analog input
(GPAI). The GPAI input can further be multiplexed to measure the brick voltage between the BATx pin and VC0
or the voltage between the GPAI+ and GPAI– pins.
The ADC and reference are factory trimmed to compensate for gain, offset, and temperature-induced errors for
all inputs. The measurement result is not allowed to roll over due to offset error at the top and bottom of the
range, i.e., a reading near zero does not underflow to 0x03ff due to offset error, and vice-versa.
The converter returns 14 valid unsigned magnitude bits in the following format:
<00xxxxxx xxxxxxxx>
Each word is returned in big-endian format in a register pair consisting of two adjacent 8-bit registers. The MSB
of the word is located in the lower-address register of the pair, i.e., data for cell 1 is returned in registers 0x03
and 0x04 as 00xxxxxx xxxxxxxxb.
Designer Note: The signal used to drive the ADC inputs sees about 45 pF of input capacitance when the
mux switches the input to the ADC. The signal source should be capable of driving this capacitance without
introducing error. The sampling time of the ADC is approximately 1 ms when the default 3-ms conversion time
is selected. Therefore, the signal source must be capable of charging the 45-pF capacitance in
approximately 200 nS to allow 5 t for settling; otherwise, the obtained reading will be in error.
Designer Note: The accuracy of the part may be affected by soldering, and may depend on the soldering
process used. This has been typically measured at less than ±2 mV (IC typically reads higher than actual) at
3.6 V/cell input. The offset is fixed, and permanent after soldering. The effect is introduced in the ADC after
the multiplexer, and therefore affects all inputs in the same way. The effect is per input, and not cumulative
for all inputs. This error is in addition to the accuracy specification in the data sheet.
3 to 6 Series Cell Configuration
When fewer than 6 cells are used, the most-positive cell voltage of the series string should be connected to the
BAT1/BAT2 pins, through the RC input network shown in the Reference Schematic section. Unused VCx inputs
should be connected to the next VCx input down until an input connected to a cell is reached – i.e., in a four cell
stack, VC6 connects to VC5, which connects to VC4.
The internal multiplexer control can be set to scan only inputs which are connected to cells, thereby speeding up
conversions slightly. The multiplexer is controlled by the ADC_CONTROL[CN2:0] bits.
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63
BAT
0.1 mF
0.1 mF
0.1 mF
16
VREF
AGND
15
VSS
14
VC0
13
CB1
12
VC1
11
CB2
10
VC2
9
CB3
8
VC3
7
CB4
6
VC4
5
CB5
4
VC5
3
CB6
2
1
0.1 mF
VC6
64
BAT
10 mF
0.1 mF
2.2 mF
0.1 mF
1 kW
1 kW
1 kW
1 kW
1 kW
1 kW
3.9 W
1 kW
Figure 4. Connecting < 6 Cells (4 Shown)
Cell Voltage Measurements
Converting the returned cell measurement value to a dc voltage (in mV) is done using the following formula (all
values are in decimal).
mV = (REGMSB × 256 + REGLSB) × 6250 / 16383
Example:
Cell_1 == 3.35 V (3350 mV);
After conversion, REG_03 == 0x22; REG_04 == 0x4d
0x22 × 0x100 + 0x4d = 0x224d (8781)
8781 × 6250 / 16,383 = 3349.89 mV ≈ 3.35 V
GPAI or VBAT Measurements
The bq76PL536 features a differential input to the ADC from two external pins, GPAI+ and GPAI–. The ADC
GPAI result register can be configured (via the FUNCTION_CONFIG[GPAI_SRC] to provide a measurement of
the voltage on these two pins, or of the brick voltage present between the BATx pins and VC0.
In the bq76PL536 device, the VBAT measurement is taken from the BATx pin to the VC0 pin, and is a separate
input to the ADC mux. Because this is a separate input to the ADC, certain common system faults, such as a
broken cell wire, can be easily detected using the bq76PL536 and simple firmware techniques.
The GPAI measurement can be configured to use one of two references via FUNCTION_CONFIG[GPAI_REF].
Either the internal bandgap (VREF) or REG50 can be selected. When REG50 is selected, the ADC returns a ratio
of the voltage at the inputs and REG50, removing the need for compensation of the REG50 voltage when used
as a source to excite the sensor. When the device is configured to measure VBAT
(FUNCTION_CONFIG[GPAI_SRC] = 1), the device selects VREF automatically and ignores the
FUNCTION_CONFIG[GPAI_REF] setting.
Converting GPAI Result to Voltage
To convert the returned GPAI measurement value to a voltage using the internal band-gap reference
(FUNCTION_CONFIG[GPAI_REF] = 1), the following formula is used.
14
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mV = (REGMSB × 256 + REGLSB) × 2500 / 16,383
FUNCTION_CONFIG[] = 0100 xxxxb
Example:
The voltage connected to the GPAI inputs == 1.25 V;
After conversion, REG_01 == 0x20; REG_02 == 0x00
0x20 × 0x100 + 0x00 = 0x2000 (8192)
8192 × 2500 / 16,383 = 1250 mV
Converting VBAT Result to Voltage
To convert the returned VBAT measurement value to a voltage, the following formula is used.
V = (REGMSB × 256 + REGLSB) × 33.333 / 214 (33.333 ≈ 6.25 / 0.1875)
FUNCTION_CONFIG[] = 0101 xxxxb
Example:
The sum of the series cells connected to VC6–VC0 == 20.295 V;
After conversion, REG_01 == 0x26; REG_02 == 0xf7
0x26 × 0x100 + 0xf7 = 0x26f7 (9975)
9975 × 33.333 / 16,383 = 20.295 V
Temperature Measurement
The bq76PL536 can measure the voltage TS1+, TS1– and TS2+, TS2– differential inputs using the ADC. These
inputs are typically driven by an external thermistor/resistor divider network. The TSn inputs use the REG50
output divided down and internally connected as the ADC reference during conversions. This produces a
ratiometric result and eliminates the need for compensation or correction of the REG50 voltage drift when used
to drive the temperature sensors. The REG50 reference allows an approximate 2.5-V full-scale input at the TSn
inputs. The final reading is limited between 0 and 16,383, corresponding to an external ratio of 0 to 0.5.
Two control bits are required for the ADC to convert the TSn input voltages successfully. ADC_CONTROL[TSn]
is set to cause the ADC to convert the TSn channel on the next requested conversion cycle. IO_CONTROL[TSn]
is set to cause the FET switch connecting the TSn– input to VSS to close, completing the circuit of the voltage
divider. The IO_CONTROL[] bits should only be set as needed to conserve power; at high temperatures,
thermistor excitation current may be relatively high.
External Temperature Sensor Support (TS1+, TS1– and TS2+, TS2–)
The device is intended for use with a nominal 10 kΩ at 25ºC NTC external thermistor (AT103 equivalent) such as
the Panasonic ERT-J1VG103FA, a 1% device. A suitable external resistor-capacitor network should be
connected to position the response of the thermistor within the range of interest. This is typically RT= 1.47 kΩ
and RB = 1.82 kΩ (1%) as shown in Figure 5. A parallel bypass capacitor in the range 1nF to 47nF placed across
the thermistor should be added to reduce noise coupled into the measurement system. The response time delay
created by this network should be considered when enabling the respective TS input prior to conversion and
setting the OT delay timer. See Figure 5 for details.
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REG50
RTH
470 nF
RT
RB = .4 (RTH @ 40C – [email protected] 90C)
TS+
RT = [email protected] 40C – 2RTH @90C – RB
RB
TS–
Figure 5. Thermistor Connection
Converting TSn Result to Voltage (Ratio)
To convert the returned TSn measurement value to a ratio, RTS = VTS:REG50, the following formula is used.
ADC behavior: COUNT = VTS / REG50 × 33,104
RTS = (REGMSB × 256 + REGLSB) / 16,548
FUNCTION_CONFIG[] = 0100 xxxxb
Example:
The voltage connected to the TSn inputs (TSn+ – TSn–) == 0.6609 V; VREG50 ≈ 5 V nominal
After conversion, REGMSB == 0x11; REGLSB == 0x18
ACTUAL_COUNT = 0x11 × 0x100 + 0x18 = 0x1118 (4376)
4376 / 33,104 = 0.1322 (ratio of TSn inputs to REG50)
0.1322 × REG50 = 0.6609 V
ADC Band-Gap Voltage Reference
The ADC and protection subsystems use separate and independent internal voltage references. The ADC
bandgap (VREF) is nominally 2.5 V. The reference is temperature-compensated and stable.
The internal reference is brought out to the VREF pin for bypassing. A high quality 10-mF capacitor should be
connected between the VREF and AGND pins, in close physical proximity to the device pins, using short track
lengths to minimize the effects of track inductance on signal quality. AGND should be connected to VSS. Device
VSS connections should be brought to a single point close to the IC to minimize layout-induced errors. The
device tab should also be connected to this point, and is a convenient common VSS location. The internal VREF
should not be used externally to the device by user circuits.
Conversion Control
Convert Start
Two methods are available to start a conversion cycle. The CONV_H pin may be asserted, or firmware may set
the CONVERT_CTRL[CONV] bit.
Hardware Start
A single interface pin (CONV_H) is used for conversion-start control by the host. A conversion cycle is started by
a hardware signal when the CONV_H is transitioned low-to-high by the host. The host should hold this state until
the conversion cycle is complete to avoid erroneous edges causing a conversion start when the present
conversion is not complete. The signal is simultaneously sent to the higher device in the stack by the assertion of
the CONV_N signal. The bq76PL536 automatically sequences through the series of measurements enabled via
the ADC_CONTROL[] register after a convert-start signal is received from either the register bit or the hardware
pin.
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If the CONV_H pin is used in the design, it must be maintained in a default low state (~0 V) to allow use of the
ADC_CONVERT[CONV] bit to trigger ADC conversions. If the CONV pin is kept high, the
ADC_CONVERT[CONV] bit does not function, and device current consumption is increased by the signaling
current, ~900 µA. If the CONV_H pin is not used by the user’s design, the pin may be left floating; the internal
current sink to VSS maintains proper bias.
Firmware Start
The CONVERT_CTRL[CONV] bit is also used to initiate a conversion by writing a 1 to the bit. It is automatically
reset at the end of a conversion cycle. The bit may only be written to 1; the IC always resets it to 0. The
BROADCAST form of packet is recommended to start all device conversions simultaneously.
Designer Note: The external CONV_H (CONV_S) pin must be held in the de-asserted (=0) state to allow the
CONV register bit to initiate conversions. An internal pulldown is provided on the pin to maintain this state.
Data Ready
The bq76PL536 signals that data is ready when the last conversion data has been stored to the associated data
result register by asserting the DRDY_S pin (DRDY_H if HOST=0) if the DRDY_N pin is also asserted. DRDY_S
(DRDY_H) signals are cleared on the next rising edge of CONV_H.
The DEVICE_STATUS[DRDY] bit indicates the state of the DRDY_N pin.
Designer Note: The DRDY_S pins remain asserted during SLEEP, leading to extra current consumption. As
a workaround, user designs should read the last result of a conversion before placing the device in SLEEP.
ADC Channel Selection
The ADC_CONTROL register can be configured as follows:
MEASUREMENT
ADC_CONTROL
VCELL1
CELL_SEL = 0x00
VCELL1, VCELL2
CELL_SEL = 0x01
VCELL1, VCELL2, VCELL3
CELL_SEL = 0x02
VCELL1, VCELL2, VCELL3, VCELL4
CELL_SEL = 0x03
VCELL1, VCELL2, VCELL3, VCELL4, VCELL5
CELL_SEL = 0x04
VCELL1, VCELL2, VCELL3, VCELL4, VCELL5, VCELL6
CELL_SEL = 0x05
External thermistor input 1
TS1 = 1
External thermistor input 2
TS2 = 1
General-purpose analog input
GPAI = 1
Conversion Time Control
The ADC can be configured to adjust the conversion time to meet system requirements. The default conversion
time is approximately 3 ms (with ADC pre-configured to be ON by setting the ADC_CONTROL[ADC_ON] bit).
This can be adjusted to approximately 3, 6, 12, or 24 ms/channel by changing the value in the
FUNCTION_CONFIG[] register. The 6-µs setting (FUNCTION_CONFIG[ADCT1:0] = 01b) is recommended for
best results over temperature.
Automatic vs Manual Control
The ADC_CONTROL[ADC_ON] bit controls powering up the ADC section and the main bandgap reference. If
the bit is set to 1, the internal circuits are powered on, and current consumption by the part increases.
Conversions begin immediately on command. The host CPU should wait >500 µs before initiating the first
conversion after setting this bit.
If the ADC_ON bit is false, an additional 500 µs is required to stabilize the reference before conversions begin. In
the AUTOMATIC mode, power consumption is greatly reduced. This is the recommended operating mode for the
part.
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ADC Application Notes
Anti-Aliasing Filter
An anti-aliasing filter, consisting of a 1-kΩ 1% series resistor and 100-nF capacitor, is required for each VCn
input. Good-quality components should be used. A 1% resistor is recommended, because the resistor creates a
small error by forming a voltage divider with the input impedance of the part. The part is factory-trimmed to
compensate for the error introduced by the filter.
Using the 6-µs Conversion Setting
1. The conversion time is adjusted from 3 µs/channel to 6 µs/channel. This extends the total time to convert all
cell voltages from ≈21 µs (6 × 3 µs + 3 µs) to ≈ 42 µs (6 × 6 µs + 6 µs). To convert all cell voltages, plus the
brick voltage, plus the two temperature inputs requires ≈ 60 µs (9 × 6 µs + 6 µs).
2. The ADC_CTRL[ADC_ON] bit is set to 1 for conversions. The ADC_CTRL[] register is located at address
0x30.
The conversion time is controlled by the FUNCTION_CONFIG[] register at address 0x40. Two bits, ADCT0,
ADCT1 set the time perTable 1.
7
ADCT[1]
6
ADCT[0]
5
GPAI_REF
FUNCTION_CONFIG REGISTER (0x40)
4
3
GPAI_SRC
CN[1]
2
CN[0]
1
-
0
-
The FUNCTION_CONFIG sets the default configuration for special features of the device.
[7..6] (ADCT[0,1]): These bits set the conversion timing of the ADC measurement.
Table 1.
ADCT[1]
ADCT[0]
~Conversion Time (ms)
0
0
3
0
1
6
1
0
12
1
1
24
A design issue in the device requires that any time the ADCT[1:0] bits are not equal to 0, the ADC_ON bit must
be set to 1 before initiating a conversion cycle. TI recommends setting the bit to 1 during battery operations when
conversions are to be made (it may be left on). The bit can be turned off when conversions are not active, i.e.,
during the key-off time. When the bit is turned on, the hardware enforces a 500-µs ±5% wait before conversions
are permitted. User firmware should wait the minimum ≈500 µs before requesting a conversion start after
ADC_ON = 1.
NOTE
If a conversion cycle is inadvertedly started while (ADCT[1:0] ≠ 0 <AND> ADC_ON = 0),
the device appears to lock up and stop working. To correct this behavior, send a device
RESET command (write 0xa5 to register 0x3c) followed by any customer-specific register
initialization. The RESET command also resets the device address to 0x00, making it
necessary to reassign addresses to all devices in the stack.
The bit may be turned on and left on, or dynamically manipulated at each conversion depending on user
firmware requirements.
TI recommends programming the OTP register to set the conversion rate permanently. This procedure is
described in the data sheet for the device. A typical value for FUNCTION_CONFIG[] register 0x40 is 0x50. See
the FUNCTION_CONFIG REGISTER (0x40) section for further details of the other bit functions.
Procedure:
OTP EPROM is Pre-programmed to 6 µs (0x40 = 0101 xx00b):
1. Prior to any conversion:
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Write ADC_CONFIG[ADC_ON] = 1 (0x30 = 01xx xxxxb)
Note: To convert all inputs typically, use 0x30 = 0111 1101b
9.8.2.1.2 Alternate Method - Use Shadow RAM Feature (EPROM 0x40 Programmed Value is Don’t Care):
The shadow RAM feature allows temporarily overwriting EPROM contents. At RESET, group-3 RAM registers
are loaded from OTP EPROM. The device always uses the contents of the RAM register internally to control the
device. The RAM register may be subsequently overwritten with a new value to modify the device defaults
programmed in EPROM. The new value is valid until the next device RESET. This example assumes that all
inputs are converted.
1. Setup for 6-µs/ch conversion time:
Write SHDW_CTRL[] = 0x35 (register 0x3a = 0x35) to enable the write to FUNCTION_CONFIG[].
Immediately followed by:
Write FUNCTION_CONFIG[] = 0x50 (register 0x40 = 0x50)
2. Prior to any conversion:
Write ADC_CTRL[] = 0x7d (register 0x30 = 0x7d)
Wait >1 ms before converting after setting ADC_ON = 1 in the previous step.
3. Converting:
Conversions are now initiated normally, using the CONV_H pin or the CONVERT[CONV] register bit.
Note: Power may be significantly reduced by setting the bit ADC_ON = 0.
Secondary Protection
The bq76PL536 integrates dedicated overvoltage and undervoltage fault detection for each cell and two
overtemperature fault detection inputs for each device. The protection circuits use a separate band-gap reference
from the ADC system and operate independently. The protector also uses separate I/O pins from the main
communications bus, and therefore is capable of signaling faults in hardware without intervention from the Host
CPU.
Protector Functionality
When a fault state is detected, the respective fault flag in the FAULT_STATUS[] or ALERT_STATUS[] registers
is set. All flags in the FAULT and ALERT registers are then ORed into the DEVICE_STATUS[] FAULT and
ALERT bits. The FAULT and ALERT bits in DEVICE_STATUS[] in turn cause the hardware FAULT_S or
ALERT_S pin to be set. The bits in DEVICE_STATUS[] and the hardware pins are latched until reset by the host
via SPI command, ensuring that the host CPU does not miss an event.
A separate timer is provided for each fault source (cell overvoltage, cell undervoltage, overtemperature) to
prevent false alarms. Each timer is programmable from 100 µs to more than 3 s. The timers may also be
disabled, which causes fault conditions to be sensed immediately and not latched.
The clearing of the FAULT or ALERT flag (and pin) occurs when the respective flag is written to a 1, which also
restarts the respective fault timer. This also clears the FAULT_S (_H) or ALERT_S (_H) pin. If the actual fault
remains present, the FAULT (ALERT) pin is again asserted at the expiration of the timer. This cycle repeats until
the cause of the fault is removed.
On exit from the SLEEP state, the COV, CUV, and OT fault comparators are disabled for approximately 200 µs
to allow internal circuitry to stabilize and prevent false error condition detection.
Using the Protector Functions With 3-5 Cells
The OV/UV condition can be ignored for unused channels by setting the FUNCTION_CONFIG[CNx] bits to the
maximum number of cells connected to the device. If fewer than 6 cells are configured, the corresponding OV/UV
faults are ignored. For example, if the FUNCTION_CONFIG[] bits are set to xxxx 1000, then the OV/UV
comparators are disabled for cells 5 and 6. Correct setting of this register prevents spurious false alarms.
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Cell Overvoltage Fault Detection (COV)
When the voltage across a cell exceeds the programmed COV threshold for a period of time greater than set in
the COV timer (COVT), the COV_FAULT[] flag for that cell is set. The bits in COV_FAULT[] are then ORed into
the FAULT[COV] flag, which is then ORed into the DEVICE_STATUS[FAULT] flag, which causes the FAULT_S
(_H) pin also to be asserted. The COV flag is latched unless COVT is programmed to 0, in which case the flag
follows the fault condition. Care should be taken when using this setting to avoid chatter of the fault status. To
reset the FAULT flag, first remove the source of the fault (i.e., the overvoltage condition) and then write a 1 to
FAULT[COV], followed by a 0 to FAULT[COV].
The voltage trip point is set in the CONFIG_COV register. Set points are spaced every 50 mV. Hysteresis is
provided to avoid chatter of the fault sensing. The filter delay time is set in the CONFIG_COVT[] register to
prevent false alarms. A start-up deglitch circuit is applied to the timers to prevent false triggering. The deglitch
time is 0–50 µs, and introduces a small error in the timing for short times. For both CUVT, and CUVT, this can
cause an error greater than the 10% maximum specified for delays <500 µs.
COV_FAULT
COVT Filter
-
LEVEL
SHIFTER
VC6
VSS
–
+
PROTECTOR
REFERENCE
-
VC6
VC5
VC4
VC3
VC2
VC1
Latch
+
CONFIG_COV[]
–
COV COMPARATOR
(one per cell)
TRIP
SETPOINT
FAULT _N
FAULT _H
FAULT _S
ANALOG TRANSLATION
FAULT
-
-
I_
FAULT
FORCE
POR
CRC
ALERT
-
ECC_
COR
UVLO
CBT
DRDY
CUV
COV
STATUS
AR
FAULT
Figure 6. COV FAULT Simplified Logic Tree
Cell Undervoltage Fault Detection (CUV)
Cell undervoltage detection operates in a similar manner to the COV protection. When the voltage across a cell
falls below the programmed CUV threshold (CONFIG_CUV[]) for a period of time greater than CUVT
(CONFIG_CUVT[]), the CUV_FAULT[] flag for that cell is set. The bits in CUV_FAULT[] are then ORed into the
FAULT[CUV] flag, which is then ORed into the DEVICE_STATUS[FAULT] flag, which causes the FAULT_S (_H)
pin also to be asserted. The CUV flag is latched unless CUVT is programmed to 0, in which case the flag follows
the fault condition. Care should be taken when using this setting to avoid chatter of the fault status. To reset the
FAULT flag, first remove the source of the fault (i.e., the overvoltage condition) and then write a 1 to
FAULT[CUV], followed by a 0 to FAULT[CUV].
20
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Overtemperature Detection
When the temperature input TS1 or TS2 exceeds the programmed OT1 or OT2 threshold (CONFIG_OT[]) for a
period of time greater than OTT (CONFIG_OTT[]) the ALERT_STATUS[OT1, OT2] flag is set. The ALERT[] flags
are then ORed into the DEVICE_STATUS[ALERT] flag, and the ALERT_S (_H) pin is also asserted. The OT flag
is latched unless OTT is programmed to 0, in which case the flag follows the fault condition. Care should be
taken when using this setting to avoid chatter of the fault status. To reset the FAULT flag, first remove the source
of the alert (i.e., the overtemperature condition) and then write a 1 to ALERT[OTn], followed by a 0 to
FAULT[OTn].
To COV-CUV Circuits
PROTECTOR
REFERENCE
ALERT[OTn]
REG50
REG50
5V LDO
(User)
+
RTH
VBAT
–
CF
RT
TS+
+
Delay Filter
RB
To ADC Mux
–
CONFIG_OTT[]
TS–
COMPARATOR
CONFIG_OT[]?0
11
1
CONFIG_OT[] Selector
IO_CTRL[TSn
]
PIN BOUNDARY
VSS
Figure 7. Simplified Overtemperature Detection Schematic
As shown in the drawing above, the OT thresholds are detectable in 11 steps representing approximately 5°C
divisions when a thermistor and gain/offset setting resistors are chosen using the formula in the External
Temperature Sensor Support (TS1+, TS1– and TS2+, TS2–) section. A DISABLED setting is also available. This
results in an adjustment range from approximately 40°C to 90°C, but the range center can be moved by
modifying the RT value. The steps are spaced in a non-linear fashion to correspond to typical thermistor
response curves. Typical accuracy of a few degrees C or better can be achieved (with no additional calibration
requirements) by careful selection of the thermistor and resistors.
Each input sensor can be adjusted independently via separate registers CONFIG_OT1[] and CONFIG_OT2[].
The two temperature setpoints share a common filter delay set in the CONFIG_OTT[] register. A setting of 0 in
the CONFIG_OTT[] register causes the fault sensing to be both instantaneous and not latched. All other settings
provide a latched ALERT state.
Ratiometric Sensing
The OT protector circuits use ratiometric inputs to sense fault conditions. The REG50 output is applied internally
to the divider which forms the reference voltages used by the comparator circuit. It is also used externally as the
excitation source for the temperature sensor. This allows the REG50 output to vary over time or temperature
(within data-sheet limits) and have virtually no effect on the correct operation of the circuit. Any change seen by
the sensor is also seen by the divider, and therefore, changes proportionally. Although it is valid to represent the
trip setpoints as voltages if you assume that REG50 is at exactly 5 V, in practice, this is not the case. In the chart
included in the next section, the correct ratios [RB/(RB + RT + RTH)] are shown, along with the equivalent voltage
points when REG50 is assumed to be 5 V.
Table 2. Overtemperature Trip Setpoints
OT THRESHOLDS
(1)
CONFIG_OT
TNOM °C
VTS RATIO SET
VTS RATIO CLEAR
VSET (1)
VCLEAR (1)
0
Disabled
Disabled
Disabled
Disabled
Disabled
Assumes REG50 = 5.000 V
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Table 2. Overtemperature Trip Setpoints (continued)
OT THRESHOLDS
CONFIG_OT
TNOM °C
VTS RATIO SET
VTS RATIO CLEAR
VSET (1)
VCLEAR (1)
1
40
0.2000
0.1766
1.000
0.883
2
45
0.2244
0.2000
1.122
1.000
3
50
0.2488
0.2270
1.244
1.135
4
55
0.2712
0.2498
1.356
1.249
5
60
0.2956
0.2750
1.478
1.375
6
65
0.3156
0.2956
1.578
1.478
7
70
0.3356
0.3162
1.678
1.581
8
75
0.3556
0.3368
1.778
1.684
9
80
0.3712
0.3528
1.856
1.764
10
85
0.3866
0.3688
1.933
1.844
11
90
0.4000
0.3824
2.000
1.912
Thermistor Power
To minimize power consumption, the thermistors are not powered ON by default. Two bits are provided in
IO_CONTROL[] to control powering the thermistors, TS1 and TS2. The TSn– input is only connected to VSS
when the corresponding bit is set. The user firmware must set these bits to 1 to enable both temperature
measurement and the secondary protector functions. When the thermistor functions are not in use, the bits may
be programmed to 0 to remove current through the thermistor circuits.
Thermistor Input Conditioning
A filter capacitor is recommended to minimize noise in to the ADC and protector. The designer should insure that
the filter capacitor has sufficient time to charge before reading the thermistors. The CONFIG_OTT[] value should
also be set to >5t, the time delay introduced by the RC network comprising CF, RTH, RT, and RB, to avoid false
triggering of the PROTECTOR function and ALERT signal when the TS1 and/or TS2 bits are set to 1 and the
inputs enabled.
On exit from the SLEEP state, the OT fault comparators are disabled for approximately 200 µs to allow internal
circuitry to stabilize and prevent false error-condition detection.
Fault and Alert Behavior
When the FAULT_N pin is asserted by the next higher bq76PL536 in the stack, then the FAULT_S is also
asserted, thereby passing the signal down the array of stacked devices if they are present. FAULT_N should
always be connected to the FAULT_S of the next higher device in the stack. If no higher device exists, it should
be tied to VBAT of this bq76PL536, either directly or via a pullup resistor ~10 kΩ to 1 MΩ. The FAULT_x pins are
active-high – current flows when asserted. The ALERT_x pins behave in a similar manner. If the FAULT_N pin of
the base device (HSEL = 0) becomes asserted, it asserts its FAULT_H signal to the host microcontroller. This
signal chain may be used to create an interrupt to the CPU, or drive other compatible logic or I/O directly.
Table 3. Fault Detection Summary
SIGNALING
FAULT
DETECTION
PIN
HSEL = 1
HSEL = 0
DEVICE_STATUS
BIT SET
X_STATUS BIT SET
EPROM double bit
error
ECC logic fault detected
FAULT_S
FAULT_H
FAULT
FAULT_STATUS[I_FAULT]
FORCE
User set FORCE bit
FAULT_S
FAULT_H
FAULT
FAULT_STATUS[FORCE]
POR
Power-on reset occurred
FAULT_S
FAULT_H
FAULT
FAULT_STATUS[POR]
CRC
CRC fail on received packet
N/A
N/A
FAULT
FAULT_STATUS[CRC]
CUV
VCx < VUV for tUV
FAULT_S
FAULT_H
FAULT
FAULT_STATUS[CUV]
COV
VCx > VOV for tOV
FAULT_S
FAULT_H
FAULT
FAULT_STATUS[COV]
AR
Address ≠ (0x01→ 0x3e)
ALERT_S
ALERT_H
ALERT
ALERT_STATUS[AR]
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Table 3. Fault Detection Summary (continued)
SIGNALING
FAULT
DETECTION
PIN
HSEL = 1
HSEL = 0
DEVICE_STATUS
BIT SET
X_STATUS BIT SET
Protected-register
parity error
Parity not even in protected
register
ALERT_S
ALERT_H
ALERT
ALERT_STATUS[PARITY]
EPROM single-bit
error
ECC logic fault detected and
corrected
ALERT_S
ALERT_H
ALERT
ALERT_STATUS[ECC_COR]
FORCE
User set FORCE bit
ALERT_S
ALERT_H
ALERT
ALERT_STATUS[FORCE]
Thermal shutdown
Die temperature ≥
TSDTHRESHOLD
ALERT_S
ALERT_H
ALERT
ALERT_STATUS[TSD]
SLEEP
IC exited SLEEP mode
ALERT_S
ALERT_H
ALERT
ALERT_STATUS[SLEEP]
OT2
VTS2 > VOT for tOT
ALERT_S
ALERT_H
ALERT
ALERT_STATUS[OT2]
OT1
VTS1 > VOT for tOT
ALERT_S
ALERT_H
ALERT
ALERT_STATUS[OT1]
Fault Recovery Procedure
When any error flag in DEVICE_STATUS[], FAULT_STATUS[], or ALERT_STATUS[] is set and latched, the
state can only be cleared by host communication via SPI. Writing to the respective FAULT_STATUS or
ALERT_STATUS register bit with a 1 clears the latch for that bit. The exceptions are the two FORCE bits, which
are cleared by writing a 0 to the bit.
The FAULT_STATUS[] and ALERT_STATUS[] register bits are read-only, with the exception of the FORCE bit,
which may be directly written to either a 1 or 0.
Secondary Protector Built-In Self-Test Features
The secondary protector functions have built-in test for verifying the connections through the signal chain of ICs
in the stack back to the host CPU. This verifies the wiring, connections, and signal path through the ICs by
forcing a current through the signal path.
To implement this feature, host firmware should set the FAULT[FORCE] or ALERT[FORCE] bit in the top-most
device in the stack. The device asserts the associated pin on the South interface, and it propagates down the
stack, back to the base device. The base device in turn asserts the FAULT_H (ALERT_H) pin to the host,
allowing the host to check for the received signal and thereby verify correct operation.
CELL BALANCING
The bq76PL536 has six dedicated outputs (CB1…CB6) that can be used to control external N-FETs as part of a
cell balancing system. The implementation of appropriate algorithms is controlled by the system host. The
CB_CTRL[CBAL1–6] bits control the state of each of the outputs. The outputs are copied from the bit state of the
CB_CTRL register, i.e., a 1 in this register activates the external balance FET by placing a high on the
associated pin.
The CBx pins switch between approximately the positive and negative voltages of the cell across which the
external FET is connected. This allows the use of small, low-cost N-FETs in series with a power resistor to
provide cell balancing.
Cell Balance Control Safety Timer
The CBx outputs are cleared when the internal safety timer expires. The internal safety timer (CB_TIME) value is
programmed in units of seconds or minutes (range set by CB_CTRL bit 7) with an accuracy of ±10%.
The timer begins when any CB_CTRL bit changes from 0 to 1. The timer is reset if all CB_CTRL bits are
modified by the host from 1 to 0, or by expiration of the timing period. The timing begins counting the
programmed period from start each time the CB_CTRL[] register is programmed from a zero to a non-zero value
in the lower six bits. In example, if the CB_TIME[] is set for 30 s, then one or more bits are set in the CB_CTRL[]
register to balance the corresponding cells; then after 10 s the user firmware sets CB_CTRL[] to 0x00, takes a
measurement, then reprograms CB_CTRL[] with the same or new bit pattern, the timer begins counting 30 s
again before expiring and disabling balancing. This restart occurs each time the CB_CTRL bits are set to a
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non-zero value. If this is done at a greater rate than the balancing period for which timer CB_TIME[] is set,
balancing is effectively never disabled – until the timer is either allowed to expire without changing the
CB_CTRL[] register to a non-zero value, or the CB_CTRL[] register is set to zero by the user firmware. If the
CB_CTRL[] register is not manipulated from zero to non-zero while the timer is running, the timer expires as
expected. Alterations of the value from a non-zero to a different non-zero value do not restart the timer (i.e., from
0x02 to 0x03, etc).
While the timer is running, the host may set or reset any bit in the CB_CTRL[] register at any time, and the CBx
output follows the bit.
The host may re-program the timer at any time. The timer must always be programmed to allow the CBx outputs
to be asserted. While the timer is non-zero, the CB_CTRL[] settings are reflected at the outputs.
During periods when the timer is actively running (not expired), then DEVICE_STATUS[CBT] is set.
OTHER FEATURES AND FUNCTIONS
Internal Voltage Regulators
The bq76PL536 derives power from the BAT pin using several internal low dropout (LDO) voltage regulators.
There are separate LDOs for internal analog circuits (4.5 V at LDOA), digital circuits (5 V at LDOD1 and LDOD2),
and external, user circuits (5 V at REG50). The BAT pin should be connected to the most-positive cell input from
cell 3, 4, 5, or 6, depending on the number of cells connected. A small series resistor and filter capacitors close
to the IC are recommended. The internal LDOs and internal VREF should not be used to power external circuitry.
Internal 4.5-V Analog Supply
The internal analog supply should be bypassed at the LDOA pin with a good-quality, low-ESR, 2.2-mF ceramic
capacitor.
Internal 5-V Analog Supply
The internal digital supply should be bypassed at the LDOD1(2) pin with a good-quality, low-ESR, 2.2-mF ceramic
capacitor. The two pins are connected internally and provided to enhance single-pin failure-mode fault tolerance.
They should also be connected together externally.
Designer Note: Because the LDODx inputs are pulled briefly to ~7 V during programming, the LDODx pins
should not be used as sources for pullups to 5-V digital pins, such as HSEL and SPI(bus)_H connected pins.
Use LDOA or VREG50 instead, unless all programming is completed prior to mounting on the application
PCB, in which case LDODx is a good choice.
Low-Dropout Regulator (REG50)
The bq76PL536 has a low-dropout (LDO) regulator provided to power the thermistors and other external circuitry.
The input for this regulator is VBAT. The output of REG50 is typically 5 V. A minimum 2.2-mF capacitor is required
for stable operation. The output is internally current-limited. The output is reduced to near zero if excess current
is drawn, causing die temperatures to rise to unacceptable levels.
The 2.2-µF output capacitor is required whether REG50 is used in the design or not.
REG50 is disabled in SLEEP mode, and may be turned off under thermal-shutdown conditions, and therefore
should not be used as a pullup source for terminating device pins where required.
Auxiliary Power Output (AUX)
The bq76PL536 provides an approximately 1-mA auxiliary power output that is controlled via
IO_CONTROL[AUX]. This output is taken directly from REG50. The current drawn from this pin must be included
in the REG50 current-limit budget by the designer.
Undervoltage Lockout and Power-On Reset
The device incorporates two comparators to detect low VBAT conditions. The first detects low voltage where some
device digital operations are still available. The second, (POR) detects a voltage below which device operation is
not ensured.
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UVLO
When the UVLO threshold voltage is sensed for a period ≥ UVLODELAY, the device is no longer able to make
accurate analog measurements and conversions. The ADC, cell-balancing and fault-detection circuitry are
disabled. The digital circuitry, including host CPU and vertical communications between ICs, is fully functional.
Register contents are preserved with the exception that CB_CTRL is set to 0, and the UVLO bit is set in
DEVICE_STATUS[].
Power-On Reset (POR)
When the POR voltage threshold or lower is sensed for a period ≥ UVLODELAY, the device is no longer able to
function reliably. The device is disabled, including all fault-detection circuitry, host SPI communications, vertical
communications, etc.
After the voltage rises above the hysteresis limit longer than the delay time, the device exits the reset state, with
all registers set to default conditions. The FAULT_STATUS[POR] bit is set and latched until reset by the host.
The device no longer has a valid address (DEVICE_ADDRESS[AR] = 0, ADDRESS_CONTROL[] = 0). The
device should be reprogrammed with a valid address, and any registers re-written if non-default values are
desired.
Reset Command
The bq76PL536 can also be reset by writing the reset code (0xa5) to the RESET register. All devices respond to
a broadcast RESET command regardless of their current assigned address. The result is identical to a POR with
the exception that the normal POR period is reduced to several hundred microseconds.
Thermal Shutdown (TSD)
The bq76PL536 contains an integrated thermal shutdown circuit whose sensor is located near the REG50 LDO
and has a threshold of TSD. When triggered, the REG50 regulator reduces its output voltage to zero, and the
ADC is turned off to conserve power. The thermal shutdown circuit has a built-in hysteresis that delays recovery
until the die has cooled slightly. When the thermal shutdown is active, the DEVICE_STATUS[TSD] bit is set. The
IO_CONTROL[SLEEP] and ALERT[SLEEP] bits also become set to reduce power consumption.
WARNING
The secondary protector settings are DISABLED in the TSD state.
CAUTION
Temperature measurement and monitoring do not function due to loss of power if the
thermistors are powered from the REG50 or AUX pins and TSD occurs.
Protection-dependent schemes implemented by the designer which depend on the
REG50 voltage also may not function as a result of loss of the REG50 output.
GPIO
The bq76PL536 includes a general-purpose input/output pin controlled by the IO_CONTROL[GPIO_OUT] bit.
The state of this bit is reflected on the pin. To use the pin as an input, program GPIO_OUT to a 1, and then read
the IO_CONTROL[GPIO_IN] bit. A pullup (10 kΩ–1 MΩ, typ.) is required on this pin if used as an input. If the
pullup is not included in the design, system firmware must program a 0 in IO_CONTROL[GPIO_OUT] to prevent
excess current draw from the floating input. Use of a pullup is recommended in all designs to prevent an
unintentional increase in current draw.
SLEEP Functionality
The bq76PL536 provides the host a mechanism to put the part into a low-power sleep state by setting the
IO_CONTROL[SLEEP] bit. When this bit is set/reset, the following actions occur:
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Sleep State Entry (bit set)
If a conversion is in progress, the device waits for it to complete, then sets DRDY true (high).
The device sets the ALERT_STATUS[SLEEP] bit, which in turn causes the ALERT pin to be asserted.
The device gates off all other sources of FAULT or ALERT except ALERT[SLEEP]. The existing state of the
FAULT and ALERT registers is preserved. The host should service and reset the ALERT generated by the
SLEEP bit being set to minimize SLEEP state current draw by writing a 1 to ALERT[SLEEP] followed by a 0 to
ALERT[SLEEP]. The ALERT North-South signal chain can draw up to ~1 mA of current when active, so this
ALERT source should be cleared prior to the host entering the SLEEP state of its own. This signaling is provided
to notify the host that the unmonitored/unprotected state is being entered.
The REG50 LDO is shut down and the output is allowed to float. The ADC, its reference, and clocks are
disabled. The COV, CUV, and OT circuits are disabled, and their band-gap reference shut off. Note that this
effectively removes protection and monitoring from the cells; the designer should take the necessary
design steps and verifications to ensure the cells cannot be put into an unsafe condition by other parts
of the system or usage characteristics.
IO_CONTROL[TS1(2)] bits are not modified. The host must also set these bits to zero to minimize current draw
of the thermistors themselves.
SPI communications are preserved; all registers may be read or written.
Sleep State Exit (Bit Reset)
VREG50 operation is restored.
COV, CUV, OT circuits are re-enabled.
The ADC circuitry returns to its former state. Note that there is a warm-up delay associated with the ADC enable,
the same delay as specified for enabling from a cold start.
The FAULT and ALERT registers are restored to their pre-SLEEP state. If a FAULT or ALERT condition was
present prior to SLEEP, the FAULT or ALERT pin is immediately asserted.
IO_CONTROL[TS1(2)] should be set by the host if the OT function or temperature measurement functions are
desired.
COMMUNICATIONS
SPI Communications – Device to Host
Device-to-host (D2H) mode is provided on the SPI interface pins for connection to a local host microcontroller,
logic, etc. D2H communications operate in voltage mode as a standard SPI interface for ease of connection to
the outside world from the bq76PL536 device. Standard TTL-compatible logic levels are presented. All relevant
SPI timing and performance parameters are met by this interface.
The host interface operates in SPI mode 1, where CPOL = 0 and CPHA = 1. The SPI clock is normally low; data
changes on rising edges, and is sampled on the falling edge. All transfers are MSB-first.
The pins of the base IC (only) in a stack should have the SCLK_H and SDI_H pins terminated with pullups to
minimize current draw of the part if the host ever enters a state where the pins are not driven. In non-base
devices, the _H pins are forced to be all outputs driven low when the HSEL pin is high. In non-base devices, all
_H pins should remain unconnected.
The CS_H has a pullup resistor of approximately 100 kΩ. SDO_H is a 3-state output and is terminated with a
weak pullup.
Designer Note: When VBAT is at or below the UVLO trip point voltage, the internal LDO which supplies the
xxxx_H host SPI communications pins (VLODx) begins to fall out of regulation. The output high voltage on
the xxxx_H pins falls off with the LDO voltage in an approximately linear manner until at the POR voltage trip
point it is reduced to approximately 3.5 V. This action is not tested in production.
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Application Notes on the Host SPI Interface Pin States
The CS_H pin is active-low. The host asserts the pin to a logic zero to initiate communications. The CS pin
should remain low until the end of the current packet. When the CS_H pin is asserted, the SPI receiver and
interface of the device are reset and resynchronized. This action ensures that a slave device that has lost
synchronization during a previous transmission or as the result of noise on the bus does not remain permanently
hung. CS_H must be driven false (high) between packets; see AC Timing Characteristics for timing details.
Device-to-Device Vertical Bus (VBUS) Interface
Device-to-device (D2D) communications makes use of a unique, current-mode interface which provides
common-mode voltage isolation between successive bq76PL536s. This vertical bus (VBUS) is found on the _N
and corresponding _S pins. It provides high-speed I/O for both the SPI bus and the direct I/O pins CONV and
DRDY. The current-mode interface minimizes the effects of wiring capacitance on the interface speed.
The _S (South-facing) pins connect to the next-lower device (operating at a lower potential) in the stack of
bq76PL536s. The _N (North facing) pins connect to the next-higher device. The pins cannot be swapped; _S
always points South, and _N always point North. The _S and _N pins are interconnected to the pin with the
same name, but opposite suffix. All pins operate within the voltages present at the BAT and VSS pins. Use
caution; these pins may be several hundred volts above system ground, depending on their position in
the stack.
Designer Note: North (_N) pins of the top, most-positive device in the stack should be connected to the
BAT1(2) pins of the device for correct operation of the string. South (_S) pins of the lowest, most-negative
device in the stack should be connected to VSS of the device. The connections may direct, or via a pullup
resistor (_N) or pulldown resistor (_S) in the range of 100 Ω–1 MΩ.
The maximum SCLK frequency is limited by the number of devices in the vertical stack and other factors. Each
device imposes an approximately 30-nS delay on the round trip communications speed, i.e., from SCLK rising
(an input to all devices) to the SDO pin transitioning requires ~30 ns per device. The designer must add to this
the delay caused by the PCB trace (in turn determined by the material and layout), any connectors in series with
the connection, and any other wiring or cabling between devices in the system. To maximize speed, these other
system components should be carefully selected to minimize delays and other detrimental effects on signal
quality. Wiring and connectors should receive special attention to their transmission line characteristics.
Other factors which should be considered are clock duty cycle, clock jitter, temperature effects on clock and
system components, user-selected drive level for the level-shift interface, and desired design margin.
The VBUS SPI interface is placed in a low-power mode when CS_H is not asserted on the base device.
The CS_N/S pins are asserted by a logic high on the vertical interface bus (logically inverted from CS_H). This
creates a default VBUS CS condition of logic low, reducing current consumption to a minimum.
To reduce power consumption of the SPI interface to a minimum, the SCLK_H and SDI_H should be maintained
at a logic low (de-asserted). The VBUS versions of these signals are not inverted from the host interface. The
device also de-asserts by default the SDO_N/S pins to minimize power consumption.
Packet Formats
Data Read Packet
When the bq76PL536 is selected (CS_S [CS_H for first device] is active and the bq76PL536 has been
addressed) and read request has been initiated, then the data is transmitted on the SDO_S pin to the SDO_N
pin of the next device down the stack. This continues to the first device in the stack, where the data in from the
SDO_N pin is transmitted to the host via the SDO_H pin. The device supplying the read data generates a CRC
as the last byte sent.
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CS
SDI
SDO
n + 1 placeholder bytes
DEV ADDR
REG ADDR
CNT = n
0x00
0x00
0x00
0x00
0x00
0x00
0x00
READ 1
READ 2
READ n...
CRC
1 byte
time
Figure 8. READ Packet Format
Read Packet
0
Device Address
R/W
0
Start Reg Address
Read Length n
Read Data 1
CS Assertion
Read Data n
CRC
Figure 9. READ Packet Detail
Data Write Packet
When the bq76PL536 is selected (CS_S is active and the bq76PL536 has been addressed) and a write request
has been initiated, the bq76PL536 receives data through the SDI_S pin, which is connected to the SDO_N of the
lower device. For the first device in the stack, the data is input to the SDI_H pin from the host, and transmitted up
the stack on the SDI_S pin to the SDI_N pin of the next higher device. If enabled, the device checks the CRC,
which it expects as the last byte sent. If the CRC is valid, no action is taken. If the CRC is invalid or missing, the
device asserts the ALERT_S signal to the next lower device, which ripples down the stack to the ALERT_H pin
on the lowest device. The host should then take action to clear the condition.
Unused or undefined register bits should be written as zeros.
CS
SDI
Start of next packet
DEV ADDR
REG ADDR
WRT DATA
CRC
DEV ADDR
REG ADDR
...
1 byte
time
Figure 10. WRITE Packet Format
Write Packet
0
Device Address
R/W
1
Reg Address
Reg Data
CS Assertion
CRC
Figure 11. WRITE Packet Detail
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Broadcast Writes
The bq76PL536 supports broadcasting single register writes to all devices. A write to device address 0x3f is
recognized by all devices on the bus with a valid address, and permits efficient simultaneous configuration of all
registers in the stack of devices. This also permits synchronizing all ADC conversions by a firmware command
sent to the CONVERT_CTRL[] register as an alternative to using the CONV and DRDY pins.
Communications Packet Structure
The bq76PL536 has two primary communication modes via the SPI interface. These two modes enable
single-byte read / write and multiple data reads. All writes are single-byte; the logical address is shifted one bit
left, and the LSB = 1 for writing.
All transactions are in the form of packets comprising:
BYTE
DESCRIPTION
#1
6-bit bq76PL536 slave address + R/W bit 0b0xxx xxxW
#2
Starting data-register offset
#3
Number of data bytes to be read (n) (omitted for writes)
#4 to 3+n
Data bytes
#4+n
CRC (omit if IO_CONFIG[CRC_DIS] = 1)
CRC Algorithm
The cyclic redundancy check (CRC) is a CRC-8 error-checking byte, calculated on all the message bytes
(including addresses). It is identical in structure to the SMBus 2.0 packet error check (PEC), and is also known
as the ATM-8 CRC. The CRC is appended to the message for all SPI packets by the device that supplied the
data as the last byte in the packet (when IO_CONTROL[CRC] == 1).
Each bus transaction requires a CRC calculation by both the transmitter and receiver within each packet. The
CRC is calculated in a way that conforms to the polynomial, C(x) = x8 + x2 + x1 + 1 and must be calculated in the
order of the bits as received, MSB first. The CRC calculation includes all bytes in the transmission, including
address, command, and data. When reading data from the device, the CRC is based on the ADDRESS +
FIRST_REGISTER + LENGTH + returned_device_data[n]. The stuff-bytes used to clock out the data from the IC
are not used as part of the calculation, although if the value 0x00 is used, the 0s have no effect on the CRC.
CRC verification is performed by the receiver when the CS_x line goes false, indicating the end of a packet. If
the CRC verification fails, the message is ignored (discarded), the CRC failure flag is set in the
FAULT_STATUS[CRC] register, and the FAULT line becomes asserted and latched until the error is read and
cleared by the host.
The CRC bit returned in the FAULT_STATUS[] register reflects the last packet received, not the CRC condition
of the packet reading the FAULT_STATUS contents. CRC errors should be handled at a high priority by the host
controller, before writing to additional registers.
Data Packet Usage Examples
The bq76PL536 can be enabled via the host to read just the specific voltage data which would require a total of 2
written bytes (chip address and R/W [#1] + first (starting) register offset [#2]) + LENGTH [#3] and 13 <null> stuff
bytes (12 [n] data bytes + CRC).
The data packet can be periodically expanded to accommodate temperature and GPAI readings as well as
device status as needed by changing the REGISTER_FIRST offset and LENGTH values.
Device Addressing
Each individual device in the series stack requires an address to allow it to be communicated with. Each
bq76PL536 has a CS_S and CS_N that are used in assigning addresses. Once addresses have been assigned,
the normal operation of the CS_N/S lines is asserted (logic high) during communications, and the appropriate
bq76PL536 in the stack responds according to the address transmitted as part of the packet.
When the bq76PL536 is reset, the DEVICE_STATUS[AR] (address request) flag is cleared, the address register
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is set to 0x00, and ALERT_S is set and passed down the stack. In this state, where address = 0x00, the CS_N
signal is forced to a de-asserted state (CS is not passed north when an address = 0). In this manner, after a
reset the host is assured that a response at address 0x00 is from the first physical device in the stack. After
address assignment of the current device, the host is assured that the next response at address 0x00 is from the
next physical device in the stack.
Once a valid address is assigned to the device, the CS_N signal responds normally, and follows the CS_H or
CS_S signal, propagating to the next device in the stack. Valid addresses are in the range 0x01 through 0x3e.
0x00 is reserved for device discovery after reset. 0x3f is reserved as a broadcast address for all devices.
Designer Note: Broadcast messages are only received by devices with a valid address, and the next higher
device. Any device with an address of 0x00 blocks messages to devices above it. A broadcast message may
not be received by all devices in a stack in situations where some devices do not have a valid address.
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POR
All devices:
ADDRESS = 0x00
n=0; i=expected+1
Look for next device –
read DEVICE_STATUS []
at address 0x00
MSB = 0?
Optionally, read other
registers for unique
pattern
Y
N
Send
BROADCAST_RESET
i-- == 0?
Control iteration
count to prevent
endless loop
READ @0x00
[0x00]
[0x00] =
0xxx xxxxb
?
N
Y
Assign unique address
(n) to this part
Assign ADDRESS
ADDR_CTRL[] = ++n
Now, read same device
for unique address (n)
just assigned as
verification
READ @n,
ADDR_CTRL[]
Validated?
ADDR_CTRL[] =
n?
Y
N
All devices found?
n ==
expected system
size?
N
Error()
Y
Done
System_Fault()
Figure 12. Simple Address Discovery and Assignment Algorithm
Once the address is written the ADDRESS_CONTROL[AR] bit will be set which is copied to the
DEVICE_STATUS[AR] and also de-asserts ALERT_S if ALERT_N is also de-asserted. This allows the CS_N pin
to follow (asserted) the CS_S pin assertions. The process of addressing can now be repeated as device ‘n’ has a
new address and device n+1 has the default address of 0x00, and can be changed to its correct address in the
stack.
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If a device loses its address through a POR or it is replaced then this device will be the highest logical device in
the stack able to be addressed (0x00) as its CS_N will be disabled and the addressing process is required to be
undertaken for this, and higher devices.
REGISTER ARCHITECTURE
I/O Register Details
The bq76PL536 has 48 addressable I/O registers. These registers provide status, control, and configuration
information for the battery protection system. Reserved registers return 0x00. Unused registers should not be
written to; the results are undefined. Unused or undefined bits should be written as zeros, and will always read
back as zeros. Several types of registers are provided, detailed as follows.
Register Types
Read-Only (Group 1)
These registers contain the results of conversions, or device status information set by internal logic. The contents
are re-initialized by a device reset as a result of either POR or the RESET command. Contents of the register are
changed by either a conversion command, or when there is an internal state change (i.e., a fault condition is
sensed).
Read / Write (Group 2)
This register group modifies the operations or behavior of the device, or indicates detailed status in the
ALERT_STATUS[] and FAULT_STATUS[] registers. The contents are re-initialized by a device reset as a result
of either POR or the RESET command. Contents of the register are changed either by a conversion command,
or when there is an internal state change (i.e., a fault condition is sensed).
Contents may also be changed by a write from the host CPU to the register. Writes may only modify a single
register at a time. If CRCs are enabled, the write packet is buffered until the CRC is checked for correctness.
Packets with bad CRCs are discarded without writing the value to the register, after setting the
FAULT_STATUS[CRC] flag.
Unused or undefined bits in any register should be written as zeros, and will always read back as zeros.
SPI DE -SERIALIZER
INTERNAL DATA BUS
CONTROL, STATUS & DATA REGISTERS
REGISTER
CRC CHECK LOGIC
7
6
5
4
3
2
1
0
WRITE
FAULT _STATUS FLAGS
CRC_ERR
Figure 13. Register Group-2 Architecture
Read / Write, Initialized From EPROM (Group 3)
These registers control the device configuration and functionality. The contents of the registers are initialized
from EPROM-stored constants as a result of POR, RESET command, or the RELOAD_SHADOW command.
This feature ensures that the secondary protector portion of the device (COV, CUV, OT) is fully functional after
any reset, without host CPU involvement.
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These registers may only be modified by using a special, sequential-write sequence to guard against accidental
changes. The value loaded from EPROM at reset (or by command) may be temporarily overridden by using the
special write sequence. The temporary value is overwritten to the programmed EPROM initialization value by the
next reset or command to reload. To write to a these protected registers, first write 0x35 to SHDW_CONTROL[],
immediately followed by the write to the desired register. Any intervening write cancels the special sequence.
To re-initialize the entire set of group-3 registers to the EPROM defaults, write the value 0x27 to
SHDW_CONTROL[].
These registers are further protected against corruption by a ninth parity bit that is automatically updated when
the register is written using even parity. If the contents of the register ever become corrupted, the bad parity
causes the ALERT_STATUS[PARITY] bit to become set, alerting the host CPU of the problem.
The EPROM-stored constants are programmed by writing the values to the register(s), then applying the
programming voltage to the LDODx pins, then issuing the EPROM_WRITE command to register E_EN[]. All
group-3 registers are programmed simultaneously, and this operation can only be performed once to the
one-time-programmable (OTP) memory cells. The process is not reversible.
SPI DE-SERIALIZER
INTERNAL DATA BUS
CRC CHECK LOGIC
PROTECTED
REGISTER
REGISTER CONTROL & STATUS BITS
WRITE-PROTECT KEY
7
6
5
4
3
2
1
0
P
STATUS FLAGS
PARITY LOGIC
WRITE
PARITY
SYNDROME CHECKER / GENERATOR
1 bit error
ERROR CHECK /
CORRECT (ECC) LOGIC
REFRESH-PROTECT KEY
POR
REFRESH
EPROM
KEY requires sequenced
write to unlock function
2+ bit errors
LOAD
PROGRAM
VOLTAGE &
TIMING CONTROL
ECC_COR
ECC_ERR
PGM-PROTECT KEY
CHECK BITS
7
6
5
4
3
2
No direct access to this register.
1
0
Cn+1...
Cn
C0
LOAD signal evaluates
ECC syndrome bits
Figure 14. Protected Register Group-3 Architecture, Simplified View
Error Checking and Correcting (ECC) EPROM
The EPROM used to initialize this group is also protected by error-check-and-correct (ECC) logic. The ECC bits
provide a highly reliable storage solution in the presence of external disturbances. This feature cannot be
disabled by user action. Implementation is fully self-contained and automatic and requires no special
computations or provisioning by the user.
When the group-3 contents are permanently written to EPROM, an additional array of hidden ECC-OTP cells is
also automatically programmed. The ECC logic implements a Hamming code that automatically corrects all
single-bit errors in the EPROM array, and senses additional multi-bit errors. If any corrections are made, the
DEVICE_STATUS[ECC_COR] flag bit is set. If any multi-bit errors are sensed, the ALERT_STATUS[ECC_ERR]
flag is set. The corrective action or detection is performed anytime the contents of EPROM are loaded into the
registers – POR, RESET, or by SHADOW_LOAD command. Note: The ECC_COR and ECC_ERR bits may
glitch during OTP-EPROM writes; this is normal. If this occurs, reset the tripped bit; it should remain cleared.
When a double-bit (uncorrectable) error is found, DEVICE_STATUS[ALERT] is set, the ALERT_S (ALERT_H for
bottom stack device) line is activated, and the ALERT_STATUS[] register returns the ECC_ERR and/or I_FAULT
bit = 1(true). The device may return erroneous measurement data, and/or fail to detect COV, CUV, or OT faults
in this state.
EPROM bits are shipped from the factory set to 0, and must be programmed to the 1 state as required.
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Table 4. Data and Control Register Descriptions
ADDR
GROUP
ACCESS (1)
RESET
DESCRIPTION
0x00
1
R
0
Status register
GPAI
0x01, 0x02
1
R
0
GPAI measurement data
VCELL1
0x03, 0x04
1
R
0
Cell 1 voltage data
VCELL2
0x05, 0x06
1
R
0
Cell 2 voltage data
VCELL3
0x07, 0x08
1
R
0
Cell 3 voltage data
VCELL4
0x09, 0x0a
1
R
0
Cell 4 voltage data
VCELL5
0x0b, 0x0c
1
R
0
Cell 5 voltage data
VCELL6
0x0d, 0x0e
1
R
0
Cell 6 voltage data
TEMPERATURE1
0x0f, 0x10
1
R
0
TS1+ to TS1– differential voltage data
TEMPERATURE2
0x11, 0x12
1
R
0
TS2+ to TS2– differential voltage data
RSVD
0x13–0x1f
–
–
–
Reserved for future use
ALERT_STATUS
0x20
2
R/W
0x80
Indicates source of ALERT signal
FAULT_STATUS
0x21
2
R/W
0x08
Indicates source of FAULT signal
COV_FAULT
0x22
1
R
0
Indicates cell in OV fault state
CUV_FAULT
0x23
1
R
0
Indicates cell in UV fault state
PRESULT_A
0x24
1
R
0
Parity result of group-3 protected registers (A)
PRESULT_B
0x25
1
R
0
Parity result of group-3 protected registers (B)
0x26–0x2f
–
–
–
Reserved for future use
ADC_CONTROL
0x30
2
R/W
0
ADC measurement control
IO_CONTROL
0x31
2
R/W
0
I/O pin control
CB_CTRL
0x32
2
R/W
0
Controls the state of the cell-balancing outputs CBx
CB_TIME
0x33
2
R/W
0
Configures the CB control FETs maximum on time
ADC_CONVERT
0x34
2
R/W
0
ADC conversion start
0x35–0x39
–
–
–
Reserved for future use
SHDW_CTRL
0x3a
2
R/W
0
Controls WRITE access to group-3 registers
ADDRESS_CONTROL
0x3b
2
R/W
0
Address register
RESET
0x3c
2
W
0
RESET control register
TEST_SELECT
0x3d
2
R/W
0
Test mode selection register
RSVD
0x3e
–
–
–
Reserved for future use
E_EN
0x3f
2
R/W
0
EPROM programming mode enable
FUNCTION_CONFIG
0x40
3
R/W
EPROM
Default configuration of device
IO_CONFIG
0x41
3
R/W
EPROM
I/O pin configuration
CONFIG_COV
0x42
3
R/W
EPROM
Overvoltage set point
CONFIG_COVT
0x43
3
R/W
EPROM
Overvoltage time-delay filter
CONFIG_CUV
0x44
3
R/W
EPROM
Undervoltage setpoint
CONFIG_CUVT
0x45
3
R/W
EPROM
Undervoltage time-delay filter
CONFIG_OT
0x46
3
R/W
EPROM
Overtemperature set point
CONFIG_OTT
0x47
3
R/W
EPROM
Overtemperature time-delay filter
USER1
0x48
3
R
EPROM
User data register 1, not used by device
USER2
0x49
3
R
EPROM
User data register 2, not used by device
USER3
0x4a
3
R
EPROM
User data register 3, not used by device
USER4
0x4b
3
R
EPROM
User data register 4, not used by device
RSVD
0x4c–0xff
–
–
–
NAME
DEVICE_STATUS
RSVD
RSVD
(1)
34
Reserved
Key: R = Read; W = Write
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REGISTER DETAILS
DEVICE_STATUS REGISTER (0x00)
7
AR
6
FAULT
5
ALERT
4
–
3
ECC_COR
2
UVLO
1
CBT
0
DRDY
The STATUS register provides information about the current state of the bq76PL536.
[7]
(ADDR_RQST)
This bit is written to indicate that the ADDR[0]…[5] bits have been written to the correct
address. This bit is a copy of in the ADDRESS_CONTROL[AR] bit.
0 = Address has not been assigned
1 = Address has been assigned
[6] (FAULT):
This bit indicates that this bq76PL536 has detected a condition causing the FAULT signal to
become asserted.
0 = No FAULT exists
1 = A FAULT exists. Read FAULT_STATUS[] to determine the cause.
[5] (ALERT):
This bit indicates that this bq76PL536 has detected a condition causing the ALERT pin to
become asserted.
0 = No FAULT exists
1 = An ALERT exists. Read ALERT_STATUS[] to determine the cause.
[4] (not implemented)
[3] (ECC_COR):
This bit indicates a one-bit error has been detected and corrected in the EPROM.
0 = No errors are detected in the EPROM
1 = A one-bit (single bit) error has been detected and corrected by on-chip logic.
[2] (UVLO):
This bit indicates the device VBAT has fallen below the undervoltage lockout trip point.
Some device operations are not valid in this condition.
0 = Normal operation
1 = UVLO trip point reached, device operation is not ensured.
[1] (CBT):
This bit indicates the cell balance timer is running.
0 = The cell balance timer is has not started or has expired.
1 = The cell balance timer is running.
[0] (DRDY):
This bit indicates the data is ready to read (no conversions active).
0 = There are conversion(s) running.
1 = There are no conversion(s) running.
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GPAI (0x01, 0x02)
15
GPAI[15]
7
GPAI [7]
14
GPAI [14]
6
GPAI [6]
13
GPAI [13]
5
GPAI [5]
12
GPAI [12]
4
GPAI [4]
11
GPAI [11]
3
GPAI [3]
10
GPAI [10]
2
GPAI [2]
9
GPAI [9]
1
GPAI [1]
8
GPAI [8]
0
GPAI [0]
9
VCELLn[9]
1
VCELLn[1]
8
VCELLn[8]
0
VCELLn[0]
The GPAI register reports the ADC measurement of GPAI+/GPAI– in units of LSBs.
Bits 15–8 are returned at address 0x01, bits 7–0 at address 0x02.
VCELLn REGISTER (0x03…0x0e)
15
VCELLn[15]
7
VCELLn[7]
14
VCELLn[14]
6
VCELLn[6]
13
VCELLn[13]
5
VCELLn[5]
12
VCELLn[12]
4
VCELLn[4]
11
VCELLn[11]
3
VCELLn[3]
10
VCELLn[10]
2
VCELLn[2]
The VCELLn registers report the converted data for cell n, where n = 1 to 6.
Bits 15–8 are returned at odd addresses (e.g. 0x03), bits 7–0 at even addresses (e.g. 0x04).
TEMPERATURE1 REGISTER (0x0f, 0x10)
15
TEMP1[15]
7
TEMP1[7]
14
TEMP1[14]
6
TEMP1[6]
13
TEMP1[13]
5
TEMP1[5]
12
TEMP1[12]
4
TEMP1[4]
11
TEMP1[11]
3
TEMP1[3]
10
TEMP1[10]
2
TEMP1[2]
9
TEMP1[9]
1
TEMP1[1]
8
TEMP1[8]
0
TEMP1[0]
The TEMPERATURE1 register reports the converted data for TS1+ to TS1–.
Bits 15–8 are returned at odd addresses (e.g., 0x0f), bits 7–0 at even addresses (e.g., 0x10).
TEMPERATURE2 REGISTER (0x11, 0x12)
15
TEMP2[15]
7
TEMP2[7]
14
TEMP2[14]
6
TEMP2[6]
13
TEMP2[13]
5
TEMP2[5]
12
TEMP2[12]
4
TEMP2[4]
11
TEMP2[11]
3
TEMP2[3]
10
TEMP2[10]
2
TEMP2[2]
9
TEMP2[9]
1
TEMP2[1]
8
TEMP2[8]
0
TEMP2[0]
The TEMPERATURE2 register reports the converted data for TS2+ to TS2–.
Bits 15–8 are returned at odd addresses (e.g., 0x11), bits 7–0 at even addresses (e.g., 0x12).
ALERT_STATUS REGISTER (0x20)
7
AR
6
PARITY
5
ECC_ERR
4
FORCE
3
TSD
2
SLEEP
1
OT2
0
OT1
The ALERT_STATUS register provides information about the source of the ALERT signal. The host must clear
each alert flag by writing a 1 to the bit that is set. The exception is bit 4, which may be written 1 or 0 as needed
to implement self-test of the IC stack and wiring.
[7] AR
This bit indicates that the ADDR[0]…[5] bits have been written to a valid address. This bit
is an inverted copy of the ADDRESS_CONTROL[AR] bit. It is not cleared until an
address has been programmed in ADDRESS_CONTROL and a 1 followed by a 0 (two
writes) is written to the bit.
0 = Address has been assigned.
1 = Address has not been assigned (default at RESET).
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[6] (PARITY):
This bit is used to validate the contents of the protected group-3 registers.
0 = Group-3 protected register(s) contents are valid.
1 = Group-3 protected register(s) contents are invalid. Group-3 registers should be
refreshed from OTP or directly written from the host.
[5] (ECC_ERR):
This bit is used to validate the OTP register blocks.
0 = No double-bit errors (a corrected one-bit error may/may not exist)
1 = An uncorrectable error has been detected in the OTP-EPROM register bank.
OTP-EPROM register(s) are not valid.
[4] (FORCE):
This bit asserts the ALERT signal. It can be used to verify correct operation and
connectivity of the ALERT as a part of system self-test.
0 = Deassert ALERT (default)
1 = Assert the ALERT signal.
[3] (TSD):
This bit indicates thermal shutdown is active.
0 = Thermal shutdown is inactive (default).
1 = Die temperature has exceeded TSD.
[2] (SLEEP):
This bit indicates SLEEP mode was activated. This bit is only set when SLEEP is first
activated; no continuous ALERT or SLEEP status is indicated after the host resets the
bit, even if the IO_CTRL[SLEEP] bit remains true. (See IO_CTRL[] register for details.)
0 = Normal operation
1 = SLEEP mode was activated.
[1] (OT2):
This bit indicates an overtemperature fault has been detected via TS2.
0 = Temperature is lower than or equal to the VOT2 (or input disabled by
IO_CONTROL[TS2] = 0).
1 = Temperature is higher than VOT2.
[0] (OT1):
This bit indicates an overtemperature fault has been detected via TS1.
0 = Temperature is lower than or equal to the VOT1 (or input disabled by
IO_CONTROL[TS1] = 0).
1 = Temperature is higher than VOT1.
FAULT_STATUS REGISTER (0x21)
7
–
6
–
5
I_FAULT
4
FORCE
3
POR
2
CRC
1
CUV
0
COV
The FAULT_STATUS register provides information about the source of the FAULT signal. The host must clear
each fault flag by writing a 1 to the bit that is set. The exception is bit 4, which may be written 1 or 0 as needed
to implement self-test of the IC stack and wiring.
[7] (not implemented)
[6] (not implemented)
[5] (I_FAULT):
The device has failed an internal register consistency check. Measurement data and
protection function status may not be accurate and should not be used.
0 = No internal register consistency check fault exists.
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1 = The internal consistency check has failed self-test. The host should attempt to reset
the device, see the RESET section. If the fault persists, the failure should be
considered uncorrectable.
[4] (FORCE):
This bit asserts the FAULT signal. It can be used to verify correct operation and
connectivity of the FAULT line as a part of system self-test.
0 = Deassert FAULT (default)
1 = Assert the FAULT signal.
[3] (POR):
This bit indicates a power-on reset has occurred.
0 = No POR has occurred since this bit was last cleared by the host.
1 = A POR has occurred. This notifies the host that default values have been loaded to
group-1, -2 registers, and OTP contents have been copied to group-3 registers.
[2] (CRC):
This bit indicates a garbled packet reception by the device.
0 = No errors
1 = A CRC error was detected in the last packet received.
[1] (CUV):
This bit indicates that this bq76PL536 has detected a cell undervoltage (CUV) condition.
Examine CUV_FAULT[] to determine which cell caused the ALERT.
0 = All cells are above the CUV threshold (default).
1 = One or more cells is below the CUV threshold.
[0] (COV):
This bit indicates that this bq76PL536 has detected a cell overvoltage (COV) condition.
Examine COV_FAULT[] to determine which cell caused the FAULT.
0 = All cells are below the COV threshold (default).
1 = One or more cells is above the COV threshold.
COV_FAULT REGISTER (0x22)
7
–
6
–
[0..5] (OV[1]..[6]):
5
OV[6]
4
OV[5]
3
OV[4]
2
OV[3]
1
OV[2]
0
OV[1]
These bits indicate which cell caused the DEVICE_STATUS[COV] flag to be set.
0 = Cell[n] does not have an overvoltage fault (default).
1 = Cell[n] does have an overvoltage fault.
COV_FAULT REGISTER (0x23)
7
–
b0..5 (UV[1]..[6]):
6
–
5
UV[6]
4
UV[5]
3
UV[4]
2
UV[3]
1
UV[2]
0
UV[1]
These bits indicate which cell caused the DEVICE_STATUS[CUV] flag to be set.
0 = Cell[n] does not have an overvoltage fault (default).
1 = Cell[n] does have an overvoltage fault.
PARITY_H REGISTER (0x24) (PRESULT_A (R/O))
7
OTT
38
6
OTV
5
CUVT
4
CUVV
3
COVT
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The PRESULT_A register holds the parity result bits for the first eight group-3 protected registers.
PARITY_H REGISTER (0x25) (PRESULT_B (R/O))
7
0
6
0
5
0
4
0
3
USER4
2
USER3
1
USER2
0
USER1
The PRESULT_B register holds the parity result bits for the first eight group-3 protected registers.
ADC_CONTROL REGISTER (0x30)
7
–
6
ADC_ON
5
TS2
4
TS1
3
GPAI
2
CELL_SEL[2]
1
CELL_SEL[1]
0
CELL_SEL[0]
The ADC_CONTROL register controls some features of the bq76PL536.
[7] not implemented. Must be written as 0.
[6] (ADC_ON):
This bit forces the ADC subsystem ON. This has the effect of eliminating internal start-up
and settling delays, but increases current consumption.
0 = Auto mode. ADC subsystem is OFF until a conversion is requested. The ADC is
turned on, a wait is applied to allow the reference to stabilize. Automatically
returns to OFF state at end of requested conversion. Note that there is a start-up
delay associated with turning the ADC to the ON state in this mode.
1 = ADC subsystem is ON, regardless of conversion state. Power consumption is
increased.
[5..4] (TS[1]..[0]):
[3] (GPAI):
These two bits select whether any of the temperature sensor inputs are to be measured
on the next conversion sequence start.
TS[1]
TS[0]
Measure T
0
0
None (default)
0
1
TS1
1
0
TS2
1
1
Both
This bit enables and disables the GPAI input to be measured on the next
conversion-sequence start.
0 = GPAI is not selected for measurement.
1 = GPAI is selected for measurement.
[2–0] (CELL_SEL):
These three bits select the series cells for voltage measurement translation on the next
conversion sequence start.
CELL_SEL[2]
CELL_SEL[1]
CELL_SEL[0]
0
0
0
Cell 1 only
0
0
1
Cells 1-2
0
1
0
Cells 1-2-3
0
1
1
Cells 1-2-3-4
1
0
0
Cells 1-2-3-4-5
1
0
1
Cells 1-2-3-4-5-6
Other
SELECTED CELL
Cell 1 only
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IO_CONTROL REGISTER (0x31)
7
AUX
6
GIPI_OUT
5
GPIO_IN
4
0
3
0
2
SLEEP
1
TS2
0
TS1
The IO_CONTROL register controls some features of the bq76PL536 external I/O pins.
[7] (AUX):
Controls the state of the AUX output pin, which is internally connected to REG50.
0 = Open
1 = Connected to REG50
[6] (GPIO_OUT):
Controls the state of the open-drain GPIO output pin; the pin should be programmed to 1
to use the GPIO pin as an input.
0 = Output low
1 = Open-drain
[5] (GPIO_IN):
Represents the input state of GPIO pin when used as an input
0 = GPIO input is low.
1 = GPIO input is high.
[4] Not implemented. Must be written as 0.
[3] Not implemented. Must be written as 0.
[2] (SLEEP):
Places the device in a low-quiescent-current state. All CUV, COV, and OT comparators
are disabled. A 1-ms delay to stabilize the reference voltage is required to exit SLEEP
mode and return to active COV, CUV monitoring.
0 = ACTIVE mode
1 = SLEEP mode
[1..0] (TSx)
Controls the connection of the TS1(2) inputs to the ADC VSS connection point. When set,
the TSx(–) input is connected to VSS. These bits should be set to 0 to reduce the current
draw of the system.
0 = Not connected
1 = Connected
CB_CTRL REGISTER (0x32)
7
–
6
–
5
CBAL[6]
4
CBAL[5]
3
CBAL[4]
2
CBAL[3]
1
CBAL[2]
0
CBAL[1]
The CB_CTRL register determines the internal cell balance output state.
CB_CTRL b(n = 5 to 0) (CBAL(n + 1)): This bit determines if the CB(n) output is high or low.
0 = CB[n] output is low (default).
1 = CB[n] output is high (active).
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CB_TIME REGISTER (0x33)
7
CBT[7]
6
–
5
CBT[5]
4
CBT[4]
3
CBT[3]
2
CBT[2]
1
CBT[1]
0
CBT[0]
The CB_TIME register sets the maximum high (active) time for the cell balance outputs from 0 seconds to 63
minutes. When set to 0, no balancing can occur – balancing is effectively disabled.
[7]
Controls minutes/seconds counting resolution.
0 = Seconds (default)
1 = Minutes
[5..0]
Sets the time duration as scaled by CBT.7
ADC_CONVERT REGISTER (0x34)
7
–
6
–
5
–
4
–
3
–
2
–
1
–
0
CONV
The CONVERT_CTRL register is used to start conversions.
[0] (CONV):
This bit starts a conversion, using the settings programmed into the ADC_CONTROL[]
register. It provides a programmatic method of initiating conversions.
0 = No conversion (default)
1 = Initiate conversion. This bit is automatically reset after conversion begins, and always
returns 0 on READ.
SHDW_CTRL REGISTER (0x3a)
7
SHDW[7]
6
SHDW[6]
5
SHDW[5]
4
SHDW[4]
3
SHDW[3]
2
SHDW[2]
1
SHDW[1]
0
SHDW[0]
The SHDW_CTRL register controls writing to group-3 protected registers. Default at RESET = 0x00.
The value 0x35 must be written to this register to allow writing to group-3 protected registers in the range
0x40–0x4f. The register always returns 0x00 on read. The register is reset to 0x00 after any successful write,
including a write to non-group-3 registers. A read operation does not reset this register.
Writing the value 0x27 results in all group-3 protected registers being refreshed from OTP programmed values.
The register is reset to 0x00 after the REFRESH is complete.
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ADDRESS_CONTROL REGISTER (0x3b)
7
AR
6
0
5
ADDR[5]
4
ADDR[4]
3
ADDR[3]
2
ADDR[2]
1
ADDR[1]
0
ADDR[0]
The ADDRESS_CONTROL register allows the host to assign an address to the bq76PL536 for communication.
The default for this register is 0x00 at RESET.
[7] (ADDR_RQST):
This bit is written to indicate that the ADDR[0]…[5] bits have been written to the correct
address. This bit is reflected in the DEVICE_STATUS[AR] bit
0 = Address has not been assigned (default at RESET).
1 = Address has been assigned.
[5..0] (ADDR):
These bits set the device address for SPI communication. This provides to a range of
addresses from 0x00 to 0x3f. Address 0x3f is reserved for broadcast messages to all
connected and addressed 76PL536 devices. The default for these 6 bits is 0x00 at
RESET.
RESET REGISTER (0x3c)
7
RST[7]
6
RST[6]
5
RST[5]
4
RST[4]
3
RST[3]
2
RST[2]
1
RST[1]
0
RST[0]
2
TSEL[2]
1
TSEL[1]
0
TSEL[0]
The RESET register allows the host to reset the bq76PL536 directly.
Writing 0xa5 causes the device to RESET. Other values are ignored.
TEST_SELECT REGISTER (0x3d)
7
TSEL[7]
6
TSEL[6]
5
TSEL[5]
4
TSEL[4]
3
TSEL[3]
The TEST_SELECT places the SPI port in a special mode useful for debug.
TSEL (b7–b0) is used to place the SPI_H interface pins in a mode to support test/debug of a string of
bq76PL536 devices. 0 = normal operating mode.
When the sequence 0xa4, 0x25 ("JR") is written on subsequent write cycles, the device enters a special TEST
mode useful for stack debugging. Writes to other registers between the required sequence bytes results in the
partial sequence being voided; the entire sequence must be written again. POR, RESET, or writing a 0x00 to this
register location exits this mode.
In this state, SPI pin SCLK and SDI become outputs and are enabled, and reflect the state of the SCLK_S,
SDI_S pins of the device. SDO remains an output. This allows observation of bus traffic mid-string. The lowest
device in the string should not be set to operate in this mode. The user is cautioned to condition the connection
to a mid- or top-string device with suitable isolation circuitry to prevent injury or damage to connected devices.
Programming the most-negative device on the stack in this mode prevents further communications with the stack
until POR, and may result in device destruction; this condition should be avoided.
E_EN REGISTER (0x3f)
7
E_EN[7]
6
E_EN [6]
5
E_EN [5]
4
E_EN [4]
3
E_EN [3]
2
E_EN [2]
1
E_EN [1]
0
E_EN [0]
The E_EN register controls the access to the programming of the integrated OTP EPROM.
This register should be written the value 0x91 to permit writing the USER block of EPROM. Values other than
0x00 and 0x91 are reserved and may result in undefined operation. The next read or write of any type to the
device resets (closes) the write window. If a group-3 protected write occurs, the window is closed after the write.
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FUNCTION_CONFIG REGISTER (0x40)
7
ADCT[1]
6
ADCT[0]
5
GPAI_REF
4
GPAI_SRC
3
CN[1]
2
CN[0]
1
–
0
0
The FUNCTION_CONFIG sets the default configuration for special features of the device.
[7..6] (ADCT[0,1]):
These bits set the conversion timing of the ADC measurement.
[5] (GPAI_REF):
ADCT[1]
ADCT[0]
~Conversion Time (ms)
0
0
3
0
1
6 (recommended)
1
0
12
1
1
24
This bit sets the reference for the GPAI ADC measurement.
0 = Internal ADC bandgap reference
1 = VREG50 (ratiometric)
[4] (GPAI_SRC):
This bit controls multiplexing of the GPAI register and determines whether the ADC mux
is connected to the external GPAI inputs, or internally to the BAT1 pin. The register
results are automatically scaled to match the input.
0 = External GPAI inputs are converted to result in GPAI register 0x01–02.
1 = BAT pin to VSS voltage is measured and reported in the GPAI register.
[3..2] (CN[1..0]):
These two bits configure the number of series cells used. If fewer than 6 cells are
configured, the corresponding OV/UV faults are ignored. For example, if the CN[x] bits
are set to 10b (2), then the OV/UV comparators are ignored for cells 5 and 6.
CN[1]
CN[0]
SERIES CELLS
0
0
6 (DEFAULT)
0
1
5
1
0
4
1
1
3
IO_CONFIG REGISTER (0x41)
7
–
6
–
5
–
4
–
3
–
2
–
1
–
0
CRC_DIS
The IO_CONFIG sets the default configuration for miscellaneous I/O features of the device.
[0] (CRC_DIS):
This bit enables and disables the automatic generation of the CRC for the SPI
communication packet. The packet size is determined by the host as part of the read
request protocol. The CRC is checked at the deassertion of the CS pin. TI recommends
that this bit be changed using the broadcast address (0x3f) so that all devices in a battery
stack use the same protocol.
0 = A CRC is expected, and generated as the last byte of the packet.
1 = A CRC is not used in communications.
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CONFIG_COV REGISTER (0x42)
7
DISABLE
6
–
5
COV[5]
4
COV[4]
3
COV[3]
2
COV[2]
1
COV[1]
0
COV[0]
The CONFIG_COV register determines cell overvoltage threshold voltage.
[7] (DISABLE):
Disables the overvoltage function when set
0 = Overvoltage function enabled
1 = Overvoltage function disabled
[5..0] (COV[5]…[0]):
Configuration bits with corresponding voltage threshold
0x00 = 2 V; each binary increment adds 50 mV until 0x3c = 5 V.
CONFIG_COVT REGISTER (0x43)
7
µs/ms
6
–
5
–
4
COVD[4]
3
COVD[3]
2
COVD[2]
1
COVD[1]
0
COVD[0]
The CONFIG_COVT register determines cell overvoltage detection delay time.
[7] (µs/ms):
Determines the units of the delay time, microseconds or milliseconds
0 = Microseconds
1 = Milliseconds
[4..0] COVD:
0x01 = 100; each binary increment adds 100 until 0x1f = 3100
Note:
When this register is programmed to 0x00, the delay becomes 0s AND the COV state
is NOT latched in the COV_FAULT[] register. In this operating mode, the overvoltage
state for a cell is virtually instantaneous in the COV_FAULT[] register. This mode may
cause system firmware to miss a dangerous cell overvoltage condition.
CONFIG_UV REGISTER (0x44)
7
DISABLE
6
–
5
–
4
CUV[4]
3
CUV[3]
2
CUV[2]
1
CUV[1]
0
CUV[0]
The CUV register determines cell under voltage threshold voltage.
[7] (DISABLE):
Disables the undervoltage function when set
0 = Undervoltage function enabled
1 = Undervoltage function disabled
[5..0] (CUV[4]…[0]):
44
Configuration bits with corresponding voltage threshold
0x00 = 0.7 V; each binary increment adds 100 mV until 0x1a = 3.3 V.
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Copyright © 2009–2010, Texas Instruments Incorporated
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bq76PL536
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SLUSA08A – DECEMBER 2009 – REVISED JULY 2010
CONFIG_CUVT REGISTER (0x45)
7
µs/ms
6
–
5
–
4
CUVD[4]
3
CUVD[3]
2
CUVD[2]
1
CUVD[1]
0
CUVD[0]
The CONFIG_CUVT register determines cell overvoltage detection delay time.
[7] (µs/ms):
Determines the units of the delay time, microseconds or milliseconds
0 = Microseconds
1 = Milliseconds
[4..0] CUVD:
0x01 = 100; each binary increment adds 100 until 0x1f = 3100.
Note:
When this register is programmed to 0x00, the delay becomes 0s AND the CUV state
is NOT latched in the CUV_FAULT[] register. In this operating mode, the overvoltage
state for a cell is virtually instantaneous in the CUV_FAULT[] register. This mode may
cause system firmware to miss a dangerous cell undervoltage condition.
CONFIG_OT REGISTER (0x46)
7
OT2[3]
6
OT2[2]
5
OT2[1]
4
OT2[0]
3
OT1[3]
2
OT1[2]
1
OT1[1]
0
OT1[0]
The CONFIG_OT register holds the configuration of the overtemperature thresholds for the two TS inputs.
For each respective nibble (OT1 or OT2), the value 0x0 disables this function. Other settings program a trip
threshold. See the Ratiometric Sensing section for details of setting this register. Values above 0x0b are illegal
and should not be used.
CONFIG_OTT REGISTER (0x47)
7
COTD[7]
6
COTD[6]
5
COTD[5]
4
COTD[4]
3
COTD[3]
2
COTD[2]
1
COTD[1]
0
COTD[0]
The CONFIG_OTT register determines cell overtemperature detection delay time.
0x01 = 10 ms; each binary increment adds 10 ms until 0xff = 2.55 seconds.
Note: When this register is programmed to 0x00, the delay becomes 0s AND the OT state is NOT
latched in the ALERT_STATUS[] register. In this operating mode, the overtemperature state
for a TSn input is virtually instantaneous in the register. This mode may cause system
firmware to miss a dangerous overtemperature condition.
USERx REGISTER (0x48–0x4b) (USER1–4)
7
USER[7]
6
USER[6]
5
USER[5]
4
USER[4]
3
USER[3]
2
USER[2]
1
USER[1]
0
USER[0]
The four USER registers can be used to store user data. The part does not use these registers for any internal
function. They are provided as convenient storage for user S/N, date of manufacture, etc.
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45
bq76PL536
SLUSA08A – DECEMBER 2009 – REVISED JULY 2010
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PROGRAMMING THE EPROM CONFIGURATION REGISTERS
The bq76PL536 has a block of OTP-EPROM that is used for configuring the operation of the bq76PL536.
Programming of the EPROM should take place during pack/system manufacturing. A 7-V (VPP) pulse is required
on the PROG pin. The part uses an internal window comparator to check the voltage, and times the internal
pulse delivered to the EPROM array.
The user first writes the desired values to all of the equivalent group-3 protected register addresses. The desired
data is written to the appropriate address by first applying 7 V to the LDOD1(2) pins. Programming then
performed by writing to the EE_EN register (address 0x3f) with data 0x91. After a time period > 1500 µs, the 7 V
is removed. Nominally, the voltage pulse should be applied for approximately 2–3 ms. Applying the voltage for an
extended period of time may lead to device damage. The write is self-timed internally after receipt of the
command. The following flow chart illustrates the procedure for programming.
No
Host writes data to Registers in USER
Block 0x40–0x47
Verify Data in 0x40–0x47
Enable Group3 Write:
Write: 0x35 to SHDW_CTRL (0x3a)
Copy EPROM back to Registers
Write 0x27 to SHDW_CTRL (0x3a)
Write data to Registers
Write: 0xnn to 0x4x
Read Register block
0x40–0x4b
ADDR++
ADDR > 0x4b?
Contents match
programmed value?
Yes
Yes
Apply 7 V to
LDOD1(2) pin
Nominal time
~ 2 ms to 3 ms
No
Verify ECC bits
Read DEVICE_STATUS [ECC_COR]
Read ALERT_STATUS [PARITY]
Read ALERT_STATUS [PARITY]
Host enables write to USER Block
Write: 0x91 to E_EN @0x3f
No
All == 0?
Remove 7 V from
LDOD1(2) pins
Yes
SUCCESS
Programming complete
FAIL
Figure 15. EPROM Programming
46
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Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s) :bq76PL536
CELL 16 +
CELL 15 +
4
2-VSS
C84
.001uf 50V
CAP0603
7
TP5
6
5
6
2-VSS
TP4
3-VSS
CELL 4 +
7
CELL 1 -
TP1
5
6
CELL 2 +
CELL 1 +
4
3
CELL 5 +
CELL 3 +
1
2
CELL 6 +
1-VSS
P1
39502-1007_7-POS
TP2
1-VSS
C51
.001uf 50V
CAP0603
TP3
7
CELL 7 +
CELL 7 -
4
5
CELL 9 +
3
CELL 11 +
CELL 10 +
CELL 8 +
1
2
CELL 12 +
P2
39502-1007_7-POS
CELL 13 -
CELL 13 +
CELL 14 +
3
GROUND PLANE OF CIRCUIT 3
CAUTION
HIGH VOLTAGE
GROUND PLANE OF CIRCUIT 1
GROUND PLANE OF CIRCUIT 2
COMM PINS OF THE CHIP BELOW
TO JUST BELOW THE NORTH
UNDER THE SOUTH COMM LINES
EXTEND THE GROUND PLANE
GROUND PLANE OF CIRCUIT 2
3-CELL6
1-CELL0
1-CELL1
1-CELL2
1-CELL3
1-CELL4
1-CELL5
1-CELL6
1-VBAT
2-CELL0
2-CELL1
2-CELL2
2-CELL3
2-CELL4
2-CELL5
2-CELL6
2-VBAT
3-CELL0
3-CELL1
3-CELL2
3-CELL3
3-CELL4
3-CELL5
3-VBAT
CELL0
CELL1
CELL2
CELL3
CELL4
CELL5
CELL6
VBAT
CONV_N
CELL6
CELL5
CELL0
CELL1
CELL2
CELL3
CELL4
CELL0
CELL1
CELL2
CELL3
CELL4
CELL5
CELL6
R81
1K
RES0603
3-VBAT
R143
R144
R145
1K
1K
1K
RES0603 RES0603 RES0603
CONV_S
R142
1K
RES0603
3-VBAT
BQ76PL536_CIRCUIT3
SHEET-4
3-VBAT
LOCATE R143, R144, R168, R176
CLOSE TO THE MOST NORTH IC
R146
1K
RES0603
R147
1K
RES0603
R148
R149
1K
1K
RES0603 RES0603
LOCATE R195, R196, R197, R199
CLOSE TO THE MOST NORTH IC
SHEET-3
BQ76PL536_CIRCUIT2
LOCATE R142, R175, R192, R193
CLOSE TO THE MOST SOUTH IC
DRDY_N
R82
R83
R84
1K
1K
1K
RES0603 RES0603 RES0603
DRDR_S
R85
1K
RES0603
R86
1K
RES0603
R91
R92
1K
1K
RES0603 RES0603
SHEET-2
BQ76PL536_CIRCUIT1
LOCATE R194, R198, R200, R201
CLOSE TO THE MOST SOUTH IC
DRDY_N
DRDY_S
2
DRDY_N
DRDY_S
3-DRDY_S
2-DRDY_N
2-DRDY_S
1-DRDY_N
1-CELL0
CELL 17 +
ALERT_N
ALERT_S
ALERT_N
3-VBAT
3-VBAT
3-ALERT_S
2-ALERT_N
2-ALERT_S
1-ALERT_N
TP6
FAULT_N
FAULT_S
FAULT_N
FAULT_S
1
FAULT_N
FAULT_S
3-FAULT_S
2-FAULT_N
2-FAULT_S
1-FAULT_N
1-CELL0
3-CONV_S
SCLK_N
SCLK_S
SCLK_S
SCLK_N
SCLK_S
P3
39502-1007_7-POS
2-SCLK_S
1-SCLK_N
1-CELL0
2-CONV_N
3-VBAT
3-SCLK_S
SCLK_N
2-SCLK_N
3-SDO_S
2-SDO_N
2-SDO_S
1-SDO_N
1-CELL0
2-CONV_S
SDO_N
SDO_S
SDO_N
SDO_S
SD0_N
SD0_S
1-CONV_N
1-CELL0
3-VBAT
3-CS_S
2-CS_N
2-CS_S
1-CS_N
CONV_N
3-VBAT
3-SDI_S
2-SDI_N
2-SDI_S
1-SDI_N
CELL 18 +
SDI_S
CONV_S
SDI_N
SDI_S
SDI_N
SDI_S
SDI_N
ALERT_S
ALERT_N
ALERT_S
1-CELL0
CONV_N
CONV_S
CS_N
CS_S
CS_N
CS_S
CS_N
CS_S
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1-CELL0
Copyright © 2009–2010, Texas Instruments Incorporated
1-CELL0
GPIO
SPI-SS
SPI-SCLK
SPI-MOSI
SPI-MISO
CONV
DRDY
ALERT
FAULT
1-GPIO
1-SPI-SS
1-SPI-SCLK
1-SPI-MOSI
1-SPI-MISO
1-CONV/RX
1-DRDY/TX
1-ALERT
1-FAULT
2-VSS
1-VSS
2-VSS
C85
.0033uf 50V
CAP0603
C52
.0033uf 50V
CAP0603
3-VSS
CAUTION
HIGH VOLTAGE
INDIVIDUAL GROUND PLANES ARE NECESSARY FOR PROPER
NOISE REJECTION AND STABILITY OF THESE CIRCUITS
R12
100
RES0603
R13
100
RES0603
R14
100
RES0603
R15
100
RES0603
1-VSS
10
9
8
7
6
5
4
3
2
1
SCLK
CS
MOSI
MISO
GND
CONV
DRDY
ALERT
FAULT
VSIG
P4
MTA100-HEADER-10PIN
Only the ground reference CELL0 of circuit 1 is safe to
connect non-isolated test equipment grounds.
S001
DO NOT connect ground references from different chips
NOTE: The ground reference per circuit block is unique
The most negative connection of CELL0 is the ground
reference for each chip.
www.ti.com
SLUSA08A – DECEMBER 2009 – REVISED JULY 2010
bq76PL536
REFERENCE SCHEMATIC
Figure 16. Schematic (Page 1 of 4)
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47
Product Folder Link(s) :bq76PL536
[1] 1-CELL2
[1] 1-CELL1
[1] 1-CELL0
CELL 2 +
CELL 1 +
CELL 1 -
[1] 1-CELL3
CELL 3 +
[1] 1-CELL6
[1] 1-CELL5
[1] 1-CELL4
CELL 6 +
CELL 5 +
CELL 4 +
R24
47
RES2512
Z5
5.1 VDC 500mW
Q6
SOD-123
FDN359AN
SOT-23
R38
47
RES2512
Z1
5.1 VDC 500mW
Q2
SOD-123
FDN359AN
SOT-23
R9
47
RES2512
Z3
5.1 VDC 500mW
Q4
SOD-123
FDN359AN
SOT-23
C9
0.1uf 50V
CAP0603
C19
0.1uf 50V
CAP0603
R49
47
RES2512
Z7
5.1 VDC 500mW
Q7
SOD-123
FDN359AN
SOT-23
C27
0.1uf 50V
CAP0603
C37
0.1uf 50V
CAP0603
Z9
5.1 VDC 500mW
Q8
SOD-123
FDN359AN
SOT-23
R69
47
RES2512
SOT-23
Z11
5.1 VDC 500mW
Q9
SOD-123
FDN359AN
C42
0.1uf 50V
CAP0603
C48
0.1uf 50V
CAP0603
R79
47
RES2512
Z2
5.1VDC
SOD-323
Z4
5.1VDC
SOD-323
Z6
5.1VDC
SOD-323
Z8
5.1VDC
SOD-323
Z10
5.1VDC
SOD-323
Z12
5.1VDC
SOD-323
** C28
0.1uf 50V
CAP0603
R2
1.0K 1%
RES0603
R7
1M 1%
RES0603
R8
1.0K 1%
RES0603
1-VSS -VSS1
** C30
0.1uf 50V
CAP0603
R18
1.0K 1%
RES0603
R21
1M 1%
RES0603
R22
1.0K 1%
RES0603
**C32
0.1uf 50V
CAP0603
R28
1.0K 1%
RES0603
R35
1M 1%
RES0603
R32
1.0K 1%
RES0603
** C33
0.1uf 50V
CAP0603
R40
1.0K 1%
RES0603
R44
1M 1%
RES0603
R45
1.0K 1%
RES0603
** C38
0.1uf 50V
CAP0603
R57
1.0K 1%
RES0603
R61
1M 1%
RES0603
R62
1.0K 1%
RES0603
0.1uf 50V
CAP0603
**C40
R75
1.0K 1%
RES0603
R76
1M 1%
RES0603
R77
1.0K 1%
RES0603
** C41
0.1uf 50V
CAP0603
13
12
11
10
9
8
7
6
5
4
3
2
1
VC0
CB1
VC1
CB2
VC2
CB3
VC3
CB4
VC4
CB5
VC5
CB6
VC6
63
BAT1
64
BAT2
1-VSS
C43 **
0.1uf 50V
CAP0603
1-VSS
bq76PL536TPAPQ1
U1
C105
DNP
CAP0603
1-VSS
1-
TS1-
TS1+
TS2-
TS2+
47
48
16
46
18
17
15
C34 **
C39 **
2.2uf 10V 0.1uf 50V
CAP0805 CAP0603
C24 **
2.2uf 10V
CAP0805
CAUTION
HIGH VOLTAGE
1-VSS
** Locate these components
very close to U1.
LDOD2
LDOD1
LDOA
AGND
VREF
1-VSS
C25
0.1uf 50V
CAP0603
C7
DNP
CAP0603
1-LDOA
R50
0R0
RES0603
R58
0R0
RES0603
T2-2
R71
1.47K 1%
RES0603
T1
T1-3
1-VSS
R27
1.47K 1%
RES0603
T1-4
R124
10K 1%
B=3435K
NTC0603
R30
100
RES0603
R29
100K
RES0603
D1
LTW-C192TL2
White LED
1-GPIO [1]
1-VSS
Q5
2N7002LT1
SOT-23
R25
2.7K
RES0603
1-VSS
TP-VSS1
TP-VPROG1
1-LDOD
S002
[1]
1-SPI-MISO
[1]
1-SPI-MOSI
[1]
1-SPI-SCLK
[1]
1-SPI-SS
C23 **
10uf 10V
CAP1206
C6
DNP
CAP0603
R33
1.82K 1%
RES0603
T2-1
R123
10K 1%
B=3435K
NTC0603
41
SDO_H
42
SDI_H
40
SCLK_H
43
CS_H
C4
DNP
CAP0603
T2
R63
1.82K 1%
RES0603
C21
0.047uf 16V
CAP0603
THERMISTOR NTC 10K OHM 1% 0603
PANASONIC PART NUMBER # ERT-J1VG103FA
T2-1,2 T1-3,4 pair on 0.100" spacing
1-FAULT [1]
1-ALERT [1]
1-DRDY/TX [1]
1-CONV/RX [1]
45
J13-1
J12-1
J11-1
J10-1
C46
0.047uf 16V
CAP0603
CAUTION
HIGH VOLTAGE
** - Locate these components
very close to U1.
39
FAULT_H
38
ALERT_H
37
DRDY_H
36
CONV_H
GPIO
51
NC2
30
NC1
62
NC3
GPAI-
19
20
60
61
1-VSS
C26 **
2.2uf 10V
CAP0805
C108
DNP
CAP0603
1-VSS
GPAI+
C47
DNP
CAP0603
R72
2.0M
RES0603
R190
2.0M
RES0603
R195
2.0M
RES0603
1-VSS -VSS VSS
1
"Bottom" part connects
all _S pins to 1-VSS.
21
CONV_S
22
DRDY_S
23
ALERT_S
24
FAULT_S
44
C113
DNP
CAP0603
50
TEST
R80
1.0K 1%
RES0603
1-CONV_N [1]
1-DRDY_N [1]
1-ALERT_N [1]
1-FAULT_N [1]
59
CONV_N
58
DRDY_N
57
ALERT_N
56
FAULT_N
26
SCLK_S
27
SDO_S
28
SDI_S
29
CS_S
1-VBAT
[1]
1-SCLK_N [1]
1-SDO_N [1]
1-SDI_N [1]
[1]
1-CS_N
55
SCLK_N
54
SDO_N
53
SDI_N
52
CS_N
1-CONV_S
1-DRDY_S
1-ALERT_S
1-FAULT_S
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1-SCLK_S
1-SDO_S
1-SDI_S
1-CS_S
HSEL
32
REG50
31
AUX
VSS6
VSS5
VSS4
VSS3
VSS2
VSS1
49
35
34
33
25
14
TAB
65
48
GROUND PLANE OF CIRCUIT 1
GROUND PLANE OF CIRCUIT 2
bq76PL536
SLUSA08A – DECEMBER 2009 – REVISED JULY 2010
www.ti.com
Figure 17. Schematic (Page 2 of 4)
Copyright © 2009–2010, Texas Instruments Incorporated
[1] 2-CELL2
[1] 2-CELL0
CELL 1 -
[1] 2-CELL3
CELL 3 +
[1] 2-CELL1
[1] 2-CELL4
CELL 4 +
CELL 2 +
[1] 2-CELL5
CELL 1 +
[1] 2-CELL6
CELL 6 +
CELL 5 +
Z14
5.1 VDC 500mW
Q10
SOD-123
FDN359AN
SOT-23
R98
47
RES2512
Q11
FDN359AN
SOT-23
R104
47
RES2512
Z16
5.1 VDC 500mW
SOD-123
C54
0.1uf 50V
CAP0603
C58
0.1uf 50V
CAP0603
Z18
5.1 VDC 500mW
Q13
SOD-123
FDN359AN
SOT-23
R114
47
RES2512
Q14
FDN359AN
SOT-23
R121
47
RES2512
Z22
5.1 VDC 500mW
Q15
SOD-123
FDN359AN
SOT-23
R132
47
RES2512
Z20
5.1 VDC 500mW
SOD-123
C65
0.1uf 50V
CAP0603
C72
0.1uf 50V
CAP0603
R139
47
RES2512
Z24
5.1 VDC 500mW
Q16
SOD-123
FDN359AN
SOT-23
C76
0.1uf 50V
CAP0603
C81
0.1uf 50V
CAP0603
Z15
5.1VDC
SOD-323
Z17
5.1VDC
SOD-323
Z19
5.1VDC
SOD-323
Z21
5.1VDC
SOD-323
Z23
5.1VDC
SOD-323
Z25
5.1VDC
SOD-323
** C64
0.1uf 50V
CAP0603
R93
1.0K 1%
RES0603
R94
1M 1%
RES0603
R95
1.0K 1%
RES0603
2-VSS
** C66
0.1uf 50V
CAP0603
R99
1.0K 1%
RES0603
R100
1M 1%
RES0603
R101
1.0K 1%
RES0603
CAP0603
** C67
0.1uf 50V
R109
1.0K 1%
RES0603
R110
1M 1%
RES0603
R111
1.0K 1%
RES0603
** C68
0.1uf 50V
CAP0603
R117
1.0K 1%
RES0603
R119
1M 1%
RES0603
R120
1.0K 1%
RES0603
** C70
0.1uf 50V
CAP0603
R128
1.0K 1%
RES0603
R129
1M 1%
RES0603
R130
1.0K 1%
RES0603
** C73
0.1uf 50V
CAP0603
R135
1.0K 1%
RES0603
R136
1M 1%
RES0603
R137
1.0K 1%
RES0603
0.1uf 50V
CAP0603
**C74
R140
1.0K 1%
RES0603
2-VSS
VC0
CB1
VC1
CB2
VC2
CB3
VC3
CB4
VC4
CB5
VC5
CB6
VC6
2-VSS
C56
DNP
CAP0603
13
12
11
10
9
8
7
6
5
4
3
2
1
63
BAT1
64
BAT2
2-VSS
C75**
0.1uf 50V
CAP0603
2-VSS
C82
DNP
CAP0603
2-VBAT
[1]
2-SCLK_N 1]
[
2-SDO_N 1][
2-SDI_N 1][
2-CS_N 1] [
R115
100K
RES0603
2-VSS
2-VSS
TS2-
TS1-
TS1+
47
48
19
20
60
61
2-VSS
GPIO
45
2-VSS
46
18
17
15
16
C60**
10uf 10V
CAP1206
2-VSS
2-VSS
C53
DNP
CAP0603
EXTEND THE GROUND PLANE
UNDER THE SOUTH COMM LINES
COMM PINS OF THE CHIP BELOW
TO JUST BELOW THE NORTH
T2-5
2-LDOD
TP-VSS2
CAUTION
HIGH VOLTAGE
2-LDOA [3]
R1
0R0
RES0603
TP-VPROG2
2-VSS
C62
0.1uf 50V
CAP0603
T1
R3
0R0
RES0603
T2-6
R157
10K 1%
B=3435K
NTC0603
R134
1.47K 1%
RES0603
C11
DNP
CAP0603
R107
1.82K 1%
RES0603
C61**
2.2uf 10V
CAP0805
C10
DNP
CAP0603
T2
1-VSS
R103
1.47K 1%
RES0603
T1-8
R158
10K 1%
B=3435K
NTC0603
T1-7
R106
100
RES0603
R105
100K
RES0603
T2-5,6 T1-7,8 pair on 0.100" spacing
THERMISTOR NTC 10K OHM 1% 0603
PANASONIC PART NUMBER # ERT-J1VG103FA
** - Locate these components
very close to U1.
R131
1.82K 1%
RES0603
C59
0.047uf 16V
CAP0603
** Locate these components
very close to U1.
LDOD2
LDOD1
LDOA
AGND
VREF
41
SDO_H
42
SDI_H
40
SCLK_H
43
CS_H
39
FAULT_H
38
ALERT_H
37
DRDY_H
36
CONV_H
C8
DNP
CAP0603
J19-1
J16-1
J15-1
J14-1
C78
0.047uf 16V
CAP0603
CAUTION
HIGH VOLTAGE
C69 **
C71**
2.2uf 10V 0.1uf 50V
CAP0805 CAP0603
C63**
2.2uf 10V
CAP0805
51
NC2
30
NC1
62
NC3
GPAI-
GPAI+
C55
DNP
CAP0603
2-VSS
C79
DNP
CAP0603
2-VSS
TS2+
C80
DNP
CAP0603
GROUND PLANE OF CIRCUIT 2
2-VSS
2-LDOA
[3]
2-VSS
C83
DNP
CAP0603
C57
DNP
CAP0603
bq76PL536TPAPQ1
U2
GROUND PLANE OF CIRCUIT 3
GROUND PLANE OF CIRCUIT 2
50
TEST
44
HSEL
32
REG50
31
AUX
49
VSS6
35
VSS5
34
VSS4
33
VSS3
25
VSS2
14
VSS1
2-CONV_N 1
[]
2-DRDY_N 1]
[
2-ALERT_N [1]
2-FAULT_N [1]
59
CONV_N
58
DRDY_N
57
ALERT_N
56
FAULT_N
21
CONV_S
22
DRDY_S
23
ALERT_S
24
FAULT_S
[1] 2-CONV_S
[1] 2-DRDY_S
[1] 2-ALERT_S
[1] 2-FAULT_S
55
SCLK_N
54
SDO_N
53
SDI_N
52
CS_N
26
SCLK_S
27
SDO_S
28
SDI_S
29
CS_S
[1] 2-SCLK_S
[1] 2-SDO_S
[1] 2-SDI_S
[1]
2-CS_S
Product Folder Link(s) :bq76PL536
TAB
Copyright © 2009–2010, Texas Instruments Incorporated
65
D4
LTW-C192TL2
White LED
2-VSS
S003
Q12
2N7002LT1
SOT-23
R102
2.7K
RES0603
www.ti.com
SLUSA08A – DECEMBER 2009 – REVISED JULY 2010
bq76PL536
Figure 18. Schematic (Page 3 of 4)
Submit Documentation Feedback
49
[1] 3-CELL2
[1] 3-CELL1
[1] 3-CELL0
CELL 1 -
CELL 3 +
CELL 2 +
[1] 3-CELL3
CELL 4 +
CELL 1 +
[1] 3-CELL5
[1] 3-CELL6
[1] 3-CELL4
CELL 6 +
CELL 5 +
Z31
R167
47
RES2512
5.1 VDC 500mW
Q20
SOD-123
FDN359AN
SOT-23
R177
47
RES2512
Q21
FDN359AN
SOT-23
R183
47
RES2512
Z27
5.1 VDC 500mW
Q17
SOD-123
FDN359AN
SOT-23
R155
47
RES2512
Z29
5.1 VDC 500mW
Q18
SOD-123
FDN359AN
SOT-23
C86
0.1uf 50V
CAP0603
C87
0.1uf 50V
CAP0603
Z35
5.1 VDC 500mW
Q22
SOD-123
FDN359AN
SOT-23
R193
47
RES2512
Q23
FDN359AN
SOT-23
Z33
5.1 VDC 500mW
SOD-123
C94
0.1uf 50V
CAP0603
C101
0.1uf 50V
CAP0603
R199
47
RES2512
Z37
5.1 VDC 500mW
SOD-123
C109
0.1uf 50V
CAP0603
C114
0.1uf 50V
CAP0603
Z28
5.1VDC
SOD-323
Z30
5.1VDC
SOD-323
Z32
5.1VDC
SOD-323
Z34
5.1VDC
SOD-323
Z36
5.1VDC
SOD-323
Z39
5.1VDC
SOD-323
3-VSS
** C93
0.1uf 50V
CAP0603
R151
1.0K 1%
RES0603
R152
1M 1%
RES0603
R153
1.0K 1%
RES0603
** C95
0.1uf 50V
CAP0603
R160
1.0K 1%
RES0603
R162
1M 1%
RES0603
R163
1.0K 1%
RES0603
** C96
0.1uf 50V
CAP0603
R170
1.0K 1%
RES0603
R173
1M 1%
RES0603
R174
1.0K 1%
RES0603
** C97
0.1uf 50V
CAP0603
R179
1.0K 1%
RES0603
R180
1M 1%
RES0603
R181
1.0K 1%
RES0603
** C99
0.1uf 50V
CAP0603
R185
1.0K 1%
RES0603
R186
1M 1%
RES0603
R187
1.0K 1%
RES0603
CAP0603
**C102
0.1uf 50V
R196
1.0K 1%
RES0603
R197
1M 1%
RES0603
R198
1.0K 1%
RES0603
**C103
0.1uf 50V
CAP0603
R208
1.0K 1%
RES0603
CAUTION
HIGH VOLTAGE
3-VSS
13
12
11
10
9
8
7
6
5
4
3
2
1
3-VSS
C2
DNP
CAP0603
VC0
CB1
VC1
CB2
VC2
CB3
VC3
CB4
VC4
CB5
VC5
CB6
VC6
63
BAT1
64
BAT2
3-VSS
C104**
0.1uf 50V
CAP0603
3-VSS
3-SCLK_N
3-SDO_N
3-SDI_N
3-CS_N
"Top" part connects
all _N pins to CELL6 of U3
GPIO
45
46
18
17
15
16
3-VSS
C3
DNP
CAP0603
3-VSS
3-REG50 [4]
3-VSS
EXTEND THE GROUND PLANE
UNDER THE SOUTH COMM LINES
COMM PINS OF THE CHIP BELOW
TO JUST BELOW THE NORTH
T2
C91
0.1uf 50V
CAP0603
C14
DNP
CAP0603
3-LDOD
3-LDOA [4]
R4
0R0
RES0603
TP-VSS3
3-VSS
T1
R5
0R0
RES0603
TP-VPROG3
R194
1.47K 1%
RES0603
T2-10
R191
10K 1%
B=3435K
NTC0603
T2-9
1-VSS
R165
1.47K 1%
RES0603
T1-12
R192
10K 1%
B=3435K
NTC0603
T1-11
R169
100
RES0603
R168
100K
RES0603
T2-9,10 T1-11,12 pair on 0.100" spacing
R171
1.82K 1%
RES0603
C90 **
2.2uf 10V
CAP0805
** - Locate these components
very close to U1.
THERMISTOR NTC 10K OHM 1% 0603
PANASONIC PART NUMBER # ERT-J1VG103FA
R188
1.82K 1%
RES0603
C88
0.047uf 16V
CAP0603
C13
DNP
CAP0603
C100
** C98**
2.2uf 10V 0.1uf 50V
CAP0805 CAP0603
C89 **
10uf 10V
CAP1206
C12
DNP
CAP0603
J23-1
J22-1
J21-1
J20-1
C111
0.047uf 16V
CAP0603
** Locate these components
very close to U1.
LDOD2
LDOD1
LDOA
AGND
VREF
41
SDO_H
42
SDI_H
40
SCLK_H
43
CS_H
39
FAULT_H
38
ALERT_H
37
DRDY_H
36
CONV_H
C1
DNP
CAP0603
3-VSS
47
48
19
20
60
61
51
NC2
30
NC1
62
NC3
GPAI-
GPAI+
TS1-
TS1+
TS2-
TS2+
3-VSS
C92 **
2.2uf 10V
CAP0805
GROUND PLANE OF CIRCUIT 3
3-VSS
C5
DNP
CAP0603
R156
510K
RES0603
bq76PL536TPAPQ1
U3
3-LDOA
[4]
R178
100K
RES0603
[4]3-REG50
50
TEST
44
HSEL
31
AUX
VSS6
VSS5
VSS4
VSS3
VSS2
VSS1
32
REG50
3-CONV_N
3-DRDY_N
3-ALERT_N
3-FAULT_N
59
CONV_N
58
DRDY_N
57
ALERT_N
56
FAULT_N
21
CONV_S
22
DRDY_S
23
ALERT_S
24
FAULT_S
[1] 3-CONV_S
[1] 3-DRDY_S
[1] 3-ALERT_S
[1] 3-FAULT_S
TAB
55
SCLK_N
54
SDO_N
53
SDI_N
52
CS_N
26
SCLK_S
27
SDO_S
28
SDI_S
29
CS_S
3-SCLK_S
3-SDO_S
3-SDI_S
3-CS_S
Product Folder Link(s) :bq76PL536
[1]
[1]
[1]
[1]
Submit Documentation Feedback
49
35
34
33
25
14
50
65
3-VBAT
[1]
CAUTION
HIGH VOLTAGE
D5
LTW-C192TL2
White LED
3-VSS
S004
Q19
2N7002LT1
SOT-23
R164
2.7K
RES0603
bq76PL536
SLUSA08A – DECEMBER 2009 – REVISED JULY 2010
www.ti.com
Figure 19. Schematic (Page 4 of 4)
Full size reference schematics are available from TI upon request.
Copyright © 2009–2010, Texas Instruments Incorporated
bq76PL536
www.ti.com
SLUSA08A – DECEMBER 2009 – REVISED JULY 2010
REVISION HISTORY
Changes from Original (December 2009) to Revision A
Page
•
Added and changed Bulleted list in Features, replaced description text, added Figure 1, Pin Descriptions and
replaced the Functional Block Diagram ................................................................................................................................ 1
•
Added New text and tables from the Absolute Max table to end of document .................................................................... 6
Submit Documentation Feedback
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s) :bq76PL536
51
PACKAGE OPTION ADDENDUM
www.ti.com
16-Jul-2010
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
BQ76PL536PAPR
ACTIVE
HTQFP
PAP
64
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
Request Free Samples
BQ76PL536PAPT
ACTIVE
HTQFP
PAP
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
Purchase Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
BQ76PL536PAPR
Package Package Pins
Type Drawing
HTQFP
PAP
64
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
1000
330.0
24.4
Pack Materials-Page 1
13.0
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
13.0
1.5
16.0
24.0
Q2
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
BQ76PL536PAPR
HTQFP
PAP
64
1000
346.0
346.0
41.0
Pack Materials-Page 2
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