ETC NUF4107FC/D

NUF4107FC
Advance Information
4 Channel EMI Pi−Filter
Array with Full USB Filter
This device is a 4 channel EMI filter array for data lines. Greater
than −35 dB attenuation is obtained at frequencies from 800 MHz to
2.2 GHz. It also offers USB filtering circuitry with speed detection.
This includes the inline resistors for impedance matching and EMI
filtering. ESD protection is provided across all capacitors.
•
•
•
•
•
•
EMI Filtering and ESD Protection for Data Lines
USB 1.1 Filtering Provided with Speed Detection
Integration of 27 Discretes Offers Cost and Space Savings
Pb−Free Package May be Available. The G−Suffix Denotes a
Pb−Free Lead Finish
350 m Solder Spheres
All TVS Protected Inputs Comply with IEC61000−4−2 (Level 4)
30 kV (Contact)
30 kV (Air)
Low Profile Flip−Chip Packaging
MSL 1
ESD Ratings (Except Pins B1, C1 and C2):
Machine Model = C
Human Body Model = 3B
ESD Ratings (Pins B1, C1 and C2):
Machine Model = C
Human Body Model = 2
R1
B1
C2
C2
D2
D11
B2
R3
A3
C3
D3
B3
C5
B4
C4
C6
D6
R5
A5
B5
C5
C8
C7
D7
D4
R4
A4
D5
C3
C4
D8
R6
C9
C6
D10
C10
FLIP−CHIP−17
CASE 499AD
STYLE TBD
A1
MAXIMUM RATINGS (TA = 25°C)
Rating
Symbol
ESD Discharge IEC61000−4−2 (Note 1)
− Air Discharge, Contact Discharge
Human Body Model
Machine Model
VPP
DC Power per Resistor
PR
100
mW
DC Power per Package
PT
600
mW
Junction Temperature
TJ
150
°C
Value
Unit
ÈÈ
ÈÈ
DEVICE MARKING
kV
30
16
0.4
NUF4107
Operating Temperature Range
Top
−40 to +85
°C
Storage Temperature Range
Tstg
−55 to +150
°C
1. This does not include Pins B1, C1 and C2
This document contains information on a new product. Specifications and information
herein are subject to change without notice.
January, 2004 − Rev. P0
R7
R2
A2
D9
EMI and USB Filtering and ESD Protection for Data Lines
Cell Phones
Handheld Portables
Notebook Computers
MP3 Players
 Semiconductor Components Industries, LLC, 2004
C1
C1
D1
A6
Typical Applications
•
•
•
•
•
CIRCUIT DESCRIPTION
A1
Features
•
•
•
•
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ORDERING INFORMATION
Device
Package
Shipping†
NUF4107FCT1G
Flip−Chip
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
NUF4107FC/D
NUF4107FC
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Symbol
VBR
Characteristic
IR = 1 mA
Min
Typ
Max
Unit
6.0
6.8
8.0
V
IR
VRM = 3.3 V per line
−
−
0.1
A
R3 − R6
EMI Filter Resistors
80
100
120
R1, R2
USB Resistors; Impedance Matching
18
22
26
1250
1500
1750
At 2.5 V Bias
48
60
72
pF
C1, C2
At Pins A1 and A2; At 2.5 V Bias
29
36
43
pF
Cpower
At Pins B2; At 2.5 V Bias
54
68
82
pF
R7
Cline
USB Pull−up; Speed Detection Resistor
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NUF4107FC
TYPICAL CHARACTERISTICS
110
25
108
106
23
RESISTANCE
RESISTANCE
24
22
21
104
102
100
98
96
94
20
92
19
−40
−20
0
20
40
60
90
−40
80 85
−20
0
20
40
80 85
60
TEMPERATURE °C
TEMPERATURE °C
Figure 1. USB 1.1 Resistors (R1, R2) vs. Temperature
Figure 2. Data Resistors (R3, R4, R5, R6)
vs. Temperature
1600
1580
RESISTANCE
1560
1540
1520
1500
1480
1460
1440
1420
1400
−40
−20
0
20
40
80 85
60
TEMPERATURE °C
Figure 3. Pull−up Resistor (R7) vs. Temperature
0
0
−5
−10
−10
−20
−30
−20
S41 (dB)
S21 (dB)
−15
−25
−30
−40
−50
−60
−35
−40
−70
−45
−80
−50
−90
1
10
100
1000
FREQUENCY (MHz)
10,000
1
10
100
1000
FREQUENCY (MHz)
Figure 5. Analog Crosstalk Curve
EMI Filter
Figure 4. Insertion Loss Curve
EMI Filter
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3
10,000
NUF4107FC
Printed Circuit Board Recommendations
500 m Pitch
300 m Solder Ball
Parameter
250 m +25
250 m −0
PCB Pad Size
Pad Shape
Round
Pad Type
NSMD
350 m ±25
Solder Mask Opening
125 m
Solder Stencil Thickness
Stencil Aperture
250 x 250 m sq.
Solder Flux Ratio
50/50
Solder Paste Type
No Clean Type 3 or Finer
Trace Finish
OSP Cu
Trace Width
150 m Max
Copper
Solder Mask
NSMD
SMD
Figure 6. Solder Mask versus Non−Solder Mask Definition
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
Tp = (15−30 sec)
Tp = 260°C − 5°C
RAMP−UP
RAMP−DOWN
tL
(60−90 sec)
PRE−HEAT
ZONE
0−
15 −
30 −
45 −
60 −
75 −
90 −
105 −
119 −
134 −
149 −
165 −
180 −
195 −
209 −
224 −
239 −
254 −
269 −
284 −
299 −
314 −
329 −
344 −
359 −
374 −
389 −
404 −
419 −
434 −
449 −
464 −
479 −
494 −
TEMPERATURE (°C)
280
270
260
250
240
230
TL= 217 210
200
190
180
170
160
150
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
TIME (seconds)
Figure 7. Typical Pb−Free Solder Heating Profile
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NUF4107FC
PACKAGE DIMENSIONS
FLIP−CHIP−17 CSP
CASE 499AD−01
ISSUE O
4X
0.10 C
TERMINAL A1
LOCATOR
ÈÈ
ÈÈ
D
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
B
E
TOP VIEW
A1
0.10 C
A2
0.05 C
SIDE VIEW
A
C
SEATING
PLANE
D1
e /2
e
C
17 X
b
0.05 C A B
0.03 C
E1
B
e1
A
1
2
3
4
5
6
BOTTOM VIEW
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DIM
A
A1
A2
D
E
b
e
e1
D1
E1
MILLIMETERS
MIN
MAX
−−−
0.740
0.210
0.270
0.380
0.430
2.960 BSC
1.330 BSC
0.300
0.350
0.500 BSC
0.435 BSC
2.500 BSC
0.870 BSC
NUF4107FC
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
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6
For additional information, please contact your
local Sales Representative.
NUF4107FC/D