27C256 256K (32K x 8) CMOS EPROM 30 31 1 32 2 A7 A12 VPP NU Vcc A14 A13 3 4 5 29 6 28 7 27 8 9 10 11 26 25 24 23 A8 A9 A11 NC OE A10 CE O7 O6 20 19 18 17 21 16 22 13 15 12 14 A6 A5 A4 A3 A2 A1 A0 NC O0 DIP/SOIC VPP A12 A7 A6 A5 A4 A3 A2 A1 A0 O0 O1 O2 VSS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 27C256 DESCRIPTION PLCC 27C256 • High speed performance - 90 ns access time available • CMOS Technology for low power consumption - 20 mA Active current - 100 µA Standby current • Factory programming available • Auto-insertion-compatible plastic packages • Auto ID aids automated programming • Separate chip enable and output enable controls • High speed “express” programming algorithm • Organized 32K x 8: JEDEC standard pinouts - 28-pin Dual-in-line package - 32-pin PLCC Package - 28-pin SOIC package - Tape and reel • Data Retention > 200 years • Available for the following temperature ranges: - Commercial: 0˚C to +70˚C - Industrial: -40˚C to +85˚C - Automotive: -40˚C to +125˚C PACKAGE TYPES O1 O2 VSS NU O3 O4 O5 FEATURES 28 27 26 25 24 23 22 21 20 19 18 17 16 15 VCC A14 A13 A8 A9 A11 OE A10 CE O7 O6 O5 O4 O3 The Microchip Technology Inc. 27C256 is a CMOS 256K bit electrically Programmable Read Only Memory (EPROM). The device is organized as 32K words by 8 bits (32K bytes). Accessing individual bytes from an address transition or from power-up (chip enable pin going low) is accomplished in less than 90 ns. This very high speed device allows the most sophisticated microprocessors to run at full speed without the need for WAIT states. CMOS design and processing enables this part to be used in systems where reduced power consumption and reliability are requirements. A complete family of packages is offered to provide the most flexibility in applications. For surface mount applications, PLCC, or SOIC packaging is available. Tape and reel packaging is also available for PLCC or SOIC packages. 1998 Microchip Technology Inc. DS11001M-page 1 27C256 1.0 ELECTRICAL CHARACTERISTICS 1.1 Maximum Ratings* TABLE 1-1: PIN FUNCTION TABLE Name Function VCC and input voltages w.r.t. VSS ........ -0.6V to +7.25V A0-A14 VPP voltage w.r.t. VSS during programming ....................................... -0.6V to +14.0V CE Chip Enable OE Output Enable Output voltage w.r.t. VSS .................-0.6V to VCC +1.0V VPP Programming Voltage Storage temperature .......................... -65˚C to +150˚C O0 - O7 Ambient temp. with power applied...... -65˚C to +125˚C VCC +5V Power Supply *Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. VSS Ground NC No Connection; No Internal Connection NU Not Used; No External Connection Is Allowed Voltage on A9 w.r.t. VSS ....................... -0.6V to +13.5V TABLE 1-2: Address Inputs Data Output READ OPERATION DC CHARACTERISTICS VCC = +5V (±10%) Commercial: Industrial: Extended (Automotive): Parameter Tamb = 0˚C to +70˚C Tamb = -40˚C to +85˚C Tamb = -40°C to +125°C Part* Status Symbol Min. Max. Units Conditions Input Voltages all Logic "1" Logic "0" VIH VIL 2.0 -0.5 VCC+1 0.8 V V Input Leakage all — ILI -10 10 µA VIN = 0 to VCC Output Voltages all Logic "1" Logic "0" VOH VOL 2.4 0.45 V V IOH = -400 µA IOL = 2.1 mA Output Leakage all — ILO -10 10 µA VOUT = 0V to VCC Input Capacitance all — CIN — 6 pF VIN = 0V; Tamb = 25°C; f = 1 MHz Output Capacitance all — COUT — 12 pF VOUT = 0V; Tamb = 25°C; f = 1 MHz Power Supply Current, Active C I,E TTL input TTL input ICC1 ICC2 — — 20 25 mA mA VCC = 5.5V; VPP = VCC f = 1 MHz; OE = CE = VIL; IOUT = 0 mA; VIL = -0.1 to 0.8V; VIH = 2.0 to VCC; Note 1 Power Supply Current, Standby C I, E all TTL input TTL input CMOS input ICC(S) — 2 3 100 mA mA µA all all Read Mode Read Mode IPP VPP 100 VCC µA V IPP Read Current VPP Read Voltage VCC-0.7 CE = VCC ± 0.2V VPP = 5.5V * Parts: C=Commercial Temperature Range; I, E=Industrial and Extended Temperature Ranges Note 1: Typical active current increases .75 mA per MHz up to operating frequency for all temperature ranges. DS11001M-page 2 1998 Microchip Technology Inc. 27C256 TABLE 1-3: READ OPERATION AC CHARACTERISTICS AC Testing Waveform: Output Load: Input Rise and Fall Times: Ambient Temperature: VIH = 2.4V and VIL = 0.45V; VOH = 2.0V VOL = 0.8V 1 TTL Load + 100 pF 10 ns Commercial: Tamb = 0˚C to +70˚C Industrial: Tamb = -40˚C to +85˚C Automotive: Tamb = -40°C to +125°C 27C256-90* 27C256-10* 27C256-12 27C256-15 27C256-20 Parameter Sym Units Conditions Min Max Min Max Min Max Min Max Min Max Address to Output Delay tACC — 90 — 100 — 120 — 150 — 200 ns CE=OE =VIL CE to Output Delay tCE — 90 — 100 — 120 — 150 — 200 ns OE = VIL OE to Output Delay tOE — 40 — 45 — 55 — 65 — 75 ns CE = VIL CE or OE to O/P High Impedance tOFF 0 30 0 30 0 35 0 50 0 55 ns Output Hold from Address CE or OE, whichever goes first tOH 0 — 0 — 0 — 0 — 0 — ns * -10, -90 AC Testing Waveform: VIH = 2.4V and VIL = .45V; VOH = 1.5V and VOL = 1.5V Output Load: 1 TTL Load + 30pF FIGURE 1-1: READ WAVEFORMS VIH Address Valid Address VIL VIH CE VIL t CE(2) VIH OE VIL Outputs O0 - O7 VOH t OFF(1,3) t OH t OE(2) High Z Valid Output High Z VOL t ACC Notes: (1) tOFF is specified for OE or CE, whichever occurs first (2) OE may be delayed up to t CE - tOE after the falling edge of CE without impact on tCE (3) This parameter is sampled and is not 100% tested. 1998 Microchip Technology Inc. DS11001M-page 3 27C256 TABLE 1-4: PROGRAMMING DC CHARACTERISTICS Ambient Temperature: Tamb = 25°C ± 5°C VCC = 6.5V ± 0.25V, VPP = VH = 13.0V ± 0.25V Parameter Status Symbol Min Max. Units Input Voltages Logic”1” Logic”0” VIH VIL 2.0 -0.1 VCC+1 0.8 V V Input Leakage — ILI -10 10 µA VIN = 0V to VCC Logic”1” Logic”0” VOH VOL 2.4 0.45 V V IOH = -400 µA IOL = 2.1 mA VCC Current, program & verify — ICC2 — 20 mA Note 1 VPP Current, program — IPP2 — 25 mA Note 1 A9 Product Identification — VH 11.5 12.5 V Output Voltages Conditions Note 1: VCC must be applied simultaneously or before VPP and removed simultaneously or after VPP TABLE 1-5: PROGRAMMING AC CHARACTERISTICS for Program, Program Verify and Program Inhibit Modes Parameter AC Testing Waveform: VIH=2.4V and VIL=0.45V; VOH=2.0V; VOL=0.8V Output Load: 1 TTL Load + 100pF Ambient Temperature: Tamb=25°C ± 5°C VCC= 6.5V ± 0.25V, VPP = VH = 13.0V ± 0.25V Symbol Min. Max. Units Address Set-Up Time tAS 2 — µs Data Set-Up Time tDS 2 — µs Data Hold Time tDH 2 — µs Address Hold Time tAH 0 — µs Float Delay (2) tDF 0 130 ns VCC Set-Up Time tVCS 2 — µs Program Pulse Width (1) tPW 95 105 µs CE Set-Up Time tCES 2 — µs OE Set-Up Time tOES 2 — µs VPP Set-Up Time tVPS 2 — µs Data Valid from OE tOE — 100 ns Remarks 100 µs typical Note 1: For express algorithm, initial programming width tolerance is 100 µs ±5%. 2: This parameter is only sampled and not 100% tested. Output float is defined as the point where data is no longer driven (see timing diagram). DS11001M-page 4 1998 Microchip Technology Inc. 27C256 FIGURE 1-2: PROGRAMMING WAVEFORMS Program Verify VIH Address Address Stable VIL t AS t AH VIH High Z Data Data Stable VIL t DS Data Out Valid t DF (1) t DH 13.0V(2) VPP 5.0V tVPS 6.5V(2) VCC tVCS 5.0V VIH CE VIL t OES t PW VIH OE t OE (1) VIL Notes: TABLE 1-6: (1) t DF and tOE are characteristics of the device but must be accommodated by the programmer (2) VCC = 6.5 V ±0.25V, VPP = V H = 13.0V ±0.25V for express algorithm MODES Operation Mode CE OE VPP A9 O0 - O7 Read VIL VIL VCC X DOUT Program VIL VIH VH X DIN Program Verify VIH VIL VH X DOUT Program Inhibit VIH VIH VH X High Z Standby VIH X VCC X High Z Output Disable VIL VIH VCC X High Z Identity VIL VIL VCC VH Identity Code X = Don’t Care 1.2 Read Mode (See Timing Diagrams and AC Characteristics) Read Mode is accessed when: a) b) For Read operations, if the addresses are stable, the address access time (tACC) is equal to the delay from CE to output (tCE). Data is transferred to the output after a delay from the falling edge of OE (tOE). the CE pin is low to power up (enable) the chip the OE pin is low to gate the data to the output pins 1998 Microchip Technology Inc. DS11001M-page 5 27C256 1.3 Standby Mode The standby mode is defined when the CE pin is high (VIH) and a program mode is not defined. When these conditions are met, the supply current will drop from 20 mA to 100 µA. 1.4 Output Enable This feature eliminates bus contention in multiple bus microprocessor systems and the outputs go to a high impedance when the following condition is true: • The OE pin is high and the program mode is not defined. 1.5 Erase Mode (U.V. Windowed Versions) Windowed products offer the ability to erase the memory array. The memory matrix is erased to the all 1’s state when exposed to ultraviolet light. To ensure complete erasure, a dose of 15 watt-second/cm2 is required. This means that the device window must be placed within one inch and directly underneath an ultraviolet lamp with a wavelength of 2537 Angstroms, intensity of 12,000µW/cm2 for approximately 20 minutes. 1.6 Programming Mode The Express Algorithm has been developed to improve on the programming throughput times in a production environment. Up to ten 100-microsecond pulses are applied until the byte is verified. No overprogramming is required. A flowchart of the express algorithm is shown in Figure 1-3. 1.7 Verify After the array has been programmed it must be verified to ensure all the bits have been correctly programmed. This mode is entered when all the following conditions are met: a) b) c) d) VCC is at the proper level, VPP is at the proper VH level, the CE line is high, and the OE line is low. 1.8 Inhibit When programming multiple devices in parallel with different data, only CE need be under separate control to each device. By pulsing the CE line low on a particular device, that device will be programmed; all other devices with CE held high will not be programmed with the data, although address and data will be available on their input pins. 1.9 Identity Mode In this mode specific data is output which identifies the manufacturer as Microchip Technology Inc. and device type. This mode is entered when Pin A9 is taken to VH (11.5V to 12.5V). The CE and OE lines must be at VIL. A0 is used to access any of the two non-erasable bytes whose data appears on O0 through O7. Pin Identity Programming takes place when: a) b) c) d) VCC is brought to the proper voltage, VPP is brought to the proper VH level, the OE pin is high, and the CE pin is low. Manufacturer Device Type* Input Output H e x A0 0 O O O O O O O 7 6 5 4 3 2 1 0 VIL VIH 0 0 1 0 1 0 0 1 29 1 0 0 0 1 1 0 0 8C * Code subject to change Since the erased state is “1” in the array, programming of “0” is required. The address to be programmed is set via pins A0-A14 and the data to be programmed is presented to pins O0-O7. When data and address are stable, a low going pulse on the CE line programs that location. DS11001M-page 6 1998 Microchip Technology Inc. 27C256 FIGURE 1-3: PROGRAMMING EXPRESS ALGORITHM Conditions: Tamb = 25˚C ±5˚C VCC = 6.5 ±0.25V VPP = 13.0 ±0.25V Start ADDR = First Location VCC = 6.5V VPP = 13.0V X=0 Program one 100 µs pulse Increment X Verify Byte Pass Fail No X = 10 ? Last Address? Yes Device Failed Yes No Increment Address VCC = VPP = 4.5V, 5.5V Device Passed 1998 Microchip Technology Inc. Yes All bytes = original data? No Device Failed DS11001M-page 7 27C256 NOTES: DS11001M-page 8 1998 Microchip Technology Inc. 27C256 NOTES: 1998 Microchip Technology Inc. DS11001M-page 9 27C256 NOTES: DS11001M-page 10 1998 Microchip Technology Inc. 27C256 27C256 Product Identification System To order or to obtain information (e.g., on pricing or delivery), please use listed part numbers, and refer to factory or listed sales offices. 27C256 – 90 I /TS Package: Temperature Range: Access Time: Device 1998 Microchip Technology Inc. L = Plastic Leaded Chip Carrier P = Plastic DIP (Mil 600) SO = Plastic SOIC (Mil 300) Blank = 0˚C to +70˚C I = -40˚C to +85˚C E = -40˚C to +125˚C 90 10 12 15 20 27C256 = = = = = 90 ns 100 ns 120 ns 150 ns 200 ns 256K (32K x 8) CMOS EPROM DS11001M-page 11 Note the following details of the code protection feature on PICmicro® MCUs. • • • • • • The PICmicro family meets the specifications contained in the Microchip Data Sheet. Microchip believes that its family of PICmicro microcontrollers is one of the most secure products of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the PICmicro microcontroller in a manner outside the operating specifications contained in the data sheet. The person doing so may be engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable”. Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our product. If you have any further questions about this matter, please contact the local sales office nearest to you. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, FilterLab, KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs and microperipheral products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified. 2002 Microchip Technology Inc. M WORLDWIDE SALES AND SERVICE AMERICAS ASIA/PACIFIC Japan Corporate Office Australia 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: http://www.microchip.com Microchip Technology Australia Pty Ltd Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 Microchip Technology Japan K.K. Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Rocky Mountain China - Beijing 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7966 Fax: 480-792-7456 Microchip Technology Consulting (Shanghai) Co., Ltd., Beijing Liaison Office Unit 915 Bei Hai Wan Tai Bldg. No. 6 Chaoyangmen Beidajie Beijing, 100027, No. China Tel: 86-10-85282100 Fax: 86-10-85282104 Atlanta 500 Sugar Mill Road, Suite 200B Atlanta, GA 30350 Tel: 770-640-0034 Fax: 770-640-0307 Boston 2 Lan Drive, Suite 120 Westford, MA 01886 Tel: 978-692-3848 Fax: 978-692-3821 Chicago 333 Pierce Road, Suite 180 Itasca, IL 60143 Tel: 630-285-0071 Fax: 630-285-0075 Dallas 4570 Westgrove Drive, Suite 160 Addison, TX 75001 Tel: 972-818-7423 Fax: 972-818-2924 Detroit Tri-Atria Office Building 32255 Northwestern Highway, Suite 190 Farmington Hills, MI 48334 Tel: 248-538-2250 Fax: 248-538-2260 Kokomo 2767 S. Albright Road Kokomo, Indiana 46902 Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles 18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 949-263-1888 Fax: 949-263-1338 China - Chengdu Microchip Technology Consulting (Shanghai) Co., Ltd., Chengdu Liaison Office Rm. 2401, 24th Floor, Ming Xing Financial Tower No. 88 TIDU Street Chengdu 610016, China Tel: 86-28-6766200 Fax: 86-28-6766599 China - Fuzhou Microchip Technology Consulting (Shanghai) Co., Ltd., Fuzhou Liaison Office Unit 28F, World Trade Plaza No. 71 Wusi Road Fuzhou 350001, China Tel: 86-591-7503506 Fax: 86-591-7503521 China - Shanghai Microchip Technology Consulting (Shanghai) Co., Ltd. Room 701, Bldg. B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 China - Shenzhen 150 Motor Parkway, Suite 202 Hauppauge, NY 11788 Tel: 631-273-5305 Fax: 631-273-5335 Microchip Technology Consulting (Shanghai) Co., Ltd., Shenzhen Liaison Office Rm. 1315, 13/F, Shenzhen Kerry Centre, Renminnan Lu Shenzhen 518001, China Tel: 86-755-2350361 Fax: 86-755-2366086 San Jose Hong Kong Microchip Technology Inc. 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955 Microchip Technology Hongkong Ltd. Unit 901-6, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 New York Toronto 6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509 India Microchip Technology Inc. India Liaison Office Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O’Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062 Korea Microchip Technology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5934 Singapore Microchip Technology Singapore Pte Ltd. 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-334-8870 Fax: 65-334-8850 Taiwan Microchip Technology Taiwan 11F-3, No. 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139 EUROPE Denmark Microchip Technology Nordic ApS Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45 4420 9895 Fax: 45 4420 9910 France Microchip Technology SARL Parc d’Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany Microchip Technology GmbH Gustav-Heinemann Ring 125 D-81739 Munich, Germany Tel: 49-89-627-144 0 Fax: 49-89-627-144-44 Italy Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883 United Kingdom Arizona Microchip Technology Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44 118 921 5869 Fax: 44-118 921-5820 01/18/02 2002 Microchip Technology Inc.