DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC8172TB SILICON MMIC 2.5 GHz FREQUENCY UP-CONVERTER FOR WIRELESS TRANSCEIVER DESCRIPTION The µPC8172TB is a silicon monolithic integrated circuit designed as frequency up-converter for wireless transceiver transmitter stage. This IC is as same circuit current as conventional µPC8106TB, but operates at higher frequency, higher gain and lower distortion. Consequently this IC is suitable for mobile communications. FEATURES • Recommended operating frequency : fRFout = 0.8 to 2.5 GHz • Higher IP3 : CG = 9.5 dB TYP., OIP3 = +7.5 dBm TYP. @ fRFout = 0.9 GHz • High-density surface mounting : 6-pin super minimold package • Supply voltage : VCC = 2.7 to 3.3 V APPLICATIONS • PCS1900M • 2.4 GHz band transmitter/receiver system (wireless LAN etc.) ORDERING INFORMATION Part Number µPC8172TB-E3 Remark Package Marking 6-pin super minimold C3A Supplying Form • Embossed tape 8 mm wide. • Pin 1, 2, 3 face the tape perforation side. • Qty 3 kpcs/reel. To order evaluation samples, please contact your nearby sales office. (Part number for sample order: µPC8172TB-A) Caution Electro-static sensitive devices Document No. P14729EJ2V0DS00 (2nd edition) Date Published September 2000 N CP(K) The mark shows major revised points. µPC8172TB PIN CONNECTIONS 3 2 1 Pin No. Pin Name 1 IFinput 2 GND 3 LOinput 4 PS 5 VCC 6 RFoutput (Bottom View) C3A (Top View) 4 4 3 5 5 2 6 6 1 SERIES PRODUCTS (TA = +25°C, VCC = VRFout = 3.0 V, ZS = ZL = 50 Ω) CG (dB) ICC (mA) fRFout (GHz) µPC8172TB 9 0.8 to 2.5 µPC8106TB 9 µPC8109TB µPC8163TB Part Number @RF 0.9 GHz Note @RF 1.9 GHz @RF 2.4 GHz 9.5 8.5 8.0 0.4 to 2.0 9 7 − 5 0.4 to.2.0 6 4 − 16.5 0.8 to 2.0 9 5.5 − PO(sat) (dBm) Part Number @RF 0.9 GHz Note OIP3 (dBm) @RF 1.9 GHz @RF 2.4 GHz @RF 0.9 GHz Note @RF 1.9 GHz @RF 2.4 GHz µPC8172TB +0.5 0 −0.5 +7.5 +6.0 +4.0 µPC8106TB −2 −4 − +5.5 +2.0 − µPC8109TB −5.5 −7.5 − +1.5 −1.0 − µPC8163TB +0.5 −2 − +9.5 +6.0 − Note fRFout = 0.83 GHz @ µPC8163TB Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. To know the associated product, please refer to each latest data sheet. BLOCK DIAGRAM (FOR THE µPC8172TB) (Top View) LOinput PS GND VCC RFoutput IFinput 2 Data Sheet P14729EJ2V0DS00 µPC8172TB SYSTEM APPLICATION EXAMPLES (SCHEMATICS OF IC LOCATION IN THE SYSTEM) Wireless Transceiver Low Noise Tr. DEMOD. RX ÷N VCO SW I Q PLL PLL I 0° Phase shifter TX PA µPC8172TB 90° Q To know the associated products, please refer to each latest data sheet. Data Sheet P14729EJ2V0DS00 3 µPC8172TB CONTENTS 1. PIN EXPLANATION .......................................................................................................................... 5 2. ABSOLUTE MAXIMUM RATINGS .................................................................................................. 6 3. RECOMMENDED OPERATING CONDITIONS............................................................................... 6 4. ELECTRICAL CHARACTERISTICS ................................................................................................ 6 5. OTHER CHARACTERISTICS, FOR REFERENCE PURPOSES ONLY...................................... 7 6. TEST 6.1 6.2 6.3 CIRCUIT .................................................................................................................................. 8 TEST CIRCUIT 1 (fRFout = 900 MHz).................................................................................... 8 TEST CIRCUIT 2 (fRFout = 1.9 GHz)..................................................................................... 9 TEST CIRCUIT 3 (fRFout = 2.4 GHz)..................................................................................... 10 7. TYPICAL CHARACTERISTICS........................................................................................................ 12 8. PACKAGE DIMENSIONS ................................................................................................................. 24 9. NOTE ON CORRECT USE ............................................................................................................. 25 10. RECOMMENDED SOLDERING CONDITIONS............................................................................... 25 4 Data Sheet P14729EJ2V0DS00 µPC8172TB 1. PIN EXPLANATION Pin No. 1 2 Pin Name IFinput GND Applied Voltage (V) Pin Voltage (V)Note − 1.4 GND − Function and Explanation This pin is IF input to double balanced mixer (DBM). The input is designed as high impedance. The circuit contributes to suppress spurious signal. Also this symmetrical circuit can keep specified performance insensitive to process-condition distribution. For above reason, double balanced mixer is adopted. GND pin. Ground pattern on the board should be formed as wide as possible. Track Length should be kept as short as possible to minimize ground impedance. − 2.3 VCC 2.7 to 3.3 − Supply voltage pin. 6 RFoutput Same bias as VCC through external inductor − This pin is RF output from DBM. This pin is designed as open collector. Due to the high impedance output, this pin should be externally equipped with LC matching circuit to next stage. 4 PS VCC/GND − Power save control pin. Bias controls operation as follows. 3 LOinput 5 Equivalent Circuit 5 6 3 1 Local input pin. Recommendable input level is −10 to 0 dBm. Pin bias 2 VCC 5 Control 4 VCC Operation GND Power Save GND 2 Note Each pin voltage is measured with VCC = VPS = VRFout = 3.0 V. Data Sheet P14729EJ2V0DS00 5 µPC8172TB 2. ABSOLUTE MAXIMUM RATINGS Parameter Symbol Test Conditions Rating Unit Supply Voltage VCC TA = +25°C 3.6 V PS pin Input Voltage VPS TA = +25°C 3.6 V Power Dissipation of Package PD Mounted on double-side copperclad 50 × 50 × 1.6 mm epoxy glass PWB (TA = +85°C) 270 mW Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Tstg −55 to +150 °C Input Power Pin +10 dBm 3. RECOMMENDED OPERATING CONDITIONS Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Supply Voltage VCC The same voltage should be applied to pin 5 and 6 2.7 3.0 3.3 V Operating Ambient Temperature TA −40 +25 +85 °C Local Input Level PLOin ZS = 50 Ω (without matching) −10 −5 0 dBm RF Output Frequency fRFout With external matching circuit 0.8 − 2.5 GHz 50 − 400 MHz IF Input Frequency fIFin 4. ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC = VRFout = 3.0 V, fIFin = 240 MHz, PLOin = −5 dBm, and VPS ≥ 2.7 V unless otherwise specified) Parameter Symbol Circuit Current Test Conditions Note TYP. MAX. Unit ICC No Signal 5.5 9.0 13 mA Circuit Current In Power Save Mode ICC(PS) VPS = 0 V − − 2 µA Conversion Gain CG1 fRFout = 0.9 GHz, PIFin = −30 dBm 6.5 9.5 12.5 dB CG2 fRFout = 1.9 GHz, PIFin = −30 dBm 5.5 8.5 11.5 dB CG3 fRFout = 2.4 GHz, PIFin = −30 dBm 5 8.0 11.0 dB Saturated RF Output Power PO(sat)1 fRFout = 0.9 GHz, PIFin = 0 dBm −2.5 +0.5 − dBm PO(sat)2 fRFout = 1.9 GHz, PIFin = 0 dBm −3.5 0 − dBm PO(sat)3 fRFout = 2.4 GHz, PIFin = 0 dBm −4 −0.5 − dBm Note fRFout < fLoin @ fRFout = 0.9 GHz fLoin < fRFout @ fRFout = 1.9 GHz/2.4 GHz 6 MIN. Data Sheet P14729EJ2V0DS00 µPC8172TB 5. OTHER CHARACTERISTICS, FOR REFERENCE PURPOSES ONLY (TA = +25°C, VCC = VRFout = 3.0 V, PLOin = −5 dBm, and VPS ≥ 2.7 V unless otherwise specified) Parameter Output Third-Order Distortion Intercept Point Input Third-Order Distortion Intercept Point SSB Noise Figure Power Save Response Time Test Conditions Symbol OIP31 Note fRFout = 0.9 GHz OIP32 fRFout = 1.9 GHz OIP33 fRFout = 2.4 GHz IIP31 fRFout = 0.9 GHz fIFin1 = 240 MHz fIFin2 = 241 MHz fIFin1 = 240 MHz fIFin2 = 241 MHz Data Unit +7.5 dBm +6.0 dBm +4.0 dBm −2.0 dBm −2.5 dBm IIP32 fRFout = 1.9 GHz IIP33 fRFout = 2.4 GHz −4.0 dBm SSB•NF1 fRFout = 0.9 GHz, fIFin = 240 MHz 9.5 dB SSB•NF2 fRFout = 1.9 GHz, fIFin = 240 MHz 10.4 dB SSB•NF3 fRFout = 2.4 GHz, fIFin = 240 MHz 10.6 dB Rise time TPS(rise) VPS: GND → VCC 1 µs Fall time TPS(fall) VPS: VCC → GND 1.5 µs Note fRFout < fLOin @ fRFout = 0.9 GHz fLOin < fRFout @ fRFout = 1.9 GHz/2.4 GHz Data Sheet P14729EJ2V0DS00 7 µPC8172TB 6. TEST CIRCUIT 6.1 TEST CIRCUIT 1 (fRFout = 900 MHz) Strip Line Spectrum Analyzer 6 50 Ω C3 C8 Signal Generator 100 pF 100 pF 1 pF L RFoutput IFinput 1 50 Ω C1 10 nH 5 VCC GND 2 Signal Generator 100 pF 1 000 pF VCC C5 4 C7 C4 C6 PS LOinput 3 50 Ω C2 1 000 pF 1 µF 68 pF 1 µF EXAMPLE OF TEST CIRCUIT 1 ASSEMBLED ON EVALUATION BOARD LOinput PS bias C4 C2 PS VCC GND C5 C7 C6 L Voltage Supply C 8 IFinput C3 C1 RFoutput µ PC8172TB COMPONENT LIST Form Chip capacitor Chip inductor Symbol Value (∗1) 35 × 42 × 0.4 mm polyimide board, double-sided copper clad C1, C2, C3 100 pF (∗2) Ground pattern on rear of the board C4 1 000 pF C5, C6 1 µF C7 68 pF C8 1 pF L 10 nH (∗3) Solder plated patterns (∗4) : Through holes Note Note 10 nH: LL1608-FH10N (TOKO Co., Ltd.) 8 Data Sheet P14729EJ2V0DS00 µPC8172TB 6.2 TEST CIRCUIT 2 (fRFout = 1.9 GHz) Strip Line Spectrum Analyzer 50 Ω 2.75 pF C8 Signal Generator 100 pF 100 pF C3 6 L RFoutput IFinput 1 50 Ω C1 470 nH 5 GND VCC 2 Signal Generator 100 pF 1 000 pF 4 PS LOinput 3 50 Ω C2 VCC C5 C7 C6 C4 1 000 pF 1 µF 30 pF 1 µF EXAMPLE OF TEST CIRCUIT 2 ASSEMBLED ON EVALUATION BOARD LOinput C4 C2 PS bias PS GND L VCC C5 C7 C6 Voltage Supply IFinput C3 C1 C8 RFoutput µ PC8172TB COMPONENT LIST Form Chip capacitor Symbol Value (∗1) 35 × 42 × 0.4 mm polyimide board, double-sided copper clad C1, C2, C3 100 pF (∗2) Ground pattern on rear of the board C4 1 000 pF C5, C6 1 µF C7 30 pF C8 Chip inductor L (∗3) Solder plated patterns (∗4) : Through holes 2.75 pF Note 470 nH Note 470 nH: LL2012-FR47 (TOKO Co., Ltd.) Data Sheet P14729EJ2V0DS00 9 µPC8172TB 6.3 TEST CIRCUIT 3 (fRFout = 2.4 GHz) Strip Line Spectrum Analyzer 50 Ω 1.75 pF Signal Generator 100 pF 100 pF C3 6 C8 L RFoutput IFinput 1 50 Ω C1 470 nH 5 GND VCC 2 Signal Generator 100 pF 1 000 pF 4 PS LOinput 3 50 Ω C2 VCC C5 C7 C6 C4 1 000 pF 1 µF 10 pF 1 µF EXAMPLE OF TEST CIRCUIT 3 ASSEMBLED ON EVALUATION BOARD LOinput C4 C2 PS bias PS GND L VCC C5 C7 C6 Voltage Supply IFinput C1 C8 C3 RFoutput µ PC8172TB COMPONENT LIST Form Chip capacitor Chip inductor Symbol Value (∗1) 35 × 42 × 0.4 mm polyimide board, double-sided copper clad C1, C2, C3 100 pF (∗2) Ground pattern on rear of the board C4 1 000 pF C5, C6 1 µF C7 10 pF C8 1.75 pF L (∗3) Solder plated patterns (∗4) : Through holes Note 470 nH Note 470 nH: LL2012-FR47 (TOKO Co., Ltd.) 10 Data Sheet P14729EJ2V0DS00 µPC8172TB Caution The test circuits and board pattern on data sheet are for performance evaluation use only (They are not recommended circuits). In the case of actual design-in, matching circuit should be determined using S-parameter of desired frequency in accordance to actual mounting pattern. Data Sheet P14729EJ2V0DS00 11 µPC8172TB 7. TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25°°C, VCC = VRFout) CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE CIRCUIT CURRENT vs. SUPPLY VOLTAGE 12 12 10 10 Circuit Current ICC (mA) Circuit Current ICC (mA) VCC = 3.3 V TA = +85°C 8 6 TA = +25°C 4 TA = –40°C 2 0 1 2 3 6 4 no signal VCC = VPS 0 –40 4 Supply Voltage VCC (V) –20 Circuit Current ICC (mA) 10 8 6 4 2 VCC = 3.0 V 0 1 2 3 4 PS Pin Input Voltage VPS (V) PS PIN CONTROL RESPONSE TIME REF LVL = 0 dBm ATT = 10 dB 10 dB/DIV (Vertical axis) CENTER = 0.9 GHz SPAN = 0 Hz RBW = 3 MHz VBW = 3 MHz SWP = 50 µ sec 5 µ sec/DIV (Horizontal axis) 12 0 20 40 60 Operating Ambient Temperature TA (°C) CIRCUIT CURRENT vs. PS PIN INPUT VOLTAGE 12 0 VCC = 3.0 V VCC = 2.7 V 2 no signal VCC = VPS 0 8 Data Sheet P14729EJ2V0DS00 80 µPC8172TB S-PARAMETERS FOR EACH PORT (VCC = VPS = VRFout = 3.0 V) (The parameters are monitored at DUT pins) LO port RF port (without matching) Z S11 REF 1.0 Units 200.0 mUnits/ 1 21.625 Ω –91.148 Ω hp Z S22 REF 1.0 Units 200.0 mUnits/ 1 71.5 Ω –240.34 Ω hp MARKER 1 1.15 GHz MARKER 1 900.0 MHz MARKER 2 1.65 GHz MARKER 2 1.9 GHz MARKER 3 2.15 GHz MARKER 3 2.5 GHz 1 1 3 2 3 2 START 0.400000000 GHz STOP 2.500000000 GHz START STOP 0.400000000 GHz 2.500000000 GHz IF port Z S11 REF 1.0 Units 200.0 mUnits/ 1 332.63 Ω –601.34 Ω hp MARKER 1 240.0 MHz 1 START STOP 0.100000000 GHz 1.000000000 GHz Data Sheet P14729EJ2V0DS00 13 µPC8172TB S-PARAMETERS FOR MATCHED RF OUTPUT (VCC = VPS = VRFout = 3.0 V) −ON EVALUATION BOARD− − (S22 data are monitored at RF connector on board) 900 MHz (matched in test circuit 1) 1.9 GHz (matched in test circuit 2) S22 Z REF 1.0 Units 200.0 mUnits/ 1 55.615 Ω 2.2849 Ω hp C MARKER 1 900.0 MHz D S22 Z REF 1.0 Units 200.0 mUnits/ 1 38.584 Ω –2.2656 Ω hp C MARKER 1 1.9 GHz D 1 1 START 0.400000000 GHz STOP 1.400000000 GHz START STOP log MAG. S22 REF 0.0 dB 10.0 dB/ 1 –24.754 dB hp C 1.400000000 GHz 2.400000000 GHz log MAG. S22 REF 0.0 dB 10.0 dB/ 1 –18.196 dB hp C MARKER 1 900.0 MHz D MARKER 1 1.9 GHz D 1 1 1 START STOP 14 0.400000000 GHz 1.400000000 GHz START STOP Data Sheet P14729EJ2V0DS00 1.400000000 GHz 2.400000000 GHz µPC8172TB S-PARAMETERS FOR MATCHED RF OUTPUT (VCC = VPS = VRFout = 3.0 V) −ON EVALUATION BOARD− − (S22 data are monitored at RF connector on board) 2.4 GHz (matched in test circuit 3) S22 Z REF 1.0 Units 200.0 mUnits/ 1 47.975 Ω –7.1113 Ω hp C MARKER 1 2.4 GHz D 1 START 1.900000000 GHz STOP 2.900000000 GHz log MAG. S22 REF 0.0 dB 10.0 dB/ 1 –22.326 dB hp C MARKER 1 2.4 GHz D 1 1 START 1.900000000 GHz STOP 2.900000000 GHz Data Sheet P14729EJ2V0DS00 15 µPC8172TB CONVERSION GAIN vs. LOCAL INPUT LEVEL RF OUTPUT LEVEL vs. IF INPUT LEVEL 15 5 VCC = 3.3 V 10 VCC = 3.0 V 5 VCC = 2.7 V 0 –5 fRFout = 900 MHz fLOin = 1 140 MHz PIFin = –30 dBm VCC = VPS –10 –15 –30 –25 –20 –15 –10 –5 0 5 RF Output Level PRFout (dBm) Conversion Gain CG (dB) VCC = 3.3 V 0 VCC = 3.0 V –5 –10 –15 fRFout = 900 MHz fLOin = 1 140 MHz PLOin = –5 dBm VCC = VPS –20 –25 –30 10 VCC = 2.7 V –25 Local Input Level PLOin (dBm) CONVERSION GAIN vs. LOCAL INPUT LEVEL –10 –5 0 5 10 RF OUTPUT LEVEL vs. IF INPUT LEVEL 5 10 TA = –40°C 5 TA = +85°C 0 TA = +25°C –5 fRFout = 900 MHz fLOin = 1 140 MHz PIFin = –30 dBm VCC = VPS = 3.0 V –10 –15 –30 –25 –20 –15 –10 –5 0 5 10 RF Output Level PRFout (dBm) Conversion Gain CG (dB) –15 IF Input Level PIFin (dBm) 15 0 –5 TA = –40°C TA = +85°C –10 –15 fRFout = 900 MHz fLOin = 1 140 MHz PLOin = –5 dBm VCC = VPS = 3.0 V TA = +25°C –20 –25 –30 Local Input Level PLOin (dBm) 16 –20 –25 –20 –15 –10 –5 0 IF Input Level PIFin (dBm) Data Sheet P14729EJ2V0DS00 5 10 µPC8172TB CONVERSION GAIN vs. LOCAL INPUT LEVEL RF OUTPUT LEVEL vs. IF INPUT LEVEL 15 5 VCC = 3.3 V 10 VCC = 3.0 V 5 VCC = 2.7 V 0 –5 –10 –15 –30 –25 –20 –15 –10 fRFout = 1.9 GHz fLOin = 1 660 MHz PIFin = –30 dBm VCC = VPS –5 0 5 10 RF Output Level PRFout (dBm) Conversion Gain CG (dB) VCC = 3.3 V 0 VCC = 3.0 V –5 VCC = 2.7 V –10 –15 fRFout = 1.9 GHz fLOin = 1 660 MHz PLOin = –5 dBm VCC = VPS –20 –25 –30 –25 Local Input Level PLOin (dBm) –15 –10 –5 0 5 10 IF Input Level PIFin (dBm) CONVERSION GAIN vs. LOCAL INPUT LEVEL RF OUTPUT LEVEL vs. IF INPUT LEVEL 5 10 TA = –40°C 5 0 TA = +25°C –5 TA = +85°C fRFout = 1.9 GHz fLOin = 1 660 MHz PIFin = –30 dBm VCC = VPS = 3.0 V –10 –15 –30 –25 –20 –15 –10 –5 0 5 10 RF Output Level PRFout (dBm) 15 Conversion Gain CG (dB) –20 0 –5 TA = –40°C –10 TA = +25°C –15 TA = +85°C –20 –25 –30 Local Input Level PLOin (dBm) –25 –20 –15 –10 fRFout = 1.9 GHz fLOin = 1 660 MHz PLOin = –5 dBm VCC = VPS = 3.0 V –5 0 5 10 IF Input Level PIFin (dBm) Data Sheet P14729EJ2V0DS00 17 µPC8172TB CONVERSION GAIN vs. LOCAL INPUT LEVEL RF OUTPUT LEVEL vs. IF INPUT LEVEL 15 5 RF Output Level PRFout (dBm) Conversion Gain CG (dB) VCC = 3.3 V 10 VCC = 3.0 V 5 VCC = 2.7 V 0 –5 fRFout = 2.4 GHz fLOin = 2 160 MHz PIFin = –30 dBm VCC = VPS –10 –15 –30 –25 –20 –15 –10 –5 0 5 0 VCC = 3.0 V –5 VCC = 2.7 V –10 –15 fRFout = 2.4 GHz fLOin = 2 160 MHz PLOin = –5 dBm VCC = VPS –20 –25 –30 10 VCC = 3.3 V –25 Local Input Level PLOin (dBm) CONVERSION GAIN vs. LOCAL INPUT LEVEL 0 5 10 RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 TA = –40°C 0 TA = +25°C –5 TA = +85°C –10 –25 –20 –15 –10 fRFout = 2.4 GHz fLOin = 2 160 MHz PIFin = –30 dBm VCC = VPS = 3.0 V –5 0 5 10 RF Output Level PRFout (dBm) Conversion Gain CG (dB) –5 5 –15 –30 0 –5 TA = –40°C –10 TA = +25°C –15 TA = +85°C –20 –25 –30 Local Input Level PLOin (dBm) 18 –15 –10 IF Input Level PIFin (dBm) 15 5 –20 –25 –20 –15 –10 fRFout = 2.4 GHz fLOin = 2 160 MHz PLOin = –5 dBm VCC = VPS = 3.0 V –5 0 IF Input Level PIFin (dBm) Data Sheet P14729EJ2V0DS00 5 10 IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 0 –10 –20 –30 TA = +25°C VCC = VPS = 2.7 V fRFout = 900 MHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 1 140 MHz PLOin = –5 dBm –40 –50 –60 –70 –80 –30 –25 –20 –15 –10 –5 0 5 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) µPC8172TB IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 0 –10 –20 –30 TA = –40°C VCC = VPS = 3.0 V fRFout = 900 MHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 1 140 MHz PLOin = –5 dBm –40 –50 –60 –70 –80 –30 –25 IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 0 –10 –20 –30 TA = +25°C VCC = VPS = 3.0 V fRFout = 900 MHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 1 140 MHz PLOin = –5 dBm –40 –50 –60 –70 –80 –30 –25 –20 –15 –10 –5 0 5 0 –10 –20 –30 TA = +25°C VCC = VPS = 3.3 V fRFout = 900 MHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 1 140 MHz PLOin = –5 dBm –70 –80 –30 –25 –20 –15 –10 –5 0 5 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL –60 –5 0 5 IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 0 –10 –20 –30 –40 TA = +25°C VCC = VPS = 3.0 V fRFout = 900 MHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 1 140 MHz PLOin = –5 dBm –50 –60 –70 –80 –30 –25 –20 –15 –10 –5 0 5 IF Input Level PIFin (dBm) 10 –50 –10 10 IF Input Level PIFin (dBm) –40 –15 IF Input Level PIFin (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) IF Input Level PIFin (dBm) –20 IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 0 –10 –20 –30 TA = +85°C VCC = VPS = 3.0 V fRFout = 900 MHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 1 140 MHz PLOin = –5 dBm –40 –50 –60 –70 –80 –30 IF Input Level PIFin (dBm) –25 –20 –15 –10 –5 0 5 IF Input Level PIFin (dBm) Data Sheet P14729EJ2V0DS00 19 IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 0 –10 –20 –30 TA = +25°C VCC = VPS = 2.7 V fRFout = 1.9 GHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 1 660 MHz PLOin = –5 dBm –40 –50 –60 –70 –80 –30 –25 –20 –15 –10 –5 0 5 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) µPC8172TB IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 0 –10 –20 –30 TA = –40°C VCC = VPS = 3.0 V fRFout = 1.9 GHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 1 660 MHz PLOin = –5 dBm –40 –50 –60 –70 –80 –30 –25 IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 0 –10 –20 –30 TA = +25°C VCC = VPS = 3.0 V fRFout = 1.9 GHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 1 660 MHz PLOin = –5 dBm –40 –50 –60 –70 –80 –30 –25 –20 –15 –10 –5 0 5 0 –10 –20 –30 TA = +25°C VCC = VPS = 3.3 V fRFout = 1.9 GHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 1 660 MHz PLOin = –5 dBm –70 –80 –30 –25 –20 –15 –10 –5 0 5 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL –60 0 5 IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 0 –10 –20 –30 –40 TA = +25°C VCC = VPS = 3.0 V fRFout = 1.9 GHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 1 660 MHz PLOin = –5 dBm –50 –60 –70 –80 –30 –25 –20 –15 –10 –5 0 5 IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 0 –10 –20 –30 TA = +85°C VCC = VPS = 3.0 V fRFout = 1.9 GHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 1 660 MHz PLOin = –5 dBm –40 –50 –60 –70 –80 –30 IF Input Level PIFin (dBm) 20 –5 IF Input Level PIFin (dBm) 10 –50 –10 10 IF Input Level PIFin (dBm) –40 –15 IF Input Level PIFin (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) IF Input Level PIFin (dBm) –20 –25 –20 –15 –10 –5 IF Input Level PIFin (dBm) Data Sheet P14729EJ2V0DS00 0 5 IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 0 –10 –20 –30 TA = +25°C VCC = VPS = 2.7 V fRFout = 2.4 GHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 2 160 MHz PLOin = –5 dBm –40 –50 –60 –70 –80 –30 –25 –20 –15 –10 –5 0 5 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) µPC8172TB IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 0 –10 –20 –30 TA = –40°C VCC = VPS = 3.0 V fRFout = 2.4 GHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 2 160 MHz PLOin = –5 dBm –40 –50 –60 –70 –80 –30 –25 IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 0 –10 –20 –30 TA = +25°C VCC = VPS = 3.0 V fRFout = 2.4 GHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 2 160 MHz PLOin = –5 dBm –40 –50 –60 –70 –80 –30 –25 –20 –15 –10 –5 0 5 0 –10 –20 –30 TA = +25°C VCC = VPS = 3.3 V fRFout = 2.4 GHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 2 160 MHz PLOin = –5 dBm –70 –80 –30 –25 –20 –15 –10 –5 0 5 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL –60 –5 0 5 IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 0 –10 –20 –30 –40 TA = +25°C VCC = VPS = 3.0 V fRFout = 2.4 GHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 2 160 MHz PLOin = –5 dBm –50 –60 –70 –80 –30 –25 –20 –15 –10 –5 0 5 IF Input Level PIFin (dBm) 10 –50 –10 10 IF Input Level PIFin (dBm) –40 –15 IF Input Level PIFin (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) IF Input Level PIFin (dBm) –20 IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 0 –10 –20 –30 TA = +85°C VCC = VPS = 3.0 V fRFout = 2.4 GHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 2 160 MHz PLOin = –5 dBm –40 –50 –60 –70 –80 –30 IF Input Level PIFin (dBm) –25 –20 –15 –10 –5 0 5 IF Input Level PIFin (dBm) Data Sheet P14729EJ2V0DS00 21 µPC8172TB LOCAL LEAKAGE AT IF PIN vs. LOCAL INPUT FREQUENCY LOCAL LEAKAGE AT IF PIN vs. LOCAL INPUT FREQUENCY 0 Local Leakage at IF Pin LOif (dBm) Local Leakage at IF Pin LOif (dBm) 0 –10 –20 –30 fRFout = 900 MHz PLOin = –5 dBm VCC = VPS = 3.0 V –40 –50 0 0.5 1 1.5 2 2.5 0.5 1 1.5 2 2.5 LOCAL LEAKAGE AT RF PIN vs. LOCAL INPUT FREQUENCY 3 0 Local Leakage at RF Pin LOrf (dBm) Local Leakage at RF Pin LOrf (dBm) 0 LOCAL LEAKAGE AT RF PIN vs. LOCAL INPUT FREQUENCY –20 –30 fRFout = 900 MHz PLOin = –5 dBm VCC = VPS = 3.0 V –40 0 0.5 1 1.5 2 2.5 3 –10 –20 –30 fRFout = 1.9 GHz PLOin = –5 dBm VCC = VPS = 3.0 V –40 –50 0 0.5 1 1.5 2 2.5 Local Input Frequency fLOin (GHz) Local Input Frequency fLOin (GHz) IF LEAKAGE AT RF PIN vs. IF INPUT FREQUENCY IF LEAKAGE AT RF PIN vs. IF INPUT FREQUENCY 3 0 –70 –80 fRFout = 900 MHz fLOin = 1 140 MHz PLOin = –5 dBm VCC = VPS = 3.0 V –90 0 100 200 300 400 500 IF Leakage at RF Pin IFrf (dBm) –60 fRFout = 1.9 GHz fLOin = 1 660 MHz PLOin = –5 dBm VCC = VPS = 3.0 V –10 –20 –30 –40 –50 IF Input Frequency fIFin (MHz) 22 fRFout = 1.9 GHz PLOin = –5 dBm VCC = VPS = 3.0 V –40 Local Input Frequency fLOin (GHz) –50 IF Leakage at RF Pin IFrf (dBm) –30 Local Input Frequency fLOin (GHz) –10 –100 –20 –50 3 0 –50 –10 0 100 200 300 400 IF Input Frequency fIFin (MHz) Data Sheet P14729EJ2V0DS00 500 µPC8172TB LOCAL LEAKAGE AT IF PIN vs. LOCAL INPUT FREQUENCY LOCAL LEAKAGE AT RF PIN vs. LOCAL INPUT FREQUENCY 0 Local Leakage at RF Pin LOrf (dBm) Local Leakage at IF Pin LOif (dBm) 0 –10 –20 –30 fRFout = 2.4 GHz PLOin = –5 dBm VCC = VPS = 3.0 V –40 –50 0 0.5 1 1.5 2 2.5 3 –10 –20 –30 fRFout = 2.4 GHz PLOin = –5 dBm VCC = VPS = 3.0 V –40 –50 0 0.5 1 1.5 2 2.5 3 Local Input Frequency fLOin (GHz) Local Input Frequency fLOin (GHz) IF LEAKAGE AT RF PIN vs. IF INPUT FREQUENCY IF Leakage at RF Pin IFrf (dBm) 0 fRFout = 2.4 GHz fLOin = 2 160 MHz PLOin = –5 dBm VCC = VPS = 3.0 V –10 –20 –30 –40 –50 0 100 200 300 400 500 IF Input Frequency fIFin (MHz) Remark The graphs indicate nominal characteristics. Data Sheet P14729EJ2V0DS00 23 µPC8172TB 8. PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 2.1±0.1 0.2+0.1 –0.05 0.65 0.65 1.3 2.0±0.2 1.25±0.1 24 Data Sheet P14729EJ2V0DS00 0.15+0.1 –0.05 0 to 0.1 0.7 0.9±0.1 0.1 MIN. µPC8172TB 9. NOTE ON CORRECT USE (1) Observe precautions for handling because of electrostatic sensitive devices. (2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation). (3) Connect a bypass capacitor (example: 1 000 pF) to the VCC pin. (4) Connect a matching circuit to the RF output pin. (5) The DC cut capacitor must be each attached to the input and output pins. 10. RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. Soldering Method Soldering Conditions Recommended Condition Symbol Infrared Reflow Package peak temperature: 235°C or below Time: 30 seconds or less (at 210°C) Note Count: 3, Exposure limit: None IR35-00-3 VPS Package peak temperature: 215°C or below Time: 40 seconds or less (at 200°C) Note Count: 3, Exposure limit: None VP15-00-3 Wave Soldering Soldering bath temperature: 260°C or below Time: 10 seconds or less Note Count: 1, Exposure limit: None WS60-00-1 Partial Heating Pin temperature: 300°C Time: 3 seconds or less (per side of device) Note Exposure limit: None − Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). Data Sheet P14729EJ2V0DS00 25 NOTICE 1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. California Eastern Laboratories and Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 2. California Eastern Laboratories has used reasonable care in preparing the information included in this document, but California Eastern Laboratories does not warrant that such information is error free. California Eastern Laboratories and Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. 3. 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