ETC UPC8190K

DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUITS
µPC8190K,µPC8191K
RX/TX-IF SiMMIC FOR W-CDMA
DESCRIPTION
The µPC8190K and µPC8191K are silicon monolithic integrated circuit designed as receiver (RX) and transmitter
(TX) IF section for W-CDMA. The µPC8190K is a RX-IF IC including IF-AGC amplifier and demodulator. The
µPC8191K is a TX-IF IC including IF-AGC amplifier and quadrature modulator. These two ICs are suitable for kit-use
for W-CDMA IF section.
The ICs are developed using NEC’s new ultra high speed silicon bipolar process.
FEATURES
• RX-IF: 380 MHz, TX-IF: 570 MHz
• Low power consumption
• Built-in power saving function
• Small size: 20-pin plastic QFN package (3.2 × 4.2 × 0.8 mm)
APPLICAION
• W-CDMA
ORDERING INFORMATION
Part Number
Package
Supplying Form
µPC8190K-E1
20-pin plastic QFN
• Embossed tape 12 mm wide.
µPC8191K-E1
(3.2 × 4.2 × 0.8 mm)
• Pin 1 indicates pull-out direction of tape
• Qty 2.5 kpcs/reel
Remark To order evaluation samples, please contact your local NEC sales office.
Part number for sample order: µPC8190K, µPC8191K
Caution electro-static sensitive devices.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. P15669EJ2V0DS00 (2nd edition)
Date Published August 2001 NS CP(K)
Printed in Japan
©
2001
µPC8190K,µPC8191K
APPLICATION EXAMPLE
Variation of IF plan
µPC8190K, µ PC8191K: RX-IF = 380 MHz, TX-IF = 570 MHz
µPC8194K, µ PC8195K: RX-IF = 190 MHz, TX-IF = 380 MHz
AGC + I/Q Demodulator
µPC8190K, µPC8194K
BPF
LNA
MIX
BPF
H
RX = 2 110 to 2 170 MHz
To Baseband
90˚
ANT
2nd LO =
760 MHz
1st LO
DUPLX
PLL1
PA
H
AGC +
PA Driver
TX = 1 920 to 1 980 MHz
H
MIX
µ PC8172TB
µ PC8187TB
2
PLL2
Data Sheet P15669EJ2V0DS
90˚
AGC + I/Q Modulator
µPC8191K, µPC8195K
From Baseband
µPC8190K,µPC8191K
INTERNAL BLOCK DIAGRAM AND PIN CONFIGURATION − µPC8190K (RX) −
11 VCC (Demod.)
12 TEST1
13 TEST2
14 GND (AGC, REG.)
15 VCC (AGC, REG.)
(Top View)
IF_IN 16
10 I
IF_INb 17
9 Ib
GND (AGC, REG.) 18
8 Q
N.C. 19
REG. and
Gain Control
Phase
Shifter
(1/2)
Data Sheet P15669EJ2V0DS
6 GND (Demod.)
GND (Demod.) 5
LOb 4
LO 3
N.C. 2
Vcont 1
VPS 20
7 Qb
3
µPC8190K,µPC8191K
PIN EXPLANATIONS − µPC8190K (RX) −
Pin
No.
1
Pin Name
Applied
Voltage
(V)
Pin
Voltage
(TYP.)
Note
(V)
Vcont
0 to 3.0
−
Functions and Applications
Internal Equivalent Circuits
Gain cnotrol pin of AGC amplifier.
Variable gains are available in
accordance with applied voltage.
VCC
54 k
12 k
1
5k
2
N.C.
−
−
19
Non connection.
This pin is not connected to internal
circuit.

This pin should be opened or grounded.
3
LO
−
−
Local signal input pin of I/Q demodulator.
VCC
Input frequency is 760 MHz.
3
4
LOb
−
−
4
Bypass pin of local signal input for I/Q
demodulator.
50
In the case of single local input, this pin
must be decoupled with capacitor ex.
100 to 1 000 pF.
5
6
GND
(Demod.)
0
−
50
GND
Ground pin of I/Q demodulator.
This pin should be grounded with
minimum inductance.

Form the ground pattern as widely as
possible to minimize ground
impeadance.
7
Qb
−
−
8
Q
−
−
9
Ib
−
−
10
I
−
−
I/Q/Ib/Qb signal output pins.
Each pin is an emitter follower.
VCC
8.5 k
Each of Ib and Qb is differential output
of I and Q.
Recommendable load impedance is 10
to 20 kΩ.
7
GND
Note Pin voltage is measured at VCC = 3.0 V
4
Data Sheet P15669EJ2V0DS
8
9
10
µPC8190K,µPC8191K
− µPC8190K (RX) −
Pin
No.
Pin Name
Applied
Voltage
(V)
Pin
Voltage
(TYP.)
Note
(V)
Functions and Applications
11
VCC
(Demod.)
2.7 to 3.3
−
Supply voltage pin of I/Q demodulator
(phase shifter + I/Q Mixer).
12
TEST 1
0
−
TEST pin.
13
TEST 2
0
−
In actual use, this pin should be
grounded.
14
GND
(AGC,
REG.)
0
−
18
Internal Equivalent Circuits


Ground pin of AGC amplifier and
internal regulator.
This pin should be grounded with
minimum inductance.

Form the ground pattern as widely as
possible to minimize ground impedance.
15
16
VCC
(AGC,
REG.)
2.7 to 3.3
IF_IN
−
−
−
Supply voltage pin of AGC amplifier and
internal regulator.

IF signal input pin.
VCC
This pin is input of AGC amplifier.
Balance input between 16, 17 pin.
16
1.1 k
Input frequency is 380 MHz.
17
IF_INb
−
−
17
IF signal input pin.
1.2 k
In the case of signal local input, this pin
must be decoupled with capacitor.
1.2 k
GND
20
VPS
H:
2.2 to VCC
−
Power saving pin.
VCC
This pin modulator can control
Active/Sleep state with bias as follows.
100 k
L: 0 to 0.5
VPS (V)
State
0 to 0.5
Sleep Mode
2.2 to 3
Active Mode
20
100 k
GND
Note Pin voltage is measured at VCC = 3.0 V
Data Sheet P15669EJ2V0DS
5
µPC8190K,µPC8191K
ABSOLUTE MAXIMUM RATINGS − µPC8190K (RX) −
Parameter
Symbol
Ratings
Unit
Supply Voltage
VCC
4.0
V
Applied Voltage
VPS,
Vcont
−0.3 to VCC + 0.3
V
Operating Ambient Temperature
TA
−40 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
RECOMMENDED OPERATING RANGE − µPC8190K (RX) −
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
Supply Voltage
VCC
2.7
3.0
3.3
V
Operating Ambient Temperature
TA
−25
25
85
°C
IF Frequency
fIF
−
380
−
MHz
Local Frequency
fLO
−
760
−
MHz
Local Input Level
PLO
−18
−15
−12
dBm
ELECTRICAL CHARACTERISTICS − µPC8190K (RX) − (Unless otherwise specified, VCC = 3.0 V,
TA = +25°°C, fIF = 382.5 MHz, fLO = 760 MHz, PLO = −15 dBm, fI/Q = 2.5 MHz)
Parameter
Circuit Current
Voltage Gain
Input 3rd Order Intercept Point
Symbol
MIN.
TYP.
MAX.
Unit
No input signal
−
9
12
mA
At power-saving mode
−
−
1
µA
V G1
Vcont = 2.5 V
68
77
−
dB
VG2
Vcont = 0.5 V
−
−20
−15
dB
IIP3
Gain = +65 dB (RS= 600 Ω balanced),
PIFin = −70 dBm
−60
−55
−
dBm
Gain = −10 dB (RS= 600 Ω balanced),
PIFin = −10 dBm
0
3
−
dBm
Leakage to I/Q port when local = 380
MHz and output = 30 mVP-P balanced
−
−
−20
dBc
3 dB down
10
−
−
MHz
Balanced output
1
−
−
VP-P
ICC
Local Leakage
LOL
I/Q Bandwidth
fI/Q
I/Q Maximum Output Swing
VO (sat)
Test Conditions
I/Q Gain Balance
AE
fI/Q = 2.5 MHz
−
−
∆0.5
dB
I/Q Phase Error
PE
fI/Q = 2.5 MHz
−
−
±4
deg.
Gain Accuracy
Gacc
Vcont = 1 to 2 V
−
∆4.6
∆6
dB/V
tPS
−
−
20
µs
Rising Voltage from Power-saving
Mode
VPS on
2.2
−
−
V
Falling Voltage from Power-saving
Mode
VPS off
−
−
0.5
V
−
−
∆0.5
dB
Rise Time from Power-saving Mode
Gain Flatness
6
Flat
fIF ± 2.5 MHz
Data Sheet P15669EJ2V0DS
µPC8190K,µPC8191K
STANDARD CHARACTERISTICS FOR REFERENCE − µPC8190K (RX) − (Unless otherwise
specified, VCC = 3.0 V, TA = +25°°C, fIF = 382.5 MHz, fLO = 760 MHz, PLO = −15 dBm, fI/Q = 2.5 MHz)
Parameter
Noise Figure
Symbol
NF
Error Vector Magnitude (Vector Error)
EVM
Gain 1 dB Compression Input Power
Pin (1 dB)
Test Conditions
MIN.
TYP.
MAX.
Unit
Gain = +65 dB
−
9.5
12
dB
IF = 380 MHz, 3.84 Msps QPSK
modulation, gain is adujsted
−
3
−
%rms
Gain = +50 dB
−
−45
−
dBm
Data Sheet P15669EJ2V0DS
7
µPC8190K,µPC8191K
MEASUREMENT CIRCUIT − µPC8190K (RX) −
VCC
2.2 nF
TOKO
Balun transformer
616DB-1078
100 pF
2.2 nF
µPC8190K
15 nH
1 pF
1.2 kΩ
IF in
AGC1 AGC2 AGC3
1µF
3.3 kΩ
1µF
3.3 kΩ
1µF
3.3 kΩ
1µF
3.3 kΩ
I
12 pF
IX
100 pF
68 nH
Q
REG. and
Gain Control
Phase
Shifter
(1/2)
VPS
LO Buffer
100
pF
Remark
8
: AC connector
: DC terminal
: Feed through capacitor
100 pF
Vcont
LOin
Data Sheet P15669EJ2V0DS
QX
µPC8190K,µPC8191K
INTERNAL BLOCK DIAGRAM AND PIN CONFIGURATION − µPC8191K (TX) −
11 VCC (REG.)
12 GND (REG.)
13 GND (AGC, MIX)
14 GND (AGC, MIX)
15 VCC (AGC, MIX)
(Top View)
REG. and
AGC_Control
IFout 16
9 VPS
IFoutb 17
GND (AGC, MIX) 18
10 Vcont
LPF
8 VCC (Shifter)
Data Sheet P15669EJ2V0DS
Tank 5
6 LOb
Tank 4
Ib 20
GND (Shifter) 3
7 LO
Phase
Shifter
(1/2)
Q 2
1/2
Qb 1
I 19
9
µPC8190K,µPC8191K
PIN EXPLANATIONS − µPC8191K (TX) −
Pin
No.
1
Pin Name
Applied
Voltage
(V)
Pin
Voltage
(TYP.)
Note
(V)
Qb
VCC/2
−
Functions and Applications
Internal Equivalent Circuits
Q signal input pin.
Apply bias voltage externally.
Maximum balance input voltage is
1 000 mVP-P (balance).
2
Q
VCC/2
−
3
GND
(Shifter)
0
−
1
2
Ground pin of I/Q modulator.
This pin should be grounded with
minimum inductance.

Form the ground pattern as widely as
possible to minimize ground
impedance.
4
Tank
0
2.65
5
External inductor and capcitor can
supress harmonics spurious of LO
frequency.
External
4
LC value should be determined
according to LO input frequency and
suppression level.
6
LOb
0
2.02
Bypass pin of local signal inpu for I/Q
modulator.

In the case of single local input, this pin
must be decoupled with capacitor
ex. 1 000 pF.
7
LO
0
2.02
Local signal input of I/Q modulator.
The DC cut capacitor ex. 1 000 pF must
be attaced to this pin.


8
VCC
(Shifter)
2.7 to 3.3
−
Supply voltage pin of I/Q modulator.
9
VPS
0 to 3.0
−
Power saving pin of I/Q modulator +
AGC amplifier.
This pin modulator can control
Active/Sleep state with bias as follows.
VPS (V)
State
0 to 0.5
Sleep Mode
2.2 to 3
Active Mode
Note Pin voltage is measured at VCC = 2.85 V
10
5
Data Sheet P15669EJ2V0DS
50 kΩ
9
µPC8190K,µPC8191K
− µPC8191K (TX) −
Pin
No.
10
Pin Name
Applied
Voltage
(V)
Pin
Voltage
(TYP.)
Note
(V)
Vcont
0 to 3.0
−
Functions and Applications
Internal Equivalent Circuits
Gain control pin of AGC amplifier.
10.5 kΩ
Variable gains are available in
accordance with applied voltage
between 0 to 3.0 V.
2.5 kΩ
11
VCC
(REG.)
2.7 to 3.3
−
Supply voltage pin of internal regulator.
12
GND
(REG.)
0
−
Ground pin internal regulator.

This pin should be grounded with
minimum inductance.

Form the ground pattern as widely as
possible to minimize ground impedance.
13
14
GND
(AGC,
MIX)
0
−
Ground pin of AGC amplifier + I/Q Mixer.
This pin should be grounded with
minimum inductance.
18

Form the ground pattern as widely as
possible to minimize ground impedance.
15
VCC
(AGC,
MIX)
2.7 to 3.3
−
Supply voltage pin of AGC amplifier +
I/Q Mixer.
16
IFout
2.7 to 3.3
−
IF output pin.

The inductor must be attached between
VCC and output pin due to open
collector.
External
16
Output frequency is 570 MHz which is
3/4 of local signal frequency 760 MHz.
17
IFoutb
2.7 to 3.3
−
1 kΩ
17
Balance output of IFout pin.
The inductor must be attached between
VCC and output pin due to open collector.
19
I
VCC/2
−
I signal input pin.
Apply bias voltage externally.
Maximum balance input voltage is
1 000 mVP-P (balance).
20
Ib
VCC/2
−
19
20
Note Pin voltage is measured at VCC = 2.85 V
Data Sheet P15669EJ2V0DS
11
µPC8190K,µPC8191K
ABSOLUTE MAXIMUM RATINGS − µPC8191K (TX) −
Parameter
Symbol
Ratings
Unit
Supply Voltage
VCC
4.0
V
Applied Voltage
VPS,
Vcont
−0.3 to VCC + 0.3
V
Operating Ambient Temperature
TA
−40 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
RECOMMENDED OPERATING RANGE − µPC8191K (TX) −
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Supply Voltage
VCC
2.7
3.0
3.3
V
Operating Ambient Temperature
TA
−25
25
85
°C
IF Frequency
fIF
−
570
−
MHz
Local Frequency
fLO
−
760
−
MHz
Local Input Level
PLO
−18
−15
−12
dBm
IF Output Impedance
ZIF
Balance output internal resistance
−
1
−
kΩ
I/Q Maximum Input Voltage
VI/Q
Balance input
−
0.4
1
VP-P
ELECTRICAL CHARACTERISTICS − µPC8191K (TX) −
(Unless otherwise specified, VCC = 3.0 V, TA = +25°°C, fIF = 570 MHz, fLO = 760 MHz, PLO = −15 dBm,
fI/Q = 10 kHz, 400 mVP-P balanced sine-wave)
Parameter
Circuit Current
Output Power
Symbol
ICC
Pout
Test Conditions
MIN.
TYP.
MAX.
Unit
No input signal
−
30.5
38
mA
At power-saving mode
−
0
1
µA
Vcont = 2.3 V,
I/Q = 400mVP-P balanced
−17
−13
−
dBm
Vcont = 0.3 V,
I/Q = 400mVP-P balanced
−
−93
−88
dBm
Local Leakage
LOL
−
−
−30
dBc
Image Rejection
ImR
−
−
−30
dBc
Output Harmonics 1
Hm1
Leakage when IF output = 190 MHz
−
−
−20
dBc
Output Harmonics 2
Hm2
Leakage when IF output = 380 MHz
−
−
−30
dBc
tPS
−
−
10
µs
Rising Voltage from Power-saving
Mode
VPS on
−
−
2.2
V
Falling Voltage from Power-saving
Mode
VPS off
0.5
−
−
V
Rise Time from Power-saving Mode
12
Data Sheet P15669EJ2V0DS
µPC8190K,µPC8191K
STANDARD CHARACTERISTICS FOR REFERENCE − µPC8191K (TX) −
(Unless otherwise specified, VCC = 3.0 V, TA = +25°°C, fIF = 570 MHz, fLO = 760 MHz, PLO = −15 dBm,
fI/Q = 10 kHz, 400 mVP-P balanced sine-wave)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Output Noise Level 1
NFL1
Pout = −25 dBm, fIF ± 20 MHz
−
−148
−
dBm/Hz
Output Noise Level 2
NFL2
Pout = −65 dBm, fIF ± 20 MHz
−
−162
−
dBm/Hz
Error Vector Magnitude (Vector Error)
EVM
−
3
−
%rms
Adjacent Channel Power
ACPR
−
−55
−
dBc
fIF ± 5 MHz
Data Sheet P15669EJ2V0DS
13
µPC8190K,µPC8191K
MEASUREMENT CIRCUIT − µPC8191K (TX) −
VCC
VCC
1 µF
1 µF
VCC
1 µF
8 pF
1 µF
82 nH
12 nH
REG. and
AGC_Control
IFout
1 µF
TOKO
Type B4F
617DB-1024
I
82 nH
VCC
VPS
VCC
1/2
LOin
1nF
1 pF
14
1 µF
1nF
Phase
Shifter
(1/2)
: AC connector
: DC terminal
Vcont
LPF
Ib
Remark
1 µF
Qb
Q
Data Sheet P15669EJ2V0DS
15 nH
µPC8190K,µPC8191K
PACKAGE DIMENSIONS
20-PIN PLASTIC QFN (PIN-PITCH: 0.4 mm, UNIT: mm)
4.2±0.2
3.0±0.2
3.2±0.2
3.2±0.2
3.0±0.2
4.0±0.2
Pin 20
Pin 1
(Bottom View)
0.18±0.05
4.0±0.2
0.8±0.1
4.2±0.2
0.30±0.15
0.4
Data Sheet P15669EJ2V0DS
15
µPC8190K,µPC8191K
NOTE ON CORRECT USE
(1) Observe precautions for handling because this IC is an electrostatic sensitive device.
(2) Form a ground pattern as widely as possible to minimize its impedance (to prevent undesires oscillation).
(3) Keep the track length of the ground pins as short as possible.
(4) Connect a bypass capacitor to the VCC pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Soldering Conditions
Recommended Condition Symbol
Infrared Reflow
Package peak temperature: 235°C or below,
Time: 30 seconds or less (at 210°C or higher),
Note
Count: 3 times or less, Exposure limit: None
IR35-00-3
VPS
Package peak temperature: 215°C or below,
Time: 40 seconds or less (at 200°C or higher),
Note
Count: 3 times or less, Exposure limit: None
VP15-00-3
Partial Heating
Pin temperature: 300°C or below,
Time: 3 seconds or less (per side of device),
Note
Exposure limit: None
−
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For the details the recommended soldering conditions, refer to the document SEMICONDUCTOR DEVICE
MOUNTING TECHNOLOGY MANUAL (C10535E).
16
Data Sheet P15669EJ2V0DS
µPC8190K,µPC8191K
[MEMO]
Data Sheet P15669EJ2V0DS
17
µPC8190K,µPC8191K
[MEMO]
18
Data Sheet P15669EJ2V0DS
µPC8190K,µPC8191K
[MEMO]
Data Sheet P15669EJ2V0DS
19
µPC8190K,µPC8191K
• The information in this document is current as of August, 2001. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
• NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
• While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
• NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4