HD66753 (168 x 132-dot Graphics LCD Controller/Driver with Bit-operation Functions) ADE-207-347(Z) Rev. 1.0 Jan. 31. 2003 Description The HD66753, dot-matrix graphics LCD controller and driver LSI, displays 168-by-132-dot graphics for four monochrome grayscales. When 12-by-13-dot size fonts are used, up to 13 lines x 11 characters (143 characters) can be simultaneously displayed. Since the HD66753 incorporates bit-operation functions and a 16-bit high-speed bus interface, it enables efficient data transfer and high-speed rewriting of data in the graphics RAM. The HD66753 has various functions for reducing the power consumption of an LCD system, such as lowvoltage operation of 1.7 V/min., a step-up circuit to generate a maximum of seven-times the LCD drive voltage from the input-supplied voltage, and voltage followers to decrease the direct current flow in the LCD drive bleeder-resistors. Combining these hardware functions with software functions, such as a partial display with low-duty drive and standby and sleep modes, allows precise power control. The HD66753 is suitable for any mid-sized or small portable battery-driven product requiring long-term driving capabilities, such as digital cellular phones supporting a WWW browser. Features • 168 × 132-dot graphics display LCD controller/driver for four monochrome grayscales • 16-/8-bit high-speed bus interface • Clock-synchronized serial interface (transfer rate: 10 MHz max.) • I2C bus interface (transfer rate: 1.3 MHz max.) • Bit-operation functions for graphics processing: Write-data mask function in bit units Bit rotation function Bit logic-operation function • Low-power operation supports: Vcc = 1.7 to 3.6 V (low voltage) VLPS = 5 to 19.5 V (liquid crystal drive voltage) Internal three-, five-, six-, or seven-times step-up circuit for liquid crystal drive voltage to be selected by software 128-step contrast adjuster and voltage followers to decrease direct current flow in the LCD drive bleeder-resistors HD66753 Power-save functions such as the standby mode and sleep mode Programmable drive duty ratios and bias values displayed on LCD • Internal LCD-drive-voltage regulator circuits • 168-segment × 132-common liquid crystal display driver • n-raster-row AC liquid-crystal drive (C-pattern waveform drive) • Duty ratio and drive bias (selectable by program) • Window cursor display supported by hardware • Black-and-white reversed display • Internal oscillation and hardware reset • Shift change of segment and common driver Table 1 Progammable Display Sizes and Duty Ratios Graphics Display Duty Optimum Bit-map Ratio Drive Bias Display Area 12 x 13-dot Font Width 12 x 14-dot 16 x 16-dot Font Width Font Width 16 x 17-dot Font Width 8 x 10-dot Font Width 1/96 12 lines x 8 characters 12 lines x 8 10 lines x 6 characters characters 10 lines x 5 characters 21 lines x 9 characters 1/104 1/11 168 x 104 dots 12 lines x 8 characters 12 lines x 8 10 lines x 6 characters characters 10 lines x 6 characters 21 lines x 10 characters 1/112 1/11 168 x 112 dots 12 lines x 9 characters 12 lines x 9 10 lines x 7 characters characters 10 lines x 6 characters 21 lines x 11 characters 1/120 1/11 168 x 120 dots 12 lines x 10 12 lines x 10 10 lines x 7 characters characters characters 10 lines x 7 characters 21 lines x 12 characters 1/128 1/11 168 x 128 dots 12 lines x 10 12 lines x 10 10 lines x 8 characters characters characters 10 lines x 7 characters 21 lines x 12 characters 1/132 1/11 168 x 132 dots 12 lines x 11 12 lines x 11 10 lines x 8 characters characters characters 10 lines x 7 characters 21 lines x 13 characters 1/10 168 x 96 dots Note: When 12 x 13-dot fonts are used for display, the spaces between characters on the last line are not displayed. Rev. 1.0, Jan. 2003, page 2 of 102 HD66753 Total Current Consumption Characteristics (Vcc = 3 V, TYP Conditions, LCD Drive Power Current Included) Total Power Consumption Normal Display Operation Character Display Dot Size R-C Duty Oscillation Frame Ratio Frequency Frequency 96 x 168 dots 1/96 Internal Logic LCD Power Total* Sleep Mode Standby Mode 100 kHz 69 Hz (60 µA) (20 µA) Five-times (12 µA) 0.1 µA (160 µA) 104 x 168 dots 1/104 100 kHz 69 Hz (60 µA) (20 µA) Five-times (12 µA) (160 µA) 112 x 168 dots 1/112 100 kHz 69 Hz (70 µA) (25 µA) Six-times (220 µA) (12 µA) 120 x 168 dots 1/120 100 kHz 69 Hz (70 µA) (25 µA) Six-times (220 µA) (12 µA) 128 x 168 dots 1/128 100 kHz 71 Hz (80 µA) (25 µA) Six-times (230 µA) (12 µA) 132 x 168 dots 1/132 100 kHz 69 Hz (80 µA) (25 µA) Six-times (230 µA) (12 µA) Note: When a three-, five-, six-, or seven-times step-up is used: the total current consumption = internal logic current + LCD power current x 3 (three-times step-up), the total current consumption = internal logic current + LCD power current x 5 (five-times step-up), the total current consumption = internal logic current + LCD power current x 6 (six-times step-up), and the total current consumption = internal logic current + LCD power current x 7 (seven-times step-up) Type Name Types External Dimensions MPU Interface COM Driver Arrangement Display HD66753TB0 Bending TCP 8-bit or 16-bit parallel or clocksynchronized serial interface Both sides of COM (Output from left and right sides of the chip) Four monochrome grayscales HCD66753BP Au-bump chip HWD66753BP Au-bump wafer Rev. 1.0, Jan. 2003, page 3 of 102 HD66753 LCD Family Comparison Items HD66724 HD66725 HD66726 Character display sizes 12 characters x 3 lines 16 characters x 3 lines 16 characters x 5 lines Graphic display sizes 72 x 26 dots 96 x 26 dots 96 x 42 dots Grayscale display — — — Multiplexing icons 144 192 192 Annunciator 1/2 duty: 144 1/2 duty: 192 1/2 duty: 192 Key scan control 8x4 8x4 8x4 LED control ports — — — General output ports 3 3 3 Operating power voltages 1.8 V to 5.5 V 1.8 V to 5.5 V 1.8 V to 5.5 V Liquid crystal drive voltages 3 V to 6.5 V 3 V to 6.5 V 4.5 V to 11 V Serial bus Clock-synchronized serial Clock-synchronized serial Clock-synchronized serial Parallel bus 4 bits, 8 bits 4 bits, 8 bits 4 bits, 8 bits Liquid crystal drive duty ratios 1/2, 10, 18, 26 1/2, 10, 18, 26 1/2, 10, 18, 26, 34, 42 Liquid crystal drive biases 1/4 to 1/6.5 1/4 to 1/6.5 1/2 to 1/8 Liquid crystal drive waveforms B B B Liquid crystal voltage step-up Single, two-, or three-times Single, two-, or three-times Single, two-, three-, or fourtimes Bleeder-resistor for liquid crystal drive Incorporated (external) Incorporated (external) Incorporated (external) Liquid crystal drive operational amplifier Incorporated Incorporated Incorporated Liquid crystal contrast adjuster Incorporated (32 steps) Incorporated (32 steps) Incorporated (32 steps) Horizontal smooth scroll 3-dot unit 3-dot unit — Vertical smooth scroll Line unit Line unit Line unit Double-height display Yes Yes Yes DDRAM 80 x 8 80 x 8 80 x 8 CGROM 20,736 20,736 20,736 CGRAM 384 x 8 384 x 8 480 x 8 SEGRAM 72 x 8 96 x 8 96 x 8 No. of CGROM fonts 240 + 192 240 + 192 240 + 192 No. of CGRAM fonts 64 64 64 Font sizes 6x8 6x8 6x8 Bit map areas 72 x 26 96 x 26 96 x 42 R-C oscillation resistor/ oscillation frequency External resistor, incorporated (32 kHz) External resistor, incorporated (32 kHz) External resistor (50 kHz) Reset function External External External Low power control Partial display off, Oscillation off, Liquid crystal power off, Key wake-up interrupt Partial display off, Oscillation off, Liquid crystal power off, Key wake-up interrupt Partial display off, Oscillation off, Liquid crystal power off, Key wake-up interrupt SEG/COM direction switching SEG, COM SEG, COM SEG, COM QFP package — — — TQFP package — — — TCP package TCP-146 TCP-170 TCP-188 Bare chip — — Yes Bumped chip Yes Yes Yes Chip sizes 10.34 x 2.51 10.97 x 2.51 13.13 x 2.51 Pad intervals 80 µm 80 µm 100 µm Rev. 1.0, Jan. 2003, page 4 of 102 HD66753 LCD Family Comparison (cont) Items HD66728 HD66729 HD66740 Character display sizes 16 characters x 10 lines — — Graphic display sizes 112 x 80 dots 105 x 68 dots 112 x 80 dots Grayscale display — — — Multiplexing icons — — — Annunciator — — — Key scan control 8x4 — — LED control ports — — — General output ports 3 — — Operating power voltages 1.8 V to 5.5 V 1.8 V to 5.5 V 1.8 V to 3.6 V Liquid crystal drive voltages 4.5 V to 15 V 4.0 V to 13 V 4.5 V to 15 V Serial bus Clock-synchronized serial Clock-synchronized serial Clock-synchronized serial Parallel bus 4 bits, 8 bits 4 bits, 8 bits 4 bits, 8 bits Liquid crystal drive duty ratios 1/8, 16, 24, 32, 40, 48, 56, 64, 72, 80 1/8, 16, 24, 32, 40, 48, 56, 64, 68 1/8, 16, 24, 32, 40, 48, 56, 64, 72, 80 Liquid crystal drive biases 1/4 to 1/10 1/4 to 1/9 1/4 to 1/10 Liquid crystal drive waveforms B, C B, C B, C Liquid crystal voltage step-up Three-, four-, or five-times Two-, three-, four-, or fivetimes Three-, four-, or five-times Bleeder-resistor for liquid crystal drive Incorporated (external) Incorporated (external) Incorporated (external) Liquid crystal drive operational amplifier Incorporated Incorporated Incorporated Liquid crystal contrast adjuster Incorporated (64 steps) Incorporated (64 steps) Incorporated (64 steps) Horizontal smooth scroll — — — Vertical smooth scroll Line unit Line unit Line unit Double-height display Yes Yes Yes DDRAM 160 x 8 — — CGROM 20,736 — — CGRAM 1,120 x 8 1,050 x 8 1,120 x 8 SEGRAM — — — No. of CGROM fonts 240 + 192 — — No. of CGRAM fonts 64 — — Font sizes 6x8 — — Bit map areas 112 x 80 105 x 68 112 x 80 R-C oscillation resistor/ oscillation frequency External resistor (70–90 kHz) External resistor (75 kHz) External resistor (70–90 kHz) Reset function External External External Low power control Partial display off, Oscillation off, Liquid crystal power off, Key wake-up interrupt Partial display off, Oscillation off, Liquid crystal power off Partial display off, Oscillation off, Liquid crystal power off SEG/COM direction switching SEG, COM SEG, COM SEG, COM QFP package — — — TQFP package — — — TCP package TCP-241 TCP-213 TCP-236 Bare chip — — — Bumped chip Yes Yes Yes Chip sizes 13.67 x 2.78 12.23 x 2.52 9.40 x 2.18 Pad intervals 70 µm 70 µm 50 µm Rev. 1.0, Jan. 2003, page 5 of 102 HD66753 LCD Family Comparison (cont) Items HD66741 HD66751S HD66750S Character display sizes — — — Graphic display sizes 128 x 80 dots 128 x 128 dots 128 x 128 dots Grayscale display — Four monochrome grayscales (5 levels) Four monochrome grayscales (5 levels) Multiplexing icons — — — Annunciator — — — Key scan control — — — LED control ports — — — General output ports 3 — — Operating power voltages 1.8 V to 5.5 V 1.7 V to 3.6 V 1.7 V to 3.6 V Liquid crystal drive voltages 4.5 V to 15 V 5.0 V to 16.5V 5.0 V to 16.5V Serial bus Clock-synchronized serial — Clock-synchronized serial Parallel bus 4 bits, 8 bits 8 bits, 16 bits 8 bits, 16 bits Liquid crystal drive duty ratios 1/8, 16, 24, 32, 40, 48, 56, 64, 72, 80 1/16, 24, 72, 80, 88, 96, 104, 1/16, 24, 72, 80, 88, 96, 104, 112, 120, 128 112, 120, 128 Liquid crystal drive biases 1/4 to 1/10 1/4 to 1/11 Liquid crystal drive waveforms B, C B, C B, C Liquid crystal voltage step-up Three-, four-, or five-times Two-, five-, six-, or seventimes Two-, five-, six-, or seventimes Bleeder-resistor for liquid crystal drive Incorporated (external) Incorporated (external) Incorporated (external) Liquid crystal drive operational amplifier Incorporated Incorporated Incorporated Liquid crystal contrast adjuster Incorporated (64 steps) Incorporated (64 steps) Incorporated (64 steps) Horizontal smooth scroll — — — Vertical smooth scroll Line unit Line unit Line unit Double-height display Yes Yes Yes DDRAM — — — CGROM — — — CGRAM 1,280 x 8 4,096 x 8 4,096 x 8 1/4 to 1/11 SEGRAM — — — No. of CGROM fonts — — — No. of CGRAM fonts — — — Font sizes — — — Bit map areas 128 x 80 128 x 128 128 x 128 R-C oscillation resistor/ oscillation frequency External resistor (70–90 kHz) External resistor (70 kHz) External resistor (70 kHz) Reset function External External External Low power control Partial display off, Oscillation off, Liquid crystal power off Partial display off, Oscillation off, Liquid crystal power off Partial display off, Oscillation off, Liquid crystal power off SEG/COM direction switching SEG, COM SEG, COM SEG, COM QFP package — — — TQFP package — — — TCP package TCP-254 TCP-308 TCP-308 Bare chip — — — Bumped chip Yes Yes Yes Chip sizes 14.30 x 2.78 8.42 x 3.18 8.44 x 2.95 Pad intervals 70 µm 50 µm 50 µm Rev. 1.0, Jan. 2003, page 6 of 102 HD66753 LCD Family Comparison (cont) Items HD66752 HD66753 Character display sizes — — Graphic display sizes 168 x 132 dots 168 x 132 dots Grayscale display Four monochrome grayscales (7 levels) Four monochrome grayscales (7 levels) Multiplexing icons — — Annunciator — — Key scan control — — LED control ports — — General output ports — — Operating power voltages 2.0 V to 3.6 V 1.7 V to 3.6 V Liquid crystal drive voltages 5.0 V to 15.5V 5 V to 19.5V Serial bus — Clock-synchronized serial Parallel bus 8 bits, 16 bits 8 bits, 16 bits Liquid crystal drive duty ratios 1/80, 88, 96, 104, 112, 120, 128, 132 1/80, 88, 96, 104, 112, 120, 128, 132 Liquid crystal drive biases 1/4 to 1/11 1/4 to 1/11 Liquid crystal drive waveforms B, C B, C Liquid crystal voltage step-up Two-, five-, six-, or seventimes Two-, five-, six-, or seventimes Bleeder-resistor for liquid crystal drive Incorporated (external) Incorporated Liquid crystal drive operational amplifier Incorporated Incorporated Liquid crystal contrast adjuster Incorporated (128 steps) Incorporated (128 steps) Horizontal smooth scroll — — Vertical smooth scroll Line unit Line unit Double-height display Yes Yes DDRAM — — CGROM — — CGRAM 5,544 x 8 5,544 x 8 SEGRAM — — No. of CGROM fonts — — No. of CGRAM fonts — — Font sizes — — Bit map areas 168 x 132, 132 x 168 168 x 132, 132 x 168 R-C oscillation resistor/ oscillation frequency External resistor (70 kHz) External resistor (70 kHz) Reset function External External Low power control 2-screen division partial drive, Partial display off, Oscillation off, Liquid crystal power off 2-screen division partial drive, Partial display off, Oscillation off, Liquid crystal power off SEG/COM direction switching SEG, COM SEG, COM QFP package — — TQFP package — — TCP package — TCP-352 Bare chip — — Bumped chip Yes Yes Chip sizes 12.68 x 4.31 15.90 x 2.02 Pad intervals 60 µm 50 µm Rev. 1.0, Jan. 2003, page 7 of 102 HD66753 HD66753 Block Diagram OSC1 OSC2 Vcc CPG RESET* TEST Timing generator Instruction decoder Instruction register (IR) IM2-1 16 IM0ID 132-bit bidirectional common shift register Address counter (AC) CS* System interface 16 ·Synchronized serial ·16-bit bus ·8-bit bus RS E/WR*/SCL RW/RD*/SDA Bit operation 16 SEG1/168-SEG168/1 16 DB0-DB15 16 Vci C1+ C1C2+ C2C3+ C3C4+ C4C5+ C5C6+ C6- COM1/132-COM132/1 Common driver 12 Read data latch 168-bit latch circuit 16 Segment driver 16 Graphic RAM (CGRAM) 5,544 bytes Three-, five-, six-, and seven-times step-up LCD drive voltage selector Four-grayscale control circuit VLOUT VSW1 VSW2 VREG Window cursor control LCD drive voltage regulator V1REF Drive bias controller Contrast adjuster VTEST +VR VLREF OPOFF + R V1OUT Rev. 1.0, Jan. 2003, page 8 of 102 + R V2OUT +R0 V3OUT +R V4OUT R V5OUT GND HD66753 C hip size: 15.9 0 m m x 2.02 m m C hip thickness : 400 µ m (ty p.) P ad coordinate s: pad centers C oordinate orig in: chip center No . 1 (2) 45 µ m x 80 µ m (m in 60-µ m pitch) CO M1/132 to C OM 14/119, CO M17/116 to C OM 30/103 (3) 35 um x 80 um (min 50- µ ‚ pitch) SE G 1/168 to S EG 168/1, CO M15/118, CO M16/117, CO M65/68 to C OM 112/21, CO M31/102 to C OM 132/1 A u bum p pitch: see the pad coo rdinates H eight of the A u bump: 15 µ m (typ.) N umbers in the figure corres pond to pad no . A lignment m ark (1) A lignment: tw o points @ @ Coordinates (X , Y ) i±7642, 613 j 190 µ m GN DD U M3 DB 15 DB 14 C OM 1/1 32 C OM 2/1 31 C OM 14/119 C OM 15/118 C OM 16/117 C OM 65/68 C OM 66/67 DB 13 T yp e c o d e DB 12 DB 11 DB 10 DB 9 DB 8 DB 7 C OM 111 /22 C OM 112 /21 S E G168 /1 S E G167 /2 DB 6 30 45 40 DB 4 DB 3 DB 2 45 30 1 90 µ m 95 40 N o. 41 7 D umm y1 DB 5 95 4 5 30 Dum my8 H D66753 A u bum p size: (1) 80 µ m x 80 µ m (m in 100-µ m pitch) Dum my1, D um my2 to GN D DU M2, D ummy8 , GN DD UM 3, DB 15 to V 4OU T, V 5O UT , Dum my9, D um my10 to Dum my19, D ummy2 0 G ND D UM2 T ES T O P OF F V ccDU M 1 IM0ID IM 1 G N DD UM 1 IM 2 Dumm y7 D ummy6 Dumm y5 D ummy4 Dum my3 D ummy2 HD66753 Pad Arrangement DB 1 DB 0 GN DD U M4 3 0 45 (2-b ) Coord inates (X , Y ) = i766 8, 406 j R ES E T * CS* RS 20 50 µ m E /W R */SC L 25 25 10 5 25 5 10 25 70 µ m 80 µ m 10 5 5 10 70 µ m 80 µ m (3-b ) Coord inates (X , Y ) = i754 8, 406 j 25 25 10 10 25 70 µ m 25 10 10 70 µ m U p da te h isto ry R e v 0 .0 : n ew ly c re ated R e v 0 .1 : p ad c oo rd in ate no . u pda te d, @ @@ @ @ ty p e co de a dde d R e v 0 .2 : p in nam e m odified in A u b um p @ @@ @ @ siz e ( 3) RW /RD */S DA G ND G ND G ND G ND G ND G ND G ND G ND O SC 2 O SC 1 V cc V cc V cc V cc V cc V cc Vci Vci Vci Vci Vci Vci V R EG C 6+ C 6+ C 6+ C 6C 6C 6C 5+ C 5+ C 5+ C 5C 5C 5C 4+ C 4+ C 4+ C 4C 4C 4C 3+ C 3+ C 3+ C 3C 3C 3C 2+ C 2+ C 2+ C 2C 2C 2C 1+ C 1+ C 1+ C 1C 1C 1V LO UT V LO UT V LO UT V LO UT V LO UT VLP S VLP S VLP S VLP S VLP S V 1RE F V LRE F H D 66 753 (T op vie w ) Y X S E G2/1 67 S E G1/1 68 C OM 132 /1 C OM 131 /2 C OM 114 /19 C OM 113 /20 C OM 64/69 C OM 63/70 C OM 31/102 C OM 30/103 V1O U T V2O U T V3O U T V4O U T V5O U T Dum my9 N o. 10 1 C OM 18/115 C OM 17/116 D umm y1 0 Dum my1 1 D umm y1 2 Dum my1 3 VTEST GN D DU M5 VSW1 VSW2 Dumm y1 4 D ummy1 5 Dumm y1 6 D ummy1 7 Dum my1 8 D ummy1 9 (3-a ) Coord inates (X , Y ) = i-754 8, 406 j D umm y2 0 No . 1 16 Rev. 1.0, Jan. 2003, page 9 of 102 HD66753 HD66753 Pad Coordinates No. Pad Name X Y No. Pad Name 1 Dummy8 -7788 2 GNDDUM3 3 X Y -848 38 Vcc 1233 -848 -7610 -848 39 Vcc 1333 -848 DB15 -7395 -848 40 Vcc 1433 -848 4 DB14 -7071 -848 41 Vci 1576 -848 5 DB13 -6747 -848 42 Vci 1676 -848 6 DB12 -6423 -848 43 Vci 1776 -848 7 DB11 -6099 -848 44 Vci 1876 -848 8 DB10 -5775 -848 45 Vci 1976 -848 9 DB9 -5451 -848 46 Vci 2076 -848 10 DB8 -5126 -848 47 VREG 2176 -848 11 DB7 -4802 -848 48 C6+ 2319 -848 12 DB6 -4478 -848 49 C6+ 2419 -848 13 DB5 -4154 -848 50 C6+ 2519 -848 14 DB4 -3830 -848 51 C6- 2619 -848 15 DB3 -3506 -848 52 C6- 2719 -848 16 DB2 -3181 -848 53 C6- 2819 -848 17 DB1 -2857 -848 54 C5+ 2920 -848 18 DB0 -2533 -848 55 C5+ 3020 -848 19 GNDDUM4 -2319 -848 56 C5+ 3120 -848 20 RESET* -2105 -848 57 C5- 3220 -848 21 CS* -1781 -848 58 C5- 3320 -848 22 RS -1456 -848 59 C5- 3420 -848 23 E/WR*/SCL -1132 -848 60 C4+ 3520 -848 24 RW/RD*/SDA -808 -848 61 C4+ 3620 -848 25 GND -594 -848 62 C4+ 3720 -848 26 GND -494 -848 63 C4- 3820 -848 27 GND -394 -848 64 C4- 3921 -848 28 GND -294 -848 65 C4- 4021 -848 29 GND -193 -848 66 C3+ 4121 -848 30 GND -93 -848 67 C3+ 4221 -848 31 GND 7 -848 68 C3+ 4321 -848 32 GND 107 -848 69 C3- 4421 -848 33 OSC2 358 -848 70 C3- 4521 -848 34 OSC1 682 -848 71 C3- 4621 -848 35 Vcc 932 -848 72 C2+ 4721 -848 36 Vcc 1032 -848 73 C2+ 4821 -848 37 Vcc 1132 -848 74 C2+ 4922 -848 Rev. 1.0, Jan. 2003, page 10 of 102 HD66753 HD66753 Pad Coordinates (cont) No. Pad Name X Y No. Pad Name X Y 75 C2- 5022 -848 112 Dummy16 7788 366 76 C2- 5122 -848 113 Dummy17 7788 466 77 C2- 5222 -848 114 Dummy18 7788 566 78 C1+ 5322 -848 115 Dummy19 7788 666 79 C1+ 5422 -848 116 Dummy20 7788 880 80 C1+ 5522 -848 117 COM17/116 7628 880 81 C1- 5622 -848 118 COM18/115 7568 880 82 C1- 5722 -848 119 COM19/114 7508 880 83 C1- 5823 -848 120 COM20/113 7448 880 84 VLOUT 5965 -848 121 COM21/112 7388 880 85 VLOUT 6065 -848 122 COM22/111 7328 880 86 VLOUT 6166 -848 123 COM23/110 7268 880 87 VLOUT 6266 -848 124 COM24/109 7207 880 88 VLOUT 6366 -848 125 COM25/108 7147 880 89 VLPS 6466 -848 126 COM26/107 7087 880 90 VLPS 6566 -848 127 COM27/106 7027 880 91 VLPS 6666 -848 128 COM28/105 6967 880 92 VLPS 6766 -848 129 COM29/104 6907 880 93 VLPS 6866 -848 130 COM30/103 6847 880 94 V1REF 7009 -848 131 COM31/102 6792 880 95 VLREF 7109 -848 132 COM32/101 6742 880 96 V1OUT 7209 -848 133 COM33/100 6691 880 97 V2OUT 7309 -848 134 COM34/99 6641 880 98 V3OUT 7409 -848 135 COM35/98 6591 880 99 V4OUT 7510 -848 136 COM36/97 6541 880 100 V5OUT 7610 -848 137 COM37/96 6491 880 101 Dummy9 7788 -848 138 COM38/95 6441 880 102 Dummy10 7788 -635 139 COM39/94 6391 880 103 Dummy11 7788 -535 140 COM40/93 6341 880 104 Dummy12 7788 -435 141 COM41/92 6290 880 105 Dummy13 7788 -335 142 COM42/91 6240 880 106 VTEST 7788 -235 143 COM43/90 6190 880 107 GNDDUM5 7788 -135 144 COM44/89 6140 880 108 VSW1 7788 -34 145 COM45/88 6090 880 109 VSW2 7788 66 146 COM46/87 6040 880 110 Dummy14 7788 166 147 COM47/86 5990 880 111 Dummy15 7788 266 148 COM48/85 5940 880 Rev. 1.0, Jan. 2003, page 11 of 102 HD66753 HD66753 Pad Coordinates (cont) No. Pad Name X Y No. Pad Name X Y 149 COM49/84 5889 880 186 SEG2/167 4035 880 150 COM50/83 5839 880 187 SEG3/166 3985 880 151 COM51/82 5789 880 188 SEG4/165 3935 880 152 COM52/81 5739 880 189 SEG5/164 3885 880 153 COM53/80 5689 880 190 SEG6/163 3834 880 154 COM54/79 5639 880 191 SEG7/162 3784 880 155 COM55/78 5589 880 192 SEG8/161 3734 880 156 COM56/77 5539 880 193 SEG9/160 3684 880 157 COM57/76 5488 880 194 SEG10/159 3634 880 158 COM58/75 5438 880 195 SEG11/158 3584 880 159 COM59/74 5388 880 196 SEG12/157 3534 880 160 COM60/73 5338 880 197 SEG13/156 3484 880 161 COM61/72 5288 880 198 SEG14/155 3433 880 162 COM62/71 5238 880 199 SEG15/154 3383 880 163 COM63/70 5188 880 200 SEG16/153 3333 880 164 COM64/69 5138 880 201 SEG17/152 3283 880 165 COM113/20 5087 880 202 SEG18/151 3233 880 166 COM114/19 5037 880 203 SEG19/150 3183 880 167 COM115/18 4987 880 204 SEG20/149 3133 880 168 COM116/17 4937 880 205 SEG21/148 3083 880 169 COM117/16 4887 880 206 SEG22/147 3032 880 170 COM118/15 4837 880 207 SEG23/146 2982 880 171 COM119/14 4787 880 208 SEG24/145 2932 880 172 COM120/13 4737 880 209 SEG25/144 2882 880 173 COM121/12 4686 880 210 SEG26/143 2832 880 174 COM122/11 4636 880 211 SEG27/142 2782 880 175 COM123/10 4586 880 212 SEG28/141 2732 880 176 COM124/9 4536 880 213 SEG29/140 2682 880 177 COM125/8 4486 880 214 SEG30/139 2631 880 178 COM126/7 4436 880 215 SEG31/138 2581 880 179 COM127/6 4386 880 216 SEG32/137 2531 880 180 COM128/5 4336 880 217 SEG33/136 2481 880 181 COM129/4 4285 880 218 SEG34/135 2431 880 182 COM130/3 4235 880 219 SEG35/134 2381 880 183 COM131/2 4185 880 220 SEG36/133 2331 880 184 COM132/1 4135 880 221 SEG37/132 2281 880 185 SEG1/168 4085 880 222 SEG38/131 2230 880 Rev. 1.0, Jan. 2003, page 12 of 102 HD66753 HD66753 Pad Coordinates (cont) No. Pad Name X Y No. Pad Name X Y 223 SEG39/130 2180 880 260 SEG76/93 326 880 224 SEG40/129 2130 880 261 SEG77/92 276 880 225 SEG41/128 2080 880 262 SEG78/91 226 880 226 SEG42/127 2030 880 263 SEG79/90 175 880 227 SEG43/126 1980 880 264 SEG80/89 125 880 228 SEG44/125 1930 880 265 SEG81/88 75 880 229 SEG45/124 1880 880 266 SEG82/87 25 880 230 SEG46/123 1829 880 267 SEG83/86 -25 880 231 SEG47/122 1779 880 268 SEG84/85 -75 880 232 SEG48/121 1729 880 269 SEG85/84 -125 880 233 SEG49/120 1679 880 270 SEG86/83 -175 880 234 SEG50/119 1629 880 271 SEG87/82 -226 880 235 SEG51/118 1579 880 272 SEG88/81 -276 880 236 SEG52/117 1529 880 273 SEG89/80 -326 880 237 SEG53/116 1479 880 274 SEG90/79 -376 880 238 SEG54/115 1428 880 275 SEG91/78 -426 880 239 SEG55/114 1378 880 276 SEG92/77 -476 880 240 SEG56/113 1328 880 277 SEG93/76 -526 880 241 SEG57/112 1278 880 278 SEG94/75 -576 880 242 SEG58/111 1228 880 279 SEG95/74 -627 880 243 SEG59/110 1178 880 280 SEG96/73 -677 880 244 SEG60/109 1128 880 281 SEG97/72 -727 880 245 SEG61/108 1078 880 282 SEG98/71 -777 880 246 SEG62/107 1028 880 283 SEG99/70 -827 880 247 SEG63/106 977 880 284 SEG100/69 -877 880 248 SEG64/105 927 880 285 SEG101/68 -927 880 249 SEG65/104 877 880 286 SEG102/67 -977 880 250 SEG66/103 827 880 287 SEG103/66 -1028 880 251 SEG67/102 777 880 288 SEG104/65 -1078 880 252 SEG68/101 727 880 289 SEG105/64 -1128 880 253 SEG69/100 677 880 290 SEG106/63 -1178 880 254 SEG70/99 627 880 291 SEG107/62 -1228 880 255 SEG71/98 576 880 292 SEG108/61 -1278 880 256 SEG72/97 526 880 293 SEG109/60 -1328 880 257 SEG73/96 476 880 294 SEG110/59 -1378 880 258 SEG74/95 426 880 295 SEG111/58 -1428 880 259 SEG75/94 376 880 296 SEG112/57 -1479 880 Rev. 1.0, Jan. 2003, page 13 of 102 HD66753 HD66753 Pad Coordinates (cont) No. Pad Name X Y No. Pad Name X Y 297 SEG113/56 -1529 880 334 SEG150/19 -3383 880 298 SEG114/55 -1579 880 335 SEG151/18 -3433 880 299 SEG115/54 -1629 880 336 SEG152/17 -3484 880 300 SEG116/53 -1679 880 337 SEG153/16 -3534 880 301 SEG117/52 -1729 880 338 SEG154/15 -3584 880 302 SEG118/51 -1779 880 339 SEG155/14 -3634 880 303 SEG119/50 -1829 880 340 SEG156/13 -3684 880 304 SEG120/49 -1880 880 341 SEG157/12 -3734 880 305 SEG121/48 -1930 880 342 SEG158/11 -3784 880 306 SEG122/47 -1980 880 343 SEG159/10 -3834 880 307 SEG123/46 -2030 880 344 SEG160/9 -3885 880 308 SEG124/45 -2080 880 345 SEG161/8 -3935 880 309 SEG125/44 -2130 880 346 SEG162/7 -3985 880 310 SEG126/43 -2180 880 347 SEG163/6 -4035 880 311 SEG127/42 -2230 880 348 SEG164/5 -4085 880 312 SEG128/41 -2281 880 349 SEG165/4 -4135 880 313 SEG129/40 -2331 880 350 SEG166/3 -4185 880 314 SEG130/39 -2381 880 351 SEG167/2 -4235 880 315 SEG131/38 -2431 880 352 SEG168/1 -4285 880 316 SEG132/37 -2481 880 353 COM112/21 -4336 880 317 SEG133/36 -2531 880 354 COM111/22 -4386 880 318 SEG134/35 -2581 880 355 COM110/23 -4436 880 319 SEG135/34 -2631 880 356 COM109/24 -4486 880 320 SEG136/33 -2682 880 357 COM108/25 -4536 880 321 SEG137/32 -2732 880 358 COM107/26 -4586 880 322 SEG138/31 -2782 880 359 COM106/27 -4636 880 323 SEG139/30 -2832 880 360 COM105/28 -4686 880 324 SEG140/29 -2882 880 361 COM104/29 -4737 880 325 SEG141/28 -2932 880 362 COM103/30 -4787 880 326 SEG142/27 -2982 880 363 COM102/31 -4837 880 327 SEG143/26 -3032 880 364 COM101/32 -4887 880 328 SEG144/25 -3083 880 365 COM100/33 -4937 880 329 SEG145/24 -3133 880 366 COM99/34 -4987 880 330 SEG146/23 -3183 880 367 COM98/35 -5037 880 331 SEG147/22 -3233 880 368 COM97/36 -5087 880 332 SEG148/21 -3283 880 369 COM96/37 -5138 880 333 SEG149/20 -3333 880 370 COM95/38 -5188 880 Rev. 1.0, Jan. 2003, page 14 of 102 HD66753 HD66753 Pad Coordinates (cont) No. Pad Name X Y No. Pad Name X Y 371 COM94/39 -5238 880 402 COM15/118 -6792 880 372 COM93/40 -5288 880 403 COM14/119 -6847 880 373 COM92/41 -5338 880 404 COM13/120 -6907 880 374 COM91/42 -5388 880 405 COM12/121 -6967 880 375 COM90/43 -5438 880 406 COM11/122 -7027 880 376 COM89/44 -5488 880 407 COM10/123 -7087 880 377 COM88/45 -5539 880 408 COM9/124 -7147 880 378 COM87/46 -5589 880 409 COM8/125 -7207 880 379 COM86/47 -5639 880 410 COM7/126 -7268 880 380 COM85/48 -5689 880 411 COM6/127 -7328 880 381 COM84/49 -5739 880 412 COM5/128 -7388 880 382 COM83/50 -5789 880 413 COM4/129 -7448 880 383 COM82/51 -5839 880 414 COM3/130 -7508 880 384 COM81/52 -5889 880 415 COM2/131 -7568 880 385 COM80/53 -5940 880 416 COM1/132 -7628 880 386 COM79/54 -5990 880 417 Dummy1 -7788 880 387 COM78/55 -6040 880 418 Dummy2 -7788 666 388 COM77/56 -6090 880 419 Dummy3 -7788 566 389 COM76/57 -6140 880 420 Dummy4 -7788 466 390 COM75/58 -6190 880 421 Dummy5 -7788 366 391 COM74/59 -6240 880 422 Dummy6 -7788 266 392 COM73/60 -6290 880 423 Dummy7 -7788 166 393 COM72/61 -6341 880 424 IM2 -7788 66 394 COM71/62 -6391 880 425 GNDDUM1 -7788 -34 395 COM70/63 -6441 880 426 IM1 -7788 -135 396 COM69/64 -6491 880 427 IM0ID -7788 -235 397 COM68/65 -6541 880 428 VccDUM1 -7788 -335 398 COM67/66 -6591 880 429 OPOFF -7788 -435 399 COM66/67 -6641 880 430 TEST -7788 -535 400 COM65/68 -6691 880 431 GNDDUM2 -7788 -635 401 COM16/117 -6742 880 Rev. 1.0, Jan. 2003, page 15 of 102 HD66753 Alignment Mark Cross X Y -7642 613 7642 613 Circle (positive) -7668 406 Circle (negative) 7668 406 L type (positive) -7548 406 L type (negative) 7548 406 Rev. 1.0, Jan. 2003, page 16 of 102 HD66753 TCP External Dimensions (HD66753TB0L/R) Bending slit 3.8 mm HD66753 0.14P x (66-1) = 9.10 mm COM15/118 COM16/117 COM65/68 COM66/67 COM 64 0.14-mm pitch COM111/22 COM112/21 0.65-mm pitch 0.14 mm SEG168/1 SEG167/2 35.74 mm 0.10-mm pitch LCD drive 0.10P x (168-1)= 16.7 mm SEG2/167 SEG1/168 0.14 mm COM132/1 COM131/2 0.14-mm pitch HITACHI NC IM2 IM1 IM0/ID OPOFF TEST DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 RESET* CS* RS E/WR*/SCL RW/RD*/SDA GND OSC2 OSC1 Vcc Vci I/O, Power supply VREG C6+ C6C5+ C5C4+ 0.65P x (50-1) C4=31.85 mm C3+ C3C2+ C2C1+ C1VLOUT VLPS V1REF VLREF V1OUT V2OUT V3OUT V4OUT V5OUT VTEST VSW1 VSW2 NC Dummy Dummy COM1/132 COM2/131 COM114/19 COM113/20 COM64/69 COM63/70 COM 68 0.14P x (70-1) = 9.66 mm COM18/111 COM17/112 Dummy Dummy Rev. 1.0, Jan. 2003, page 17 of 102 HD66753 Pin Functions Table 2 Signals IM2, IM1, IM0/ID Pin Functional Description Number of Pins I/O Connected to Functions 3 GND or VCC Selects the MPU interface mode: I IM2 GND GND GND GND Vcc Vcc IM1 GND GND Vcc Vcc GND Vcc IM0 GND Vcc GND Vcc ID ID MPU interface mode 68-system 16-bit bus interface 68-system 8-bit bus interface 80-system 16-bit bus interface 80-system 8-bit bus interface Clock-synchronized serial interface I2C bus interface When a serial interface is selected, the IM0 pin is used for setting the device code ID. CS* 1 I MPU Selects the HD66753: Low: HD66753 is selected and can be accessed High: HD66753 is not selected and cannot be accessed Must be fixed at GND level when not in use. RS 1 I MPU Selects the register. Low: Index/status High: Control Must be fixed at Vcc or GND level for a clocksynchronized interface. E/WR*/SCL 1 I MPU For a 68-system bus interface, serves as an enable signal to activate data read/write operation. For an 80-system bus interface, serves as a write strobe signal and writes data at the low level. For a clock-synchronized interface, serves as a synchronized clock signal. RW/RD*/ SDA 1 I/O MPU For a 68-system bus interface, serves as a signal to select data read/write operation. Low: Write High: Read For an 80-system bus interface, serves as a read strobe signal and reads data at the low level. For a clock-synchronized interface, serves as a bidirectional serial transfer data to receive and send the data. DB0–DB15 16 I/O MPU Serves as a 16-bit bidirectional data bus. For an 8-bit bus interface, data transfer uses DB15DB8; fix unused DB7-DB0 to the Vcc or GND level. For a clock-synchronized interface, fix DB15-DB0 to the Vcc or GND level. Rev. 1.0, Jan. 2003, page 18 of 102 HD66753 Table 2 Pin Functional Description (cont) Signals Number of Pins I/O Connected to Functions COM1/132 132 – COM132/1 O LCD Output signals for common drive: All the unused pins output unselected waveforms. In the display-off period (D = 0), sleep mode (SLP = 1), or standby mode (STB = 1), all pins output GND level. The CMS bit can change the shift direction of the common signal. For example, if CMS = 0, COM1/132 is COM1, and COM132/1 is COM132. If CMS = 1, COM1/132 is COM132, and COM132/1 is COM1. SEG1/168– 168 SEG168/1 O LCD Output signals for segment drive. In the display-off period (D = 0), sleep mode (SLP = 1), or standby mode (STB = 1), all pins output GND level. The SGS bit can change the shift direction of the segment signal. For example, if SGS = 0, SEG1/168 is SEG1. If SGS = 1, SEG1/168 is SEG168. V1OUT– V5OUT 5 O Stabilization capacitance Built-in op-amp output. This should be stabilized by connecting a capacitor. VLPS 1 — Power supply Power supply for LCD drive. VLPS = 19.5 V max. Power supply VCC: +1.7 V to + 3.6 V; GND (logic): 0 V VCC, GND 2 — OSC1, OSC2 2 I or O OscillationFor R-C oscillation using an external resistor, resistor or clock connect an external resistor. For external clock supply, input clock pulses to OSC1. Vci 1 I Power supply VLOUT 1 O VLPS pin/step-up Potential difference between Vci and GND is two- to capacitance seven-times-stepped up and then output. Magnitude of step-up is selected by instruction. C1+, C1– 2 — Step-up capacitance External capacitance should be connected here when using the five-times or more step-up. C2+, C2– 2 — Step-up capacitance External capacitance should be connected here for step-up. C3+, C3– 2 — Step-up capacitance External capacitance should be connected here for step-up. C4+, C4– 2 — Step-up capacitance External capacitance should be connected here when using the five-times or more step-up. C5+, C5– 2 — Step-up capacitance External capacitance should be connected here for step-up. C6+, C6– 2 — Step-up capacitance External capacitance should be connected here for step-up. Inputs a reference voltage and supplies power to the step-up circuit; generates the liquid crystal display drive voltage from the operating voltage. The stepup output voltage must not be larger than the absolute maximum ratings. Must be left disconnected when the step-up circuit is not used. Rev. 1.0, Jan. 2003, page 19 of 102 HD66753 Table 2 Pin Functional Description (cont) Signals Number of Pins I/O RESET* 1 OPOFF 1 Connected to Functions I MPU or external R-C circuit Reset pin. Initializes the LSI when low. Must be reset after power-on. I GND Test pin. Must be fixed at GND level. VSW1 1 I GND Test pin. Must be fixed at GND level. VSW2 1 — — Test pin. Must be left disconnected. VREG 1 I Input pin Input pin for the reference voltage of the LCD-drivevoltage regulator circuit. Connect Vci or external power supply. V1REF 1 O Stabilization capacitance or open Output pin for the LCD-drive-voltage regulator circuit. Must be left disconnected when not in use. VLREF 1 I Input pin Connected to the top electrode of the internal bleeder-resistor. Use this pin to supply the LCD voltage externally. VccDUM 1 O Input pins Outputs the internal VCC level; shorting this pin sets the adjacent input pin to the VCC level. GNDDUM 5 O Input pins Outputs the internal GND level; shorting this pin sets the adjacent input pin to the GND level. Dummy 4 — — Dummy pad. Must be left disconnected. TEST 1 I GND Test pin. Must be fixed at GND level. VTEST 1 — — Test pin. Must be left disconnected. Rev. 1.0, Jan. 2003, page 20 of 102 HD66753 Block Function Description System Interface The HD66753 has five high-speed system interfaces: an 80-system 16-bit/8-bit bus, a 68-system 16-bit/8bit bus, and a clock-synchronized serial interface. The interface mode is selected by the IM2-0 pins. The HD66753 has three 16-bit registers: an index register (IR), a write data register (WDR), and a read data register (RDR). The IR stores index information from the control registers and the CGRAM. The WDR temporarily stores data to be written into control registers and the CGRAM, and the RDR temporarily stores data read from the CGRAM. Data written into the CGRAM from the MPU is first written into the WDR and then is automatically written into the CGRAM by internal operation. Data is read through the RDR when reading from the CGRAM, and the first read data is invalid and the second and the following data are normal (for the serial interface, the 5-byte data is invalid). When a logic operation is performed inside of the HD66753 by using the display data set in the CGRAM and the data written from the MPU, the data read through the RDR is used. Accordingly, the MPU does not need to read data twice nor to fetch the read data into the MPU. This enables high-speed processing. Execution time for instruction excluding oscillation start is 0 clock cycle and instructions can be written in succession. Table 3 Register Selection R/W Bits RS Bits Operations 0 0 Writes indexes into IR 1 0 Status read 0 1 Writes into control registers and CGRAM through WDR 1 1 Reads from CGRAM through RDR Bit Operation The HD66753 supports the following functions: a bit rotation function that writes the data written from the MPU into the CGRAM by moving the display position in bit units, a write data mask function that selects and writes data into the CGRAM in bit units, and a logic operation function that performs logic operations on the display data set in the CGRAM and writes into the CGRAM. With the 16-bit bus interface, these functions can greatly reduce the processing loads of the MPU graphics software and can rewrite the display data in the CGRAM at high speed. For details, see the Graphics Operation Function section. Address Counter (AC) The address counter (AC) assigns addresses to the CGRAM. When an address set instruction is written into the IR, the address information is sent from the IR to the AC. After writing into the CGRAM, the AC is automatically incremented by 1 (or decremented by 1). After reading from the data, the RDM bit automatically updates or does not update the AC. Rev. 1.0, Jan. 2003, page 21 of 102 HD66753 Graphic RAM (CGRAM) The graphic RAM (CGRAM) stores bit-pattern data of 168 x 132 dots. It has two bits/pixel and 5,544-byte capacity. Grayscale Control Circuit The grayscale control circuit performs four-grayscale control with the frame rate control (FRC) method for four-monochrome grayscale display. For details, see the Four Grayscale Display Function section. Timing Generator The timing generator generates timing signals for the operation of internal circuits such as the CGRAM. The RAM read timing for display and internal operation timing by MPU access are generated separately to avoid interference with one another. Oscillation Circuit (OSC) The HD66753 can provide R-C oscillation simply through the addition of an external oscillation-resistor between the OSC1 and OSC2 pins. The appropriate oscillation frequency for operating voltage, display size, and frame frequency can be obtained by adjusting the external-resistor value. Clock pulses can also be supplied externally. Since R-C oscillation stops during the standby mode, current consumption can be reduced. For details, see the Oscillation Circuit section. Liquid Crystal Display Driver Circuit The liquid crystal display driver circuit consists of 132 common signal drivers (COM1 to COM132) and 168 segment signal drivers (SEG1 to SEG168). When the number of lines are selected by a program, the required common signal drivers automatically output drive waveforms, while the other common signal drivers continue to output unselected waveforms. Display pattern data is latched when 168-bit data has arrived. The latched data then enables the segment signal drivers to generate drive waveform outputs. The shift direction of 168-bit data can be changed by the SGS bit. The shift direction for the common driver can also be changed by the CMS bit by selecting an appropriate direction for the device mounting configuration. When multiplexing drive is not used, or during the standby or sleep mode, all the above common and segment signal drivers output the GND level, halting the display. Step-up Circuit (DC-DC Converter) The step-up generates three-, five-, six-, or seven-times voltage input to the Vci pin. With this, both the internal logic units and LCD drivers can be controlled with a single power supply. Step-up output level from three-times to seven-times step-up can be selected by software. For details, see the Liquid Crystal Display Voltage Generator section. Rev. 1.0, Jan. 2003, page 22 of 102 HD66753 V-Pin Voltage Follower A voltage follower for each voltage level (V1 to V5) reduces current consumption by the LCD drive power supply circuit. No external resistors are required because of the internal bleeder-resistor, which generates different levels of LCD drive voltage. This internal bleeder-resistor can be software-specified from 1/4 bias to 1/11 bias, according to the liquid crystal display drive duty value. The voltage followers can be turned off while multiplexing drive is not being used. For details, see the Power Supply for Liquid Crystal Display Drive section. Contrast Adjuster The contrast adjuster can be used to adjust LCD contrast in 128 steps by varying the LCD drive voltage by software. This can be used to select an appropriate LCD brightness or to compensate for temperature. LCD-Drive Power-Supply Regulator Circuit The LCD-drive power-supply regulator circuit generates an LCD-drive voltage from the reference voltage that does not depend on the LCD load current. Change of the LCD-drive voltage is controlled for the LCD load current. For details, see the Liquid Crystal Display Voltage Generator section. Rev. 1.0, Jan. 2003, page 23 of 102 HD66753 CGRAM Address Map Table 4 Relationships between the CGRAM Address and the Display Screen Position Table 5 Relationships between the CGRAM Data and the Display Contents Upper Bit Lower Bit LCD 0 0 Non-selection display (unlit) 0 1 1/4-, 1/3- or 2/4-level grayscale display (selected by the GSL1-0 bits) 1 0 2/4-, 2/3-, or 3/4-level grayscale display (selected by the GSH1-0 bits) 1 1 Selection display (lit) Note: Upper bits: DB15, DB13, DB11, DB9, DB7, DB5, DB3, DB1 Lower bits: DB14, DB12, DB10, DB8, DB6, DB4, DB2, DB0 Rev. 1.0, Jan. 2003, page 24 of 102 HD66753 Instructions Outline The HD66753 uses the 16-bit bus architecture. Before the internal operation of the HD66753 starts, control information is temporarily stored in the registers described below to allow high-speed interfacing with a high-performance microcomputer. The internal operation of the HD66753 is determined by signals sent from the microcomputer. These signals, which include the register selection signal (RS), the read/write signal (R/W), and the data bus signals (DB15 to DB0), make up the HD66753 instructions. There are seven categories of instructions that: • Specify the index • Read the status • Control the display • Control power management • Process the graphics data • Set internal CGRAM addresses • Transfer data to and from the internal CGRAM Normally, instructions that write data are used the most. However, an auto-update of internal CGRAM addresses after each data write can lighten the microcomputer program load. Because instructions are executed in 0 cycles, they can be written in succession. Rev. 1.0, Jan. 2003, page 25 of 102 HD66753 Instruction Descriptions Index (IR) The index instruction specifies the RAM control and control register indexes (R00 to R12). It sets the register number in the range of 00000 to 10010 in binary form. R/W RS 0 0 DB15 DB14 DB13 DB12 DB11 DB10 * * * * * * DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 * * * * * ID4 ID3 ID2 ID1 ID0 Figure 1 Index Instruction Status Read (SR) The status read instruction reads the internal status of the HD66753. L7–0: Indicate the driving raster-row position where the liquid crystal display is being driven. C6–0: Read the contrast setting values (CT6–0). R/W RS 1 0 DB15 DB14 DB13 DB12 DB11 DB10 L7 L6 L5 L4 L3 L2 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 L1 L0 0 C6 C5 C4 C3 C2 C1 C0 Figure 2 Status Read Instruction Start Oscillation (R00) The start oscillation instruction restarts the oscillator from the halt state in the standby mode. After issuing this instruction, wait at least 10 ms for oscillation to stabilize before issuing the next instruction. (See the Standby Mode section.) If this register is read forcibly as R/W = 1, 0753H is read. R/W RS DB15 DB14 DB13 DB12 DB11 DB10 0 1 * * * * * 1 1 0 0 0 0 0 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 * * * * * * * * * * 1 1 1 1 0 1 0 1 0 0 0 0 Figure 3 Start Oscillation Instruction Rev. 1.0, Jan. 2003, page 26 of 102 HD66753 Driver Output Control (R01) CMS: Selects the output shift direction of a common driver. When CMS = 0, COM1/132 shifts to COM1, and COM132/1 to COM132. When CMS = 1, COM1/132 shifts to COM132, and COM132/1 to COM1. SGS: Selects the output shift direction of a segment driver. When SGS = 0, SEG1/168 shifts to SEG1, and SEG168/1 to SEG168. When SGS = 1, SEG1/168 shifts to SEG128, and SEG168/1 to SEG1. NL4-0: Specify the LCD drive duty ratio. The duty ratio can be adjusted for every eight raster-rows. CGRAM address mapping does not depend on the setting value of the drive duty ratio. R/W RS 0 1 DB15 DB14 DB13 DB12 DB11 DB10 * * * * * * DB9 DB8 CMS SGS DB7 DB6 DB5 * * * DB4 DB3 DB2 DB1 DB0 NL4 NL3 NL2 NL1 NL0 Figure 4 Driver Output Control Instruction Table 6 NL Bits and Drive Duty NL4 NL3 NL2 NL1 NL0 Display Size LCD Drive Duty Common Driver Used 0 0 0 0 0 168 x 8 dots 1/8 Duty COM1–COM8 0 0 0 0 1 168 x 16 dots 1/16 Duty COM1–COM16 0 0 0 1 0 168 x 24 dots 1/24 Duty COM1–COM24 0 0 0 1 1 168 x 32 dots 1/32 Duty COM1–COM32 0 0 1 0 0 168 x 40 dots 1/40 Duty COM1–COM40 0 0 1 0 1 168 x 48 dots 1/48 Duty COM1–COM48 0 0 1 1 0 168 x 56 dots 1/56 Duty COM1–COM56 0 0 1 1 1 168 x 64 dots 1/64 Duty COM1–COM64 0 1 0 0 0 168 x 72 dots 1/72 Duty COM1–COM72 0 1 0 0 1 168 x 80 dots 1/80 Duty COM1–COM80 0 1 0 1 0 168 x 88 dots 1/88 Duty COM1–COM88 0 1 0 1 1 168 x 96 dots 1/96 Duty COM1–COM96 0 1 1 0 0 168 x 104 dots 1/104 Duty COM1–COM104 0 1 1 0 1 168 x 112 dots 1/112 Duty COM1–COM112 0 1 1 1 0 168 x 120 dots 1/120 Duty COM1–COM120 0 1 1 1 1 168 x 128 dots 1/128 Duty COM1–COM128 1 0 0 0 0 168 x 132 dots 1/132 Duty COM1–COM132 Rev. 1.0, Jan. 2003, page 27 of 102 HD66753 LCD-Driving-Waveform Control (R02) B/C: When B/C = 0, a B-pattern waveform is generated and alternates in every frame for LCD drive. When B/C = 1, a C-pattern waveform is generated and alternates in each raster-row specified by bits EOR and NW4–NW0 in the LCD-driving-waveform control register. For details, see the n-raster-row Reversed AC Drive section. EOR: When the C-pattern waveform is set (B/C = 1) and EOR = 1, the odd/even frame-select signals and the n-raster-row reversed signals are EORed for alternating drive. EOR is used when the LCD is not alternated by combining the set values of the LCD drive duty ratio and the n raster-row. For details, see the n-raster-row Reversed AC Drive section. NW4–0: Specify the number of raster-rows n that will alternate at the C-pattern waveform setting (B/C = 1). NW4–NW0 alternate for every set value + 1 raster-row, and the first to the 32nd raster-rows can be selected. R/W RS 0 1 DB15 DB14 DB13 DB12 DB11 DB10 * * * * * * DB9 DB8 DB7 * * * DB6 DB5 DB4 DB3 DB2 DB1 DB0 B/C EOR NW4 NW3 NW2 NW1 NW0 Figure 5 LCD-Driving-Waveform Control Instruction Power Control (R03) BS2–0: The LCD drive bias value is set within the range of a 1/4 to 1/11 bias. The LCD drive bias value can be selected according to its drive duty ratio and voltage. For details, see the Liquid Crystal Display Drive Bias Selector section. BT1-0: The output factor of VLOUT between two-times, three-times, four-times, five-times, six-times, and seven-times step-up is switched. The LCD drive voltage level can be selected according to its drive duty ratio and bias. Lower amplification of the step-up circuit consumes less current. PS1-0: Using the internal or external power supply is selected as the reference voltage for the LCD drive voltage generator. DC1-0: The operating frequency in the step-up circuit is selected. When the step-up operating frequency is high, the driving ability of the step-up circuit and the display quality become high, but the current consumption is increased. Adjust the frequency considering the display quality and the current consumption. AP1-0: The amount of fixed current from the fixed current source in the operational amplifier for V pins (V1 to V5) is adjusted. When the amount of fixed current is large, the LCD driving ability and the display quality become high, but the current consumption is increased. Adjust the fixed current considering the display quality and the current consumption. During no display, when AP1–0 = 00, the current consumption can be reduced by ending the operational amplifier and step-up circuit operation. Rev. 1.0, Jan. 2003, page 28 of 102 HD66753 Table 7 BS Bits and LCD Drive Bias Value BS2 BS1 BS0 LCD Drive Bias Value 0 0 0 1/11 bias drive 0 0 1 1/10 bias drive 0 1 0 1/9 bias drive 0 1 1 1/8 bias drive 1 0 0 1/7 bias drive 1 0 1 1/6 bias drive 1 1 0 1/5 bias drive 1 1 1 1/4 bias drive Table 8 BT Bits and Output Level BT1 BT0 VLOUT Output Level 0 0 Three-times step-up 0 1 Five-times step-up 1 0 Six-times step-up 1 1 Seven-times step-up Table 9 DC Bits and Operating Clock Frequency DC1 DC0 Operating Clock Frequency in the Step-up Circuit 0 0 32-divided clock 0 1 16-divided clock 1 0 8-divided clock 1 1 Setting inhibited Table 10 AP Bits and Amount of Fixed Current AP1 AP0 Amount of Fixed Current in the Operational Amplifier 0 0 Operational amplifier and booster do not operate. 0 1 Small 1 0 Middle 1 1 Large Rev. 1.0, Jan. 2003, page 29 of 102 HD66753 Table 11 PS Bits and Reference Power Supply Switching the Reference Power Supply for the LCD Voltage Generator VLREF Regulator V1REF-VLREF Switch Input (internal short between V1REF and VLREF) Used On Output from regulator Input Used Off Open Input (from external power supply) Halt Off PS1 PS0 VREG Pin V1REF Pin VLREF Pin 0 0 Input Output from regulator 0 1 Input 1 0 Open 1 1 Setting inhibited SLP: When SLP = 1, the HD66753 enters the sleep mode, where the internal display operations are halted except for the R-C oscillator, thus reducing current consumption. For details, see the Sleep Mode section. Only the following instructions can be executed during the sleep mode. Power control (BS2–0, BT1–0, DC1–0, AP1–0, SLP, and STB bits) During the sleep mode, the other CGRAM data and instructions cannot be updated although they are retained. STB: When STB = 1, the HD66753 enters the standby mode, where display operation completely stops, halting all the internal operations including the internal R-C oscillator. Further, no external clock pulses are supplied. For details, see the Standby Mode section. Only the following instructions can be executed during the standby mode. a. Standby mode cancel (STB = 0) b. Start oscillation c. Power control (BS2–0, BT1–0, DC1–0, AP1–0, SLP, and STB bits) During the standby mode, the CGRAM data and instructions may be lost. To prevent this, they must be set again after the standby mode is canceled. R/W RS 0 1 DB15 DB14 DB13 DB12 DB11 DB10 * * * DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 BS2 BS1 BS0 BT1 BT0 PS1 PS0 DC1 DC0 AP1 AP0 SLP STB Figure 6 Power Control Instruction Rev. 1.0, Jan. 2003, page 30 of 102 HD66753 Contrast Control (R04) CT6–0: These bits control the LCD drive voltage (potential difference between V1 and GND) to adjust 128-step contrast. For details, see the Contrast Adjuster section. R/W RS 0 1 DB15 DB14 DB13 DB12 DB11 DB10 * * * * * DB9 DB8 VR2 VR1 VR0 DB7 * DB6 DB5 DB4 DB3 DB2 DB1 DB0 CT6 CT5 CT4 CT3 CT2 CT1 CT0 Figure 7 Contrast Control Instruction HD66753 V LREF VR R R + - V1 + - V2 + - V3 + - V4 + - V5 R0 R R GND GND Figure 8 Contrast Adjuster Table 12 CT Bits and Variable Resistor Value of Contrast Adjuster CT Set Value CT6 CT5 CT4 CT3 CT2 CT1 CT0 Variable Resistor (VR) 0 0 0 0 0 0 0 6.40 x R 0 0 0 0 0 0 1 6.35 x R 0 0 0 0 0 1 0 6.30 x R 0 0 0 0 0 1 1 6.25 x R 0 0 0 0 1 0 0 6.20 x R • • • • 1 1 1 1 1 0 0 1.20 x R 1 1 1 1 1 0 1 0.15 x R 1 1 1 1 1 1 0 0.10 x R 1 1 1 1 1 1 1 0.05 x R Rev. 1.0, Jan. 2003, page 31 of 102 HD66753 VR2–0: These bits adjust the output voltage (V1REF) for the LCD-drive reference voltage generator within the 2.8- to 6.5-times ranges of Vreg (Vci or VREG pin input voltage). Table 13 VR Bits and V1REF Voltages VR2 VR1 VR0 V1REF Voltage Setting 0 0 0 Vreg x 2.8 0 0 1 Vreg x 3.5 0 1 0 Vreg x 4.0 0 1 1 Vreg x 4.5 1 0 0 Vreg x 5.0 1 0 1 Vreg x 5.5 1 1 0 Vreg x 6.0 1 1 1 Vreg x 6.5 Entry Mode (R05) Rotation (R06) The write data sent from the microcomputer is modified in the HD66753 and written to the CGRAM. The display data in the CGRAM can be quickly rewritten to reduce the load of the microcomputer software processing. For details, see the Graphics Operation Function section. I/D: When I/D = 1, the address counter (AC) is automatically incremented by 1 after the data is written to the CGRAM. When I/D = 0, the AC is automatically decremented by 1 after the data is written to the CGRAM. AM1–0: Set the automatic update method of the AC after the data is written to the CGRAM. When AM1– 0 = 00, the data is continuously written in parallel. When AM1–0 = 01, the data is continuously written vertically. When AM1–0 = 10, the data is continuously written vertically with two-word width (32-bit length). LG1–0: Write again the data read from the CGRAM and the data written from the microcomputer to the CGRAM by a logical operation. When LG1–0 = 00, replace (no logical operation) is done. ORed when LG1–0 = 01, ANDed when LG1–0 = 10, and EORed when LG1–0 = 11. RT2–0: Write the data sent from the microcomputer to the CGRAM by rotating in a bit unit. RT3–0 specify rotation. For example, when RT2–0 = 001, the data is rotated in the upper side by two bits. When RT2–0 = 111, the data is rotated in the upper side by 14 bits. The upper bit overflown in the most significant bit (MSB) side is rotated in the least significant bit (LSB) side. Rev. 1.0, Jan. 2003, page 32 of 102 HD66753 R/W RS DB15 DB14 DB13 DB12 DB11 DB10 DB9 0 1 * * * * * * 0 1 * * * * * * DB8 DB7 DB6 DB5 DB4 DB3 DB1 DB0 * * * * * I/D AM1 AM0 LG1 LG0 * * * * * * * DB2 RT2 RT1 RT0 Figure 9 Entry Mode and Rotation Instructions Write data sent from the microcomputer (DB15-0) DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 0 0 0 1 1 1 0 0 1 1 1 0 0 0 1 1 0 1 1 1 0 0 1 1 1 0 0 0 1 1 0 0 Rotation (RT2-0 = 001) Logical operation Logical operation (LG1-0) Write data mask* (WM15-0) LG1-0 = 00: Replace LG1-0 = 01: ORed LG1-0 = 10: ANDed LG1-0 = 11: EORed Write data mask (WM15-0) CGRAM Note: The write data mask (WM15-0) is set by the register in the RAM Write Data Mask section. Figure 10 Logical Operation and Rotation for the CGRAM Display Control (R07) SPT: When SPT = 01, the 2-division LCD drive is performed. For details, see the Division Screen Drive section. GSH1-0: When GS = 0, the grayscale level at a brightly-colored display (when DB = 10) is selected. For details, see the 4-Grayscale Display Function section. GSL1-0: The grayscale level at a weakly-colored display (when DB = 01) is selected. Rev. 1.0, Jan. 2003, page 33 of 102 HD66753 Table 14 GSH Bits and Output Level GSH1 GSH0 Grayscale Output Level (DB = 10) 0 0 3/4 level grayscale control 0 1 2/3 level grayscale control 1 0 2/4 level grayscale control 1 1 Lit (No grayscale control) Table 15 GSL Bits and Output Level GSL1 GSL0 Grayscale Output Level (DB = 01) 0 0 1/4 level grayscale control 0 1 1/3 level grayscale control 1 0 2/4 level grayscale control 1 1 Lit (No grayscale control) REV: Displays all character and graphics display sections with black-and-white reversal when REV = 1. For details, see the Reversed Display Function section. D: Display is on when D = 1 and off when D = 0. When off, the display data remains in the CGRAM, and can be displayed instantly by setting D = 1. When D is 0, the display is off with the SEG1 to SEG168 outputs and COM1 to COM132 outputs set to the GND level. Because of this, the HD66753 can control the charging current for the LCD with AC driving. R/W 0 RS 1 DB15 * DB14 DB13 DB12 DB11 DB10 * * * * * DB9 * DB8 SPT DB7 * DB6 DB5 DB4 DB3 DB2 DB1 DB0 * GS H1 GS H0 GS L1 GS L0 REV D Figure 11 Display Control Instruction Cursor Control (R08) C: When C = 1, the window cursor display is started. The display mode is selected by the CM1–0 bits, and the display area is specified in a dot unit by the horizontal cursor position register (HS6–0 and HE6–0 bits) and vertical cursor position register (VS6–0 and VE6–0 bits). For details, see the Window Cursor Display section. CM1–0: The display mode of the window cursor is selected. These bits can display a white-blink cursor, black-blink cursor, black-and-white reversed cursor, and black-and-white-reversed blink cursor. Rev. 1.0, Jan. 2003, page 34 of 102 HD66753 R/W RS 0 1 DB15 DB14 DB13 DB12 DB11 DB10 * * * * * * DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 * * * * * * * C DB1 DB0 CM1 CM0 Figure 12 Cursor Control Instruction Table 16 CM Bits and Window Cursor Display Mode CM1 CM0 Window Cursor Display Mode 0 0 White-blink cursor (alternately blinking between the normal display and an all-white display (all unlit)) 0 1 Black-blink cursor (alternately blinking between the normal display and an all-black display (all lit)) 1 0 Black-and-white reversed cursor (black-and-white-reversed normal display (no blinking)) 1 1 Black-and-white-reversed blink cursor (alternately blinking the black-and-whitereversed normal display) Horizontal Cursor Position (R0B) Vertical Cursor Position (R0C) HS7-0: Specify the start position for horizontally displaying the window cursor in a dot unit. The cursor is displayed from the 'set value + 1' dot. Ensure that HS7–0 ≤ HE7–0. HE7-0: Specify the end position for horizontally displaying the window cursor in a dot unit. The cursor is displayed to the 'set value + 1' dot. Ensure that HS7–0 ≤ HE7–0. VS7-0: Specify the start position for vertically displaying the window cursor in a dot unit. The cursor is displayed from the 'set value + 1' dot. Ensure that VS7–0 ≤ VE7–0. VE7-0: Specify the end position for vertically displaying the window cursor in a dot unit. The cursor is displayed to the 'set value + 1' dot. Ensure that VS7–0 ≤ VE7–0. R/W RS DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 0 1 HE7 HE6 HE5 HE4 HE3 HE2 HE1 HE0 HS7 HS6 HS5 HS4 HS3 HS2 HS1 HS0 0 1 VE7 VE6 VE5 VE4 VE3 VE2 VE1 VE0 VS7 VS6 VS5 VS4 VS3 VS2 VS1 VS0 Figure 13 Horizontal Cursor Position and Vertical Cursor Position Instructions Rev. 1.0, Jan. 2003, page 35 of 102 HD66753 HS1+1 HE1+1 VS1+1 Window cursor VE1+1 Figure 14 Window Cursor Position 1st Screen Driving Position (R0D) 2nd Screen Driving Position (R0E) SS17-10: Specify the driving start position for the first screen in a line unit. The LCD driving starts from the 'set value + 1' common driver. SE17-10: Specify the driving end position for the first screen in a line unit. The LCD driving is performed to the 'set value + 1' common driver. For instance, when SS17-10 = 07H and SE17-10 = 10H are set, the LCD driving is performed from COM8 to COM17, and non-selection driving is performed for COM1 to COM7, COM18, and others. Ensure that SS17–10 ≤ SE17–10 ≤ 83H. For details, see the Screen Division Driving Function section. SS27-20: Specify the driving start position for the second screen in a line unit. The LCD driving starts from the 'set value + 1' common driver. The second screen is driven when SPT = 1. SE27-20: Specify the driving end position for the second screen in a line unit. The LCD driving is performed to the 'set value + 1' common driver. For instance, when SPT = 1, SS27-20 = 20H, and SE27-20 = 5FH are set, the LCD driving is performed from COM33 to COM96 and the non-selected driving is performed from COM1 to COM7 and COM18 and followings. Ensure that SS17–10 ≤ SE17–10 < SS27– 20 ≤ SE27–20 ≤ 83H. For details, see the Screen Division Driving Function section. R/W RS DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 0 1 SE17 SE16 SE15 SE14 SE13 SE12 SE11 SE10 SS17 SS16 SS15 SS14 SS13 SS12 SS11 SS10 0 1 SE27 SE26 SE25 SE24 SE23 SE22 SE21 SE20 SS27 SS26 SS25 SS24 SS23 SS22 SS21 SS20 Figure 15 1st Screen Driving Position and 2nd Screen Driving Position Rev. 1.0, Jan. 2003, page 36 of 102 DB1 DB0 HD66753 RAM Write Data Mask (R10) WM15-0: In writing to the CGRAM, these bits mask writing in a bit unit. When WM15 = 1, this bit masks the write data of DB15 and does not write to the CGRAM. Similarly, the WM14–0 bits mask the write data of DB14–0 in a bit unit. However, when AM = 10, the write data is masked with the set values of WM15–0 for the odd-times CGRAM write. It is also masked automatically with the reversed set values of WM15–0 for the even-times CGRAM write. For details, see the Graphics Operation Function section. R/W RS 0 1 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 WM 15 WM 9 WM WM 8 7 WM 6 WM WM 5 4 WM 3 WM WM 2 1 WM 0 WM WM 14 13 WM 12 WM WM 11 10 Figure 16 RAM Write Data Mask Instruction RAM Address Set (R11) AD12-0: Initially set CGRAM addresses to the address counter (AC). Once the CGRAM data is written, the AC is automatically updated according to the AM1–0 and I/D bit settings. This allows consecutive accesses without resetting addresses. Once the CGRAM data is read, the AC is not automatically updated. CGRAM address setting is not allowed in the sleep mode or standby mode. R/W RS 0 1 DB15 DB14 DB13 DB12 DB11 DB10 DB9 * * * AD 12 AD 11 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 AD 10 AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 Figure 17 RAM Address Set Instruction Table 17 AD Bits and CGRAM Settings AD12–AD0 CGRAM Setting "0000"H–"0014"H Bitmap data for COM1 "0020"H–"0034"H Bitmap data for COM2 "0040"H–"0054"H Bitmap data for COM3 "0060"H–"0074"H Bitmap data for COM4 "0080"H–"0094"H Bitmap data for COM5 "00A0"H–"00B4"H Bitmap data for COM6 : : "0FC0"H–"0FD4"H Bitmap data for COM127 "0FE0"H–"0FF4"H Bitmap data for COM128 "1000"H–"1014"H Bitmap data for COM129 "1020"H–"1034"H Bitmap data for COM130 "1040"H–"1054"H Bitmap data for COM131 "1060"H–"1074"H Bitmap data for COM132 Rev. 1.0, Jan. 2003, page 37 of 102 HD66753 Write Data to CGRAM (R12) WD15-0 : Write 16-bit data to the CGRAM. After a write, the address is automatically updated according to the AM1–0 and I/D bit settings. During the sleep and standby modes, the CGRAM cannot be accessed. R/W RS 0 1 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 WD 15 WD 9 WD 8 WD 7 WD 6 WD 5 WD 4 WD 3 WD 2 WD 1 WD 0 WD 14 WD 13 WD 12 WD 11 WD 10 Figure 18 Write Data to CGRAM Instruction Read Data from CGRAM (R12) RD15-0 : Read 16-bit data from the CGRAM. When the data is read to the microcomputer, the first-word read immediately after the CGRAM address setting is latched from the CGRAM to the internal read-data latch. The data on the data bus (DB15–0) becomes invalid and the second-word read is normal. When bit processing, such as a logical operation, is performed within the HD66753, only one read can be processed since the latched data in the first word is used. For the clock-synchronized serial interface, the 5-byte data is invalid. For details, see the Serial Data Transfer section. R/W RS 1 1 DB15 DB14 DB13 DB12 DB11 DB10 DB9 RD 15 RD 14 RD 13 RD 12 RD 11 RD 10 RD 9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 RD 8 RD 7 RD 6 RD 5 RD 4 RD 3 RD 2 RD 1 RD 0 Figure 19 Read Data from CGRAM Instruction Rev. 1.0, Jan. 2003, page 38 of 102 HD66753 First word Second word Sets the I/D and AM1-0 bits Sets the I/D and AM1-0 bits Address: N set Address: N set Dummy read (invalid data) CGRAM -> Read-data latch Read (data of address n) Read-data latch -> DB15-0 First word Second word Second word Dummy read (invalid data) CGRAM -> Read-data latch Read (data of address) Read-data latch -> DB15-0 i) Data read to the microcomputer Read (data of address n) DB15-0 -> CGRAM Automatic address update: N + α Address: M set First word Dummy read (invalid data) CGRAM -> Read-data latch First word Second word Dummy read (invalid data) CGRAM -> Read-data latch Write (data of address N + α) DB15-0 -> CGRAM ii) Logical operation processing in the HD66753 Figure 20 CGRAM Read Sequence Rev. 1.0, Jan. 2003, page 39 of 102 HD66753 Table 18 Instruction List Upper Code Lower Code No. Register Name DB DB DB DB DB DB DB DB DB DB DB DB DB DB DB DB R/W RS 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 IR Index 0 0 * * * * * * * * * * * ID4 ID3 ID2 ID1 ID0 SR Status read 1 0 L7 L6 L5 L4 L3 L2 L1 L0 0 C6 C5 C4 C3 C2 C1 C0 0 1 * * * * * * * * * * * * * * * 1 Device code read 1 1 0 0 0 0 0 1 1 1 0 1 0 1 0 0 1 1 R01 Driver output control 0 1 * * * * * * CMS SGS * * * NL4 NL3 NL2 NL1 NL0 R02 LCD-drivingwaveform control 0 1 * * * * * * * B/C EOR NW NW NW NW NW 4 3 2 1 0 R03 Power control 0 1 * * * BS2 BS1 BS0 BT1 BT0 PS1 PS0 DC DC AP1 AP0 SLP STB 1 0 R04 Contrast control 0 1 * * * * * VR2 VR1 VR0 * CT6 CT5 CT4 CT3 CT2 CT1 CT0 R05 Entry mode 0 1 * * * * * * * * * * * I/D AM AM LG1 LG0 1 0 R06 Rotation 0 1 * * * * * * * * * * * * * R07 Display control 0 1 * * * * * * * SPT * * GSH GSH GSL GSL REV D Reg. R00 Start oscillation * * RT2 RT1 RT0 1 0 1 0 R08 Cursor control 0 1 * * * * * * * * * * * * * C CM CM 1 0 R09 NOOP 0 1 * * * * * * * * * * * * * * * * R0A NOOP 0 1 * * * * * * * * * * * * * * * * R0B Horizontal 0 cursor position 1 HE7 HE6 HE5 HE4 HE3 HE2 HE1 HE0 HS7 HS6 HS5 HS4 HS3 HS2 HS1 HS0 R0C Vertical cursor 0 position 1 VE7 VE6 VE5 VE4 VE3 VE2 VE1 VE0 VS7 VS6 VS5 VS4 VS3 VS2 VS1 VS0 R0D 1st screen 0 driving position 1 SE SE 17 16 SE 15 SE SE 14 13 SE 12 SE SE 11 10 SS 17 SS SS 16 15 SS 14 SS SS 13 12 SS 11 SS 10 R0E 2nd screen 0 driving position 1 SE SE 27 26 SE 25 SE SE 24 23 SE 22 SE SE 21 20 SS 27 SS SS 26 25 SS 24 SS SS 23 22 SS 21 SS 20 R10 RAM write data mask 0 1 WM WM WM WM WM WM WM WM WM WM WM WM WM WM WM WM 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R11 RAM address 0 set 1 * R12 RAM data write 0 1 Write data (upper) Write data (lower) RAM data read 1 1 Read data (upper) Read data (lower) * Note: '*' means 'doesn't matter'. Rev. 1.0, Jan. 2003, page 40 of 102 * AD12-8 (upper)) AD7-0 (lower) HD66753 Table 18 Instruction List (cont) Reg. Register Name No. Description Execution Cycle 0 IR Index Sets the index register value. SR Status read Reads the driving raster-row position (L7-0) and contrast setting (C6-0). 0 R00 Start oscillation Starts the oscillation mode. 10 ms Device code read Reads 0753H. 0 R01 Driver output control Sets the common driver shift direction (CMS), segment driver shift direction (SGS), and driving duty ratio (NL4-0). 0 R02 LCD-drivingwaveform control Sets the LCD drive AC waveform (B/C), and EOR output (EOR) or the number of n-raster-rows (NW4-0) at C-pattern AC drive. 0 R03 Power control Sets the sleep mode (SLP), standby mode (STB), LCD power on (AP1- 0 0), boosting cycle (DC1-0), boosting output multiplying factor (BT1-0), reference power supply (PS1-0), and LCD drive bias value (BS2-0). R04 Contrast control Sets the contrast adjustment (CT6-0) and regulator adjustment (VR2-0). 0 R05 Entry mode Specifies the logical operation (LG1-0), AC counter mode (AM1-0), and 0 increment/decrement mode (I/D). R06 Rotation Specifies the amount of write-data rotation (RT2-0). R07 Display control Specifies display on (D), black-and-white reversed display (REV), 0 grayscale mode (GS), double-height display on (DHE), and partial scroll (PS1-0). R08 Cursor control Specifies cursor display on (C) and cursor display mode (CM1-0). 0 R09 NOOP No operation 0 R0A NOOP No operation 0 R0B Horizontal cursor position Sets horizontal cursor start (HS6-0) and end (HE6-0). 0 0 R0C Vertical cursor Sets vertical cursor start (VS6-0) and end (VE6-0). position 0 R0D 1st screen driving position Sets 1st screen driving start (SS17-10) and end (SE17-10). 0 R0E 2nd screen driving position Sets 2nd screen driving start (SS27-20) and end (SE27-20). 0 R10 RAM write data mask Specifies write data mask (WM15-0) at RAM write. 0 R11 RAM address Initially sets the RAM address to the address counter (AC). set 0 R12 RAM data write Writes data to the RAM. 0 RAM data read Reads data from the RAM. 0 Rev. 1.0, Jan. 2003, page 41 of 102 HD66753 Reset Function The HD66753 is internally initialized by RESET input. Because the busy flag (BF) indicates a busy state (BF = 1) during the reset period, no instruction or CGRAM data access from the MPU is accepted. The reset input must be held for at least 1 ms. Do not access the CGRAM or initially set the instructions until the R-C oscillation frequency is stable after power has been supplied (10 ms). Instruction Set Initialization: 1. Start oscillation executed 2. Driver output control (NL4–0 = 10000, SGS = 0, CMS = 0) 3. B-pattern waveform AC drive (B/C = 0, ECR = 0, NW4–0 = 00000) 4. Power control (PS1–0 = 00, DC1–0 = 00, AP1–0 = 00: LCD power off, SLP = 0: Sleep mode off, STB = 0: Standby mode off) 5. 1/11 bias drive (BS2–0 = 000), Three-times step-up (BT1–0 = 00), Weak contrast (CT6–0 = 0000000), 2.8-times output voltage for LCD-drive reference voltage generator (VR2–0 = 000) 6. Entry mode set (I/D = 1: Increment by 1, AM1–0 = 00: Horizontal move, LG1–0 = 00: Replace mode) 7. Rotation (RT2–0 = 000: No shift) 8. Display control (SPT = 0: GSH1-0 = GSL1-0 = 00, REV = 0, GS = 0, D = 0: Display off) 9. Cursor control (C = 0: Cursor display off, CM1–0 = 00) 10. 1st screen division (SS17–10 = 00000000, SE17–10 = 00000000) 11. 2nd screen division (SS27–20 = 00000000, SE27–20 = 00000000) 12. Window cursor display position (HS7–0 = HE7–0 = VS7–0 = VE7–0 = 00000000) 13. RAM write data mask (WM15–0 = 0000H: No mask) 14. RAM address set (AD12–0 = 000H) CGRAM Data Initialization: This is not automatically initialized by reset input but must be initialized by software while display is off (D = 0). Output Pin Initialization: 1. LCD driver output pins (SEG/COM): Outputs GND level 2. Step-up circuit output pins (VLOUT): Outputs Vcc level 3. Oscillator output pin (OSC2): Outputs oscillation signal Rev. 1.0, Jan. 2003, page 42 of 102 HD66753 Parallel Data Transfer 16-bit Bus Interface Setting the IM2/1/0 (interface mode) to the GND/GND/GND level allows 68-system E-clock-synchronized 16-bit parallel data transfer. Setting the IM2/1/0 to the GND/Vcc/GND level allows 80-system 16-bit parallel data transfer. When the number of buses or the mounting area is limited, use an 8-bit bus interface. CSn* H8/2245 CS* A1 RS HWR* WR* (RD*) (RD*) D15 - D0 HD66753 DB15 - DB0 16 Figure 21 Interface to 16-bit Microcomputer 8-bit Bus Interface Setting the IM2/1/0 (interface mode) to the GND/GND/Vcc level allows 68-system E-clock-synchronized 8-bit parallel data transfer using pins DB15–DB8. Setting the IM2/1/0 to the GND/Vcc/Vcc level allows 80-system 8-bit parallel data transfer. The 16-bit instructions and RAM data are divided into eight upper/lower bits and the transfer starts from the upper eight bits. Fix unused pins DB7–DB0 to the Vcc or GND level. Note that the upper bytes must also be written when the index register is written to. CSn* H8/2245 CS* A1 RS HWR* WR* (RD*) (RD*) D15 - D8 HD66753 DB15 - DB8 DB7 - 0 8 8 GND Figure 22 Interface to 8-bit Microcomputer Note: Transfer synchronization function for an 8-bit bus interface The HD66753 supports the transfer synchronization function which resets the upper/lower counter to count upper/lower 8-bit data transfer in the 8-bit bus interface. Noise causing transfer mismatch between the eight upper and lower bits can be corrected by a reset triggered by consecutively writing a 00H instruction four times. The next transfer starts from the upper eight bits. Executing synchronization function periodically can recover any runaway in the display system. Rev. 1.0, Jan. 2003, page 43 of 102 HD66753 RS R/W E DB15-DB8 Upper/ lower 00H 00H 00H 00H (1) (2) (3) (4) Upper Lower (8-bit transfer synchronization) Figure 23 8-bit Transfer Synchronization Rev. 1.0, Jan. 2003, page 44 of 102 HD66753 Serial Data Transfer Setting the IM1 and IM2 pins (interface mode pins) to the Vcc or GND level allows standard clocksynchronized serial data transfer, using the chip select line (CS*), serial data line (SDA), and serial transfer clock line (SCL). For a serial interface, the IM0/ID pin function uses an ID pin. The HD66753 initiates serial data transfer by transferring the start byte at the falling edge of CS* input. It ends serial data transfer at the rising edge of CS* input. The HD66753 is selected when the 6-bit chip address in the start byte transferred from the transmitting device matches the 6-bit device identification code assigned to the HD66753. The HD66753, when selected, receives the subsequent data string. The least significant bit of the identification code can be determined by the ID pin. The five upper bits must be 01110. Two different chip addresses must be assigned to a single HD66753 because the seventh bit of the start byte is used as a register select bit (RS): that is, when RS = 0, an index register can be written to or the status can be read from, and when RS = 1, an instruction can be written to or the data can be written to or read from RAM. Read or write is selected according to the eighth bit of the start byte (R/W bit) as shown in table 19. After receiving the start byte, the HD66753 receives or transmits the subsequent data byte-by-byte. The data is transferred with the MSB first. Since all the instructions in the HD66753 are configured by 16 bits, they are internally executed after two bytes have been transferred with the MSB first (DB15-0). The HD66753 internally receives the first byte as upper eight bits of instructions, and the second byte as lower eight bits. Five bytes of RAM read data after the start byte are invalid. The HD66753 starts to read correct RAM data from the sixth byte. Table 19 Start Byte Format Transfer Bit S 1 Start byte format Transfer start Device ID code 0 2 1 3 1 4 1 5 0 6 7 8 RS R/W ID Note: ID bit is selected by the IM0/ID pin. Table 20 RS and R/W Bit Functions RS R/W Function 0 0 Writes index register 0 1 Reads status 1 0 Writes instructions and RAM data 1 1 Reads RAM data Rev. 1.0, Jan. 2003, page 45 of 102 HD66753 a) Basic Data-transfer Timing through Clock-synchronized Serial Bus Interface Transfer end Transfer start CS* (Input) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 SCL (Input) MSB DB DB DB DB DB "0" "1" "1" "1" "0" ID RS RW DB 15 14 13 12 11 10 SDA (Input) Device ID code LSB DB DB 9 8 DB 7 DB 6 DB DB 5 4 DB 3 DB 2 DB 1 DB 0 RS RW Start byte Instruction register set, instruction, RAM data write b) Consecutive Data-transfer Timing through Clock-synchronized Serial Bus Interface CS* (Input) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 SCL 25 26 27 28 29 30 31 32 (Input) SDA Upper 8 bits of instruction 1 Start byte (Input) Lower 8 bits of instruction 1 Upper 8 bits of instruction 2 Execution time for instruction 1 Start End Note: The first byte after the start byte should be upper 8 bits. c) RAM Data Read-transfer Timing CS* (Input) SCL (Input) SDA Start byte RS="1", R/W="1" (Input) Dummy read 1 Dummy read 2 Dummy read 3 Dummy read 4 Dummy read 5 Upper 8 bits of RAM read Start Lower 8 bits of RAM read End Note: Five bytes of the RAM read data after the start byte are invalid. The HD66753 starts to read the correct RAM data from the sixth byte. d) Status Read/Instruction Read Timing CS* (Input) SCL (Input) Start byte RS="1", R/W="1" SDA (Input) Start Dummy read 1 Upper 8 bits of status read Lower 8 bits of status read End Note: One byte of the read after the start byte is invalid. The HD66753 starts to read the correct data from the second byte. Figure 24 Clock-synchronized Serial Interface Timing Sequence Rev. 1.0, Jan. 2003, page 46 of 102 HD66753 Graphics Operation Function The HD66753 can greatly reduce the load of the microcomputer graphics software processing through the 16-bit bus architecture and graphics-bit operation function. This function supports the following: 1. A write data mask function that selectively rewrites some of the bits in the 16-bit write data. 2. A bit rotation function that shifts and writes the data sent from the microcomputer in a bit unit. 3. A logical operation function that writes the data sent from the microcomputer and the original RAM data by a logical operation. Since the display data in the graphics RAM (CGRAM) can be quickly rewritten, the load of the microcomputer processing can be reduced in the large display screen when a font pattern, such as kanji characters, is developed for any position (BiTBLT processing). The graphics bit operation can be controlled by combining the entry mode register, the bit set value of the RAM-write-data mask register, and the read/write from the microcomputer. Table 21 Graphics Operation Bit Setting Operation Mode I/D AM LG Operation and Usage Write mode 1 0/1 00 00 Horizontal data replacement, horizontal-border drawing Write mode 2 0/1 01 00 Vertical data replacement, font development, verticalborder drawing Write mode 3 0/1 10 00 Vertical data replacement with two-word width, kanjifont development Read/write mode 1 0/1 00 01 10 11 Horizontal data replacement with logical operation, horizontal-border drawing Read/write mode 2 0/1 01 01 10 11 Vertical data replacement with logical operation, vertical-border drawing Read/write mode 3 0/1 10 01 10 11 Horizontal data replacement with two-word-width logical operation Rev. 1.0, Jan. 2003, page 47 of 102 HD66753 Microcomputer 16 16 HD66753 Write-data latch Readdata atch +1/-1 16 +16 16 Bit rotation 3 Rotation bit (RT2-0 ) 16 Address counter (AC) 00: through 2 Logical operation 16 Write bit mask 16 Logical operation bit (LG1-0) Graphics RAM (CGRAM) Figure 25 Data Processing Flow of the Graphics Bit Operation Rev. 1.0, Jan. 2003, page 48 of 102 10: AND 11: EOR Write-mask register (WM15-0) 16 11 01: OR HD66753 1. Write mode 1: AM1–0 = 00, LG1–0 = 00 This mode is used when the data is horizontally written at high speed. It can also be used to initialize the graphics RAM (CGRAM) or to draw borders. The rotation function (RT2–0) or write-data mask function (WM15–0) are also enabled in these operations. After writing, the address counter (AC) automatically increments by 1 (I/D = 1) or decrements by 1 (I/D = 0), and automatically jumps to the counter edge one-raster-row below after it has reached the left edge of the graphics RAM. Operation Examples: 1) I/D = 1, AM1-0 = 00, LG1-0 = 00, RT2-0 = 000 2) WM15-0 = 0000H 3) AC = 0000H WM0 Write data mask: WM15 00 00 00 00 00 00 00 00 DB0 DB15 Write data (1) : 10 0 110 0 10 100 00 1 1 Write data (2) : 11 00 00 1 100 00 1 100 Write data (3) : 01 1 10 100 00 0 11 11 1 0000H 0001H 1 00 11 00 10 10 00 01 1 11 00 00 1 100 00 1 100 01 1 10 100 00 0 11 11 1 Write data (2) Write data (3) Write data (1) 0002H CGRAM Figure 26 Writing Operation of Write Mode 1 Rev. 1.0, Jan. 2003, page 49 of 102 HD66753 2. Write mode 2: AM1–0 = 01, LG1–0 = 00 This mode is used when the data is vertically written at high speed. It can also be used to initialize the graphics RAM (CGRAM), develop the font pattern in the vertical direction, or draw borders. The rotation function (RT2–0) or write-data mask function (WM15–0) are also enabled in these operations. After writing, the address counter (AC) automatically increments by 20, and automatically jumps to the upper-right edge (I/D = 1) or upper-left edge (I/D = 0) following the I/D bit after it has reached the lower edge of the graphics RAM. Operation Examples: 1) I/D = 1, AM1-0 = 01, LG1-0 = 00, RT2-0 = 010 2) WM15-0 = F007H 3) AC = 0000H WM0 WM15 Write data mask: 1 1 1 0 0 0 0 0 0 0 0 0 1 1 1 1 DB0 DB15 Write data (1) : 1 0 0 1 1 0 0 1 0 1 0 0 0 0 1 1 Write data (2) : 1 1 0 0 0 0 1 1 0 0 0 0 1 1 0 0 Write data (3) : 0 1 1 1 0 1 0 0 0 0 0 1 1 1 1 1 0000H * * * 11 00 11 00 1 * * * * Write data (1) 0020H * * * 011 0 00 01 1 * * * * Write data (2) 0040H : 1060H * * * 101 1 10 10 0 * * * * Write data (3) 4-bit rotation 4-bit rotation 4-bit rotation 00 1 110 0 110 0 10 100 1 100 11 00 00 1 100 00 1 11 101 1 10 100 00 0 1 CGRAM Notes: 1. The bit area data in the RAM indicated by "*" is not changed. 2. After writing to address 1060H, the AC jumps to 0001H. Figure 27 Writing Operation of Write Mode 2 Rev. 1.0, Jan. 2003, page 50 of 102 HD66753 3. Write mode 3: AM1–0 = 10, LG1–0 = 00 This mode is used when the data is written at high speed by vertically shifting bits. It can also be used to write the 16-bit data for two words into the graphics RAM (CGRAM), develop the font pattern, or transfer the BiTBLT as a bit unit. The rotation function (RT2–0) or write-data mask function (WM15– 0) are also enabled in these operation. However, although the write-data mask function masks the bit position set with the write-data mask register (WM15–0) at the odd-times (such as the first or third) write, the function masks the bit position that reversed the setting value of the write-data mask register (WM15–0) at the even-times (such as the second or fourth) write. After the odd-times writing, the address counter (AC) automatically increments by 1 (I/D = 1) or decrements by 1 (I/D = 0). After the even-times writing, the AC automatically increments or decrements by –1 + 20 (I/D = 1) or +1 + 20 (I/D = 0). The AC automatically jumps to the upper edge after it has reached the lower edge of the graphics RAM. Operation Examples: 1) I/D = 1, AM1-0 = 10, LG1-0 = 00, RT2-0 = 010 2) WM15-0 = 000FH 3) AC = 0000H WM0 Write data mask: WM15 11 1 100 00 00 00 0 00 0 DB0 Write data (1) : Write data (2) : Write data (3) : Write data (4) : Write data (5) : Write data (6) : DB15 11 1 111 0 00 001 10 0 0 11 11 11 0 000 01 1 000 00 0 00 111 00 0 01 11 1 00 0 00 111 00 0 01 11 1 00 1 00 00 11 11 11 00 0 00 1 00 00 11 11 11 00 0 0000H 4-bit rotation 4-bit rotation 4-bit rotation 4-bit rotation 4-bit rotation 4-bit rotation 10 0 011 1 111 0 00 001 1 000 11 11 11 0 000 01 1 11 100 0 00 111 00 0 0 1 11 100 0 00 111 00 0 0 1 00 000 1 00 00 11 11 1 1 00 000 1 00 00 11 11 1 0001H 0000H * * * * 11 1 11 10 00 00 1 1 0 0 0 * * * * * * * * * * * * Write data (1), (2) 0020H * * * * 00 0 00 11 10 00 0 1 1 1 1 * * * * * * * * * * * * Write data (3), (4) 0040H * * * * 00 1 00 00 11 11 1 1 0 0 0 * * * * * * * * * * * * Write data (5), (6) CGRAM 1060H Notes: 1. The bit area data in the RAM indicated by "*" is not changed. 2. After writing to address 1061H, the AC jumps to 0001H. Figure 28 Writing Operation of Write Mode 3 Rev. 1.0, Jan. 2003, page 51 of 102 HD66753 4. Read/Write mode 1: AM1–0 = 00, LG1–0 = 01/10/11 This mode is used when the data is horizontally written at high speed by performing a logical operation with the original data. It reads the display data (original data), which has already been written in the graphics RAM (CGRAM), performs a logical operation with the write data sent from the microcomputer, and rewrites the data to the CGRAM. This mode can read the data during the same bus cycle as for the write operation since the read operation of the original data does not latch the read data into the microcomputer and temporarily holds it in the read-data latch. (However, the bus cycle must be the same as the read cycle.) The rotation function (RT2–0) or write-data mask function (WM15–0) are also enabled in these operations. After writing, the address counter (AC) automatically increments by 1 (I/D = 1) or decrements by 1 (I/D = 0), and automatically jumps to the counter edge one-raster-row below after it has reached the left or right edges of the graphics RAM. Operation Examples: 1) I/D = 1, AM1-0 = 00, LG1-0 = 01 (OR), RT2-0 = 000 2) WM15-0 = 0000H 3) AC = 0000H WM0 Write data mask: WM15 00 00 00 00 00 00 00 00 DB0 DB15 Read data (1): 10 0 110 0 10 100 00 1 1 Write data (1): 10 1 111 0 00 110 00 0 1 Read data (2): 00 00 11 1 100 00 0 000 Write data (2): 11 00 00 1 110 00 1 100 Read data (3): 00 0 01 110 10 0 00 11 0 Write data (3): 01 1 10 100 00 0 11 11 1 Logical operation (OR) 10 1 111 0 10 110 00 1 1 Logical operation (OR) 11 00 11 1 110 00 1 100 Logical operation (OR) 01 1 11 110 10 0 11 11 1 0000H 0001H 0002H 10 1 111 0 10 11 00 01 1 11 001 1 1 110 00 1 100 01 1 11 11 0 100 11 11 1 Read data (1) + Write data (1) Read data (2) + Write data (2) Read data (3) + Write data (3) CGRAM Figure 29 Writing Operation of Read/Write Mode 1 Rev. 1.0, Jan. 2003, page 52 of 102 HD66753 5. Read/Write mode 2: AM1–0 = 01, LG1–0 = 01/10/11 This mode is used when the data is vertically written at high speed by performing a logical operation with the original data. It reads the display data (original data), which has already been written in the graphics RAM (CGRAM), performs a logical operation with the write data sent from the microcomputer, and rewrites the data to the CGRAM. This mode can read the data during the same bus cycle as for the write operation since the read operation of the original data does not latch the read data into the microcomputer and temporarily holds it in the read-data latch. The rotation function (RT2–0) or write-data mask function (WM15–0) are also enabled in these operations. After writing, the address counter (AC) automatically increments by 20, and automatically jumps to the upper-right edge (I/D = 1) or upper-left edge (I/D = 0) following the I/D bit after it has reached the lower edge of the graphics RAM. Operation Examples: 1) I/D = 1, AM1-0 = 01, LG1-0 = 01 (OR), RT2-0 = 010 2) WM15-0 = FC03H 3) AC = 0000H WM0 Write data mask: WM15 11 00 00 00 00 1 11 11 1 DB0 DB15 Read data (1): 10 0 110 0 10 100 00 1 1 Write data (1): 10 1 111 0 00 110 00 0 1 4-bit rotation 00 0 110 1 111 0 00 110 Logical operation (OR) 10 01 10 11 1 100 01 1 1 Read data (2): 00 00 11 1 100 00 0 000 Write data (2): 11 00 00 1 110 00 1 100 4-bit rotation 1 100 11 00 00 1 110 00 Logical operation (OR) 11 001 11 100 11 10 00 Read data (3): 00 0 01 110 1 11 00 11 0 Write data (3): 01 1 10 100 00 0 11 11 1 4-bit rotation 1 11 101 1 10 100 00 0 1 Logical operation (OR) 11 111 1 11 1 110 0 111 0000H 0001H 0000H * * 0 1 1 0 1 1 1 1 * * * * * * Read data (1) + Write data (1) 0020H * * 0 0 1 1 1 1 0 0 * * * * * * Read data (2) + Write data (2) 0040H * * 1 1 1 1 1 1 1 1 * * * * * * Read data (3) + Write data (3) CGRAM 1060H Notes: 1. The bit area data in the RAM indicated by "*" is not changed. 2. After writing to address 1060H, the AC jumps to 0001H. Figure 30 Writing Operation of Read/Write Mode 2 Rev. 1.0, Jan. 2003, page 53 of 102 HD66753 6. Read/Write mode 3: AM1–0 = 10, LG1–0 = 01/10/11 This mode is used when the data is written with high speed by vertically shifting bits and by performing logical operation with the original data. It can be also used to write the 16-bit data for two words into the graphics RAM (CGRAM), develop the font pattern, or transfer the BiTBLT as a bit unit. This mode can read the data during the same bus cycle as for the write operation since the read operation of the original data does not latch the read data into the microcomputer and temporarily holds it in the readdata latch. The rotation function (RT2–0) or write-data mask function (WM15–0) are also enabled in these operations. However, although the write-data mask function masks the bit position set with the write-data mask register (WM15–0) at the odd-times (such as the first or third) write, the function masks the bit position which reversed the setting value of the write-data mask register (WM15–0) at the even-times (such as the second or fourth) write. After the odd-times writing, the address counter (AC) automatically increments by 1 (I/D = 1) or decrements by 1 (I/D = 0). After the even-times writing, the AC automatically increments or decrements by –1 + 20 (I/D = 1) or +1 + 20 (I/D = 0). The AC automatically jumps to the upper edge after it has reached the lower edge of the graphics RAM. Rev. 1.0, Jan. 2003, page 54 of 102 HD66753 Operation Examples: 1) I/D = 1, AM1-0 = 10, LG1-0 = 01, RT2-0 = 010 2) WM15-0 = 000FH 3) AC = 0000H WM0 Write data mask: WM15 11 1 100 00 00 00 0 00 0 DB0 DB15 Read data (1): 00 0 111 1 00 00 01 10 0 Write data (1): 11 1 111 0 00 001 10 0 0 4-bit rotation 10 0 011 1 111 0 00 001 Logical operation (OR) 10 0 111 1 111 0 01 101 Read data (2): 00 1 111 1 100 0 00 11 1 Write data (2): 11 11 11 0 000 01 1 000 4-bit rotation 1 000 11 11 11 0 000 01 Logical operation (OR) 1 011 11 11 11 0 001 11 Read data (3): 00 1 10 011 00 0 00 11 0 Write data (3): 00 0 00 111 00 0 01 11 1 4-bit rotation 1 11 100 0 00 111 00 0 0 Logical operation (OR) 1 11 100 1 10 111 01 1 0 Read data (4): 11 1 10 00 000 0 00 10 1 Write data (4): 00 0 00 111 00 0 01 11 1 4-bit rotation 1 11 100 0 00 111 00 0 0 Logical operation (OR) 1 11 100 0 00 111 01 0 1 0000H 0001H 0000H * * * * 11 1 11 10 01 10 1 1 0 1 1 * * * * * * * * * * * * Write data (1), (2) 0020H * * * * 00 1 10 11 101 1 0 1 1 1 1 * * * * * * * * * * * * Write data (3), (4) CGRAM 1060H Notes: 1. The bit area data in the RAM indicated by "*" is not changed. 2. After writing to address 1060H, the AC jumps to 0001H. Figure 31 Writing Operation of Read/Write Mode 3 Rev. 1.0, Jan. 2003, page 55 of 102 HD66753 Oscillation Circuit The HD66753 can either be supplied with operating pulses externally (external clock mode) or oscillate using an internal R-C oscillator with an external oscillator-resistor (external resistor oscillation mode). Note that in R-C oscillation, the oscillation frequency is changed according to the internal capacitance value, the external resistance value, or operating power-supply voltage. 1) External clock mode Clock (100 kHz) 2) External resistor oscillation mode OSC1 OSC1 Rf OSC2 Dumping resistance (2 kΩ) HD66753 HD66753 The oscillator frequency can be adjusted by oscillator resistor (Rf). If Rf is increased or power supply voltage is decreased, the oscillation frequency decreases. For the relationship between Rf resistor value and oscillation frequency, see the Electric Characteristics Notes section. Figure 32 Oscillation Circuits Table 22 Relationship between Liquid Crystal Drive Duty Ratio and Frame Frequency LCD Duty NL4–0 Set Value Recommended Drive Bias Value Frame Frequency One-frame Clock 1/24 02H 1/6 72 Hz 1392 1/32 03H 1/6 71 Hz 1408 1/40 04H 1/7 71 Hz 1400 1/48 05H 1/8 72 Hz 1392 1/56 06H 1/8 71 Hz 1400 1/64 07H 1/9 71 Hz 1408 1/72 08H 1/9 69 Hz 1440 1/80 09H 1/10 69 Hz 1440 1/88 0AH 1/10 71 Hz 1408 1/96 0BH 1/10 69 Hz 1440 1/104 0CH 1/11 69 Hz 1456 1/112 0DH 1/11 69 Hz 1456 1/120 0EH 1/11 69 Hz 1440 1/128 0FH 1/11 71 Hz 1408 1/132 10H 1/11 69 Hz 1452 Note: The frame frequency above is for 100-kHz operation and proportions the oscillation frequency (fosc). Rev. 1.0, Jan. 2003, page 56 of 102 HD66753 1 2 3 4 131 132 1 2 3 131 132 V1 V2 COM1 V5 GND V1 V2 COM2 V5 GND V1 V2 COM131 V5 GND V1 V2 COM132 V5 GND 1 frame 1 frame Figure 33 LCD Drive Output Waveform (B-pattern AC Drive with 1/132 Multiplexing Duty Ratio) Rev. 1.0, Jan. 2003, page 57 of 102 HD66753 n-raster-row Reversed AC Drive The HD66753 supports not only the LCD reversed AC drive in a one-frame unit (B-pattern waveform) but also the n-raster-row reversed AC drive which alternates in an n-raster-row unit from one to 32 raster-rows (C-pattern waveform). When a problem affecting display quality occurs, such as crosstalk at high-duty driving of more than 1/64 duty, the n-raster-row reversed AC drive (C-pattern waveform) can improve the quality. Determine the number of raster-rows n (NW bit set value + 1) for alternating after confirmation of the display quality with the actual LCD panel. However, if the number of AC raster-rows is reduced, the LCD alternating frequency becomes high. Because of this, the charge or discharge current is increased in the LCD cells. 1 frame 1 2 3 4 5 6 7 8 9 10 11 12 13 1 frame 79 80 1 2 3 4 5 6 7 8 9 10 11 12 13 79 80 1 2 3 B-pattern waveform drive · 1/80 duty C-pattern waveform drive · 1/80 duty · 11-raster-row reversal · Without EORs C-pattern waveform drive · 1/80 duty · 11-raster-row reversal · With EORs Note: Specify the number of AC drive raster-rows and the necessity of EOR so that the DC bias is not generated for the liquid crystal. Figure 34 Example of an AC Signal under n-raster-row Reversed AC Drive Rev. 1.0, Jan. 2003, page 58 of 102 HD66753 Liquid Crystal Display Voltage Generator When External Power Supply and Internal Operational Amplifiers are Used To supply LCD drive voltage directly from the external power supply without using the internal step-up circuit, circuits should be connected as shown in figure 35. Here, contrast can be adjusted by software through the CT bits of the contrast adjustment register. Since the VLREF input is the reference voltage to determine the LCD drive voltage, fluctuation of the voltage must be minimized. The HD66753 incorporates a voltage-follower operational amplifier for each V1 to V5 to reduce current flowing through the internal bleeder-resistors, which generate different levels of liquid-crystal drive voltages. Thus, potential difference between VLPS and V1 must be 0.1 V or higher, and that between V4 and GND must be 1.4 V or higher. Place a capacitor of about 0.47 µF (B characteristics) between each internal operational amplifier (V1OUT to V5OUT outputs) and GND and stabilize the output level of the operational amplifier. Adjust the capacitance value of the stabilized capacitor after the LCD panel has been mounted and the screen quality has been confirmed. Rev. 1.0, Jan. 2003, page 59 of 102 HD66753 VLPS VLREF *2 0.1 µF (B characteristics) GND (+) PS1-0 = "10" HD66753 VR V1OUT + - V1 + - V2 + - V3 R V2OUT R V3OUT LCD driver R0 V4OUT SEG1-SEG168 + - V4 + - V5 COM1-COM132 R *2 0.47 µF (*) (B characteristics) V5OUT R GND GND GND Vci C1+ C1C2+ C2C3+ C3C4+ C4C5+ C5C6+ C6- Step-up circuit VLOUT Notes: 1. Adjust the capacitance value of the capacitor after the LCD panel has been mounted. 2. Use the capacitors with breakdown voltages equal to or higher than the VLPS voltage for connecting to V1OUT through V5OUT. Determine the capacitor breakdown voltages by checking VLPS voltage fluctuation. Figure 35 External Power Supply Circuit for LCD Drive Voltage Generation Rev. 1.0, Jan. 2003, page 60 of 102 HD66753 When an Internal Booster and Internal Operational Amplifiers are Used To supply LCD drive voltage using the internal step-up circuit, circuits should be connected as shown in figure 36. Generate a higher voltage (VLPS) of the internal operational amplifier than the output voltage (V1REF) of the LCD drive voltage regulator. Here, contrast can be adjusted through the CT bits of the contrast control instruction. The HD66753 incorporates a voltage-follower operational amplifier for each of V1 to V5 to reduce current flowing through the internal bleeder-resistors, which generate different liquid-crystal drive voltages. Thus, potential difference between VLPS and V1 must be 0.1 V or higher, and that between V4 and GND must be 1.4 V or higher. Place a capacitor of about 0.47 µF (B characteristics) between each internal operational amplifier (V1OUT to V5OUT outputs) and GND and stabilize the output level of the operational amplifier. Adjust the capacitance value of the stabilized capacitor after the LCD panel has been mounted and the screen quality has been confirmed. Rev. 1.0, Jan. 2003, page 61 of 102 HD66753 V LPS PS1-0 = "00" V REG V1REF LCD drive voltage regulator HD66753 ON *5 0.1 µF (B characteristics) (+) GND VLREF VR V1OUT + - V1 + - V2 + - V3 R V2OUT SEG1-SEG168 R V3OUT LCD driver R0 *5, *8, *9 0.47 µF (*) (B characteristics) V4OUT + - V4 + - V5 COM1-COM132 R V5OUT R GND GND Vci *7 1-2 µF (+) (B characteristics) *7 1-2 µF (+) (B characteristics) *6 1-2 µF (+) (B characteristics) *7 1-2 µF (+) (B characteristics) *7 1-2 µF (+) (B characteristics) *8 1-2 µF (+) (B characteristics) GND Vci *6 1-2 µF (+) (B characteristics) C1+ C1C2+ C2C3+ C3C4+ C4- Step-up circuit C5+ C5C6+ C6VLOUT GND Notes: 1. The reference voltage input (Vci) must be adjusted so that the output voltage after boosting will not exceed the absolute maximum rating for the liquid-crystal power supply voltage (20.5 V). 2. Vci is both a reference voltage and power supply for the step-up circuit; obtain sufficient current. 3. Polarized capacitors must be connected correctly. 4. Circuits for temperature compensation should be based on the sample circuits in figures 37 and 38. 5. Adjust the capacitance value of the stabilized capacitor after the LCD panel has been mounted. 6. The breakdown voltages of the capacitors connected to C3+/C3- and C6+/C6- should be three times or higher than the Vci voltage. 7. The breakdown voltages of the capacitors connected to C1+/C1-, C2+/C2-, C4+/C4-, and C5+/C5should be equal to or higher than the Vci voltage. 8. The breakdown voltages of the capacitors connected to VLOUT and V1OUT through V5OUT should be n times or higher than the Vci voltage (n: step-up magnification). 9. Determine thebreakdown voltages of the capacitors used in 6 to 8 above by checking Vci voltage fluctuation. Figure 36 Internal Step-up Circuit for LCD Drive Voltage Generation Rev. 1.0, Jan. 2003, page 62 of 102 HD66753 Temperature can be compensated either through the CT bits by software, by controlling the reference voltage for the LCD drive voltage regulator (VREG pin) using a thermistor, or by controlling the reference output voltage of the LCD drive voltage regulator (V1REF pin). Vcc PS1-0 = "00" V REG Thermistor Tr GND V 1REF LCD drive voltage regulator HD66753 ON *5 0.1 µF (B characteristics) GND (+) V LREF VR V1OUT + - V1 + - V2 + - V3 R V2OUT SEG1-SEG168 R V3OUT LCD driver R0 V4OUT + - V4 + - V5 COM1-COM132 R V5OUT R GND GND Figure 37 Temperature Compensation Circuits (1) Rev. 1.0, Jan. 2003, page 63 of 102 HD66753 PS1-0 = "01" V REG V 1REF LCD drive voltage regulator HD66753 0.1 µF OFF Tr Thermistor V LREF VR GND V1OUT (or Vcc) + - V1 + - V2 + - V3 R V2OUT SEG1-SEG168 R V3OUT LCD driver R0 V4OUT + - V4 + - V5 R V5OUT R GND GND Figure 38 Temperature Compensation Circuits (2) Rev. 1.0, Jan. 2003, page 64 of 102 COM1-COM132 HD66753 Picture quality provision in case of high-load display The HD66753 is an on-chip LCD driver that has an LCD power supply for high duty. Screen quality is affected by the load current of the high-duty LCD panel used. When the bias (1/11 bias, 1/10 bias, 1/9 bias, etc.) is high and the displayed pattern is completely or almost completely white, the white sections may appear dark. If this happens, execute the following countermeasures to improve screen quality. (1) After the change in the V4OUT/V3OUT level is verified, insert about 1 MΩ between V4OUT and GND or VLPS and V3OUT and then adjust the screen quality (see the following figures). By inserting resistance, the current consumption increases as much as the boosting factor of the resistance current. Adjust the resistance after checking the screen quality and the increase in current consumption. (2) Decrease the drive bias and use the new bias level after verifying that the potential differences between V4OUT and GND or VLPS and V3OUT are sufficient. VLPS Driver V4OUT Vbn Fixed current source C Rv4 GND Figure 39 Countermeasure for V4OUT Output VLPS Vbp Fixed current source Driver Rv3 C V3OUT GND Figure 40 Countermeasure for V3OUT Output Note: The actual LCD drive voltage VLREF used must not exceed 16.5 V. Rev. 1.0, Jan. 2003, page 65 of 102 HD66753 Switching the Step-up Factor Instruction bits (BT1/0 bits) can optionally select the step-up factor of the internal step-up circuit. According to the display status, power consumption can be reduced by changing the LCD drive duty and the LCD drive bias, and by controlling the step-up factor for the minimum requirements. For details, see the Partial-display-on Function section. According to the maximum step-up factor, external capacitors need to be connected. For example, when the maximum step-up is six times or five times, capacitors between C6+ and C6– or between C5+ and C5– are needed as in the case of the seven-times step-up. When the step-up is three-times, capacitors between C1+ and C1– or between C4+ and C4– are not needed. Place a capacitor with a breakdown voltage of three times or more the Vci-GND voltage between C6+ and C6– and between C3+ and C3–, a capacitor with a breakdown voltage larger than the Vci-GND voltage between C1+ and C1–, C2+ and C2–, C4+ and C4–, and C5+ and C5–, and a capacitor with a breakdown voltage of n times or more the Vci-GND voltage to VLOUT (n: step-up factor) (see figure 37). Note: Determine the capacitor breakdown voltages by checking Vci voltage fluctuation. Table 23 VLOUT Output Status BT1 BT0 VLOUT Output Status 0 0 Three-times step-up output 0 1 Five-times step-up output 1 0 Six-times step-up output 1 1 Seven-times step-up output Rev. 1.0, Jan. 2003, page 66 of 102 HD66753 i) Maximum seven-times step-up Vci Vci 1 µF (+) (B Characteristics) 1 µF (+) C1+ C1C2+ (B Characteristics) 1 µF (+) (B Characteristics) 1 µF (+) C2C3+ C3C4+ (B Characteristics) 1 µF (+) C4C5+ (B Characteristics) 1 µF (+) C5C6+ (B Characteristics) C6(+) 1 µF VLOUT ii) Maximum six-times step-up Vci Vci (+) 1 µF C1C2+ (B Characteristics) 1 µF (+) C2- (B Characteristics) 1 µF (+) C3- C3+ C4+ (B Characteristics) 1 µF (+) C4C5+ (B Characteristics) 1 µF (+) C5C6+ (B Characteristics) C6- 1 µF VLOUT (+) (B Characteristics) (B Characteristics) GND GND iii) Maximum five-times step-up Vci Vci (+) (B Characteristics) 1 µF (+) 1 µF iv) Maximum three-times step-up Vci Vci C1+ C1+ C1C2+ (B Characteristics) 1 µF (+) C2C3+ (B Characteristics) 1 µF (+) (B Characteristics) 1 µF (+) C3- C11 µF (+) C2+ (B Characteristics) 1 µF (+) C2C3+ (B Characteristics) C3- C4+ C4+ C4C5+ (B Characteristics) 1 µF (+) (+) (B Characteristics) C41 µF (+) C6+ (B Characteristics) 1 µF (+) C6- (B Characteristics) C5- (B Characteristics) 1 µF C1+ (B Characteristics) 1 µF (+) VLOUT 1 µF C5+ C5C6+ C6(+) VLOUT (B Characteristics) GND GND Figure 41 Step-up Circuit Output Factor Switching Rev. 1.0, Jan. 2003, page 67 of 102 HD66753 Example of Power-supply Voltage Generator for More Than Seven-times Step-up Output The HD66753 incorporates a step-up circuit for up to seven-times step-up. However, the LCD drive voltage (VLREF) will not be enough for seven-times step-up from Vcc when the power-supply voltage of Vcc is low or when the LCD drive voltage is high for the high-contrast LCD display. In this case, the reference voltage (Vci) for step-up can be set higher than the power-supply voltage of Vcc. When the step-up factor is high, the current driving ability is lowered and insufficient display quality may result. In this case, the step-up ability can be improved by decreasing the step-up factor as shown in the step-up circuit in figure 42. Set the Vci input voltage for the step-up circuit to 3.6 V or less. Control the Vci voltage so that the step-up output voltage (VLOUT) should be less than the absolute maximum ratings (20.5 V). HD66753 Regulator (1) 2.0 V Vci Vcc Logic circuit C1+ Battery 3.6 V Regulator (2) 2.2 V C1- Vci C2+ C2C3+ Step-up circuit GND C3C4+ VLPS (= 15.4V) C4- 2.2 V x 7 = 15.4 V C5+ VLOUT C5C6+ C6- (+) 1 µF (B Characteristics) (+) 1 µF (B Characteristics) (+) 1 µF (B Characteristics) (+) 1 µF (B Characteristics) (+) 1 µF (B Characteristics) (+) 1 µF (B Characteristics) SEG1-SEG 168 (+) 1 µF (B Characteristics) GND Vci (= 2.2 V) Vcc (= 2.0 V) VLPS LCD driver COM1-COM132 GND GND GND (= 0 V) Note: In practice, the LCD drive current lowers the voltage in the step-up output voltage. Figure 42 Usage Example of Step-up Circuit at Vci > Vcc Rev. 1.0, Jan. 2003, page 68 of 102 HD66753 Precautions when Switching Boosting Circuit The boosting factor of the HD66753 can be switched between 3, 5, 6, and 7 times by instruction. When the factor is switched, there is a transition period before the voltage from VLOUT stabilizes. When VLOUT is used as the VLPS, the boosting factor is changed by switching the BT bit, and the supply voltage for the VLPS is changed, a direct current may be applied to the LCD display if the display is on during the transition period. When the output voltage of the VLOUT pin is changed, the display must be switched off and on after the output voltage stabilizes. Table 24 Instructions Accompanying Change in Boosting Factor (example) Display Contents Instructions All display drive in 1/128 duty to 1/48 duty drive (1) Display control (R7) 0x0000 (2) Power control (R1) 0x1914 (3) 10-ms wait (4) Contrast control (R4) 0x0006 (5) Driver output control (R1) 0x0245 (6) Display control (R7) 0x0005 Rev. 1.0, Jan. 2003, page 69 of 102 HD66753 Contrast Adjuster Software can adjust 128-step contrast for an LCD by varying the liquid-crystal drive voltage (potential difference between VLREF and V1) through the CT bits of the contrast adjustment register (electron volume function). The value of a variable resistor between VLREF and V1 (VR) can be precisely adjusted in a 0.05 x R unit within a range from 0.05 x R through 6.40 x R, where R is a reference resistance obtained by dividing the total resistance. The HD66753 incorporates a voltage-follower operational amplifier for each of V1 to V5 to reduce current flowing through the internal bleeder resistors, which generate different liquid-crystal drive voltages. Thus, CT5-0 bits must be adjusted so that potential difference between VLPS and V1 is 0.1 V or higher and that between V4 and GND is 1.4 V or higher when liquid-crystal drives, particularly when the VR is small. HD66753 V LREF CT VR R R + - V1 + - V2 + - V3 + - V4 + - V5 R0 R R GND GND Figure 43 Contrast Adjuster Rev. 1.0, Jan. 2003, page 70 of 102 HD66753 Table 25 Contrast Adjustment Bits (CT) and Variable Resistor Values CT Set Value CT6 CT5 CT4 CT3 CT2 CT1 CT0 Variable Resistor Potential Difference Valu e (VR) between V1 and GND 0 0 0 0 0 0 0 6.40 x R 0 0 0 0 0 0 1 6.35 x R 0 0 0 0 0 1 0 6.30 x R 1 6.25 x R 0 0 0 0 0 1 0 0 0 0 1 0 0 6.20 x R 0 0 0 0 1 0 1 6.15 x R 0 0 0 0 1 1 0 6.10 x R 0 0 0 0 1 1 1 6.05 x R 0 0 0 1 0 0 0 6.00 x R 0 1 5.95 x R 1 0 5.90 x R 5.85 x R 0 0 0 1 0 0 0 0 1 0 0 0 0 1 0 1 1 0 0 0 1 1 0 0 5.80 x R 0 1 1 1 1 1 1 3.25 x R 1 0 0 0 0 0 0 3.20 x R 1 1 0 0 0 0 1 3.15 x R 1 0 0 0 0 1 0 3.10 x R 1 0 0 0 0 1 1 3.05 x R 1 0 0 3.00 x R 1 0 1 2.95 x R 2.90 x R 1 0 0 0 1 0 0 0 1 0 0 0 1 1 0 1 0 0 0 1 1 1 2.85 x R 1 0 0 1 0 0 0 2.80 x R 1 0 1 1 0 0 1 2.75 x R 1 1 1 1 1 0 0 0.20 x R 1 1 1 1 1 0 1 0.15 x R 1 1 1 1 1 1 0 0.10 x R 1 1 1 1 1 1 1 0.05 x R Display Color (Small) (Weak) (Large) (Bright) Rev. 1.0, Jan. 2003, page 71 of 102 HD66753 Table 26 Bias 1/11 bias drive 1/10 bias drive 1/9 bias drive 1/8 bias drive Contrast Adjustment per Bias Drive Voltage LCD Drive Voltage: VDR Contrast Adjustment Range - LCD drive voltage adjustment range 11 x R x (VLREF-GND) 11 x R + VR : 0.775 x (VLREF-GND) ≤ VDR ≤ 0.995 x (VLREF-GND) 2xR - Limit of potential x (VLREF-GND) ≥ 1.4 [V] : 11 x R + VR difference between V4 and GND VR - Limit if potential x (VLREF-GND) ≥ 0.1 [V] : 11 x R + VR difference between VLPS and V1 - LCD drive voltage adjustment range 10 x R x (VLREF-GND) 10 x R + VR : 0.757 x (VLREF -GND) ≤ VDR ≤ 0.995 x (VLREF-GND) 2xR - Limit of potential x (VLREF-GND) ≥ 1.4 [V] : difference between V4 and GND 10 x R + VR VR - Limit if potential x (VLREF-GND) ≥ 0.1 [V] : difference between VLPS and V1 10 x R + VR - LCD drive voltage adjustment range 9xR 9 x R + VR x (VLREF-GND) 2xR - Limit of potential : 9 x R + VR difference between V4 and GND x (VLREF-GND) ≥ 1.4 [V] VR - Limit if potential : difference between VLPS and V1 9 x R + VR x (VLREF-GND) ≥ 0.1 [V] - LCD drive voltage adjustment range 8xR x (VLREF-GND) 8 x R + VR : 0.737 x (V LREF-GND) ≤VDR ≤ 0.994 x (V LREF-GND) : 0.714 x (VLREF-GND) ≤ VDR ≤ 0.993 x (VLREF-GND) - Limit of potential : difference between V4 and GND - Limit if potential : difference between VLPS and V1 1/7 bias drive 1/6 bias drive - LCD drive voltage adjustment range 7xR x (VLREF-GND) 7 x R + VR : 0.686 x (VLREF-GND) ≤ VDR ≤ 0.993 x (VLREF-GND) 2xR - Limit of potential x (VLREF-GND) ≥ 1.4 [V] : 7 x R + VR difference between V4 and GND VR - Limit if potential x (VLREF-GND) ≥ 0.1 [V] : 7 x R + VR difference between VLPS and V1 - LCD drive voltage adjustment range 6xR x (VLREF-GND) 6 x R + VR : 0.652 x (VLREF-GND) ≤ VDR ≤ 0.992 x (VLREF-GND) - Limit of potential : difference between V4 and GND - Limit if potential : difference between VLPS and V1 1/5 bias drive 1/4 bias drive 2xR x (VLREF-GND) ≥ 1.4 [V] 8 x R + VR VR x (VLREF-GND) ≥ 0.1 [V] 8 x R + VR - LCD drive voltage adjustment range 5xR x (VLREF-GND) 5 x R + VR : 0.610 x (VLREF-GND ) ≤ VDR ≤ 0.990 x (VLREF-GND) - Limit of potential : difference between V4 and GND - Limit if potential : difference between VLPS and V1 - LCD drive voltage adjustment range 4xR x (VLREF-GND) 4 x R + VR Rev. 1.0, Jan. 2003, page 72 of 102 2xR x (VLREF-GND) ≥ 1.4 [V] 6 x R + VR VR x (VLREF-GND) ≥ 0.1 [V] 6 x R + VR 2xR x (VLREF-GND ) ≥ 1.4 [V] 5 x R + VR VR x (VLREF-GND ) ≥ 0.1 [V] 5 x R + VR : 0.556 x (VLREF-GND) ≤ VDR ≤ 0.988 x (VLREF-GND) 2xR - Limit of potential : 4 x R + VR x (VLREF-GND) ≥ 1.4 [V] difference between V4 and GND VR - Limit if potential : 4 x R + VR x (VLREF-GND) ≥ 0.1 [V] difference between VLPS and V1 HD66753 Liquid-crystal-display Drive-bias Selector An optimum liquid-crystal-display bias value can be selected using the BS2-0 bits, according to the liquid crystal drive duty ratio setting (NL4-0 bits). The liquid-crystal-display drive duty ratio and bias value can be displayed while switching software applications to match the LCD panel display status. The optimum bias value calculated using the following expression is a logical optimum value. Driving by using a lower value than the optimum bias value provides lower logical contrast and lower liquid-crystal-display voltage (the potential difference between V1 and GND), which results in better image quality. When the liquidcrystal-display voltage is insufficient even if a seven-times step-up circuit is used, when the step-up driving ability is lowered by setting a high factor for the step-up circuit, or when the output voltage is lowered because the battery life has been reached, the display can be made easier to see by lowering the liquidcrystal-display bias. The liquid crystal display can be adjusted by using the contrast adjustment register (CT6-0 bits) and selecting the step-up output level (BT1/0 bits). Optimum bias value for 1/N duty ratio drive voltage = 1 N+1 Table 27 Optimum Drive Bias Values LCD drive duty ratio 1/132 1/128 1/120 1/112 1/104 1/96 1/88 1/80 1/72 1/64 1/32 1/24 1/16 (NL4-0 set value) 10H 0FH 0EH 0DH 0CH 0BH 0AH 09H 08H 07H 03H 02H 01H Optimum drive bias value 1/11 1/11 1/11 1/11 1/11 1/10 1/10 1/10 1/9 1/9 1/6 1/6 1/5 (BS2-0 set value) 000 000 000 000 000 001 001 001 010 010 101 101 110 Rev. 1.0, Jan. 2003, page 73 of 102 HD66753 VLREF VLREF VLREF VR VR VR R R 7R R R GND R R GND GND GND i) 1/ 11 bias ii) 1/ 10 bias (BS2Ð0 = 000) V4 VLREF GND GND V4 V4 R V5 R GND iv) 1/ 8 bias (BS2Ð0 = 010) V3 3R 4R GND iii) 1/ 9 bias (BS2Ð0 = 001) R V5 R V2 V3 R V5 V5 R R V4 V4 V2 V3 5R 6R V1 R V2 V3 V3 V1 R V2 R R VR V1 R V2 VLREF VR V1 V1 R VLREF (BS2Ð0 = 011) V5 R GND GND v) 1/7 bias (BS2Ð0 = 100) VLREF VLREF VR VR V1 R V1 VR R V2 R R R V3 2R R R R R GND GND v) 1/6 bias (BS2Ð0 = 101) V3,V4 V4 V5 R V2 V3 V4 R V1 V2 V5 V5 R R GND GND GND v) 1/5 bias (BS2Ð0 = 110) Note: R = Reference resistor GND vi) 1/ 4 bias (BS2Ð0 = 111) Figure 44 Liquid Crystal Display Drive Bias Circuit Rev. 1.0, Jan. 2003, page 74 of 102 HD66753 Four-grayscale Display Function The HD66753 supports the four-grayscale monochrome display function. The four-grayscale monochrome display is used for the display data of the two-bit pixel set sent to the CGRAM. There are four grayscale levels: always unlit, weak middle level, bright middle level, and always lit. In the middle-level grayscale display, the GSL1-0 and GSH1-0 bits can select the grayscale level, respectively. The frame rate control (FRC) method, which is used for grayscale control, can reduce charge/discharge current in the LCD glass during grayscale display. Table 28 Relationships between the CGRAM Data and the Display Contents Upper Bit Lower Bit Liquid Crystal Display 0 0 Non-selected (unlit) 0 1 GSL1-0 = 00: 1/4-level grayscale (one frame lit during a four-frame period) GSL1-0 = 01: 1/3-level grayscale (one frame lit during a three-frame period) GSL1-0 = 10: 2/4-level grayscale (two frames lit during a four-frame period) GSL1-0 = 11: Lit (no grayscale control) 1 0 GSH1-0 = 00: 3/4-level grayscale (three frames lit during a fourframe period) GSH1-0 = 01: 2/3-level grayscale (two frames lit during a threeframe period) GSH1-0 = 10: 2/4-level grayscale (two frames lit during a four-frame period) GSH1-0 = 11: Lit (no grayscale control) 1 1 Selected (lit) Note: Upper bits: DB15, DB13, DB11, DB9, DB7, DB5, DB3, and DB1 Lower bits: DB14, DB12, DB10, DB8, DB6, DB4, DB2, and DB0 Rev. 1.0, Jan. 2003, page 75 of 102 HD66753 LSB MSB DB0 DB15 DB0 0 0 1 0 0 1 1 1 1 1 0 1 1 0 0 0 LSB MSB DB15 0 0 0 0 1 0 1 0 0 1 0 1 1 1 1 1 CGRAM Grayscale control circuit LCD panel display Figure 45 Four-grayscale Monochrome Display Rev. 1.0, Jan. 2003, page 76 of 102 HD66753 Window Cursor Display Function The HD66753 displays the window cursor by specifying a window area. The horizontal display position of the window cursor is specified with the horizontal cursor position register (HS6-0 to HE6-0), and the vertical display position is specified with the vertical cursor position register (VS6-0 or VE6-0). In these display position setting registers, ensure that HS6-0 ≤ HE6-0 and VS6-0 ≤ VE6-0. If these relationships are not satisfied, normal display cannot be attained. In addition, if the setting is VS6-0 = VE6-0 = 00H, a cursor is displayed on a raster-row at the most-upper edge of the screen. This window cursor can automatically display the hardware-supported block cursor, highlight window, or menu bar. The CM1-0 bits select the following four displays in each window cursor: 1. White-blink cursor (CM1-0 = 00): Alternately blinks between the normal display and an all-white (unlit) display 2. Black-blink cursor (CM1-0 = 01): Alternately blinks between the normal display and an all-black (all lit) display 3. Black-and-white reversed cursor (CM1-0 = 10): Normal black-and-white-reversed display (without blinking) 4. Black-and-white reversed blinking cursor (CM1-0 = 11): Alternately blinks between the normal display and a black-and-white-reversed display The above blinking display is switched in a 32-frame unit. To set a range of the window cursor, specify the display area. Figure 46 White Blink Cursor Display Rev. 1.0, Jan. 2003, page 77 of 102 HD66753 Figure 47 Black Blink Cursor Display Figure 48 Black-and-white Reversed Cursor Display Figure 49 Black-and-white Reversed Blink Cursor Display Rev. 1.0, Jan. 2003, page 78 of 102 HD66753 Reversed Display Function The HD66753 can display graphics display sections by black-and-white reversal. Black-and-white reversal can be easily displayed when the REV bit in the display control register is set to 1. Figure 50 Reversed Display Rev. 1.0, Jan. 2003, page 79 of 102 HD66753 Screen-division Driving Function The HD66753 can select and drive two screens at any position with the screen-driving position registers (R0D and R0E). Any two screens required for display are selectively driven and a duty ratio is lowered by LCD-driving duty setting (NL4-0), thus reducing LCD-driving voltage and power consumption. For the 1st division screen, start line (SS17-10) and end line (SE17-10) are specified by the 1st screendriving position register (R0D). For the 2nd division screen, start line (SS27-20) and end line (SE27-20) are specified by the 2nd screen-driving position register (R0E). The 2nd screen control is effective when the SPT bit is 1. The total count of selection-driving lines for the 1st and 2nd screens must correspond to the LCD-driving duty set value. Figure 51 Display Example in 2-screen Division Driving Rev. 1.0, Jan. 2003, page 80 of 102 HD66753 Restrictions on the 1st/2nd Screen Driving Position Register Settings The following restrictions must be satisfied when setting the start line (SS17-10) and end line (SE17-10) of the 1st screen driving position register (R0D) and the start line (SS27-20) and end line (SE27-20) of the 2nd screen driving position register (R0D) for the HD66753. Note that incorrect display may occur if the restrictions are not satisfied. Table 29 Restrictions on the 1st/2nd Screen Driving Position Register Settings 1st Screen Driving (STP = 0) 2nd Screen Driving (STP = 1) Register setting SS17-10 ≤ SE17-0 ≤ 83H SS17-10 ≤ SE17-10 < SS17-10 ≤ SE17-0 ≤ 83H Display operation Time-sharing driving for COM pins (SS1+1) to (SE1+1) Time-sharing driving for COM pins (SS1+1) to (SE1+1) and (SS2+1) to (SE2+1) Non-selection level driving for others Non-selection level driving for others Notes: 1. When the total line count in screen division driving settings is less than the duty setting, nonselection level driving is performed without the screen division driving setting range. 2. When the total line count in screen division driving settings is larger than the duty setting, the start line, the duty-setting line, and the lines between them are displayed and non-selection level driving is performed for other lines. 3. For the 1st screen driving, the SS27-20 and SE27-20 settings are ignored. Rev. 1.0, Jan. 2003, page 81 of 102 HD66753 Sleep Mode Setting the sleep mode bit (SLP) to 1 puts the HD66753 in the sleep mode, where the device stops all internal display operations, thus reducing current consumption. Specifically, LCD operation is completely halted. Here, all the SEG (SEG1 to SEG168) and COM (COM1 to COM132) pins output the GND level, resulting in no display. If the AP1-0 bits in the power control register are set to 00 in the sleep mode, the LCD drive power supply can be turned off, reducing the total current consumption of the LCD module. Table 30 Comparison of Sleep Mode and Standby Mode Function Sleep Mode (SLP = 1) Standby Mode (STB = 1) LCD control Turned off Turned off R-C oscillation circuit Operates normally Operation stopped Standby Mode Setting the standby mode bit (STB) to 1 puts the HD66753 in the standby mode, where the device stops completely, halting all internal operations including the R-C oscillation circuit, thus further reducing current consumption compared to that in the sleep mode. Specifically, all the SEG (SEG1 to SEG168) and COM (COM1 to COM132) pins for the time-sharing drive output the GND level, resulting in no display. If the AP1-0 bits are set to 00 in the standby mode, the LCD drive power supply can be turned off. During the standby mode, no instructions can be accepted other than the start-oscillation instruction. To cancel the standby mode, issue the start-oscillation instruction to stabilize R-C oscillation before setting the STB bit to 0. Turn off the LCD power supply: AP1 to 0 = 00 Set standby mode: STB = 1 Standby mode Issue the start-oscillation instruction Wait at least 10 ms Cancel standby mode: STB = 0 Turn on the LCD power supply: AP1 to 0 = 01 / 10 / 11 Figure 52 Procedure for Setting and Canceling Standby Mode Rev. 1.0, Jan. 2003, page 82 of 102 HD66753 Absolute Maximum Ratings Item Symbol Unit Value Notes* Power supply voltage (1) VCC V –0.3 to +4.6 1, 2 Power supply voltage (2) VLPS – GND V –0.3 to +20.5 1, 3 Input voltage Vt V –0.3 to VCC + 0.3 1 Operating temperature Topr °C –40 to +85 1, 4 Storage temperature Tstg °C –55 to +110 1, 5 Notes: 1. If the LSI is used above these absolute maximum ratings, it may become permanently damaged. Using the LSI within the following electrical characteristics limits is strongly recommended for normal operation. If these electrical characteristic conditions are also exceeded, the LSI will malfunction and cause poor reliability. 2. VCC > GND must be maintained. 3. VLPS > GND must be maintained. 4. For bare die and wafer products, specified up to 85•C. 5. This temperature specifications apply to the TCP package. Rev. 1.0, Jan. 2003, page 83 of 102 HD66753 DC Characteristics (VCC = 1.7 to 3.6 V, Ta = –40 to +85°C*1) Item Symbol Min Typ Max Unit Test Condition Notes Input high voltage VIH 0.7 VCC — VCC V 2, 3 Input low voltage VIL –0.3 — 0.15 VCC V VCC = 1.7 to 2.4 V 2, 3 –0.3 — 0.15 VCC V VCC = 2.4 to 3.6 V 2, 3 Output high voltage (1) VOH1 (DB0-15 and SDA pins) 0.75 VCC — — V IOH = –0.1 mA 2 Output low voltage (1) VOL1 (DB0-15 and SDA pins) — — 0.2 VCC V VCC = 1.7 to 2.4 V, IOL = 0.1 mA 2 — — 0.15 VCC V VCC = 2.4 to 3.6 V, IOL = 0.1 mA 2 Driver ON resistance (COM pins) RCOM — 3 10 kΩ ±Id = 0.05 mA, VLPS = 10 V 4 Driver ON resistance (SEG pins) RSEG — 3 10 kΩ ±Id = 0.05 mA, VLPS = 10 V 4 I/O leakage current ILi –1 — 1 µA Vin = 0 to VCC 5 Current consumption IOP during normal operation (VCC – GND) — 100 150 µA R-C oscillation, 6, 7 VCC = 3 V, Ta = 25 °C, fOSC = 100 kHz (1/132 duty), RAM write: checker pattern Current consumption during standby mode (VCC – GND) — 0.1 5 µA VCC = 3 V, Ta = 25°C — 40 60 µA V = 3 V, V = 15 V, 1/11 7 bias, Ta = 25 °C, fOSC = 100 IST LCD drive power supply ILPS current (VLPS – GND) 6, 7 kHz, amount of fixed current in the operational amplifier: small LCD drive voltage (VLPS – GND) VLPS 5.0 — 19.5 V 8 VREG input voltage (VREG pin) VREG — 1.3 2.5 V VREG external input (PS1-0 = 10), Ta = 25 °C V1REF output voltage (V1REF pin) V1REF — 13.0 — V VREG = 1.3 V, Ta = 25 °C, 11 times of VREG (VR2-0 = 111), V1REF ≤ VLPS – 0.5 V Note: For the numbered notes, refer to the Electrical Characteristics Notes section following these tables. Rev. 1.0, Jan. 2003, page 84 of 102 HD66753 Step-up Circuit Characteristics Item Symbol Min Typ Max Unit Test Condition Notes Three-times step-up output voltage (VLOUT pin) VUP3 7.6 8.0 8.1 V VCC = Vci = 2.7 V, IO = 30 µA, C = 1 µF, fOSC = 100 kHz, Ta = 25°C 11 Five-times stepup output voltage (VLOUT pin) VUP5 13.0 13.3 13.5 V VCC = Vci = 2.7 V, IO = 30 µA, C = 1 µF, fOSC = 100 kHz, Ta = 25°C 11 Six-times step-up output voltage (VLOUT pin) VUP6 15.7 16.0 16.2 V VCC = Vci = 2.7 V, IO = 30 µA, C = 1 µF, fOSC = 100 kHz, Ta = 25°C 11 Seven-times step-up output voltage (VLOUT pin) VUP7 18.4 18.7 18.9 V VCC = Vci = 2.7 V, IO = 30 µA, C = 1 µF, fOSC = 100 kHz, Ta = 25°C 11 Use range of step-up output voltages VUP3 VUP5 VUP6 VUP7 Vcc — 19.5 V For three- to seven-times step-up 11 Note: For the numbered notes, refer to the Electrical Characteristics Notes section following these tables. Rev. 1.0, Jan. 2003, page 85 of 102 HD66753 AC Characteristics (VCC = 1.7 to 3.6 V, Ta = –40 to +85°C*1) Clock Characteristics (VCC = 1.7 to 3.6 V) Item Symbol Min Typ Max Unit Test Condition External clock frequency fcp 50 75 150 kHz 9 External clock duty ratio Duty 45 50 55 % 9 External clock rise time trcp — — 0.2 µs 9 External clock fall time tfcp — — 0.2 µs 9 R-C oscillation clock fOSC 80 100 120 kHz Rf = 220 kΩ, VCC = 3 V Notes 10 Note: For the numbered notes, refer to the Electrical Characteristics Notes section following these tables. 68-system Bus Interface Timing Characteristics (Vcc = 1.7 to 2.4 V) Item Enable cycle time Enable high-level pulse width Enable low-level pulse width Symbol Min Typ Max Unit Test Condition ns Figure 60 ns Figure 60 ns Figure 60 Write tCYCE 600 — — Read tCYCE 800 — — Write PWEH 120 — — Read PWEH 350 — — Write PWEL 300 — — Read PWEL 400 — — Enable rise/fall time tEr, tEf — — 25 ns Figure 60 Setup time (RS, R/W to E, CS*) tASE 50 — — ns Figure 60 Address hold time tAHE 20 — — ns Figure 60 Write data setup time tDSWE 60 — — ns Figure 60 Write data hold time tHE 20 — — ns Figure 60 Read data delay time tDDRE — — 300 ns Figure 60 Read data hold time tDHRE 5 — — ns Figure 60 Rev. 1.0, Jan. 2003, page 86 of 102 HD66753 (Vcc = 2.4 to 3.6 V) Item Symbol Min Typ Max Unit Test Condition — — ns Figure 60 ns Figure 60 ns Figure 60 Enable cycle time Write tCYCE 380 Read tCYCE 500 — — Enable high-level pulse width Write PWEH 70 — — Read PWEH 250 — — Write PWEL 150 — — Read PWEL 200 — — Enable low-level pulse width Enable rise/fall time tEr, tEf — — 25 ns Figure 60 Setup time (RS, R/W to E, CS*) tASE 50 — — ns Figure 60 Address hold time tAHE 20 — — ns Figure 60 Write data setup time tDSWE 60 — — ns Figure 60 Write data hold time tHE 20 — — ns Figure 60 Read data delay time tDDRE — — 200 ns Figure 60 Read data hold time tDHRE 5 — — ns Figure 60 Rev. 1.0, Jan. 2003, page 87 of 102 HD66753 80-system Bus Interface Timing Characteristics (Vcc = 1.7 to 2.4 V) Item Bus cycle time Symbol Min Typ Max Unit Test Condition Write tCYCW 600 — — ns Figure 61 Read tCYCR 800 — — ns Figure 61 Write low-level pulse width PWLW 120 — — ns Figure 61 Read low-level pulse width PWLR 350 — — ns Figure 61 Write high-level pulse width PWHW 300 — — ns Figure 61 Read high-level pulse width PWHR 400 — — ns Figure 61 Write/Read rise/fall time tWRr , WRf — — 25 ns Figure 61 Setup time (RS to CS*, WR*, RD*) tAS 50 — — ns Figure 61 Address hold time tAH 20 — — ns Figure 61 Write data setup time tDSW 60 — — ns Figure 61 Write data hold time tH 20 — — ns Figure 61 Read data delay time tDDR — — 300 ns Figure 61 Read data hold time tDHR 5 — — ns Figure 61 Typ Max Unit Test Condition (Vcc = 2.4 to 3.6 V) Item Bus cycle time Symbol Min Write tCYCW 380 — — ns Figure 61 Read tCYCR 500 — — ns Figure 61 Write low-level pulse width PWLW 70 — — ns Figure 61 Read low-level pulse width PWLR 250 — — ns Figure 61 Write high-level pulse width PWHW 150 — — ns Figure 61 Read high-level pulse width PWHR 200 — — ns Figure 61 Write/Read rise/fall time tWRr, WRf — — 25 ns Figure 61 Setup time (RS to CS*, WR*, RD*) tAS 50 — — ns Figure 61 Address hold time tAH 20 — — ns Figure 61 Write data setup time tDSW 60 — — ns Figure 61 Write data hold time tH 20 — — ns Figure 61 Read data delay time tDDR — — 200 ns Figure 61 Read data hold time tDHR 5 — — ns Figure 61 Rev. 1.0, Jan. 2003, page 88 of 102 HD66753 Clock-synchronized Serial Interface Timing Characteristics (Vcc = 1.7 to 2.4 V) Item Serial clock cycle time Serial clock high-level width Symbol Min Typ Max Unit Test Condition Write (receive) tSCYC 100 — 2000 ns Figure 62 Read (send) 250 — 2000 ns Figure 62 tSCYC Write (receive) tSCH 40 — — ns Figure 62 Read (send) 120 — — ns Figure 62 Write (receive) tSCL 40 — — ns Figure 62 Read (send) tSCL 120 — — ns Figure 62 Serial clock rise/fall time tscf , tscr — — 20 ns Figure 62 Chip-select setup time tCSU 20 — — ns Figure 62 Chip-select hold time tCH 60 — — ns Figure 62 Serial input data setup time tSISU 30 — — ns Figure 62 Serial input data hold time tSIH 30 — — ns Figure 62 Serial output data delay time tSCD — — 200 ns Figure 62 Serial output data hold time tSCH 5 — — ns Figure 62 Typ Max Unit Test Condition Serial clock low-level width tSCH (Vcc = 2.4 to 3.6 V) Item Serial clock cycle time Symbol Min Write (receive) tSCYC 100 — 2000 ns Figure 62 Read (send) 250 — 2000 ns Figure 62 Write (receive) tSCH 40 — — ns Figure 62 Read (send) 120 — — ns Figure 62 Write (receive) tSCL 40 — — ns Figure 62 Read (send) tSCL 120 — — ns Figure 62 Serial clock rise/fall time tscf , tscr — — 20 ns Figure 62 Chip-select setup time tCSU 20 — — ns Figure 62 Chip-select hold time tCH 60 — — ns Figure 62 Serial input data setup time tSISU 30 — — ns Figure 62 Serial input data hold time tSIH 30 — — ns Figure 62 Serial output data delay time tSCD — — 200 ns Figure 62 Serial output data hold time tSCH 5 — — ns Figure 62 Serial clock high-level width Serial clock low-level width tSCYC tSCH Reset Timing Characteristics (VCC = 1.7 to 3.6 V) Item Symbol Min Typ Max Unit Test Condition Reset low-level width tRES 1 — — ms Figure 63 Reset rise time TrRES — — 10 µs Figure 63 Rev. 1.0, Jan. 2003, page 89 of 102 HD66753 Electrical Characteristics Notes 1. For bare die products, specified up to +85°C. 2. The following three circuits are I/O pin configurations (figure 53). Pins: RESET*, CS*, E/WR/SCL,RS, OSC1, OPOFF, IM2-1, IM0/ID, TEST Pin: OSC2 Vcc Vcc PMOS PMOS NMOS NMOS GND Pins: DB15 to DB0, RW/RD/SDA PMOS GND Vcc PMOS (Input circuit) NMOS Vcc (Tri-state output circuit) Output enable PMOS NMOS GND Figure 53 I/O Pin Configuration Rev. 1.0, Jan. 2003, page 90 of 102 Output data HD66753 3. The TEST pin must be grounded and the IM1/0 and OPOFF pins must be grounded or connected to Vcc. 4. Applies to the resistor value (RCOM) between power supply pins V1OUT, V2OUT, V5OUT, GND and common signal pins, and resistor value (RSEG) between power supply pins V1OUT, V3OUT, V4OUT, GND and segment signal pins. 5. This excludes the current flowing through output drive MOSs. 6. This excludes the current flowing through the input/output units. The input level must be fixed high or low because through current increases if the CMOS input is left floating. 7. The following shows the relationship between the operation frequency (fosc) and current consumption (Icc) (figure 54). Vcc = 3.0 V 100 Vcc = 3.0 V, fosc = 100 kHz Display on (typ.) 60 I LCD (µA) Iop (µA) 80 60 40 typ. 20 40 0 80 Sleep (typ.) 20 40 60 80 Standby (typ.) 100 120 0 11.0 R-C oscillation frequencies: fosc (kHz) 13.0 15.0 17.0 LCD drive voltage: VLCD (V) Figure 54 Relationship between the Operation Frequency and Current Consumption 8. Each COM and SEG output voltage is within ±0.15 V of the LCD voltage (Vcc, V1, V2, V3, V4, V5) when there is no load. 9. Applies to the external clock input (figure 55). Th Tl 2 kΩ Oscillator OSC1 0.7Vcc 0.5Vcc Open OSC2 Duty = Th Th + Tl 0.3Vcc t rcp x 100% t fcp Figure 55 External Clock Supply Rev. 1.0, Jan. 2003, page 91 of 102 HD66753 10. Applies to the internal oscillator operations using external oscillation resistor Rf (figure 56 and table 31). OSC1 Since the oscillation frequency varies depending on the OSC1 and OSC2 pin capacitance, the wiring length to these pins should be minimized. Rf OSC2 Figure 56 Internal Oscillation Table 31 External Resistance Value and R-C Oscillation Frequency (Referential Data) External R-C Oscillation Frequency: fosc Resistance (Rf) Vcc = 1.8 V Vcc = 2.2 V Vcc = 3.0 V Vcc = 3.6 V 200 kΩ 89 kHz 103 kHz 115 kHz 121 kHz 270 kΩ 70 kHz 80 kHz 88 kHz 92 kHz 300 kΩ 65 kHz 73 kHz 80 kHz 83 kHz 330 kΩ 60 kHz 68 kHz 74 kHz 77 kHz 360 kΩ 55 kHz 62 kHz 68 kHz 71 kHz 390 kΩ 52 kHz 58 kHz 64 kHz 66 kHz 430 kΩ 48 kHz 53 kHz 58 kHz 60 kHz 470 kΩ 44 kHz 48 kHz 52 kHz 54 kHz 11. The step-up characteristics test circuit is shown in figure 57. (5 to 7-times step-up) Vcc Vci C1+ + C1C2+ + C2C3+ + C3C4+ + 1 µF 1 µF 1 µF 1 µF C4C5+ + 1 µF C5C6+ + 1 µF C6GND VLOUT V LCD + 1 µF Figure 57 Step-up Characteristics Test Circuit Rev. 1.0, Jan. 2003, page 92 of 102 HD66753 (i) Relation between the obtained voltage and input voltage Seven-times step-up Six-times step-up typ. 15.0 12.0 9.0 1.5 typ. VUP7 (V) VUP6 (V) 18.0 18.0 13.0 8.0 2.0 2.5 1.5 3.0 2.0 2.5 3.0 Vci (V) Vci (V) Vci = Vcc, fosc = 100 kHz, Ta = 25˚C, DC1 to 0= 00 Vci = Vcc, fosc = 100 kHz, Ta = 25˚C, DC1 to 0 = 00 (ii) Relation between the obtained voltage and temperature Six-times step-up Seven-times step-up typ. 18.0 VUP7 (V) VUP6 (V) 20.0 16.0 14.0 -60 21.0 typ. 19.0 17.0 -20 0 20 60 Ta (˚C) -60 100 -20 0 20 60 100 Ta (˚C) Vci = Vcc = 2.7 V, fosc = 100 kHz, Io = 30 µA, DC1 to 0= 00 Vci = Vcc = 2.7 V, fosc = 100 kHz, Io = 30 µA, DC1 to 0 = 00 Figure 58 Step-up Rev. 1.0, Jan. 2003, page 93 of 102 HD66753 (iii) Relation between the obtained voltage and capacity Six-times step-up Seven-times step-up 20.0 typ. 17.0 typ. 19.0 VUP7 (V) VUP6 (V) 18.0 16.0 18.0 15.0 14.0 17.0 0.5 1.0 16.0 1.5 0.5 1.0 C (µF) 1.5 C (µF) Vci = Vcc = 2.7 V, fosc = 100 kHz, Io = 30 µA, DC1 to 0 = 00 Vci = Vcc = 2.7 V, fosc = 100 kHz, Io = 30 µA, DC1 to 0 = 00 (iv) Relation between the obtained voltage and current Seven-times step-up Six-times step-up 16.4 19.2 19.0 typ. 16.0 VUP7 (V) VUP6 (V) 16.2 15.8 15.6 typ. 18.8 18.6 18.4 18.2 15.4 15.2 0 10 20 30 Io (µA) 40 50 Vci = Vcc = 2.7 V, fosc = 100 kHz, Ta = 25˚C, DC1 to 0 = 00 18.0 0 20 30 Io (µA) 40 50 Vci = Vcc = 2.7 V, fosc = 100 kHz, Ta = 25˚C, DC1 to 0 = 00 Figure 58 Step-up (cont) AC Characteristics Test Load Circuits Data bus: DB15 to DB0 Test Point 50 pF Figure 59 Load Circuit Rev. 1.0, Jan. 2003, page 94 of 102 10 HD66753 Timing Characteristics 68-system Bus Operation RS R/W VIH VIH VIL VIL t ASE CS* t AHE VIL VIL PWEH * VIH E PWEL VIH VIL VIL VIL t Ef t Er t CYCE t DSWE DB0 to DB15 VIH VIL Write data t DDRE DB0 to DB15 t HE VIH VIL t DHRE VOH1 VOL1 Read data VOH1 VOL1 Note: PWEH is specified in the overlapped period when CS* is low and E is high. Figure 60 68-system Bus Timing Rev. 1.0, Jan. 2003, page 95 of 102 HD66753 80-system Bus Operation RS VIH VIH VIL VIL t AS CS* t AH VIH VIL PWHW PWHR PWLW, PWLR WR* RD* VIH VIH VIH VIL VIL t WRf t WRr t CYCW, t CYCR t DSW DB0 to DB15 VIH VIL Write data t DDR DB0 to DB15 tH VIH VIL t DHR VOH1 VOL1 Read data VOH1 VOL1 Note: PWLW and PWLR are specified in the overlapped period when CS* is low and WR* or RD* is low. Figure 61 80-system Bus Timing Rev. 1.0, Jan. 2003, page 96 of 102 HD66753 Clock-synchronized Serial Operation Start: S End: P VIH CS* VIL VIL t CSU t SCH VIL t CH VIH VIL VIH VIL VIL t SISU SDA t SCL VIH VIH VIH VIL SCL t SCYC tscf tscr t SIH VIH Input data Input data VIL t SOD t SOH VOH1 SDA VOL1 Output data VOH1 Output data VOL1 Figure 62 Clock-synchronized Serial Interface Timing Reset Operation t rRES t RES VIH RESET* VIL VIL Figure 63 Reset Timing Rev. 1.0, Jan. 2003, page 97 of 102 HD66753 Power-on/off Sequence To prevent pulse lighting of LCD screens at power-on/off, the power-on/off sequence is activated as shown below. However, since the sequence depends on LCD materials to be used, confirm the conditions by using your own system. Power-on Sequence Turn on power voltages Vcc and Vci, RESET = "Low" Wait for 1 ms or longer (power-on time) Wait for 10 ms or longer (oscillation stabilization time) Issue LCD power instruction Issue use-state instruction Wait for 10-150 ms or longer (op-amplifier output stabilization time) Note: Depends on the external capacitance of V1OUT to V5OUT. Turned on display: D = 1 Figure 64 Power-on Sequence Rev. 1.0, Jan. 2003, page 98 of 102 HD66753 Vcc Power voltage: Vcc GND Power-on reset time: 1 ms Vcc RESET GND Oscillation state Oscillation stabilization time: 10 ms Vcc Signal-input instruction issued GND Note: CR oscillation starts by power-on and input reset. The standby mode is cleared by input reset. Figure 65 Power-on Timing Rev. 1.0, Jan. 2003, page 99 of 102 HD66753 Power-off Sequence Normal state Turn off display: D = 0 Issue LCD power instruction Turn off power voltages Vcc and Vci To the power-on sequence Abnormal state Turn off power voltages Vcc and Vci RESET = "Low" Driver SEG/COM output: GND To the power-on sequence Figure 66 Power-off Sequence Rev. 1.0, Jan. 2003, page 100 of 102 HD66753 Vcc Power is turned off. Power voltage: Vcc GND RESET is input as soon as possible. Vcc RESET GND V1OUT Driver SEG/COM output GND Note: When hardware reset is input during the power-off period, the D bit is cleared to 0 and SEG/COM output is forcibly lowered to the GND level. Figure 67 Power-off Timing Rev. 1.0, Jan. 2003, page 101 of 102 HD66753 Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Sales Offices Hitachi, Ltd. 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(Taipei Branch Office) 4/F, No. 167, Tun Hwa North Road Hung-Kuo Building Taipei (105), Taiwan Tel : <886>-(2)-2718-3666 Fax : <886>-(2)-2718-8180 Telex : 23222 HAS-TP URL : http://semiconductor.hitachi.com.tw Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower World Finance Centre, Harbour City, Canton Road Tsim Sha Tsui, Kowloon Hong Kong Tel : <852>-2735-9218 Fax : <852>-2730-0281 URL : http://semiconductor.hitachi.com.hk Copyright © Hitachi, Ltd., 2002. All rights reserved. Printed in Japan. Colophon 7.0 Rev. 1.0, Jan. 2003, page 102 of 102