TARGET DATA SHEET ECM051 4 X 4 mm Dual Mode Cellular Band CDMA 3.5V POWER AMPLIFIER MODULE Description Features The ECM051 is a 10 signal pin 4 X 4 mm dual mode power amplifier module at 3.5V Vcc with high efficiency. This device was developed using EiC’s proprietary InGaP Gallium Arsenide Heterojunction Bipolar Transistor (HBT) process. It is optimized for cellular CDMA (digital) and AMPS (analog) in the 824 MHz to 849 MHz band. It operates from a positive voltage (3.2 - 4.2V Vcc) and includes a power-down feature. The input and output are both matched to 50Ω internally. It is housed in a 4 X 4 mm Land Grid Array package with 10 signal pins. A Q control pin switches the quiescent current to 50mA for low output power range. Applications 4 X 4 mm LGA Module with 10 Signal Pins Dual Mode CDMA/AMPS Quiescent current control Single 3.5V Supply for 3-Cell Ni or Li-Ion Battery Power-down activated when Vref pin <1V 28.0 dBm CDMA Power with 39% Efficiency 31.0 dBm AMPS Power 50mA Typical Quiescent Current (Low power mode) High Reliability InGaP Design with proprietary temperature compensation 3.5 V CDMA/AMPS Cellular Handsets CAUTION! SENSITIVE ELECTRONIC DEVICE SS-000505-000 Revision E EiC Corp. A Subsidiary of EiC Enterprises, Ltd. 45738 Northport Loop West, Fremont, CA 94538 Phone: (510) 979-8999 Fax: (510) 979-8902 www.eiccorp.com 1 TARGET DATA SHEET ECM051 4 X 4 mm Dual Mode Cellular Band CDMA 3.5V POWER AMPLIFIER MODULE Electrical Specifications Test Conditions: Ta = 25oC, VCC = +3.5 V, VREF / PD (reference / power-down voltage) = +2.9 V, F = 824 to 849 MHz SYMBOL F G P ACPR Alt CPR PAE PAE G PAE ICQ ICQ Vref /pd Vcc Icc Icc Vq Vq IRL RXBN TON/OFF NOTE 1: NOTE 2: NOTE 3: NOTE 4: PARAMETER MIN. Frequency 824 Gain (CDMA Modulation) Output Power (CDMA) 28 Adjacent Channel Power Rejection Alternate Channel Power Rejection Power Added Efficiency (CDMA) @ 28.0 dBm Power Added Efficiency (CDMA) @ 16.0 dBm Gain (AMPS) @ 31.0 dBm, Pin typical +4dBm Power Added Efficiency (AMPS) @ 31.0 dBm Output Load Stability Ruggedness for output VSWR Mismatch Quiescent Current (No RF) Quiescent Current (No RF) Leakage Current Vcc = 3.5V, Vref = 0V Vref/pd Voltage Supply Voltage Operating Current @ 28dBm Operating Current @ 16dBm Vq Voltage (High Power Mode) 0 Vq Voltage (Low Power Mode) 2 Input Return Loss Receiver Band Noise Harmonics, 2f, 3f, 4f Power Down On/Off Time Using Application Schematic. @ 885 KHz offset from band center, Pout ≤ 28dBm @ 1980 KHz offset from band center, Pout ≤ 28dBm Spur < -60dBc for all phase angles LIMITS TYP. MAX. 849 28 -50 -60 39 9.5 27 48 -46 -56 UNIT TEST CONDITION MHz dB dBm dBc dBc % % dB % NOTE 1 NOTE 2 NOTE 3 High Power Mode Low Power Mode 6:1 10:1 120 50 3 2.9 3.5 460 120 170 70 10 0.8 2.8 -10 -135 -40 <100 mA mA uA V V mA mA V V dB dBm/Hz dBc ns NOTE 4 No Damage High Power Mode Low Power Mode Pin Description PIN 1 2 4 5 6 7, 9, 10 11 8 Notes: FUNCTION DESCRIPTION Ref. Voltage for the bias circuit. No significant amplifier current is drawn until Vref reaches Vref / Vpd approximately 2.5V. The quiescent current is compensated over the temperature range.In low power mode operation (>2.0v) VQ the current is reduced to 50mA.The efficiency is optimized at the low RF power range (≤16dBm). RF In RF input port connects to internally matched 50 ohm circuit. Vcc1 PIN 5 connects to the driver stage HBT collector. Vcc2 Vcc2 connects to the power amplifier stage HBT collector. GND Ground. Ground. This ground also serves as heat sink and must connect well to the PCB RF ground and heat GND sink. RF Out RF out is internally matched to 50 ohms and expects a 50 ohm load impedance. All supply pins may be connected together at the supply. PIN 3 N/A SS-000505-000 Revision E EiC Corp. A Subsidiary of EiC Enterprises, Ltd. 45738 Northport Loop West, Fremont, CA 94538 Phone: (510) 979-8999 Fax: (510) 979-8902 www.eiccorp.com 2 TARGET DATA SHEET ECM051 4 X 4 mm Dual Mode Cellular Band CDMA 3.5V POWER AMPLIFIER MODULE PACKAGE DIMENSIONS AND MARKINGS The ECM051 is a laminate based, overmold encapsulated modular package designed for surface-mounted solder attachment to a printed circuit board. Package Dimension X4 1 X 10 11 Y4 2 X1 X2 Y2 9 C L Y3 X4 8 Y 4 7 5 6 X1 X1 BOTTOM SIDE PAD .40mm X .40mm (.016" x .016") X2 X .158 .083 .041 .080 .162 .038 .063 .067 .071 Y4 .075 .070 .083 .078 Y5 .144 .079 .074 .148 Y2 Y3 Y2 .079 .037 .076 .034 Y Y1 Y1 Y5 .075 .033 .072 .154 .030 X3 Y1 C L 3 English inches min nom max .154 .158 .162 .071 .063 .067 BOTTOM SIDE GROUND PAD X3 .152 Metric millimeters nom max min 3.90 4.00 4.10 1.60 1.70 1.80 1.90 0.84 2.00 2.10 0.94 1.84 1.94 4.00 1.04 2.04 3.90 0.75 1.60 1.90 1.78 3.65 0.85 1.70 2.00 1.88 3.75 4.10 0.95 1.80 2.10 1.98 3.85 English values are converted from Metric values. English values are rounded off. TOP VIEW Device Marking .062" +/- .004" (1.57 mm +/-0.10 mm) .157" +/- 0.004" (4.00mm +/- 0.1mm) .157" +/- 0.004" (4.00mm +/- 0.1mm) PIN 1 INDICATOR EiC xxxx ECM051 XXXX XXXX LOT NUMBER PINOUT 1 2 3 4 5 6 7 8 9 10 11 Vref Vq n/a RFin Vcc1 Vcc2 Gnd RFout Gnd Gnd Gnd SS-000505-000 Revision E EiC Corp. A Subsidiary of EiC Enterprises, Ltd. 45738 Northport Loop West, Fremont, CA 94538 Phone: (510) 979-8999 Fax: (510) 979-8902 www.eiccorp.com 3