NSC LM98714

LM98714
Three Channel, 16-Bit, 45 MSPS Digital Copier Analog
Front End with Integrated CCD/CIS Sensor Timing
Generator and LVDS Output
General Description
The LM98714 is a fully integrated, high performance 16-Bit,
45 MSPS signal processing solution for digital color copiers,
scanners, and other image processing applications. Highspeed signal throughput is achieved with an innovative architecture utilizing Correlated Double Sampling (CDS), typically employed with CCD arrays, or Sample and Hold (S/H)
inputs (for Contact Image Sensors and CMOS image sensors). The signal paths utilize 8 bit Programmable Gain
Amplifiers (PGA), a +/-9-Bit offset correction DAC and independently controlled Digital Black Level correction loops for
each input. The PGA and offset DAC are programmed independently allowing unique values of gain and offset for each
of the three inputs. The signals are then routed to a 45MHz
high performance analog-to-digital converter (ADC). The
fully differential processing channel shows exceptional noise
immunity, having a very low noise floor of -74dB. The 16-bit
ADC has excellent dynamic performance making the
LM98714 transparent in the image reproduction chain.
Applications
n
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Multi-Function Peripherals
Facsimile Equipment
Flatbed or Handheld Color Scanners
High-speed Document Scanner
n
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n
n
Independent Gain/Offset Correction for Each Channel
Digital Black Level Correction Loop for Each Channel
Programmable Input Clamp Voltage
Flexible CCD/CIS Sensor Timing Generator
Key Specifications
n
n
n
n
n
n
n
n
n
n
n
n
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n
n
n
Maximum Input Level
1.2 or 2.4 Volt Modes
(both with + or - polarity option)
ADC Resolution
16-Bit
ADC Sampling Rate
45 MSPS
INL
+/- 23 LSB (typ)
Channel Sampling Rate
15/22.5/30 MSPS
PGA Gain Steps
256 Steps
PGA Gain Range
0.7 to 7.84x
Analog DAC Resolution
+/-9 Bits
Analog DAC Range
+/-300mV or +/-600mV
Digital DAC Resolution
+/-6 Bits
Digital DAC Range
-1024 LSB to + 1008 LSB
SNR
-74dB (@0dB PGA Gain)
Power Dissipation
505mW (LVDS) 610mW (CMOS)
Operating Temp
0 to 70˚C
Supply Voltage
3.3V Nominal (3.0V to 3.6V range)
Features
n LVDS/CMOS Outputs
n LVDS/CMOS Pixel Rate Input Clock or ADC Input Clock
n CDS or S/H Processing for CCD or CIS sensors
System Block Diagram
20105370
© 2006 National Semiconductor Corporation
DS201053
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LM98714 - Three Channel, 16-Bit, 45 MSPS Digital Copier Analog Front End with Integrated
CCD/CIS Sensor Timing Generator and LVDS Output
October 2006
LM98714
LM98714 Overall Chip Block Diagram
20105301
FIGURE 1. Chip Block Diagram
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LM98714
LM98714 Pin Out Diagram
20105302
FIGURE 2. LM98714 Pin Out Diagram
3
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Typical Application Diagram
FIGURE 3. Typical Application Diagram
20105373
LM98714
LM98714
Pin Descriptions
Pin
Name
I/O
Typ
Res
Description
1
CLK3
O
D
PU
Configurable sensor control output.
2
CLK2
O
D
PD
Configurable sensor control output.
3
CLK1
O
D
PU
Configurable sensor control output.
4
SH
O
D
PD
Sensor - Shift or transfer control signal for CCD and CIS sensors.
5
RESET
I
D
PU
Active-low master reset. NC when function not being used.
6
SH_R
I
D
PD
7
SDIO
I/O
D
8
SCLK
I
D
PD
Serial Interface shift register clock.
9
SEN
I
D
PU
Active-low chip enable for the Serial Interface.
10
AGND
P
Analog ground return.
11
VA
P
Analog power supply. Bypass voltage source with 4.7µF and pin with 0.1µF to
AGND.
12
VREFB
O
A
Bottom of ADC reference. Bypass with a 0.1µF capacitor to ground.
13
VREFT
O
A
Top of ADC reference. Bypass with a 0.1µF capacitor to ground.
14
VA
P
Analog power supply. Bypass voltage source with 4.7µF and pin with 0.1µF to
AGND.
15
AGND
P
Analog ground return.
16
VCLP
A
Input Clamp Voltage. Normally bypassed with a 0.1µF, and a 4.7µF capacitor to
AGND. An external reference voltage may be applied to this pin.
17
VA
P
Analog power supply. Bypass voltage source with 4.7µF and pin with 0.1µF to
AGND.
18
AGND
19
OSR
20
AGND
21
OSG
22
AGND
23
OSB
24
AGND
25
IO
External request for an SH pulse.
Serial Interface Data Input
P
Analog ground return.
I
A
Analog input signal. Typically sensor Red output AC-coupled thru a capacitor.
P
Analog ground return.
I
A
Analog input signal. Typically sensor Green output AC-coupled thru a capacitor.
P
Analog ground return.
A
Analog input signal. Typically sensor Blue output AC-coupled thru a capacitor.
P
Analog ground return.
DGND
P
Digital ground return.
26
VR
P
Power supply input for internal voltage reference generator. Bypass this supply
pin with a 0.1µF capacitor.
27
DVB
O
P
Digital Core Voltage bypass. Not an input. Bypass with 0.1µF capacitor to
DGND.
28
INCLK+
I
D
Clock Input. Non-Inverting input for LVDS clocks or CMOS clock input. CMOS
clock is selected when pin 29 is held at DGND, otherwise clock is configured
for LVDS operation.
29
INCLK-
I
D
Clock Input. Inverting input for LVDS clocks, connect to DGND for CMOS clock.
DOUT7/
O
D
Bit 7 of the digital video output bus in CMOS Mode, LVDS Frame Clock+ in
LVDS Mode.
O
D
Bit 6 of the digital video output bus in CMOS Mode, LVDS Frame Clock- in
LVDS Mode.
O
D
Bit 5 of the digital video output bus in CMOS Mode, LVDS Data Out2+ in LVDS
Mode.
O
D
Bit 4 of the digital video output bus in CMOS Mode, LVDS Data Out2- in LVDS
Mode.
O
D
Bit 3 of the digital video output bus in CMOS Mode, LVDS Data Out1+ in LVDS
Mode.
O
D
Bit 2 of the digital video output bus in CMOS Mode, LVDS Data Out1- in LVDS
Mode.
30
I
TXCLK+
31
DOUT6/
TXCLK-
32
DOUT5/
TXOUT2+
33
DOUT4/
TXOUT2-
34
DOUT3/
TXOUT1+
35
DOUT2/
TXOUT1-
5
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LM98714
Pin Descriptions
Pin
36
Name
DOUT1/
I/O
(Continued)
Typ
Res
D
Bit 1 of the digital video output bus in CMOS Mode, LVDS Data Out0+ in LVDS
Mode.
O
D
Bit 0 of the digital video output bus in CMOS Mode, LVDS Data Out0- in LVDS
Mode.
TXOUT0+
37
DOUT0/
Description
O
TXOUT038
DGND
P
Digital ground return.
39
VD
P
Power supply for the digital circuits. Bypass this supply pin with 0.1µF
capacitor. A single 4.7µF capacitor should be used between the supply and the
VD, VR and VC pins.
40
CLKOUT/
CLK10
O
D
PD
Output clock for registering output data when using CMOS outputs, or
configurable sensor control output.
41
CLK9
O
D
PD
Configurable sensor control output.
42
CLK8
O
D
PD
Configurable sensor control output.
43
CLK7
O
D
PD
Configurable sensor control output.
44
CLK6
O
D
PU
Configurable sensor control output.
45
CLK5
O
D
PD
Configurable sensor control output.
46
DGND
P
Digital ground return.
47
VC
P
Power supply for the sensor control outputs. Bypass this supply pin with 0.1µF
capacitor.
48
CLK4
O
D
PD
Configurable sensor control output.
(I=Input), (O=Output), (IO=Bi-directional), (P=Power), (D=Digital), (A=Analog), (PU=Pull Up with an internal resistor), (PD=Pull Down with an internal resistor.).
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6
Thermal Resistance (θJA)
(Notes 2,
Package Dissipation at TA = 25˚C
(Note 4)
1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (VA,VR,VD,VC)
−0.3V to
(VA + 0.3V)
Voltage on Any Output Pin
(execpt DVB and not to exceed
4.2V)
−0.3V to
(VA + 0.3V)
DVB Output Pin Voltage
Human Body Model
2500V
Machine Model
250V
Storage Temperature
−65˚C to +150˚C
Soldering process must comply with National
Semiconductor’s Reflow Temperature Profile
specifications. Refer to www.national.com/packaging.
(Note 6)
2.0V
Input Current at any pin other than
Supply Pins (Note 3)
± 25 mA
Package Input Current (except
Supply Pins) (Note 3)
± 50 mA
Maximum Junction Temperature (TA)
1.89W
ESD Rating (Note 5)
4.2V
Voltage on Any Input Pin
(Not to exceed 4.2V)
66˚C/W
Operating Ratings (Notes 1, 2)
Operating Temperature Range
All Supply Voltage
0˚C ≤ TA ≤ +70˚C
+3.0V to +3.6V
150˚C
Electrical Characteristics
The following specifications apply for VA = VD = VR = VC = 3.3V, CL = 10pF, and fINCLK = 15MHz unless otherwise specified.
Boldface limits apply for TA = TMIN to TMAX; all other limits TA = 25˚C.
Symbol
Parameter
Conditions
Min
Typ
(Note 8)
Max
Units
CMOS Digital Input DC Specifications (RESETb, SH_R, SCLK, SENb)
VIH
Logical “1” Input Voltage
VIL
Logical “0” Input Voltage
IIH
Logical “1” Input Current
IIL
2.0
V
0.8
V
VIH = VD
Logical “0” Input Current
RESET
235
SH_R, SCLK
70
µA
SEN
130
nA
nA
VIL = DGND
RESET
70
µA
SH_R, SCLK
235
nA
SEN
70
µA
CMOS Digital Output DC Specifications (SH, CLK1 to CLK10, CMOS Data Outputs)
VOH
Logical “1” Output Voltage
IOUT = -0.5mA
VOL
Logical “0” Output Voltage
IOUT = 1.6mA
IOS
Output Short Circuit Current
VOUT = DGND
16
VOUT= VD
-20
IOZ
CMOS Output TRI-STATE
Current
2.95
V
0.25
VOUT = DGND
20
VOUT = VD
-25
V
mA
nA
CMOS Digital Input/Output DC Specifications (SDIO)
IIH
Logical “1” Input Current
VIH = VD
90
nA
IIL
Logical “0” Input Current
VIL = DGND
90
nA
LVDS/CMOS Clock Receiver DC Specifications (INCLK+ and INCLK- Pins)
VIHL
VILL
Differential LVDS Clock
RL = 100W
High Threshold Voltage
VCM (LVDS Input Common
Mode Voltage)= 1.25V
Differential LVDS Clock
100
-100
mV
mV
Low Threshold Voltage
7
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LM98714
Absolute Maximum Ratings
LM98714
Electrical Characteristics
(Continued)
The following specifications apply for VA = VD = VR = VC = 3.3V, CL = 10pF, and fINCLK = 15MHz unless otherwise specified.
Boldface limits apply for TA = TMIN to TMAX; all other limits TA = 25˚C.
Symbol
Parameter
Conditions
Min
VIHC
CMOS Clock
INCLK- = DGND
2.0
Typ
(Note 8)
Max
Units
V
High Threshold Voltage
VILC
CMOS Clock
0.8
V
280
µA
-150
µA
Low Threshold Voltage
IIHL
CMOS Clock
Input High Current
IILC
CMOS Clock
Input Low Current
LVDS Output DC Specifications
VOD
Differential Output Voltage
VOS
LVDS Output Offset Voltage
IOS
Output Short Circuit Current
RL = 100Ω
180
328
450
mV
1.17
1.23
1.3
V
VOUT = 0V, RL = 100Ω
7.9
mA
Power Supply Specifications
IA
VA Analog Supply Current
VA Normal State
60
97
125
mA
VA Low Power State
12
23
32
mA
30
64
75
mA
15
47
55
mA
(Powerdown)
IR
VR Digital Supply Current
VR Normal State
(LVDS Outputs)
CMOS Output Data Format
ID
LVDS Output Data Format
with Data Outputs Disabled
47
mA
VD Digital Output Driver Supply
LVDS Output Data Format
0.05
mA
Current
CMOS Output Data Format
12
40
mA
0.5
12
mA
(ATE Loading of CMOS
Outputs > 50pF)
IC
VC CCD Timing Generator
Output Driver Supply Current
Typical sensor outputs:
SH, CLK1=Φ1A, CLK2=Φ2A,
CLK3=ΦB, CLK4=ΦC,
CLK5=RS, CLK6=CP
(ATE Loading of CMOS
Outputs > 50pF)
PWR
Average Power Dissipation
LVDS Output Data Format
350
505
650
mW
CMOS Output Data Format
380
610
700
mW
(ATE Loading of CMOS
Outputs > 50pF)
Input Sampling Circuit Specifications
VIN
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Input Voltage Level
CDS Gain=1x, PGA Gain=1x
2.3
CDS Gain=2x, PGA Gain=
1x
1.22
8
Vp-p
(Continued)
The following specifications apply for VA = VD = VR = VC = 3.3V, CL = 10pF, and fINCLK = 15MHz unless otherwise specified.
Boldface limits apply for TA = TMIN to TMAX; all other limits TA = 25˚C.
Typ
(Note 8)
Symbol
Parameter
Conditions
Min
Max
Units
IIN_SH
Sample and Hold Mode
Source Followers Off
50
70
µA
CDS Gain = 1x
(-70)
(-40)
Source Followers Off
75
105
CDS Gain = 2x
(-105)
(-75)
Input Leakage Current
OSX = VA (OSX = AGND)
µA
OSX = VA (OSX = AGND)
Source Followers On
-200
CDS Gain = 2x
-10
200
nA
-16
OSX = VA (OSX = AGND)
CSH
Sample/Hold Mode
CDS Gain = 1x
2.5
pF
Equivalent Input Capacitance
IIN_CDS
RCLPIN
(see Figure 11)
CDS Gain = 2x
CDS Mode
Source Followers Off
Input Leakage Current
OSX = VA (OSX = AGND)
4
-300
7
pF
300
nA
50
Ω
(-25)
CLPIN Switch Resistance
16
(OSX to VCLP Node in Figure 8)
VCLP Reference Circuit Specifications
VCLP DAC Resolution
4
VCLP DAC Step Size
VVCLP
VCLP DAC Voltage Min Output
Bits
0.16
VCLP Config. Register =
V
0.14
0.26
0.43
V
2.38
2.68
2.93
V
1.54
VA / 2
1.73
V
0001 0000b
VCLP DAC Voltage Max Output
VCLP Config. Register =
0001 1111b
Resistor Ladder Enabled
VCLP Config. Register =
0010 xxxxb
ISC
VCLP DAC Short Circuit Output
Current
VCLP Config. Register =
30
mA
10
Bits
0001 xxxxb
Black Level Offset DAC Specifications
Resolution
Monotonicity
Guaranteed by characterization
Offset Adjustment Range
CDS Gain = 1x
Referred to AFE Input
Minimum DAC Code =
0x000
-614
Maximum DAC Code =
0x3FF
614
mV
CDS Gain = 2x
-307
Maximum DAC Code =
0x3FF
307
mV
Offset Adjustment Range
Minimum DAC Code =
0x000
-16000
-18200
Referred to AFE Output
Maximum DAC Code =
0x3FF
16000
18200
DAC LSB Step Size
DNL
Minimum DAC Code =
0x000
LSB
CDS Gain = 1x
1.2
mV
Referred to AFE Output
(32)
(LSB)
Differential Non-Linearity
-0.95
9
3.25
LSB
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LM98714
Electrical Characteristics
LM98714
Electrical Characteristics
(Continued)
The following specifications apply for VA = VD = VR = VC = 3.3V, CL = 10pF, and fINCLK = 15MHz unless otherwise specified.
Boldface limits apply for TA = TMIN to TMAX; all other limits TA = 25˚C.
Symbol
Parameter
INL
Integral Non-Linearity
Conditions
Min
Typ
(Note 8)
-3.1
Max
Units
2.65
LSB
PGA Specifications
Gain Resolution
8
Monotonicity
Maximum Gain
Minimum Gain
Bits
Guaranteed by characterization
CDS Gain = 1x
7.18
7.9
8.77
CDS Gain = 1x
17.1
17.9
18.9
dB
CDS Gain = 1x
0.56
0.7
0.82
V/V
CDS Gain = 1x
-5
-3
-1.72
dB
PGA Function
V/V
Gain (V/V) = (196/(280-PGA Code))
Gain (dB) = 20LOG10(196/(280-PGA Code))
Channel Matching
Minimum PGA Gain
3
Maximum PGA Gain
12.7
%
ADC Specifications
VREFT
Top of Reference
VREFB
Bottom of Reference
VREFT VREFB
Differential Reference Voltage
2.07
V
0.89
1.07
1.18
Overrange Output Code
65535
Underrange Output Code
0
V
1.29
V
Digital Offset “DAC” Specifications
7
Bits
Digital Offset DAC LSB Step Size
Resolution
Referred to AFE Output
16
LSB
Offset Adjustment Range
Min DAC Code =7b0000000
-1024
Referred to AFE Output
Mid DAC Code =7b1000000
0
Max DAC Code =
7b1111111
1008
LSB
Full Channel Performance Specifications
DNL
Differential Non-Linearity
-0.99
0.8/-0.6
2.55
LSB
INL
Integral Non-Linearity
-73
+/-23
78
LSB
SNR
Total Output Noise
Minimum PGA Gain
PGA Gain = 1x
-79
dB
7.2
LSB
RMS
-74
13
Maximum PGA Gain
Channel to Channel Crosstalk
dB
30
LSB
RMS
-56
dB
104
LSB
RMS
Mode 3
47
Mode 2
16
LSB
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions. Operation of the device beyond the Operating Ratings is not recommended.
Note 2: All voltages are measured with respect to AGND = DGND = 0V, unless otherwise specified.
Note 3: When the input voltage (VIN) at any pin exceeds the power supplies (VIN < GND or VIN > VA or VD), the current at that pin should be limited to 25 mA.
The 50 mA maximum package input current rating limits the number of pins that can simultaneously safely exceed the power supplies with an input current of 25
mA to two.
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Note 5: Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through 0Ω.
Note 6: Reflow temperature profiles are different for lead-free and non-lead-free packages.
Note 7: The analog inputs are protected as shown below. Input voltage magnitudes beyond the supply rails will not damage the device, provided the current is
limited per note 3. However, input errors will be generated If the input goes above VA and below AGND.
20105371
Note 8: Typical figures are at TA = 25˚C, and represent most likely parametric norms at the time of product characterization. The typical specifications are not
guaranteed.
11
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LM98714
Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA and the ambient temperature, TA. The maximum
allowable power dissipation at any temperature is PD = (TJMAX – TA)/θJA. The values for maximum power dissipation listed above will be reached only when the
device is operated in a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed).
Such conditions should always be avoided.
LM98714 - Three Channel, 16-Bit, 45 MSPS Digital Copier Analog Front End with Integrated
CCD/CIS Sensor Timing Generator and LVDS Output
Physical Dimensions
inches (millimeters) unless otherwise noted
48-Lead TSSOP
NS Package Number MTD48
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves
the right at any time without notice to change said circuitry and specifications.
For the most current product information visit us at www.national.com.
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which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and whose failure to perform when
properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to result
in a significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be reasonably
expected to cause the failure of the life support device or
system, or to affect its safety or effectiveness.
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